CN104831326A - Electroplating method of continuous casting crystallizer copper plate heterogeneous alloy plating layer - Google Patents
Electroplating method of continuous casting crystallizer copper plate heterogeneous alloy plating layer Download PDFInfo
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Abstract
The invention belongs to the technical field of surface treatment for a continuous casting crystallizer copper plate. The invention discloses an electroplating method of a continuous casting crystallizer copper plate heterogeneous alloy plating layer, the step is as follows: first, the surface of the continuous casting crystallizer copper plate is preprocessed before plating, then comprehensive electroplating is performed under set technological conditions, when the thickness of the upper plating layer of the copper plate meets the process requirements, a liquid level sensor in a electroplating bath and a PLC servo control system control the electroplating liquid level to drop to a set position, the lower plating layer of the copper plate is electroplated, alloy elements are added into the electroplating liquid, and when the thickness of the lower plating layer meets the process requirements, the electroplating is stopped. According to the electroplating method, plating layers with different thickness and different properties can be flexibly obtained in different horizontal positions of the continuous casting crystallizer copper plate, the material waste can be reduced effectively, the intermediate production process can be eliminated, the production cycle can be shortened, the crystallizer service life and continuous casting efficiency and product quality can be improved.
Description
Technical field
The invention belongs to continuous casting crystallizer copper plate surface treatment method technical field, particularly relate to the even alloy layer of a kind of continuous casting crystallizer copper plate non-uniform electro-plating method.
Background technology
The heart equipment that crystallizer is produced as continuous casting, the quality of its quality directly affects slab quality and the operating rate of continuous casting production.When continuous casting is produced, copper plate of crystallizer internal surface upper area directly directly contacts with the molten steel of high-boiling, the covering slag of melting, sink surface is cooled by strong water coolant, during cast, molten steel face copper plate of crystallizer upper surface, position coating is by the mechanical erosion of high-temperature molten steel, cold and hot distortion and stress deformation, under such circumstances, require the good toughness of copper plate of crystallizer top coating, and there is good thermal fatigue resistance and corrosion resistance nature; The bottom coating contact of copper plate of crystallizer be the strand that cooling forms base shell, produce huge force of sliding friction between strand and copper plate of crystallizer surface.Therefore, copper plate of crystallizer bottom coating requires that hardness is higher, and has good wear resistance.
Copper plate of crystallizer Electroplating Technology for Surface is from initial plating Cr, the main coating such as plating Ni, plating Ni-Fe, plating Ni-Co and plating Co-Ni are defined at present, the performance of product also progressively improves, but along with the develop rapidly of Iron And Steel Industry, the performance of copper plate of crystallizer surfacing is had higher requirement.But at present crystallizer surface coating is mostly the homogeneous coating of performance, even if when utilizing upper and lower position to separate electroplating technology, cause whole production process long flow path, complexity loaded down with trivial details, production efficiency is low, and do not wash clean clearly the quality that directly can have influence on copper plate of crystallizer surface electrical coating, easily cause copper plate of crystallizer upper area electrolytic coating to come off, the phenomenon such as to burn, cause the waste of a large amount of production cost, affect the continuous casting production efficiency of STEELMAKING PRODUCTION.
Summary of the invention
Technical problem to be solved by this invention is, for the deficiencies in the prior art, a kind of electro-plating method that can obtain different thickness and different performance coating neatly in continuous casting crystallizer copper plate different levels position is provided, that it changes original plating liquid level to fix, electrolytic coating everywhere thickness is homogeneous, the electrolytic coating situation that performance is consistent everywhere, effectively reduce the waste of material, eliminate middle production process, shorten the production cycle, achieve significant energy conservation and consumption reduction effects.
For solving the problems of the technologies described above, the technical solution adopted in the present invention is: the electro-plating method of the even alloy layer of a kind of continuous casting crystallizer copper plate non-uniform, comprises the following steps:
1. Pre-treatment before plating is carried out to continuous casting crystallizer copper plate surface, comprise machine tooling, cleaning is deoiled, mechanical sandblasting plucking, electrolytic degreasing, ultrasonic cleaning and acid solution activation treatment;
2. the described continuous casting crystallizer copper plate after 1. processing through described step is installed vertically in plating tank, described copper coin and electroplate liquid achieving full-area contact, starts to implement gross area electroplating activity to described copper coin surface;
3. after the thickness of coating of described copper coin top cladding region reaches setting processing requirement, the tap valve of described plating tank is accurately opened by the liquid level sensor in described plating tank and PLC servo-control system, electroplate liquid in described plating tank is precisely put by processing requirement and falls, carry out the plating of described copper coin lower surface areas, now, electroplating current I adjusts according to following functional relation:
I=D
k×(S-h×L)
In formula: I represents the electroplating current of continuous casting crystallizer copper plate lower region;
D
krepresent the current density of continuous casting crystallizer copper plate lower region;
S represents the total area of the continuous casting crystallizer copper plate of current electroplating activity;
H represents that in electroplating process, electroplate liquid puts the decline displacement of falling;
L represents the width of the continuous casting crystallizer copper plate of current electroplating activity;
4. while the electroplate liquid in described plating tank is precisely put and is down to processing requirement, alloying element additive is added continuously in the electroplate liquid of described copper coin lower surface areas, start to implement electroplating activity to the lower surface areas of described copper coin, after the thickness of coating of described copper coin lower surface areas reaches setting processing requirement, stop electroplating activity.
