CN206814875U - Electroplanting device - Google Patents
Electroplanting device Download PDFInfo
- Publication number
- CN206814875U CN206814875U CN201720645276.4U CN201720645276U CN206814875U CN 206814875 U CN206814875 U CN 206814875U CN 201720645276 U CN201720645276 U CN 201720645276U CN 206814875 U CN206814875 U CN 206814875U
- Authority
- CN
- China
- Prior art keywords
- pilot trench
- cobalt
- liquid
- back pipe
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000007788 liquid Substances 0.000 claims abstract description 40
- 239000010941 cobalt Substances 0.000 claims abstract description 30
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 30
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 30
- 238000009434 installation Methods 0.000 claims abstract description 6
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 3
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 3
- 241001330002 Bambuseae Species 0.000 claims description 3
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 3
- 239000011425 bamboo Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 abstract description 35
- 239000011248 coating agent Substances 0.000 abstract description 29
- 238000000576 coating method Methods 0.000 abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 18
- 239000010949 copper Substances 0.000 abstract description 18
- 229910052802 copper Inorganic materials 0.000 abstract description 18
- 238000009713 electroplating Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 9
- 150000001868 cobalt Chemical class 0.000 abstract description 4
- 238000003754 machining Methods 0.000 abstract description 3
- 239000011159 matrix material Substances 0.000 abstract description 2
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- 229910017709 Ni Co Inorganic materials 0.000 description 2
- 229910003267 Ni-Co Inorganic materials 0.000 description 2
- 229910003262 Ni‐Co Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910001429 cobalt ion Inorganic materials 0.000 description 1
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Abstract
The utility model discloses a kind of electroplanting device, include a set of mother-son groove, the volume of female groove is twice of pilot trench, and the liquid back pipe of combination is provided with the pilot trench, the liquid back pipe one end is connected by return duct with female groove, and the female groove is connected by feed tube and the liquid feeding pump of installation with pilot trench；Also include corresponding to pilot trench with a peace times hour measuring pump for being used to mend cobalt, the port of export of the peace times hour measuring pump of the benefit cobalt.By using the design of mother-son groove, installation can adjust the return duct of plating liquid level in pilot trench simultaneously, descending liquid is carried out to pilot trench in electroplating process, using carrying out in different time adding cobalt content to cobalt salt during descending liquid, it is possible to achieve gradient distribution of the cobalt in coating.By above-mentioned electroplanting device, efficiently solve copper coin upper end liquid level area and come off problem, the adhesion of coating and matrix is more rationally added to cobalt distribution, has saved plating and machining operation and cost.
Description
Technical field
A kind of electroplanting device is the utility model is related to, it is specifically a kind of for copper plate of crystallizer nickel-cobalt alloy plating cobalt
The electroplanting device of gradient distribution.
Background technology
Original plating mode it is most commonly seen be the plating of drill traverse formula, copper plate of crystallizer integrally immerses one by this plating mode
In individual overall tank liquor, cobalt ions, whole crystallizer copper after which plating are supplemented to tank liquor according to the consumption of kilo-ampere hour
The thickness of plate coating is roughly the same, cobalt to be distributed in each position of coating more uniform.Because electrodeposited coating unreasonable structure is electroplated
Copper coin coating afterwards will be machined, because the copper coin integral thickness electroplated using drill traverse formula is identical, in order to meet to design
Taper is subsequently very big to the processing capacity of coating, wastes substantial amounts of material, adds the cost of product.Because crystallizer copper
The plating layer state of acquisition is wished in plate electroplating process is：The nickel-cobalt alloy plating stress initially electroplated is low, such coating and base
The adhesion of body is more preferable, and this part coating is as excessive layer.The coating stress that we are also wanted in the range of the 0-100mm of upper end is low,
Because very high to pour molten steel face area temperature apart from upper end 0-100mm positions, come off if coating stress is easily heated greatly；Electroplate
It is desirable that coating cobalt content can raise after excessive layer because this part is steel mill draw during steel using layer, it is necessary to height
Cobalt content and high coating hardness, particularly copper coin lower end coating, be key wear position because molten steel forms steel billet completely
Put；We need more plating a period of times after thickness of coating reaches design thickness, because in the very big plating of crystallizer copper plate suqare
It is difficult to ensure that thickness of coating is complete consistent, it is necessary to there is 0.2-0.3mm plating surplus, this parcel plating surplus is required for machinery
Processing removal belongs to useless coating, it is desirable to which the more low better consumption that can reduce plated material of this part cobalt content adds with follow-up
Work cost.As can be seen here, the plating of drill traverse formula is that copper coin coating upper end cobalt content difficult to realize is low, and lower end cobalt content is high；Coating bottom
Layer cobalt content is low, and intermediate layer cobalt content is high, machining layer cobalt content and low this structure.The plating of drill traverse formula is easy to get to upper and lower
Thickness of coating electrodeposited coating identical with cobalt content is held, causes very big waste, coating structure is unreasonable easily to occur coating suitable for reading
Come off.
