CN208929972U - Pressure-detecting device and substrate grinding system comprising it - Google Patents
Pressure-detecting device and substrate grinding system comprising it Download PDFInfo
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- CN208929972U CN208929972U CN201821330472.3U CN201821330472U CN208929972U CN 208929972 U CN208929972 U CN 208929972U CN 201821330472 U CN201821330472 U CN 201821330472U CN 208929972 U CN208929972 U CN 208929972U
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- pressure
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- detecting device
- carrier
- substrate carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Disclose pressure-detecting device and the substrate grinding system comprising it.It according to being configured in the movement routine of the substrate carrier to the pressure-detecting device for the substrate carrier that substrate is clamped and is moved for one embodiment, is pressurizeed by the substrate carrier, it is possible thereby to detect the pressure of the substrate carrier.
Description
Technical field
Embodiment below is related to a kind of pressure-detecting device and the substrate grinding system comprising it.
Background technique
In general, the manufacturing process of substrate executes CMP (Chemical mechanical polishing, chemical machinery
Grinding) technique.It is well known that CMP process is by making substrate carry out relative rotation relative to grinding flat plate come to substrate
The standard technology that surface is ground.
In order to enable substrate is rotated relative to grinding flat plate, needs for clamping substrate and substrate is stressed on into grinding
The device of plate.The device of clamping substrate is provided with the pressure chamber for clamping (chucking) or the substrate that pressurizes.In addition,
Substrate is detached from during the grinding process in order to prevent, and the device of clamping substrate is provided with the retaining ring of package substrate peripheral regions.
The quality of substrate is required according to the uniformity coefficient of the lapping degree for substrate entirety.In order to keep the grinding of substrate
The uniformity carries out the device of different set using the pressure that each region of opposite substrate applies.It is obtained according to by experiment
Profile determine the pressure for being applied to each region, in fact, if the pressure for being applied to substrate is de- from the pressure limit of setting
From, then can occur substrate the grinding uniformity reduce the problem of.In addition, the abrasion of the retaining ring caused by grinding is also to reduce base
The reason of plate fringe region lapping degree.
So truth is the work for needing to carry out the pressure for being applied to substrate to detect and can be confirmed the damage of device accordingly
Skill.
Utility model content
The purpose of embodiment is, provide pressure-detecting device that the pressure of a kind of pair of substrate carrier is detected and comprising
Its substrate grinding system.
The purpose of embodiment is, provides a kind of pressure of damage that device can be confirmed during substrate grinding technics
Detection device and substrate grinding system comprising it.
Institute is configured at according to the pressure-detecting device of the substrate carrier for being clamped and moving to substrate of one embodiment
It states in the movement routine of substrate carrier, is pressurizeed by the substrate carrier, it is possible thereby to detect the pressure of the substrate carrier
Power.
A side, the pressure-detecting device may include: loading part, be used to load the substrate carrier；With
And pressure sensor, it is set to loading part.
A side, the loading part can have the area for covering the retaining ring of the substrate carrier.
A side, in the state that the substrate carrier is loaded into loading part, the pressure sensor can be with right
It is formed in the form that each pressure of each pressure chamber of the substrate carrier measures and is configured at the loading part.
A side, the pressure sensor can be to configure with the facing form of the retaining ring of the substrate carrier
In the loading part.
A side, the pressure-detecting device detects the pressure of the multiple regions of the substrate carrier, can
To generate the pressure distribution for the substrate carrier.
A side, the multiple region may include each pressure chamber and the holding for being formed in the substrate carrier
Ring.
A side, each normal pressure of the pressure-detecting device to the multiple regions for the substrate carrier
Range is set, if caution signal can be generated departing from the typical pressure range in the pressure of the detection.
A side, the pressure-detecting device pair normal pressure corresponding with the thickness of the retaining ring is set
It is fixed, the pressure generated by the pressurization of the retaining ring is compared with the normal pressure, so as to measure the holding
The thickness of ring.
It may include: grinding stations according to the substrate grinding system of one embodiment comprising grinding flat plate, grinding flat plate peace
Equipped with grinding pad and carry out rotation process；Substrate carrier, with the state of clamping substrate along the path of setting to the grinding
Plate is mobile；And pressure-detecting device, it is configured on the path, is pressurizeed by the substrate carrier, thus examined
Survey the pressure of the substrate carrier.
