CN206825189U - Chemical mechanical polishing device - Google Patents
Chemical mechanical polishing device Download PDFInfo
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- CN206825189U CN206825189U CN201620884045.4U CN201620884045U CN206825189U CN 206825189 U CN206825189 U CN 206825189U CN 201620884045 U CN201620884045 U CN 201620884045U CN 206825189 U CN206825189 U CN 206825189U
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- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Engineering (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Computer Hardware Design (AREA)
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- Power Engineering (AREA)
Abstract
A kind of chemical mechanical polishing device is the utility model is related to, chemical mechanical polishing device includes：Carrier head；Substrate detecting sensor, it is installed on the outside of the carrier head and receives and dispatches the perceptual signal for being perceived to substrate, and the substrate is attached to the carrier head；Signal transfer member, its one end is connected to the substrate detecting sensor, other ends are exposed to the bottom surface for the carrier head for being attached with substrate, and transmit the perceptual signal, and the chemical mechanical polishing device can perceive the attachment state of the substrate for carrier head exactly.
Description
Technical field
A kind of chemical mechanical polishing device is the utility model is related to, relates more particularly to a kind of cmp dress
Put, the chemical mechanical polishing device can perceive the substrate attachment state for carrier head exactly.
Background technology
Semiconductor element is densely fabricated by fine circuit height, and therefore, wafer surface needs to carry out accordingly
Precise finiss.For the grinding more to be become more meticulous to wafer, as shown in Figures 1 and 2, mechanical lapping and chemical grinding are carried out
Parallel chemical mechanical milling tech (CMP).
In other words, above grinding flat plate 10, the grinding pad 11 that wafer W is contacted while pressurized is arranged to and ground
Polish plate 10 and rotate 11d together, and for chemical grinding, made by lapping liquid (slurry) supply mouth 32 of feed unit 30
Lapping liquid while supply, by friction to wafer progress mechanical lapping.Now, wafer W passes through carrier head
(Carrier Head) 20 rotates 20d in specified location, so as to the grinding technics critically planarized.Coated on described
The lapping liquid on the surface of grinding pad 11 towards the drawing reference numeral 40d directions indicated rotate while, pass through adjuster
(conditioner) 40 uniformly spread on grinding pad 11, and can flow into wafer W, the arm (arm) of the adjuster 40
41 can by machine finish (dressing) technique of adjuster 40 towards the direction circumnutation for being denoted as 41d, grinding pad 11
Keep certain abradant surface.
In addition, after being terminated using the chemical mechanical milling tech of grinding pad and lapping liquid, the wafer W can be with attachment
Cleaning device is moved to by carrier head 20 in the state of carrier head 20.
But if the wafer W in the state of carrier head 20 is not attached to exactly, carrier head 20 moves, then exists
The risk that wafer W is separated and landed from carrier head 20 be present in wafer W transfer way, therefore, in the transfer of carrier head 20
In preceding or transfer way, it has to be possible to perceive whether wafer W is attached to carrier head exactly.
In addition, if the state that wafer W is attached to carrier head 20 can not be perceived exactly, it is difficult to control grinding exactly
Technique and cleaning, it is thus necessary to be able to perceive the wafer W attachment states for carrier head 20 exactly.
Therefore, the various researchs for being used to perceive exactly for the substrate attachment state of carrier head recently are being carried out, but
It is to still suffer from deficiency, it is therefore desirable to the exploitation to this.
Utility model content
The purpose of this utility model is the attachment state that can perceive substrate exactly, and the shifting of control base board exactly
It is dynamic.
Especially, the purpose of this utility model be using be installed on carrier head outside substrate detecting sensor so as to
The attachment state of the substrate for carrier head is perceived exactly.
In addition, the purpose of this utility model is the indoor design free degree that can improve carrier head, and construction can be simplified.
In addition, the purpose of this utility model is to improve stability and reliability.
Preferred embodiment of the present utility model is used to reach above-mentioned the purpose of this utility model, new according to described practicality
The preferred embodiment of type, chemical mechanical polishing device include：Carrier head；Substrate detecting sensor, it is installed on the carrier head
Outside and receive and dispatch the perceptual signal for being perceived to substrate, the substrate is attached to the carrier head；Signal transmits
Part, its one end are connected to the substrate detecting sensor, and other ends are exposed to the bottom surface for the carrier head for being attached with substrate,
And the perceptual signal is transmitted, the chemical mechanical polishing device can perceive the attachment shape for the substrate of carrier head exactly
State.
