CN206834164U - Integrated circuit package body - Google Patents
Integrated circuit package body Download PDFInfo
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- CN206834164U CN206834164U CN201720746326.8U CN201720746326U CN206834164U CN 206834164 U CN206834164 U CN 206834164U CN 201720746326 U CN201720746326 U CN 201720746326U CN 206834164 U CN206834164 U CN 206834164U
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- integrated circuit
- circuit package
- package body
- connection structure
- insulation shell
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Abstract
It the utility model is related to a kind of integrated circuit package body.Included according to the integrated circuit package body of the embodiment of the utility model one：It is configured to provide the ground connection structure of the grounding connection of integrated circuit package body, and masking ground connection structure is located at the insulation shell of integrated circuit package body inside person.The side wall of the wherein insulation shell has slope above and underlying vertical component effect, and the height of vertical component effect is less than the 1/10 of the integrated circuit package body target jamming ripple wavelength to be shielded.Integrated circuit package body is further comprising shielding metal leve and screening conductive post, wherein shielding metal leve is placed only in the upper surface and slope of the insulation shell, and screening conductive post is arranged in insulation shell and is configured to electrically connect the shielding metal leve and ground connection structure.Manufacturing process can be simplified according to the integrated circuit package body of the utility model embodiment, reduce manufacturing cost.
Description
Technical field
The application is related to a kind of integrated circuit package body.
Background technology
Be highly integrateable in because of increasing radio communication device in the mobile phone of a limited areal so that originally less by
Pay attention to and use the radio frequency component of the lead frame processing of low cost such as：Radio-frequency power amplifier (RF Power
Amplifier, RF PA), low noise amplifier (Low Noise Amplifier, LNA), duplexer (Antenna
) etc. Switch the interference of electromagnetic field problem faced is also more and more.
The universal way for solving this problem in the industry is to coat metal screen layer in the outside of integrated circuit package body.At present
The general technique for using vacuum splashing and plating makes this kind of screen layer, i.e., in ultra-high vacuum environment, is put by plasma
Electricity, target metal is directly bombarded to the surface to packaging body.Simultaneously because screen layer needs to be grounded competence exertion shielding electromagnetic field
Effect, so typically by the integrated circuit package body to link together be cut into single be attached to respectively again it is anti-overflow plating adhesive tape on carry out
After vacuum splashing and plating, to ensure that jet-plating metallization connects with grounding pin.Due to needing to increase the processing procedure put product and pick up product,
The shortcomings that low production efficiency be present in this scheme.And this technical scheme cannot be guaranteed integrated circuit package body bottom surface and adhesive tape
Between 100% fitting, easily formed in integrated circuit package body bottom surface and overflow plating and cause short circuit between its pin.
In addition to the above drawbacks, production cost height, technique also be present using vacuum splashing and plating to make the technique of screen layer at present
The other problems such as complexity.Therefore, existing integrated circuit package body with electromagnetic-field-shielded function and preparation method thereof still needs to
Further improve.
Utility model content
One of the purpose of this utility model is to provide integrated circuit package body, its can simple, efficient technique obtain
Integrated circuit package body with electromagnetic-field-shielded function.
An embodiment of the present utility model provides an integrated circuit package body, and it includes：It is configured to provide integrated electricity
The ground connection structure of the grounding connection of road packaging body, and masking ground connection structure are located at integrated circuit package body inside person's
Insulation shell.The side wall of the wherein insulation shell has slope above and underlying vertical component effect, the height of vertical component effect
1/10 of degree less than the integrated circuit package body target jamming ripple wavelength to be shielded.Integrated circuit package body further includes
Shielding metal leve and screening conductive post, wherein shielding metal leve is placed only in the upper surface and slope of the insulation shell, and shields
Conductive pole is arranged in insulation shell and is configured to electrically connect the shielding metal leve and ground connection structure.