A side, the substrate carrier may include: carrier head；Diaphragm is connected to the carrier head, to clamp
The form of the substrate forms pressure chamber；And retaining ring, in the form of surrounding the substrate surrounding clamped by the diaphragm
It is connected with the carrier head.
A side, the substrate carrier can also include rotary joint, and rotary joint to the pressure chamber to apply
Stressed form is connected to the carrier head.
A side, the movement routine of the substrate carrier can form closed loop tracks, and closed loop tracks are formed in grinding
On standing.
A side, the movement routine of the substrate carrier can be the circuit orbit formed centered on axis.
A side, the substrate carrier can be loaded into the pressure-detecting device, and the pressure-detecting device exists
It is mounted in the state of the substrate carrier, the substrate carrier can detecte by the substrate carrier pressure applied
The pressure of each region.
A side, the pressure-detecting device can be to added by the region and the retaining ring that the diaphragm is pressurizeed
The pressure in the region of pressure is detected.
A side, the pressure-detecting device includes: pressure sensor, measures pressure；Operational part, will be described
The pressure of measurement is compared with the pressure of setting；And alarm portion, generate alarm.If the pressure of the measurement and setting
The difference of pressure is above standard value, then the alarm portion can provide the police whether region for the value that is above standard is replaced
Report.
Pressure-detecting device according to the embodiment and it can detecte comprising its substrate grinding system and act on substrate carrier
Pressure and confirm whether device damages.
For pressure-detecting device according to the embodiment and substrate grinding system comprising it, even if not interrupting substrate
Grinding technics is it can be identified that whether device damages.
Pressure-detecting device according to the embodiment and effect comprising its substrate grinding system are not limited to above mention
And effect, unmentioned other common technical staff of effect can it is based on following record is explicitly understood.
Detailed description of the invention
The following drawings for being additional to this specification instantiates preferred one embodiment of the utility model, plays further
Understand the effect of the detailed description of the utility model and the technical idea of the utility model, therefore, the utility model cannot be solved
It is interpreted as only being defined in the item for being recorded in the attached drawing.
Fig. 1 is the ideograph according to the substrate grinding system of one embodiment.
Fig. 2 is the sectional view of the substrate carrier and grinding flat plate according to one embodiment.
Fig. 3 is the sectional view of the substrate carrier and pressure-detecting device according to one embodiment.
Fig. 4 is the figure for showing the pressure detecting position according to the pressure-detecting device of one embodiment.
Fig. 5 is the figure for showing the pressure detecting position according to the pressure-detecting device of one embodiment.
Fig. 6 is the block diagram according to the pressure-detecting device of one embodiment.
Fig. 7 is the ideograph according to the substrate grinding system of one embodiment.
Specific embodiment
Hereinafter, embodiment is described in detail by the attached drawing illustrated.It is additional in the constituent element to each attached drawing
When reference numeral, it should be noted that identical constituent element is directed to, even if coming across on different attached drawings, also as much as possible
Make it have identical label.In addition, when illustrating embodiment, judgement think for it is relevant it is known constitute or function it is specific
When illustrating to interfere the understanding for embodiment, detailed description thereof is omitted.
Also, when illustrating the constituent element of embodiment, the terms such as first, second, A, B, (a), (b) can be used.In this way
Term be only intended to difference this composition element and other constituent elements, not by the term to the essence of corresponding constituent element
Or order or sequence etc. are defined.A certain constituent element " connection ", " in conjunction with " or " engagement " is recorded to want in others composition
When plain, this composition element can be directly connected to or be engaged in other constituent elements, it is to be understood, however, that each constituent element it
Between " can also connect ", " in conjunction with " or " engagement " other constituent element again.
For being included in the constituent element of any one embodiment and constituent element including common function, in other realities
It applies in example and is illustrated using identical title.As long as no opposite to that record, recorded in any one embodiment
Illustrate to be readily applicable to other embodiments, omits specific description in duplicate range introspection.
Fig. 1 is according to the ideograph of the substrate grinding system of one embodiment, and Fig. 2 is carried according to the substrate of one embodiment
The sectional view of body and grinding flat plate, Fig. 3 are the sectional views of the substrate carrier and pressure-detecting device according to one embodiment.