The content of the invention
In view of the above-mentioned state of the art, the utility model provides a kind of electroplanting device, is controlled and tied by newly-designed coating bath
Cobalt content on brilliant device copper coin Ni-Co alloy layer different-thickness, so as to be obtained in the different thickness position of Ni-Co alloy layers
Different hardness, to meet use demand.
Electroplanting device of the present utility model, include a set of mother-son groove, female groove volume is twice of pilot trench, in the pilot trench
The interior liquid back pipe for being provided with combination, the liquid back pipe one end connected by return duct with female groove, and the female groove passes through feed tube and installation
Liquid feeding pump connects with pilot trench, in addition to a peace times hour measuring pump for being used to mend cobalt, the peace times hour metering of the benefit cobalt
The port of export of pump corresponds to pilot trench.Using copper plate of crystallizer as negative electrode during plating, fill nickel button titanium basket and be put into pilot trench as negative electrode
The plating of copper plate of crystallizer cobalt content layer is carried out in electroplate liquid.Mother-son groove is used to complete circulating for plating solution, heats, filters, adjusts
Whole and preparation plating solution is completed in female groove, is ensured that the parameter of plating solution in pilot trench can be more stable, is passed through liquid feeding pump in electroplating process
The circulating property of plating solution in mother-son groove is realized with return duct.
The structural casing that liquid back pipe is more piece " bamboo shape ", the length of each section liquid back pipe are installed in above-mentioned, in the pilot trench
To spend for 100mm, copper plate of crystallizer is fixed in plating, by adjusting the height of liquid back pipe, controls the height of plating solution liquid level,
So as to serve the purpose of control plating thickness.
Further, the both ends of each section liquid back pipe pass through variable-diameter interface grafting each other respectively.According to the need of each coating
Descending liquid is wanted, removing each section liquid back pipe by the stage respectively can be achieved descending liquid.
Using ampere-hour metering pump in above-mentioned middle signified electroplating process, cobalt salt is added according to kilo-ampere hour consumption,
Equipment add automatically be advantageous in that it is uniform and accurate.The switch of pump is measured in electroplating process by regulating and controlling ampere-hour, to control
Distribution of the cobalt processed in coating.
The beneficial effects of the utility model are：By using the design of mother-son groove, while install and can adjust in pilot trench
Section plating liquid level return duct, in electroplating process to pilot trench carry out descending liquid, using during descending liquid to cobalt salt in difference
Time carries out adding cobalt content, it is possible to achieve gradient distribution of the cobalt in coating.Thus, solve copper coin upper end liquid level area to come off
Problem, the adhesion of coating and matrix is more rationally added to cobalt distribution, it is important to saved plating and machining operation
And cost.
Brief description of the drawings
Fig. 1 is this new schematic diagram；
Fig. 2 is Fig. 1 liquid back pipe structural representations.
Embodiment
Below in conjunction with accompanying drawing embodiment, the utility model is described in further detail.