As reference, so-called substrate can be regarded as to be ground using carrier head and on grinding pad in the utility model
The grinding object of mill, and the utility model is not limited or restriction by the species and characteristic of substrate.For example, wafer can be used
As substrate.
Carrier head can be formed as various constructions according to required condition and design pattern.For example, carrier head may include：Body
Portion, it is set in the form of rotatable；Basal part, it is configured to rotate jointly with body；Film, it is arranged at basal part
Bottom surface.
Substrate detecting sensor is installed on the outside of carrier head, is appreciated that in the utility model on the outside of so-called carrier head
Concept including being the remaining area outside in addition to all bottom surfaces except being attached with the carrier head of substrate.
Substrate detecting sensor can be installed on multiple positions of carrier head according to required condition and design pattern.For example,
Substrate detecting sensor is mountable to the top of body.Depending on the situation, substrate detecting sensor is mountable to substrate
The side in portion, or it is installed on other positions.
Substrate detecting sensor is configured to the perceptual signal that transmitting-receiving is used to perceive substrate.Here, so-called perception
Signal can transmit the optical signal of signal using light as medium, it is preferable that perceptual signal can be it will be seen that light and red
At least any one uses the optical signal mediated in outside line.
Substrate detecting sensor can use multiple sensors according to required condition and design pattern.For example, as substrate
The optical sensor as element can be used in detecting sensor, and the optical sensor as element converts optical signals to e-mail
Number and detected.More specifically, substrate detecting sensor includes illuminating part and light absorbing part, and the illuminating part sends light letter
Number, the light absorbing part receives the optical signal reflected from substrate by signal transfer member.
One end of signal transfer member may pass through the inner side of carrier head and be connected to substrate detecting sensor, and other ends can be sudden and violent
It is exposed to the bottom surface for the carrier head for being attached with substrate.Depending on the situation, also may be configured as wearing in one end of signal transfer member
Cross after the side of carrier head, be connected to substrate detecting sensor.
The a variety of parts that can be transmitted to the perceptual signal of substrate detecting sensor can be used as signal transfer member.
For example, the optical cable (optical cable) that can be transmitted to optical signal can be used as signal transfer member.
In addition, other ends of signal transfer member are exposed to the bottom surface of substrate parts, because the bottom in substrate parts is matched somebody with somebody
Film is equipped with, therefore, film can be formed by the transparent translucency material of optical signal, be transmitted will pass through signal transfer member
Perceptual signal (optical signal) pierceable membrane.
In addition, according to chemical mechanical polishing device of the present utility model, it may include alarm generating unit, if the substrate sense
Know that the perceptual signal of sensor is not transferred on the substrate, then alarm generating unit produces alarm signal.Here, so-called police
The number of notifying may include the police according to the alarm signal of the sense of hearing of conventional audio unit and the vision according to conventional warning etc.
It is at least one in the number of notifying.In addition, other a variety of alarm signals can also be used, a variety of alarm signals of others can
So that the situation that substrate is not perceived is identified operating personnel.
In addition, may be provided with seal member between the outside of carrier head and the outside of substrate detecting sensor, and believe
Number transfer member in the form of can passing through the inside of seal member to be configured.Seal member according to required condition and can be set
Meter pattern is arranged to a variety of constructions, and the utility model is not limited or limited by the construction and characteristic of seal member.
Substrate detecting sensor and signal transfer member can be arranged to a variety of numbers according to required condition and design pattern
Amount and arrangement.For example, substrate detecting sensor and signal transfer member can be can independently be sensed shape
Formula sets multiple on carrier head.In addition, it is connected to its of multiple signal transfer members of multiple substrate detecting sensors
He can be set radial direction or circumferencial direction of the end along carrier head in the form of being spaced in intervals.
As described above, according to the utility model, the attachment state of substrate can be perceived exactly, and can control base exactly
The transfer of plate.