According to another embodiment of the present utility model, the minimum thickness of insulation shell can be more than 0.18mm.Grounding connection knot
Structure can be located on package substrate or lead frame.What screening conductive post can be integrally formed with shielding metal leve.Screening conductive
The lower end of post can person's connection directly corresponding in ground connection structure.According to an embodiment of the present utility model, the integrated circuit
Packaging body can further include the conductive projection on the corresponding person being formed in ground connection structure, and the screening conductive post, which is located at, leads
On electric projection.And according in another embodiment of the present utility model, integrated circuit package body can further include passive device,
The earth terminal of screening conductive post and passive device connects.According in another embodiment of the present utility model, integrated antenna package
Body further includes the ground lead of person corresponding in ground connection structure connection, and screening conductive post is connected with ground lead.
In one embodiment, integrated circuit package body can further include substrate ground copper face, and the screening conductive post is located at substrate ground
On copper face.
In integrated circuit package body of the present utility model, metal will be shielded due to being formed from top to bottom in insulation shell
Layer and the screening conductive post of grounding pin interconnection, therefore, must be in integrated circuit package body side wall no longer as prior art
Also formed metal coating come with grounding pin interconnect and shielded.In other words, external pin is without particular design；Inside need not
Single ground metal layer is designed, interiors of products space is without waste.Accordingly, the utility model has that manufacturing process is simple, system
Cause this low plurality of advantages.
Brief description of the drawings
Fig. 1 is the longitudinal cross-section schematic diagram according to the integrated circuit package body of the utility model one embodiment
Fig. 2 a-2e are the flow examples according to the method for the manufacture integrated circuit package body of the embodiment of the utility model one
Schematic diagram
Fig. 3 is the longitudinal cross-section schematic diagram according to the integrated circuit package body of the utility model another embodiment
Fig. 4 a-4e are the flow examples according to the method for the manufacture integrated circuit package body of the embodiment of the utility model one
Schematic diagram
Embodiment
For the shield effectiveness for making metal screen layer reach good, metal screen layer will be connected to connecing for integrated circuit package body
Ground pin.For the integrated circuit package body using package substrate, traditional sputter is usually the cutting inside package substrate
Ground metal layer is designed on road, single integrated circuit package body is obtained after then the substrate of whole piece is cut according to Cutting Road, every time
Sputter is required for putting single integrated circuit package body on anti-overflow plating adhesive tape one by one, is then fed into sputtering machine and starts operation.
Because package substrate inner metal layer is to be cut, cutting blade, another aspect package substrate interior metal on the one hand can be lost
Layer also easily produces burr phenomena.And for the integrated circuit package body using lead frame, if using foregoing this
Technique, all pins positioned at side wall all can short circuit together.So must not using the integrated circuit package body of lead frame
First the grounding pin of inside is not formed prefabricated metal block or by way of making it higher than framework, then will by hemisect
Prefabricated grounding pin is exposed to the side wall of integrated circuit package body, hereafter could make screen layer.This can increase substantially production
The process complexity of product.Further, since need the grounding pin of integrated circuit package body being exposed to product side wall, certainly will be sacrificial
Domestic animal falls the original inner space of integrated circuit package body, the space availability ratio of the product of reduction.
In addition, existing this sputtering process generally existing low production efficiency, such as will first cut and put integrated electricity with single
Road；Cost is high, and such as anti-overflow plating adhesive tape is disposable consumptive material；Potential product quality risk, such as anti-overflow plating adhesive tape can not and produce
Product 100% are bonded, once metal, which overflows to be plated on the pin at the back side, may result in pin short circuit.
The integrated circuit package body and its manufacture method that the utility model embodiment provides can effectively solve the above problems.For
Spirit of the present utility model is better understood from, it is made furtherly below in conjunction with part preferred embodiment of the present utility model
It is bright.
Fig. 1 is the longitudinal cross-section schematic diagram according to the integrated circuit package body 100 of the utility model one embodiment.This reality
To apply in example, the integrated circuit package body 100 includes single stack package substrate 11, and in other embodiments, integrated circuit package body
100 can include layer multilayer packaging substrate 11.