Referring to figs. 1 to Fig. 3, for the substrate grinding system 1 according to one embodiment, in order to can be multiple with simultaneous grinding
Substrate W acts on substrate carrier 110 by detection during the path along setting moves substrate carrier 110
Pressure carrys out the damage of sensing device, so that the productivity of technique improves.
Substrate W can be the silicon wafer for manufacturing semiconductor device.But the type of substrate W is not limited to this.Than
Such as, substrate W is also possible to for such as liquid crystal display (LCD, liquid crystal display), plasma display panel
The glass of the flat panel display equipment (FPD, flat panel display device) of (PDP, plasma display panel)
Glass.In addition, substrate W, w is shown in the attached drawings with circular shape, but this is only to facilitate explanation and the illustration that carries out,
The shape of substrate W is not limited to this.
Substrate grinding system 1 according to one embodiment may include: grinding stations 100, substrate carrier 110, load units
140, unloading unit 130,140, pressure-detecting device 120.
Grinding stations 100 can provide the grinding space for the multiple substrate W of simultaneous grinding.Substrate W is transferred to grinding stations
100, grinding stations 100 can be made to be ground while movement along the path of setting.Grinding stations 100 may include along setting
Multiple grinding flat plates 101 of fixed path configuration.
In order to grind to substrate W, grinding flat plate 101 can be set to the station substrate W in the form that can be rotated.Grinding
The rotary shaft of plate 101 can be perpendicular to ground.Grinding pad 1011 can be attached to the top of grinding flat plate 101, grinding pad
1011 and substrate W is in contact and the surface to be polished of grinding base plate W.Flexible material can be set in the lower part of grinding pad 1011
Permanent layer (backing layer) (not shown).
Multiple grinding flat plates 101 can fitly be arranged along circulating path, and circulating path includes rectilinear orbit and curve rail
Road simultaneously forms closed loop.Substrate W is clamped and transferred to grinding flat plate 101 along circulating path by aftermentioned underlying carrier 110,
So as to execute grinding.Due to being provided with multiple grinding flat plates 101, so can be multiple with simultaneous grinding in grinding stations 100
Substrate W.In addition, substrate W can also successively be ground by the multiple grinding flat plates configured along multiple circulating paths.It omits and this phase
The content of pass.
Substrate carrier 110 with clamping substrate W and can be moved.Substrate carrier 110 can be along setting in grinding stations 100
Substrate W is transferred to grinding flat plate 101 while path is mobile.At this point, substrate carrier 110, which is formed by movement routine, can be shape
At in the closed loop tracks in grinding stations 100.Substrate carrier 110 is located in the state of grinding flat plate 101, and substrate carrier 110 makes
Substrate W is contacted with grinding flat plate 101, so as to the surface to be polished of grinding base plate W.Substrate carrier 110 may include: carrier head
111, diaphragm 112, retaining ring 113 and rotary joint 115.
Carrier head 111 obtains the power provided, so as to be moved along the path of the setting in grinding stations 100.
Carrier head 111 can along be located at and the plane of the level of grinding pad 1011 on first direction and vertical with first direction second
Direction is mobile.Carrier head 111 can be so that substrate W connects with grinding flat plate 101 while vertically movement relative to ground
The form of touching is moved.In addition, carrier head 111 can make substrate W relative to grinding while pivoting about with axis
Plate 101 is polished to be rotated.
Diaphragm 112 is connected to the lower part of carrier head 111, and the pressure for clamping substrate W can be formed in carrier head 111
Power chamber 114.Diaphragm 112 may include: circular seating surface, towards the face substrate W；Extension, it is vertical with seating surface.With
The center of seating surface is standard, is formed with multiple extensions in the form of forming concentric circles, is mutually distinguished it is possible thereby to be formed
Multiple pressure chamber 114a, 114b, 114c.In other words, the seating surface of diaphragm 112 can be made to be divided by extension
Multiple regions.
Diaphragm 112 can be with the non-abrasive side of clamping substrate W by seating surface.Specifically, if to diaphragm 112 each pressure
Chamber 114 applies negative pressure, then vacuum is formed between the seating surface of diaphragm 112 and the face substrate W, so that substrate W can be by diaphragm 112
Clamping.In addition, substrate W can be along the side far from diaphragm 112 if applying positive pressure to each pressure chamber 114 of diaphragm 112
To being under pressure.So substrate W can be stressed on to grinding pad 1011 by the positive pressure for being applied to pressure chamber 114.Especially
Its, in the case where being provided with multiple pressure chamber 114, according to the pressure of each pressure chamber 114, each position of substrate W
Compression levels can be different.