Especially, can be using the substrate detecting sensor in the outside for being installed on carrier head come accurate according to the utility model
Ground perceives the attachment state of the substrate for carrier head.For example, using signal transfer member by from being installed on the outside of carrier head
The optical signal of substrate detecting sensor irradiation be sent to the bottom surface of carrier head, and received using signal transfer member from base
The optical signal of the surface reflection of plate, can be perceived with the presence or absence of substrate exactly with this.
In addition, according to the utility model, substrate detecting sensor need not be not only configured to the inside of carrier head, and
Power supplying line need not be arranged to the inside of carrier head, the power supplying line is used to supply to substrate to perceive by power supply to pass
Sensor, thus, the interference as caused by substrate detecting sensor can be prevented in advance, and the indoor design that can improve carrier head is free
Degree, and construction can be simplified.
In addition, according to the utility model, due to that can not be confirmed whether substrate be present by other compressed air line,
Therefore construction can be simplified, and the validity of control can be improved.
In addition, according to the utility model, due to that can come that substrate is carried out in the form of unrelated with vacuum noise (noise)
Identification, the vacuum noise is as caused by the foreign matter as cleaning fluid, therefore, can improve stability and reliability.
Brief description of the drawings
Fig. 1 and Fig. 2 is the figure for illustrating existing chemical mechanical polishing device,
Fig. 3 is to show the figure according to chemical mechanical polishing device of the present utility model,
Fig. 4 is according to chemical mechanical polishing device of the present utility model, for illustrating substrate detecting sensor and signal
The figure of the construction of transfer member,
Fig. 5 is according to chemical mechanical polishing device of the present utility model, for illustrating the base using substrate detecting sensor
The figure of plate perception principle,
Fig. 6 and Fig. 7 is according to chemical mechanical polishing device of the present utility model, for illustrating substrate detecting sensor and letter
The figure of the variation of number transfer member,
Fig. 8 is the block diagram for illustrating the control method according to chemical mechanical polishing device of the present utility model.
Embodiment
Hereinafter, preferred embodiment of the present utility model is described in detail referring to the drawings, but the utility model is not
It is limited by example or limits.As reference, identical label substantially refers to identical key element in this explanation, and in institute
State under rule, content described in other accompanying drawings can be quoted to illustrate, and can omit self-evident interior for practitioner
Perhaps recurrent content.
Fig. 3 is to show the figure according to chemical mechanical polishing device of the present utility model, and Fig. 4 is according to of the present utility modelization
Learn mechanical lapping equipment, the figure of the construction for illustrating substrate detecting sensor and signal transfer member.In addition, Fig. 5 is root
According to chemical mechanical polishing device of the present utility model, for illustrating the figure of the substrate perception principle using substrate detecting sensor.
Reference picture 3 includes to Fig. 5 according to chemical mechanical polishing device of the present utility model：Carrier head 120, substrate perceive
Sensor 200 and signal transfer member 300.
The carrier head 120 is arranged to supplying lapping liquid above the grinding pad 111 being arranged on grinding flat plate 110
In the state of, pressurize substrate 10, so as to perform chemical mechanical milling tech, and in the change using grinding pad 111 and lapping liquid
After mechanical milling tech terminates, substrate 10 can be moved to cleaning device.
As reference, what so-called substrate 10 can be regarded as to be ground on grinding pad 111 in the utility model grinds
Object is ground, and the utility model is not limited or restriction by the species and characteristic of substrate 10.For example, wafer conduct can be used
Substrate 10.
The carrier head 120 can be formed as various constructions according to required condition and design pattern.For example, the carrier head
120 may include：Body 122, it is set in the form of rotatable；Substrate (base) portion 124, its be configured to it is described
Body 122 rotates jointly；Film (membrane) 128, it is arranged at the bottom surface of the basal part 124.
The film 128 is securable in central portion formed with opening portion, and with the medial extremity of the central portion adjoining of film 128
Basal part 124, and the outboard end of film 128 is by being incorporated into the retainer plate (retainer in edge (edge) portion of basal part 124
Ring) 126 are fixed on basal part 124.