Connect as shown in figure 1, integrated circuit package body 100 includes the signal for being configured to provide integrated circuit package body 100
The signal connection structure 10 that connects, the ground connection structure 12 for being configured to provide the grounding connection of integrated circuit package body 100, and
Cover in the signal connection structure 10 positioned at the inside person of integrated circuit package body 100 and ground connection structure 12 positioned at integrated electricity
The insulation shell 14 of the inside person of road packaging body 100.Signal connection structure 10 can be located at the bottom surface of integrated circuit package body 100
The external signal pin of (such as bottom surface of package substrate 11), or (such as package substrate 11 is formed in integrated circuit package body 100
Upper surface) internal signal pin etc..Ground connection structure 12 can be (as sealed positioned at the bottom surface of integrated circuit package body 100
Fill the bottom surface of substrate 11) external ground pin, or be formed in integrated circuit package body 100 that (such as package substrate 11 is upper
Surface) interior grounding leg etc..For the integrated circuit package body 100 comprising layer multilayer packaging substrate, between different layers
Internal signal pin or external signal pin between can be connected with each other by conduction column 102.Similar, it is interior between different layers
It can be connected with each other between portion's grounding pin or external ground pin by conduction column 102.The side wall of the insulation shell 14 has position
In the slope 140 of top and underlying vertical component effect 142.The integrated circuit package body 100 further includes shielding metal leve
16 are placed only in the upper surface 144 and slope 140 of the insulation shell 14 with screening conductive post 18, wherein shielding metal leve 16, and
Screening conductive post 18 is arranged in insulation shell 14 and is configured to electrically connect the shielding metal leve 16 and ground connection structure 12.
In the present embodiment, the upper end connection shielding metal leve 16 of screening conductive post 18, and lower end person corresponding in ground connection structure,
As being directly connected with interior grounding leg (can be earthed surface).The number of screening conductive post 18 can be multiple, and arrangement also may be used
There are various shapes, visual specific shielding needs and design requirement adjustment.In other embodiments, screening conductive post 18 can pass through
Other manner realizes electrical connection shielding metal leve 16 and ground connection structure 12, such as can be corresponding in ground connection structure 12
Conductive projection is formed on person, screening conductive post 18 is formed on conductive projection；Or integrated circuit package body 100 is included and is configured
With the passive device electrically connected with ground connection structure 12, the lower end of screening conductive post 18 and the earth terminal of passive device connect；
Or integrated circuit package body 100 includes the ground lead for being configured person's electrical connection corresponding in ground connection structure 12,
Screening conductive post 18 is connected with ground lead.In another embodiment, integrated circuit package body 100 also can further include substrate
Copper face is grounded, screening conductive post 18 can be located on substrate ground copper face.
The height h of the vertical component effect 142 of the insulation shell 14 determines the shielding gap of the integrated circuit package body 100, when this
When height h is less than the 1/10 of the integrated circuit package body 100 target jamming ripple wavelength to be shielded, you can make the integrated circuit
Packaging body 100 reaches preferable effectiveness.For example, when the relative dielectric constant of insulation shell 14 is 4, to be shielded
Target jamming ripple when being 6GHz, its wavelength is 25mm, then to reach preferable effectiveness, insulation shell 14 it is vertical
The height h in portion 142 need to be less than 25mm/10 and be less than 2.5mm.Research through utility model people, the minimum thickness of insulation shell 14
It should be greater than 0.18mm.Such as the minimum thickness of insulation shell 14 is more than 0.6mm.Therefore, the utility model embodiment is no longer as existing
There is technology to expose ground connection structure 12 in the side wall of integrated circuit package body 100 like that and form shielding metal completely
Layer 16, so that shielding metal leve 16 is connected with ground connection structure 12 and realizes shielding.