Further, described step described electroplate liquid 2. consists of:
Nickel sulfamic acid: 550 ~ 700g/L;
Nickelous chloride: 1.5 ~ 7.5g/L;
Boric acid: 18 ~ 24g/L;
Sodium lauryl sulphate: 0.1 ~ 5g/L;
Benzyl-thiazolinyl pyridinium inner salt: 0 ~ 20ml/L.
Further, described step 2. with step 4. in, the processing condition of described continuous casting crystallizer copper plate electroplating surface operation are: the pH value of described electroplate liquid is 1.0 ~ 2.5, and the temperature of described electroplate liquid is 35 ~ 47 DEG C, the current density D that described electroplating activity adopts
kbe 1 ~ 20A/dm
2, the anode material that described electroplating activity adopts is sulfur-bearing nickel cake, and in described electroplating activity process, described electroplate liquid adopts recycle pump or pressurized air to stir.
Further, the additive capacity of described alloying element additive is 0 ~ 30mL/Ah.
Further, described alloying element additive is the combination of one or more in cobalt element additive, phosphoric additive, ferro element additive, manganese additive, molybdenum element additive, W elements additive.
Further, the compound method of described alloying element additive is: first choose the solubility salt containing alloying element matched with the main salt of electroplate liquid composition, then described solubility salt and water are prepared with the ratio of mass ratio 15:100, obtain alloying element additive.
For cobalt element, thionamic acid cobalt can be selected as the soluble salt of preparation cobalt-base alloy element additive, then by the thionamic acid cobalt of 15 weight parts and the water mixed preparing of 100 weight parts, obtain cobalt-base alloy element additive.Accordingly, phosphoric can select phosphorous acid as the solubility salt matched with the main salt of electroplate liquid composition; Ferro element can select ferrous sulfamate as the solubility salt matched with the main salt of electroplate liquid composition; Manganese element can select thionamic acid manganese as the solubility salt matched with the main salt of electroplate liquid composition; Molybdenum element can select ammonium molybdate or Sodium orthomolybdate as the solubility salt matched with the main salt of electroplate liquid composition; W elements can select ammonium tungstate or sodium wolframate as the solubility salt matched with the main salt of electroplate liquid composition, and the compound method that the compound method of above-mentioned each alloying element additive can refer to cobalt-base alloy element additive is implemented.
Beneficial effect of the present invention is as follows: electro-plating method of the present invention can obtain the coating of different thickness and different performance neatly in the different levels position of continuous casting crystallizer copper plate, change original plating liquid level to fix, electrolytic coating everywhere thickness is homogeneous, the electrolytic coating situation that performance is consistent everywhere, effectively reduce the waste of material, eliminate middle production process, shorten the production cycle, improve the work-ing life of crystallizer, casting efficiency and quality product, achieve significant energy conservation and consumption reduction effects.
Embodiment
In order to illustrate further in more detail instead of limit the present invention, provide the following example.
Embodiment one
Take specification as the continuous casting crystallizer copper plate of 1950mm × 900mm be example, its top 0 ~ 150mm cladding region is pure Ni, and thickness is 0.3mm; Bottom 150 ~ 900mm is pure nickel, and thickness is by 0.3mm to 3.0mm linear transitions.