Retaining ring 113 can be connected to carrier head 111 in the form of surrounding by the surrounding for the substrate W that diaphragm 112 clamps
Lower outside.Retaining ring 113 can play the role of keeping the position of substrate W, to prevent the substrate W clamped by diaphragm 112
It is detached from during the grinding process from carrier head 111.
Rotary joint 115 can by pressure chamber 114 apply it is stressed in the form of be connected to carrier head 111.Rotary joint
115, which are connected to diaphragm 112, is formed by multiple pressure chamber 114a, 114b, 114c, can be individually to each pressure chamber
Room 114 provides pressure.
Multiple substrate carriers 110 can be set.For example, substrate carrier 110 with be set to the multiple of grinding stations 100 and grind
It polishes the identical number of plate 101 to be formed, multiple grinding flat plates 101 can be with the multiple substrate W of simultaneous grinding.But unlike this, base
Onboard body 110 can be set to the number more than the number than grinding flat plate 101.At this point, if complete in a grinding flat plate 101
At substrate W grinding and unload carried base board W, then will be supplied immediately by the substrate W of other 110 clampings of substrate carrier to grinding flat plate
101, thus prevent grinding technics from interrupting during unloading completes the substrate W of grinding and loads new substrate W, hereby it is possible to
So that the efficiency and productivity of grinding technics are improved.
Substrate W can be led to grinding stations 100 or from grinding stations by load units 140 and unloading unit 130,140
100 move out substrate W.Substrate W before grinding can be loaded into the movement routine of substrate carrier 110 by load units 140.It loads single
The substrate W that member 140 is loaded can be transferred in the state of being clamped by substrate carrier 110 to grinding flat plate 101.Unloading unit
130,140 can obtain by substrate carrier 110 transmit Lai the substrate W that has ground of completion and shifting by the substrate W from substrate W
Dynamic path moves out.
Pressure-detecting device 120 can detecte the pressure of substrate carrier 110.Pressure-detecting device 120 can be set in grinding
Mill station 100.Pressure-detecting device 120 can be configured on the mobile path of substrate carrier 110.If substrate carrier 110 is located at pressure
The top of force checking device 120, then pressure-detecting device 120 is pressurizeed by substrate carrier 110, it is possible thereby to detect substrate
The pressure of carrier 110.
Fig. 4 and Fig. 5 is the figure for showing the pressure detecting position of the pressure-detecting device 120 according to one embodiment.
Referring to Fig. 4 and Fig. 5, it is each that the region division pressurizeed by substrate carrier 110 is that multiple regions and detecting are applied to
The pressure in region, accordingly, pressure-detecting device 120 can detecte the pressure of each region for substrate carrier 110.Pressure inspection
Surveying device 120 may include loading part 120 and pressure sensor 122.
Substrate carrier 110 can be loaded into loading part 121.Loading part 121 can have the holding of hiding substrate carrier 110
The area of ring.In other words, loading part 121 can have the area bigger than the substrate W clamping region of substrate carrier 110.It can be with
In the form of corresponding with the multiple regions of substrate carrier 110 by loading part be divided into multiple regions 121a, 121b, 121c,
121d。
Pressure sensor 122 is set to loading part 121, can detecte the pressure that substrate carrier 110 is applied to loading part 121
Power.Pressure sensor 122 is applied in the state that substrate carrier 110 is loaded into loading part 121 by substrate carrier 110
Pressure can detecte out the pressure of each region for substrate carrier 110.It is provided with multiple pressure sensors 122, multiple pressures
Force snesor 122 can be set to loading part in the form of detecting simultaneously for the pressure of the multiple regions of substrate carrier 110
Each region.Multiple regions may include being formed in 113rd area of each pressure chamber 114 and retaining ring of substrate carrier 110
Domain.For example, the pressure of each region of 122 measuring diaphragm 112 of pressure sensor, is carried so as to detect by being formed in substrate
The pressurized pressure of each pressure chamber 114 of body 110.In addition, pressure sensor 122 is with the retaining ring 113 with substrate carrier
Facing form is configured at loading part 121, so as to measure the pressure in the region being pressurized by retaining ring 113.