The film 128 can be formed as various constructions according to required condition and design pattern.For example, can in the film 128
Multiple traps (flap) (for example, trap of ring-shaped) are formed, and by multiple traps between basal part 124 and film 128
It can be divided formed with multiple balancing gate pits, radial direction of the multiple balancing gate pit along basal part 124.
The pressure sensor of pressure can be separately provided for determining in each balancing gate pit.Each balancing gate pit
Pressure can be individually adjusted by the control of balancing gate pit's control unit, and the pressure of each balancing gate pit is adjusted,
So as to which individually the pressure for the substrate 10 that pressurizes is adjusted.
The central part of the carrier head 120 can lead to formed with central part balancing gate pit (not shown), the central part balancing gate pit
Cross the opening of film 128 and be formed through.The central part balancing gate pit directly connects with substrate 10, so as to polish
(polishing) wafer will not only be pressurizeed, and functioned as follows in technique：, will in the presence of suction pressure
Substrate 10 is close to the film 128 of carrier head 120, thus to grasp the state of substrate 10 to the 3rd position (for example, cleaning device)
It is mobile.
The substrate detecting sensor 200 is installed on the outside of carrier head 120, and is configured to pass using signal described later
Part 300 is sent to perceive the substrate 10 for the bottom surface for being attached to carrier head 120.As reference, so-called carrier in the utility model
First 120 outside can be regarded as the remaining outside in addition to including all bottom surfaces except being attached with the carrier head 120 of substrate 10
Concept including region.
The substrate detecting sensor 200 can be installed on the multiple of carrier head 120 according to required condition and design pattern
Position.For example, the substrate detecting sensor 200 is mountable to the top of body.Depending on the situation, substrate, which perceives, passes
Sensor is mountable to the side of basal part, or is installed on other positions.
The substrate detecting sensor 200 is configured to the perceptual signal that transmitting-receiving is used to perceive substrate 10.Here, so-called sense
It can transmit the optical signal of signal using light as medium to know signal.Preferably, perceptual signal can be it will be seen that light and
At least any one uses the optical signal mediated in infrared ray.
The substrate detecting sensor 200 can use multiple sensors according to required condition and design pattern.For example, make
The optical sensor as element can be used for the substrate detecting sensor 200, the optical sensor as element believes light
Number be converted to electronic signal and detected.As reference, as composition according to substrate detecting sensor 200 of the present utility model
Can be used can perceive that (Near Infrared Ray, wavelength are the infrared of 0.75-3 μm of region from luminous ray near infrared ray
Line) optical sensor.
More specifically, the substrate detecting sensor 200 may include illuminating part 210 (for example, light emitting diode) and
Light absorbing part 220 (for example, phototransistor (phototransistor)), the illuminating part 210 send optical signal, the receipts light
Portion 220 receives the optical signal reflected from substrate 10 by signal transfer member 300 described later.Further, in the light absorbing part 220
The optical signal of reception can carry out amplification by conventional amplification portion 230.
For the substrate detecting sensor 200, such as conventional photo interrupter (photo interrupter) one
Sample, illuminating part 210 and light absorbing part 220 are arranged to one-piece type construction.Depending on the situation, substrate detecting sensor is luminous
Portion and light absorbing part can also be arranged to the construction of separation in addition respectively.
The signal transfer member 300, which is arranged to the perceptual signal of substrate detecting sensor 200 being sent to, is attached with base
The bottom surface of the carrier head 120 of plate 10, and the perceptual signal for perceiving substrate 10 can be retransferred by signal transfer member 300
To substrate detecting sensor 200.
Therefore, one end of the signal transfer member 300 is connected to substrate detecting sensor 200, other ends are exposed to attached
The bottom surface of the carrier head 120 of substrate 10.Preferably, one end of signal transfer member 300 may pass through the inner side of carrier head 120
And it is connected to substrate detecting sensor 200.Hereinafter, to being illustrated with the following example formed that formed, the signal transport unit
One end of part 300 is through basal part and body and is connected to substrate detecting sensor 200, and signal transfer member 300
Other ends are exposed to the bottom surface of basal part.Depending on the situation, it also may be configured as passing through in one end of signal transfer member and carry
After the side of body head, substrate detecting sensor is connected to.