Fig. 2 a-2e are the flow examples according to the method for the manufacture integrated circuit package body of the embodiment of the utility model one
Schematic diagram, it can manufacture a variety of integrated circuit package bodies including the integrated circuit package body 100 of embodiment illustrated in fig. 1
100。
As shown in Figure 2 a, as understood by those skilled in the art, integrated circuit package body 100 is some envelopes during fabrication
Dress body unit 13 links together progress.The method of the manufacture integrated circuit package body can be completed to encapsulate in a usual manner first
The series of process processing such as the circuit of body unit 13 is set, viscous crystalline substance, routing, injection.Can for example, forming each encapsulation body unit 13
It is included in offer signal connection structure 10 on package substrate 11, it is configured to the signal connection for providing the encapsulation body unit 13；
Ground connection structure 12 is provided on package substrate 11, it is configured to the grounding connection for providing the encapsulation body unit 13；And
It is molded and forms the insulation shell 14 of encapsulation body unit 13, is located at packaging body in the mask signal attachment structure 10 of insulation shell 14
The inside person of unit 13 and ground connection structure 12 are positioned at the encapsulation inside person of body unit 13.To ensure follow-up shield effectiveness, absolutely
The thickness of edge housing 14 need to be more than 0.6mm.As the skilled personnel can understand, although the present embodiment illustrate only individual layer
Package substrate 11, right the utility model can equally be well applied to include the integrated circuit package body 100 of layer multilayer packaging substrate 11.
As shown in Figure 2 b, if forming dry-packing hole 146 from top to bottom in the insulation shell 14 of each encapsulation body unit 13,
The form of specific optional laser boring or machine drilling.In the present embodiment, the bottom in filling hole 146 is gone directly internally positioned connect
The upper surface of corresponding person in ground pin, it can be formed with the metal for ensureing subsequently to fill with ground connection structure 12 and electrically connect configuration.
In other embodiments, if the screening conductive post 18 to be formed is via other manner, if the earth terminal of passive device is with connecing
Ground attachment structure 12 forms electrical connection configuration, then fills the bottom in hole 146 and at least to expose the element.
As shown in Figure 2 c, it is similar, it can be cut by laser or the mode of machine cuts is in the exhausted of each encapsulation body unit 13
Slope 140 above, i.e. edge cuts are formed on the border of edge housing 14.Accordingly, can be directly at adjacent two absolutely
Make V-arrangement cutting between edge housing 14 and form respective slope 140.As the skilled personnel can understand, hole 146 is filled
With edge cuts and in the absence of the limitation of order, inappropriate limit should not be carried out with the order illustrated that the present embodiment is shown
It is fixed.
Then, metal screen layer 16 can be covered on insulation shell 14, conductive material is filled in hole 146 is filled to be formed
Screening conductive post 18.As shown in Figure 2 d, metal screen layer 16 and screening conductive post 18 can be formed simultaneously, and coating spraying skill can be used
Art spraying metal materials 30, as conducting resinl makes its filling completely fill hole 146 and covers the upper surface 144 and slope of insulation shell 14
140.In other embodiments, the various ways such as atomizing spraying, sputter formation metal screen layer 16 and shielding also can be used to lead
Electric post 18.In this way, screening conductive post 18 can be configured to electrically connect shielding metal leve 18 and ground connection structure 12, so that
Shielding metal leve 18 is grounded.
As shown in Figure 2 e, after the completion of the preparation technology of the encapsulation body unit 13 to be linked together to whole piece, can be cut
Cut separation and form independent integrated circuit package body 100, obtained most with completing the unification of integrated circuit package body 100 processing
Whole integrated circuit package body 100.The side wall of integrated circuit package body 100 has slope 140 and hanging down positioned at the lower section of slope 140
Straight portion 142, the height of the vertical component effect 142 are less than the 1/ of the integrated circuit package body 100 target jamming ripple wavelength to be shielded
10。
As embodiment of the present utility model is demonstrated, due to forming screening conductive post in integrated circuit package body 100
18 electrically connecting shielding metal leve 18 and ground connection structure 12, it is not necessary to is connect in the side wall exposure of integrated circuit package body 100
Ground pin (does not have metallic ground attachment structure) i.e. on line of cut, thus reduces the loss of cutter.Moreover, in this practicality
In new embodiment, the side wall of the insulation shell 14 of integrated circuit package body 100 only up has metallic shield on slope 140
Layer, and vertical component effect 142 is then arranged to the shielding gap with proper height according to the target jamming ripple wavelength to be shielded, effectively
Improve the effect of electromagnetic shielding.In addition, according to embodiment of the present utility model, the encapsulation unit 13 of whole piece completes note together
The multi-step process such as modeling, the formation of shielding metal leve 16 just separate up to the final stage of encapsulation process, effectively increase production efficiency.