The electro-plating method of the even alloy layer of above-mentioned continuous casting crystallizer copper plate non-uniform, realizes by following steps:
1. Pre-treatment before plating is carried out to continuous casting crystallizer copper plate surface, comprise machine tooling, cleaning is deoiled, mechanical sandblasting plucking, electrolytic degreasing, ultrasonic cleaning and acid solution activation treatment, can refer to prior art;
2. the described continuous casting crystallizer copper plate after 1. processing through described step is installed vertically in plating tank, described copper coin and electroplate liquid achieving full-area contact, starts to implement gross area electroplating activity, consisting of of described electroplate liquid to described copper coin surface:
Nickel sulfamic acid: 550g/L;
Nickelous chloride: 1.5g/L;
Boric acid: 18g/L;
Sodium lauryl sulphate: 0.1g/L;
In this step, the processing condition of described gross area electroplating activity are: adopt thionamic acid to regulate the pH value of described electroplate liquid to be 1.0, the temperature of described electroplate liquid is 35 DEG C, the current density D that described electroplating activity adopts
kfor 1A/dm
2, the anode material that described electroplating activity adopts is sulfur-bearing nickel cake, and in described electroplating activity process, described electroplate liquid adopts recycle pump to stir;
3. when step 2. in electroplating time reach product requirement top 150mm cladding region needed for electroplating time time, accurately tap valve is opened by the liquid level sensor in plating tank and PLC servo-control system, electroplate liquid in plating tank is precisely put by processing requirement and falls, reduce 150mm, carry out the plating of continuous casting crystallizer copper plate bottom 150-900mm cladding region;
In the present embodiment, continuous casting crystallizer copper plate lower region electroplates pure Ni, and electroplating current is according to functional relation I=D
k× (S-h × L) determines, according to the size requirements of product coating, determines S=175.5dm
2, h=150mm, L=1950mm, setting current density D
k=2A/dm
2, can I=290A be drawn.
4., while the electroplate liquid in described plating tank is precisely put and is down to processing requirement, start to implement electroplating activity to the lower surface areas of described copper coin;
The electroplate liquid composition adopted in this step is 2. identical with step, and concrete technology condition is: adopt thionamic acid to regulate the pH value of described electroplate liquid to be 1.2, the temperature of described electroplate liquid is 35 DEG C, the current density D that described electroplating activity adopts
kfor 2A/dm
2, the anode material that described electroplating activity adopts is sulfur-bearing nickel cake, and in described electroplating activity process, described electroplate liquid adopts recycle pump and pressurized air to stir;
Calculate according to electroplating process, when electroplating time needed for the bottom cladding region that electroplating time reaches product requirement, electroplating activity stops, and now electroplates edge under liquid level to copper coin base.
Utilize continuous casting crystallizer copper plate electrolytic coating prepared by the electro-plating method of the even alloy layer of continuous casting crystallizer copper plate non-uniform of the present invention, compared with original conventional electroplating method, plated material saves nearly 1/3rd, production cycle reduces 1/4th, the work-ing life of copper plate of crystallizer is extended for 682 present stoves by 380 original stoves, casting efficiency improves 12.5%, coating and matrix in conjunction with intact, coating surface flawless, peel off, the defect such as bubbling.
Embodiment two
Take specification as the continuous casting crystallizer copper plate of 1950mm × 900mm be example, its top 0 ~ 150mm cladding region is pure Ni, and thickness is 0.3mm; Bottom 150 ~ 900mm is Ni-Co/P/Fe/Mn/Mo/W, and thickness is by 0.3mm to 3.0mm linear transitions.
The electro-plating method of the even alloy layer of above-mentioned continuous casting crystallizer copper plate non-uniform, realizes by following steps:
1. Pre-treatment before plating is carried out to continuous casting crystallizer copper plate surface, comprise machine tooling, cleaning is deoiled, mechanical sandblasting plucking, electrolytic degreasing, ultrasonic cleaning and acid solution activation treatment, can refer to prior art;
2. the described continuous casting crystallizer copper plate after 1. processing through described step is installed vertically in plating tank, described copper coin and electroplate liquid achieving full-area contact, starts to implement gross area electroplating activity, consisting of of described electroplate liquid to described copper coin surface:
Nickel sulfamic acid: 620g/L;
Nickelous chloride: 2.8g/L;
Boric acid: 20g/L;
Sodium lauryl sulphate: 2.3g/L;
Benzyl-thiazolinyl pyridinium inner salt: 4.5ml/L;
In this step, the processing condition of described gross area electroplating activity are: adopt thionamic acid to regulate the pH value of described electroplate liquid to be 1.7, the temperature of described electroplate liquid is 40 DEG C, the current density D that described electroplating activity adopts
kfor 5A/dm
2, the anode material that described electroplating activity adopts is sulfur-bearing nickel cake, and in described electroplating activity process, described electroplate liquid adopts recycle pump and pressurized air to stir;
3. when step 2. in electroplating time reach product requirement top 150mm cladding region needed for electroplating time time, accurately tap valve is opened by the liquid level sensor in plating tank and PLC servo-control system, electroplate liquid in plating tank is precisely put by processing requirement and falls, reduce 150mm, carry out the plating of continuous casting crystallizer copper plate bottom 150-900mm cladding region;
Continuous casting crystallizer copper plate lower region electroplated Ni-Co/P/Fe/Mn/Mo/W in the present embodiment, electroplating current is according to functional relation I=D
k× (S-h × L) determines, according to the size requirements of product coating, determines S=175.5dm
2, h=150mm, L=1950mm, setting current density D
k=4A/dm
2, can I=580A be drawn.