The signal transfer member 300 can be used the perceptual signal of substrate detecting sensor 200 can be transmitted it is more
Kind part.Hereinafter, following content is illustrated, optical signal can be transmitted as the use of signal transfer member 300
Conventional optical cable (optical cable).Depending on the situation, also being transmitted to optical signal for optical cable will can be substituted
Other parts be used as signal transfer member.In addition, if perceptual signal can be transmitted according to the species and characteristic of perceptual signal,
Then a variety of transfer members can be used according to required condition and design pattern.
Described in content as the aforementioned, other ends of the signal transfer member 300 are exposed to the bottom surface of substrate parts.Due to
Film 128 is configured with the bottom of the substrate parts, therefore, film 128 can be formed by the transparent translucency material of optical signal, with
It will pass through perceptual signal (optical signal) pierceable membrane 128 that signal transfer member 300 is transmitted.For example, the film 128 can be by
The transparent transparent material of optical signal is formed.Depending on the situation, if film there can be translucency, may also comprise in film
Some opaque degree.
As shown in figure 5, according to the composition, the optical signal sent from substrate detecting sensor 200 can be transmitted by signal
Part 300 is sent to the bottom surface (bottom surfaces of substrate parts) of carrier head 120, and the light letter reflected on the surface of substrate 10
Number it can be retransferred according to signal transfer member 300 to substrate detecting sensor 200, and substrate detecting sensor 200 receives
Optical signal, so as to whether perceive the attachment of substrate 10.
In addition, alarm generating unit 400 may include according to chemical mechanical polishing device of the present utility model, if the substrate sense
Know that the perceptual signal of sensor 200 is not transferred on the substrate 10, then the alarm generating unit 400 produces alarm signal.
If, can in the case of in the absence of other alarm signal on the contrary, perceive substrate 10 by substrate detecting sensor 200
Substrate 10 is transferred by carrier head 120.
Here, so-called alarm signal may include according to the alarm signal of the sense of hearing of conventional audio unit and according to normal
It is at least one in the alarm signal of the vision of warning etc..In addition, other a variety of alarm signals can also be used, it is described
Other a variety of alarm signals may be such that the situation that operating personnel are not perceived to substrate 10 is identified.
In addition, it may be provided with sealing between the outside of the carrier head 120 and the outside of substrate detecting sensor 200
Part 320, and the signal transfer member 300 in the form of can passing through the inside of seal member 320 to be configured.It is described
Seal member 320 prevent between carrier head 120 and substrate detecting sensor 200 because signal transfer member 300 is exposed and
Caused light loss and scattering, thus it can prevent due to light loss and the perception characteristic of caused substrate detecting sensor 200
Lowly.
The seal member 320 can be arranged to a variety of constructions according to required condition and design pattern, and this practicality is new
Type is not limited or limited by the construction and characteristic of seal member 320.
In addition, Fig. 6 and Fig. 7 are according to chemical mechanical polishing device of the present utility model, it is to be used to illustrate that substrate perceives biography
The figure of the variation of sensor 200 and signal transfer member 300.Also, for foregoing composition identical and most of phase
Same part, gives identical or most of identical reference numeral, and omit detailed description thereof.
The substrate detecting sensor 200 and signal transfer member 300 can be set according to required condition and design pattern
It is set to a variety of quantity and arrangement.
Reference picture 6 and Fig. 7, the substrate detecting sensor 200 and signal transfer member 300 can be can independently enter
The form of row sensing (sensing) sets multiple on carrier head 120.Here, so-called multiple substrate detecting sensors 200
And signal transfer member 300 independently carries out sensing and can be regarded as multiple substrate detecting sensors 200 and signal transport unit
Part 300 perceives substrate in mutually different position and whether adhered to respectively.
For example, referring to Fig. 6, multiple signal transfer members 300 of multiple substrate detecting sensors 200 its is connected to
In other words he, can be provided at end in the bottom surface of substrate parts along the radial direction of carrier head 120 along radial direction with interval
The form of spacing is set.