Accordingly, the utility model has that manufacturing process is simple, the advantages such as manufacturing cost is low.
The utility model is equally applicable to the integrated circuit package body 100 using lead frame 15.Fig. 3 is according to this practicality
The longitudinal cross-section schematic diagram of the integrated circuit package body 200 of another new embodiment.In the present embodiment, the integrated antenna package
Body 200 uses lead frame 15 rather than package substrate 11.
Connect as shown in figure 3, integrated circuit package body 200 includes the signal for being configured to provide integrated circuit package body 200
The signal connection structure 10 that connects, the ground connection structure 12 for being configured to provide the grounding connection of integrated circuit package body 200, and
Cover in the signal connection structure 10 positioned at the inside person of integrated circuit package body 200 and ground connection structure 12 positioned at integrated electricity
The insulation shell 14 of the inside person of road packaging body 100.Signal connection structure 10 can be signal pins, and ground connection structure 12 can be with
It is grounding pin.The side wall of the insulation shell 14 has slope 140 above and underlying vertical component effect 142.The collection
Further it is placed only in into circuit package 200 comprising shielding metal leve 16 and screening conductive post 18, wherein shielding metal leve 16
The upper surface 144 and slope 140 of the insulation shell 14, and screening conductive post 18 is arranged in insulation shell 14 and is configured to electricity
Connect the shielding metal leve 16 and ground connection structure 12.In the present embodiment, integrated circuit package body 100 include be configured to
The passive device 17 that ground connection structure 12 electrically connects, the lower end of screening conductive post 18 is connected with the earth terminal of passive device 17.
The number of screening conductive post 18 can be multiple, and arrangement can also have various shapes, and visual specific shielding needs and design requirement is adjusted
It is whole.In other embodiments, screening conductive post 18 can realize electrical connection shielding metal leve 16 and grounding connection otherwise
Structure 12, such as the upper end connection shielding metal leve 16 of screening conductive post 18, and lower end is corresponding in ground connection structure 12
Person, as system earth pin connects；Or conductive projection, screening conductive post can be formed on the corresponding person in ground connection structure 12
18 are formed on conductive projection；Or integrated circuit package body 200 can be included and is configured and the phase in ground connection structure 12
The ground lead of the person's of answering electrical connection, screening conductive post 18 are connected with ground lead.
The height h of the vertical component effect 142 of the insulation shell 14 determines the shielding gap of the integrated circuit package body 200, when this
When height h is less than the 1/10 of the integrated circuit package body 200 target jamming ripple wavelength to be shielded, you can make the integrated circuit
Packaging body 200 reaches preferable effectiveness.
Although having difference in technique early stage of encapsulation using package substrate 11 or lead frame 15, in the later stage, particularly
Integrated circuit of the manufacture using the integrated circuit package body 200 of lead frame 15 with manufacture using package substrate 11 after the completion of injection
Identical processing procedure can be used in packaging body 100.Fig. 4 a-4e are the manufacture integrated antenna packages according to another embodiment of the utility model
The flow example schematic diagram of the method for body, it can be manufactured including the integrated circuit package body 200 of embodiment illustrated in fig. 3
A variety of integrated circuit package bodies 200.
As shown in fig. 4 a, as understood by those skilled in the art, integrated circuit package body 200 is some envelopes during fabrication
Dress body unit 13 links together progress.The method of the manufacture integrated circuit package body 200 can be completed in a usual manner first
The circuit for encapsulating body unit 13 sets, glues the processing of the series of process such as crystalline substance, routing, injection.For example, form each encapsulation body unit
13 may include to provide signal connection structure 10 on lead frame 15, and it is configured to provide the signal of the encapsulation body unit 13 and connected
Connect；Ground connection structure 12 is provided on lead frame 15, it is configured to the grounding connection for providing the encapsulation body unit 13；With
And be molded and form the insulation shell 14 of the encapsulation body unit 13, positioned at envelope in the mask signal attachment structure 10 of insulation shell 14
The inside person of body unit 13 and ground connection structure 12 are filled positioned at the encapsulation inside person of body unit 13.To ensure follow-up shielding effect
Fruit, the thickness of insulation shell 14 need to be more than 0.18mm.