See the electroplanting device shown in Fig. 1, Fig. 2, include a grooving 1 and female groove 9, the volume of the female groove 9 is the two of pilot trench 1
Times.The liquid back pipe 3 of combination is provided with the pilot trench 1, the one end of liquid back pipe 3 is connected by return duct 7 with female groove 9, the mother
Groove 9 is connected by the liquid feeding pump 8 of feed tube 6 and installation with pilot trench 1.Also include with a peace times hour metering for being used to mend cobalt
Pump 5, the port of export of the peace times hour measuring pump 5 of the benefit cobalt correspond to the notch of pilot trench 1.During plating using copper plate of crystallizer 4 as
Negative electrode, fill nickel button titanium basket 2 and be put into progress copper plate of crystallizer cobalt content layer plating in the electroplate liquid of pilot trench 1 as negative electrode.The He of pilot trench 1
Female groove 9 is used to complete circulating for plating solution, heats, filters, adjusts and prepares plating solution and completed in pilot trench 1 and female groove 9, ensures
The parameter of plating solution can be more stable in pilot trench 1 and female groove 9, is realized in electroplating process by liquid feeding pump 8 and return duct 7 in mother-son groove
The circulating property of plating solution.In above-mentioned, the liquid back pipe 3 installed in pilot trench 1 described in the present embodiment is the structure of more piece " bamboo shape "
Sleeve pipe, the length of each section liquid back pipe 3 is 100mm, and copper plate of crystallizer is fixed in plating, by adjusting liquid back pipe 3
Highly, the height of plating solution liquid level is controlled, so as to serve the purpose of control plating thickness.In above-mentioned middle signified electroplating process
Using ampere-hour measure pump 5, according to kilo-ampere hour consumption add cobalt salt, equipment add automatically be advantageous in that it is uniform and accurate
Really.The switch of pump 5 is measured in electroplating process by regulating and controlling ampere-hour, to control distribution of the cobalt in coating.
Claims (3)
1. a kind of electroplanting device, it is characterized in that, include a set of pilot trench（1）And female groove（9）, female groove（9）Volume be pilot trench（1）
Twice, in the pilot trench（1）The interior liquid back pipe for being provided with combination（3）, the liquid back pipe（3）One end passes through return duct（7）With female groove
（9）Connection, the female groove（9）Pass through feed tube（6）And the liquid feeding pump of installation（8）With pilot trench（1）Connection；Also include that there is one
For mending the peace times hour measuring pump of cobalt（5）, the peace times hour measuring pump of the benefit cobalt（5）The port of export correspond to pilot trench（1）.
2. electroplanting device according to claim 1, it is characterized in that, the pilot trench（1）Middle installation liquid back pipe（3）For more piece
The structural casing of " bamboo shape ", each section liquid back pipe（3）Length be 100mm.
3. electroplanting device according to claim 2, it is characterized in that, each section liquid back pipe（3）Both ends pass through reducing respectively
Interface grafting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720645276.4U CN206814875U (en) | 2017-06-06 | 2017-06-06 | Electroplanting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720645276.4U CN206814875U (en) | 2017-06-06 | 2017-06-06 | Electroplanting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206814875U true CN206814875U (en) | 2017-12-29 |
Family
ID=60758880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720645276.4U Active CN206814875U (en) | 2017-06-06 | 2017-06-06 | Electroplanting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206814875U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108315782A (en) * | 2018-01-15 | 2018-07-24 | 江西芯创光电有限公司 | Improve the method for uniformity in a kind of plating |
-
2017
- 2017-06-06 CN CN201720645276.4U patent/CN206814875U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108315782A (en) * | 2018-01-15 | 2018-07-24 | 江西芯创光电有限公司 | Improve the method for uniformity in a kind of plating |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Electroplating device Effective date of registration: 20210423 Granted publication date: 20171229 Pledgee: Changjiang Technology sub branch of Qinhuangdao Bank Co.,Ltd. Pledgor: QINHUANGDAO HANFENG CHANGBAI CRYSTALLIZER Co.,Ltd. Registration number: Y2021980002952 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20171229 Pledgee: Changjiang Technology sub branch of Qinhuangdao Bank Co.,Ltd. Pledgor: QINHUANGDAO HANFENG CHANGBAI CRYSTALLIZER Co.,Ltd. Registration number: Y2021980002952 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Electroplating equipment Granted publication date: 20171229 Pledgee: Changjiang Technology sub branch of Qinhuangdao Bank Co.,Ltd. Pledgor: QINHUANGDAO HANFENG CHANGBAI CRYSTALLIZER Co.,Ltd. Registration number: Y2024990000106 |