Another example, reference picture 7, it is connected to multiple signal transfer members 300 of multiple substrate detecting sensors 200
Circumferencial direction of other ends along carrier head 120, in other words, circumferentially may be configured as in the bottom surface of substrate parts
The arrangement of annular state is formed in the form of interval provides spacing.Depending on the situation, multiple substrates are connected to and perceive biography
Other ends of multiple signal transfer members of sensor also can the bottom surface of substrate parts circumferentially and radial direction with
Every form configuration.
In addition, Fig. 8 is the block diagram for illustrating the control method according to chemical mechanical polishing device of the present utility model.And
And for foregoing composition identical and most of identical part, give identical or most of identical with reference to mark
Number, and omit detailed description thereof.
Reference picture 8, chemical mechanical polishing device includes：Carrier head 120；Substrate detecting sensor 200, it is installed on described
The outside of carrier head 120 and receive and dispatch the perceptual signal for being perceived to the substrate 10 for being attached to carrier head 120；Signal passes
Part 300 is sent, its one end is connected to the substrate detecting sensor 200, and other ends are exposed to the carrier head for being attached with substrate 10
120 bottom surface, and perceptual signal is transmitted, the chemical mechanical polishing device can be by walking including attachment steps S10 with perceiving
Rapid S20 is controlled, and substrate 10 is attached to the carrier head 120, the perception step S20 profits by the attachment steps S10
The perceptual signal transmitted by signal transfer member 300 is perceived with the substrate detecting sensor 200, is so as to perceive
It is no substrate 10 to be present.
Step 1：
First, substrate 10 is attached to the carrier head 120 (S10).
In the attachment steps S10, the support (not shown) of (loading)/unloading (unloading) unit is loaded
Or the substrate 10 being positioned on grinding pad can be attached to carrier head 120.For example, in the attachment steps S10, loading is positioned over
In the case that the substrate of the support of unit is attached to carrier head, the supports of load units can be with the height that has set to moving up
It is dynamic, and after support is moved upward to the height set, can be attached by substrate by the suction pressure as caused by carrier head
In the bottom surface of the film of carrier head.
As reference, the arrangement of the substrate detecting sensor 200 and signal transfer member 300 can be according to required
Condition and design pattern be installed on multiple positions of carrier head 120.For example, the carrier head 120 may include：Body, its
Set in the form of rotatable；Basal part, it is configured to rotate jointly with the body；Film 128, it is arranged at described
The bottom surface of basal part, and substrate detecting sensor 200 is mountable to the top of body, and the signal transfer member 300
One end may pass through the inner side of carrier head 120 and be connected to substrate detecting sensor 200, the signal transfer member 300 its
His end can be exposed to the bottom surface of basal part.
The substrate detecting sensor 200 is configured to the perceptual signal that transmitting-receiving is used to perceive substrate 10.Here, institute
The perceptual signal of meaning can transmit the optical signal of signal using light as medium.Preferably, perceptual signal can be it will be seen that light
At least any one optical signal utilized as medium in line and infrared ray.
The substrate detecting sensor 200 can use multiple sensors according to required condition and design pattern.For example, make
The optical sensor as element can be used for the substrate detecting sensor 200, the optical sensor as element believes light
Number be converted to electronic signal and detected.Also, it can be used as the signal transfer member 300 and optical signal can be passed
The conventional optical cable (optical cable) sent.
In addition, film 128 can be formed by the transparent translucency material of optical signal, will pass through the signal transfer member
300 perceptual signal transmitted (not shown) pierceable membranes 128.
Step 2：
Next, perceive the sense transmitted by signal transfer member 300 using the substrate detecting sensor 200
Signal is known, so as to perceive with the presence or absence of substrate 10 (S20).
In the perception step S20, the optical signal sent from substrate detecting sensor 200 can pass through signal transfer member
300 are sent to the bottom surface (bottom surfaces of substrate parts) of carrier head 120, and the optical signal reflected on the surface of substrate 10
It can be retransferred according to signal transfer member 300 to substrate detecting sensor 200, and substrate detecting sensor 200 can receive
Optical signal, so as to whether perceive the attachment of substrate 10.
In the perception step S20, if substrate 10 is perceived S22, substrate can be transferred using carrier head 120, and
And if substrate 10 is not perceived S24, can stop the transfer of substrate 10.