As shown in Figure 4 b, if forming dry-packing hole 146 from top to bottom in the insulation shell 14 of each encapsulation body unit 13,
The form of specific optional laser boring or machine drilling.In the present embodiment, the bottom in filling hole 146 is gone directly internally positioned connect
The upper surface of corresponding person in ground pin, it can be formed with the metal for ensureing subsequently to fill with ground connection structure 12 and electrically connect configuration.
In other embodiments, if the screening conductive post 18 to be formed is via other manner, such as ground lead and grounding connection knot
Structure 12 forms electrical connection configuration, then fills the bottom in hole 146 and at least to expose the element.
As illustrated in fig. 4 c, it is similar, it can be cut by laser or the mode of machine cuts is in the exhausted of each encapsulation body unit 13
Slope 140 above, i.e. edge cuts are formed on the border of edge housing 14.Accordingly, can be directly at adjacent two absolutely
Make V-arrangement cutting between edge housing 14 and form respective slope 140.As the skilled personnel can understand, hole 146 is filled
With edge cuts and in the absence of the limitation of order, inappropriate limit should not be carried out with the order illustrated that the present embodiment is shown
It is fixed.
Then, metal screen layer 16 can be covered on insulation shell 14, conductive material is filled in hole 146 is filled to be formed
Screening conductive post 18.As shown in figure 4d, metal screen layer 16 and screening conductive post 18 can be formed simultaneously, such as be sprayed using atomizing
Technology spraying metal materials 30, as conducting resinl make its filling completely fill hole 146 and cover insulation shell 14 upper surface 144 and tiltedly
Slope 140.In other embodiments, the various ways such as coating spraying, sputter formation metal screen layer 16 and shielding also can be used to lead
Electric post 18.In this way, screening conductive post 18 can be configured to electrically connect shielding metal leve 18 and ground connection structure 12, so that
Shielding metal leve 18 is grounded.
As shown in fig 4e, after the completion of the preparation technology of the encapsulation body unit 13 to be linked together to whole piece, can be cut
Cut separation and form independent integrated circuit package body 200, obtained most with completing the unification of integrated circuit package body 200 processing
Whole integrated circuit package body 200.The side wall of integrated circuit package body 200 has slope 140 and hanging down positioned at the lower section of slope 140
Straight portion 142, the height of the vertical component effect 142 are less than the 1/ of the integrated circuit package body 200 target jamming ripple wavelength to be shielded
10。
The integrated circuit package body and its manufacture method that the utility model embodiment provides, by insulation shell after the completion of injection
The border of body 14 cuts away certain angle edge and forms slope 140, not destroy encapsulation unit 13 that whole piece links together
Under the premise of annexation can earthing position drill to obtain filling hole 146, metal level is then made equably using certain technique
It is distributed in filling hole 146 and on the upper surface 144 and slope 140 of insulation shell 14, so as to without being specially provided and exposed to
While the ground structure of side wall, reach same shield effectiveness.Thus the utility model embodiment can have the following advantages that：No
Need to use the adhesive tape of anti-sputter；External pin is without particular design；Inside need not design single ground metal layer, in product
Portion space is without waste；Surface conductive coating technique, sputtering process can use, and technique versatility is high, and Coating
Metal level is without expensive sputtering equipment；Extra routing or prefabricated metal are not needed, technique is simple, the easy management and control of processing procedure.