Pressure-detecting device 120 can set the respective normal pressure model for the multiple regions pressurizeed by substrate carrier 110
It encloses.At this point, if it is detected that pressure be detached from set typical pressure range, pressure-detecting device 120 can recognize
Substrate carrier 110 is abnormal and generates caution signal.For example, if the pressure in region corresponding with a pressure chamber 114
The pressure not up to set then identifies that substrate W does not pass through substrate carrier 110 and sufficiently pressurizeed, and can be understood as in phase
114 position of pressure chamber is answered to be abnormal.
Pressure-detecting device 120 is to the state of retaining ring 113, for example, the thickness of retaining ring 113 is measured, thus
The information for being directed to and whether replacing retaining ring 113 can be generated.During substrate W is contacted with grinding flat plate and is ground, keep
Ring 113 can also be contacted with grinding flat plate and be worn together.During grinding multiple substrate W, the mill of retaining ring 113
Damage degree may be impacted to the lapping degree of the fringe region of substrate W.Because the thickness of retaining ring 113, which is more reduced, passes through guarantor
The pressurization of support ring 113 and the intensity of pressure that detects is lower, so can detecte the abrasion of retaining ring 113 by pressure detecting
Degree and whether need replacing.For example, in the state of 110 moulding pressure detection device 120 of substrate carrier, pressure detecting dress
It sets 120 and sets normal pressure corresponding with the thickness of retaining ring 130 for the region that retaining ring 113 is pressurizeed, will actually lead to
The pressurization of retaining ring 113 is crossed and the pressure that detects is compared with normal pressure, it is possible thereby to measure the thickness of retaining ring 113.
Pressure-detecting device 120 detects the pressure of the multiple regions for substrate carrier 110 by pressure sensor 122
Power, and the pressure distribution for each region of substrate carrier 110 can be generated.Compare each region of substrate W simultaneously as a result,
Pressure, so as to easily verify that specific region whether excessively pressurized or understressed.
Pressure-detecting device 120 individually detects the pressure for the multiple pressure chamber for being formed in substrate carrier 110,
Whereby it was confirmed that whether pressure leakages occur in each pressure chamber.For example, applying identical pressure to multiple pressure chamber
When power, the case where detecting different pressure in specified pressure chamber by pressure-detecting device 120, it can be understood as in phase
It answers and pressure leakages occurs in pressure chamber.
Fig. 6 is the block diagram according to the pressure-detecting device 120 of one embodiment.
Referring to Fig. 6, the pressure-detecting device 120 according to one embodiment may include pressure sensor 122, operational part and
Alarm portion.
Pressure sensor 122 can detecte the pressure for being applied to pressure-detecting device 120.Pressure sensor 122 can be with
Various ways measure pressure.For example, pressure sensor 122 can be piezoelectric transducer, optical vortex sensor etc..But this
It is only example, the mode that pressure sensor 122 measures pressure is not limited to this.Multiple pressure sensors 122 are provided with, it is multiple
Pressure sensor 122a, 122b, 122c can measure the pressure for being applied to each position of pressure-detecting device 120.
The pressure measured by pressure sensor 122 can be compared by operational part 123 with the pressure of setting.Setting
Pressure can be the goal pressure that each region of substrate carrier 110 is applied to according to grinding profile.
The pressure of actual measurement is compared by alarm portion 124 with the pressure of setting, if the pressure of the pressure of measurement and setting
Power difference is above standard value, then can provide the alarm whether region for the value that is above standard is abnormal.For example, if in retaining ring
The pressure at 113 positions is abnormal, then can be understood as the needs of retaining ring 113 and be replaced.On the contrary, if in pressure chamber 114
Position is abnormal, then can be understood as diaphragm 112 and be damaged or pressure leakages occur in substrate carrier 110.
Fig. 7 is the ideograph according to the substrate grinding system of one embodiment.
Referring to Fig. 7, the substrate grinding system 2 according to one embodiment may include grinding stations 200, substrate carrier 210, dress
Carrier unit 230, unloading unit 240, pressure-detecting device 220 and control unit.