In addition, in the utility model, it may include alarm produces step S30, if being perceived by substrate detecting sensor 200
To at the bottom surface of carrier head 120 substrate be not perceived, then cause alarm signal produce.If on the contrary, in substrate perceives step
Substrate is perceived, then in the case of in the absence of other alarm signal, substrate can be transferred by carrier head 120.
As described above, be illustrated with reference to preferred embodiment of the present utility model, it is to be understood that, affiliated technology
The skilled practitioner in field can not depart from thought of the present utility model and field described in following claims scope
In the range of various modifications and changes are carried out to the utility model.
Label declaration
110：Grinding flat plate 111：Grinding pad
120：Carrier head 122：Body
124：Basal part 126：Retainer plate
128：Film 200：Substrate detecting sensor
210：Illuminating part 220：Light absorbing part
230：Amplification portion 300：Signal transfer member
320：Seal member 400：Alarm generating unit.
Claims (12)
- A kind of 1. chemical mechanical polishing device, it is characterised in that including：Carrier head；Substrate detecting sensor, it is installed on described The outside of carrier head and the perceptual signal for being perceived to substrate is received and dispatched, the substrate is attached to the carrier head；Letter Number transfer member, its one end are connected to the substrate detecting sensor, and other ends are exposed to the carrier head for being attached with substrate Bottom surface.
- 2. chemical mechanical polishing device according to claim 1, it is characterised in that described the one of the signal transfer member End is through the inner side of the carrier head and is connected to the substrate detecting sensor.
- 3. chemical mechanical polishing device according to claim 1, it is characterised in that the carrier head includes：Body, its Set in the form of rotatable；Basal part, it is configured to rotate jointly with the body；Film, it is arranged at the base The bottom surface of bottom, other described ends of the signal transfer member are exposed to the bottom surface of the basal part.
- 4. chemical mechanical polishing device according to claim 3, it is characterised in that the substrate detecting sensor is installed on The top of the body.
- 5. chemical mechanical polishing device according to claim 3, it is characterised in that the perceptual signal is using light as matchmaker It is situated between to transmit the optical signal of signal, and the film can be formed by the transparent translucency material of the optical signal.
- 6. chemical mechanical polishing device according to claim 5, it is characterised in that the perceptual signal will be seen that light with And at least one in infrared ray utilized as medium.
- 7. chemical mechanical polishing device according to claim 1, it is characterised in that the substrate detecting sensor is that light passes Sensor, and the signal transfer member is optical cable.
- 8. chemical mechanical polishing device according to claim 1, it is characterised in that the substrate detecting sensor and institute State signal transfer member set in the form of it can independently be sensed on the carrier head it is multiple.
- 9. chemical mechanical polishing device according to claim 8, it is characterised in that the institute of multiple signal transfer members Circumferencial direction or radial direction of other ends along the carrier head is stated to configure in the form of interval.
- 10. chemical mechanical polishing device according to claim 1, it is characterised in that the substrate detecting sensor includes Illuminating part and light absorbing part, the illuminating part send optical signal, and the light absorbing part is to the optical signal that is reflected from the substrate Received.
- 11. chemical mechanical polishing device according to claim 1, it is characterised in that also including alarm generating unit, if described The perceptual signal of substrate detecting sensor is not transferred on the substrate, then alarm generating unit produces alarm signal.
- 12. chemical mechanical polishing device according to claim 1, it is characterised in that also including seal member, the sealing Part is arranged between the outside of the carrier head and the outside of the substrate detecting sensor, and with the signal transport unit Part configures through internal form.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2015-0182012 | 2015-12-18 | ||
| KR1020150182012A KR20170073816A (en) | 2015-12-18 | 2015-12-18 | Chemical mechanical polishing apparatus and control method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206825189U true CN206825189U (en) | 2018-01-02 |
Family
ID=59280010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620884045.4U Active CN206825189U (en) | 2015-12-18 | 2016-08-15 | Chemical mechanical polishing device |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20170073816A (en) |
| CN (1) | CN206825189U (en) |
-
2015
- 2015-12-18 KR KR1020150182012A patent/KR20170073816A/en not_active Application Discontinuation
-
2016
- 2016-08-15 CN CN201620884045.4U patent/CN206825189U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170073816A (en) | 2017-06-29 |
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