Technology contents and technical characterstic of the present utility model are had revealed that as above, but those skilled in the art still may be used
A variety of replacements and modification without departing substantially from the utility model spirit can be made based on teaching of the present utility model and announcement.Therefore, originally
The protection domain of utility model should be not limited to the content disclosed in embodiment, and should be replaced including various without departing substantially from of the present utility model
Change and modify, and covered by present patent application claims.
Claims (9)
1. a kind of integrated circuit package body, it is characterised in that the integrated circuit package body includes：
Ground connection structure, it is configured to provide the grounding connection of the integrated circuit package body；
Insulation shell, it covers the ground connection structure and is located at the integrated circuit package body inside person；The insulation shell
Side wall there is slope above and underlying vertical component effect, the height of the vertical component effect is sealed less than the integrated circuit
Fill the 1/10 of the body target jamming ripple wavelength to be shielded；
Shielding metal leve, it is placed only in the upper surface of the insulation shell and the slope；And
Screening conductive post, it is arranged in the insulation shell and is configured to electrically connect the shielding metal leve and the ground connection company
Binding structure.
2. integrated circuit package body according to claim 1, it is characterised in that the thickness of the insulation shell is more than or equal to
0.18mm。
3. integrated circuit package body according to claim 1, it is characterised in that the ground connection structure is positioned at encapsulation base
On plate or lead frame.
4. integrated circuit package body according to claim 1, it is characterised in that the lower end of the screening conductive post directly with
Corresponding person connection in the ground connection structure.
5. integrated circuit package body according to claim 1, it is characterised in that the integrated circuit package body further wraps
Containing the conductive projection being formed on the corresponding person in the ground connection structure, the screening conductive post is located at the conductive projection
On.
6. integrated circuit package body according to claim 1, it is characterised in that the integrated circuit package body further wraps
Containing passive device, the screening conductive post is connected with the earth terminal of the passive device.
7. integrated circuit package body according to claim 1, it is characterised in that the integrated circuit package body further wraps
Copper face containing substrate ground, the screening conductive post are located on the substrate ground copper face.
8. integrated circuit package body according to claim 1, it is characterised in that the integrated circuit package body further wraps
Containing the ground lead for being configured to person's electrical connection corresponding in the ground connection structure, the screening conductive post connects with described
Ground lead connection.
9. integrated circuit package body according to claim 1, it is characterised in that the screening conductive post and the shielding gold
Category layer is integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720746326.8U CN206834164U (en) | 2017-06-23 | 2017-06-23 | Integrated circuit package body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720746326.8U CN206834164U (en) | 2017-06-23 | 2017-06-23 | Integrated circuit package body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206834164U true CN206834164U (en) | 2018-01-02 |
Family
ID=60776978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720746326.8U Active CN206834164U (en) | 2017-06-23 | 2017-06-23 | Integrated circuit package body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206834164U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107195587A (en) * | 2017-06-23 | 2017-09-22 | 苏州日月新半导体有限公司 | Integrated circuit package body and its manufacture method |
| CN109002806A (en) * | 2018-07-27 | 2018-12-14 | 星科金朋半导体（江阴）有限公司 | A kind of rear road packaging method of QFN product |
| CN111564301A (en) * | 2019-02-14 | 2020-08-21 | 模甸科技股份有限公司 | Electromagnetic shielding structure of transformer |
-
2017
- 2017-06-23 CN CN201720746326.8U patent/CN206834164U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107195587A (en) * | 2017-06-23 | 2017-09-22 | 苏州日月新半导体有限公司 | Integrated circuit package body and its manufacture method |
| CN109002806A (en) * | 2018-07-27 | 2018-12-14 | 星科金朋半导体（江阴）有限公司 | A kind of rear road packaging method of QFN product |
| CN111564301A (en) * | 2019-02-14 | 2020-08-21 | 模甸科技股份有限公司 | Electromagnetic shielding structure of transformer |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: No. 188, Suhong West Road, Suzhou Industrial Park, Suzhou, Jiangsu Province Patentee after: Riyuexin semiconductor (Suzhou) Co.,Ltd. Address before: 215026 No.188 Suhong West Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province Patentee before: SUZHOU ASEN SEMICONDUCTORS Co.,Ltd. |