Grinding stations 200 may include multiple grinding flat plates 201 for grinding base plate W.
Substrate carrier 210 makes multiple grinding flat plates 201 successively move along path while moving in grinding stations 200
Substrate W is transferred.At this point, the movement routine of substrate carrier 210 can be the circuit orbit formed centered on axis.Example
Such as, multiple substrate carriers 210 are provided with, multiple substrate carriers 210 are moved centered on axis along circuit orbit, while can be made
Multiple grinding flat plates 201 are obtained successively to move.
Pressure-detecting device 220 is configured on the mobile path of substrate carrier 210, is pressurizeed by substrate carrier 210,
So as to detect the pressure of substrate carrier 210.
Control unit can control whole techniques of substrate grinding system.For example, control unit can control carrier head or grind
Polish the operation of plate.
When control unit confirms that device is abnormal based on the detected value as measured by pressure-detecting device, Ke Yizhong
The operation of the disconnected device being abnormal.For example, by pressure-detecting device, the pressure mean values of each pressure chamber of carrier head
When the stop value not up to set, control unit can control respective carrier head operation and respective carrier head locating for grinding flat plate
Operation.As a result, interrupting the operation for the carrier head for detecting abnormal pressure by the operation of control unit, base thus it can be prevented that
Dash-board injury.
According to structure as described above, during substrate carrier moves for grinding base plate and towards grinding flat plate, lead to
Crossing the pressure-detecting device being configured on path can detecte the pressure of substrate carrier, even if thus not interrupting the grinding work of substrate
Skill can also simply confirm the state that whether substrate carrier is abnormal and the pressure for grinding base plate is distributed.Thus
The productivity of substrate grinding technics can be made to be substantially improved.
Although embodiment is illustrated by the attached drawing limited as described above, but if being had in relevant art field
There is the technical staff of general knowledge, then can carry out various modifications and change based on the record.For example, i.e. use with it is described
The different sequence of bright method executes the technology of explanation, and/or the constituent element of the structure of explanation, device etc. combined or
Group is combined into the different form of method from explanation, or is substituted or replaced with others constituent elements or equipollent, can also be with
Reach suitable result.
Label declaration
W: substrate
T: movement routine
100: grinding stations
101: grinding flat plate
110: substrate carrier
120: pressure-detecting device.
Claims (20)
1. a kind of pressure-detecting device, is the pressure-detecting device of substrate carrier, substrate carrier is clamped and moves to substrate
It is dynamic,
The pressure-detecting device is configured in the movement routine of the substrate carrier, is pressurizeed by the substrate carrier,
Thus the pressure of the substrate carrier is detected.
2. pressure-detecting device according to claim 1, the pressure-detecting device include:
Loading part is used to load the substrate carrier；And
Pressure sensor is set to the loading part.
3. pressure-detecting device according to claim 2,
The loading part has the area for the retaining ring for covering the substrate carrier.
4. pressure-detecting device according to claim 2,
In the state that the substrate carrier is loaded into the loading part, the pressure sensor is to carry to being formed in the substrate
The form that each pressure of each pressure chamber of body measures is configured at the loading part.
5. pressure-detecting device according to claim 4,
The pressure sensor is configured at the loading part in the form facing with the retaining ring of the substrate carrier.
6. pressure-detecting device according to claim 1,
The pressure-detecting device detects the pressure of the multiple regions of the substrate carrier and is generated for the substrate
The pressure of carrier is distributed.
7. pressure-detecting device according to claim 6,
The multiple region includes each pressure chamber and the retaining ring for being formed in the substrate carrier.
8. pressure-detecting device according to claim 6,
The pressure-detecting device sets each typical pressure range of the multiple regions for the substrate carrier, if
The pressure of detection then generates caution signal departing from the typical pressure range.
9. pressure-detecting device according to claim 6,
The pressure-detecting device detects the pressure for each pressure chamber for being formed in the substrate carrier, and detects pressure
The pressure whether power not up to sets.
10. pressure-detecting device according to claim 6,
The pressure-detecting device pair normal pressure corresponding with the thickness of the retaining ring of the substrate carrier is set, will
The pressure and the normal pressure generated by the pressurization of the retaining ring is compared, to measure the thickness of the retaining ring.
11. a kind of substrate grinding system comprising:
Grinding stations comprising grinding flat plate, grinding flat plate are equipped with grinding pad and carry out rotation process；
Substrate carrier is moved along the path of setting to grinding flat plate with the state of clamping substrate；And
Pressure-detecting device is configured on the path, is pressurizeed by the substrate carrier, and the substrate is thus detected
The pressure of carrier.
12. substrate grinding system according to claim 11, the substrate carrier include:
Carrier head；
Diaphragm is connected with the carrier head, and pressure chamber is formed in the form of clamping the substrate；And
Retaining ring is connected by the form around substrate that the diaphragm clamps with the carrier head with surrounding.
13. substrate grinding system according to claim 12, the substrate carrier further include rotary joint,
Rotary joint by the pressure chamber apply it is stressed in the form of be connected with the carrier head.
14. substrate grinding system according to claim 12,
The movement routine of the substrate carrier forms closed loop tracks, and closed loop tracks are formed in grinding stations.
15. substrate grinding system according to claim 12,
The movement routine of the substrate carrier is the circuit orbit of formation centered on axis.
16. substrate grinding system according to claim 12,
The substrate carrier can be loaded into the pressure-detecting device,
The pressure-detecting device in the state of being mounted with the substrate carrier, by pressure that the substrate carrier applies come
Detect the pressure of each region of the substrate carrier.
17. substrate grinding system according to claim 16,
The pressure in the region that the region and the retaining ring that the pressure-detecting device pressurizes to the diaphragm are pressurizeed carries out
Detection.
18. substrate grinding system according to claim 17, the pressure-detecting device include:
Pressure sensor measures pressure；
The pressure of the measurement is compared by operational part with the pressure of setting；And
Alarm portion generates alarm,
The value if difference of the pressure of the pressure and setting of the measurement is above standard, the alarm portion provide the area for the value that is above standard
The alarm whether domain is abnormal.
19. substrate grinding system according to claim 12, further include:
The control unit of the operation of the substrate grinding system is controlled,
When the pressure mean values of each pressure chamber measured by the pressure-detecting device are not up to the stop value set, control
Portion processed stops the operation of the carrier head or grinding flat plate.
20. substrate grinding system according to claim 12, further include:
Load units load substrate to the movement routine of the substrate carrier；And
Unloading unit moves out the substrate for completing grinding from the movement routine.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2018-0038166 | 2018-04-02 | ||
| KR1020180038166A KR102130883B1 (en) | 2018-04-02 | 2018-04-02 | Pressure checking device and substrate polishing system comprising the same |
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| Publication Number | Publication Date |
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| CN208929972U true CN208929972U (en) | 2019-06-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821330472.3U Active CN208929972U (en) | 2018-04-02 | 2018-08-17 | Pressure-detecting device and substrate grinding system comprising it |
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| Country | Link |
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| KR (1) | KR102130883B1 (en) |
| CN (1) | CN208929972U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210237224A1 (en) * | 2020-01-17 | 2021-08-05 | Ebara Corporation | Polishing head system and polishing apparatus |
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| KR102566811B1 (en) * | 2021-10-12 | 2023-08-14 | (주)스펄스엠텍 | Antifouling apparatus for a vessel and control method using the same |
| KR102628016B1 (en) * | 2022-09-05 | 2024-01-23 | 김재중 | Operating method for grinding device comprising main tray and auxiliary tray each rotating |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6203414B1 (en) * | 1997-04-04 | 2001-03-20 | Tokyo Seimitsu Co., Ltd. | Polishing apparatus |
| JP3438874B2 (en) * | 2000-10-23 | 2003-08-18 | 株式会社東京精密 | Jig for calibration of wafer polishing apparatus and calibration apparatus |
| US20140141696A1 (en) * | 2012-11-21 | 2014-05-22 | Applied Materials, Inc. | Polishing System with In-Sequence Sensor |
| KR101516989B1 (en) * | 2013-08-12 | 2015-04-30 | 주식회사 케이씨텍 | Chemical mechanical polishing apparatus with improved accuracy of monitoring controlled pressure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20210237224A1 (en) * | 2020-01-17 | 2021-08-05 | Ebara Corporation | Polishing head system and polishing apparatus |
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| KR102130883B1 (en) | 2020-07-06 |
| KR20190115302A (en) | 2019-10-11 |
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