4. while the electroplate liquid in described plating tank is precisely put and is down to processing requirement, alloying element additive is added continuously in the electroplate liquid of described copper coin lower surface areas, start to implement electroplating activity to the lower surface areas of described copper coin, the electroplate liquid adopted in this step consists of:
Nickel sulfamic acid: 620g/L;
Nickelous chloride: 2.8g/L;
Boric acid: 20g/L;
Sodium lauryl sulphate: 2.3g/L;
Benzyl-thiazolinyl pyridinium inner salt: 4.5mL/L;
Alloying element additive: 5ml/Ah; Wherein, alloying element additive is selected from cobalt or phosphorus or iron or manganese or molybdenum or W elements additive;
The processing condition that the electroplating activity of described copper coin lower region adopts are: utilize thionamic acid to regulate electroplate liquid pH value to be 2.0, temperature of electroplating solution is 40 DEG C, current density D
kfor 4A/dm
2, anode material is sulfur-bearing nickel cake, and electroplating process electroplate liquid adopts pressurized air to stir;
Calculate according to electroplating process, when electroplating time needed for the bottom cladding region that electroplating time reaches product requirement, electroplating activity stops, and now electroplates edge under liquid level to copper coin base.
Concrete, the compound method of described cobalt element additive is, first select thionamic acid cobalt as the soluble salt of preparation cobalt-base alloy element additive, then by the thionamic acid cobalt of 15 weight parts and the water mixed preparing of 100 weight parts, obtain cobalt-base alloy element additive.Accordingly, phosphoric can select phosphorous acid as the solubility salt matched with the main salt of electroplate liquid composition; Ferro element can select ferrous sulfamate as the solubility salt matched with the main salt of electroplate liquid composition; Manganese element can select thionamic acid manganese as the solubility salt matched with the main salt of electroplate liquid composition; Molybdenum element can select ammonium molybdate or Sodium orthomolybdate as the solubility salt matched with the main salt of electroplate liquid composition; W elements can select ammonium tungstate or sodium wolframate as the solubility salt matched with the main salt of electroplate liquid composition, and the compound method that the compound method of above-mentioned each alloying element additive can refer to cobalt-base alloy element additive is implemented.
Utilize continuous casting crystallizer copper plate electrolytic coating prepared by the electro-plating method of the even alloy layer of continuous casting crystallizer copper plate non-uniform of the present invention, compared with original conventional electroplating method, plated material saving is more than 1/3rd, production cycle reduces 1/3rd, the work-ing life of copper plate of crystallizer is extended for 805 present stoves by 392 original stoves, casting efficiency improves 30%, coating and matrix in conjunction with intact, coating surface flawless, peel off, the defect such as bubbling.
Embodiment three
Take specification as the continuous casting crystallizer copper plate of 1950mm × 900mm be example, its top 0 ~ 150mm cladding region is pure Ni, and thickness is 0.3mm; Bottom 150 ~ 900mm is Ni-Co-P/Co-Fe/P-W/Mn-W/Mn-Mo, and thickness is by 0.3mm to 3.0mm linear transitions.
The electro-plating method of the even alloy layer of above-mentioned continuous casting crystallizer copper plate non-uniform, realizes by following steps:
1. Pre-treatment before plating is carried out to continuous casting crystallizer copper plate surface, comprise machine tooling, cleaning is deoiled, mechanical sandblasting plucking, electrolytic degreasing, ultrasonic cleaning and acid solution activation treatment, can refer to prior art;
2. the described continuous casting crystallizer copper plate after 1. processing through described step is installed vertically in plating tank, described copper coin and electroplate liquid achieving full-area contact, starts to implement gross area electroplating activity, consisting of of described electroplate liquid to described copper coin surface:
Nickel sulfamic acid: 650g/L;
Nickelous chloride: 4.7g/L;
Boric acid: 24g/L;
Sodium lauryl sulphate: 3.5g/L;
Benzyl-thiazolinyl pyridinium inner salt: 9.2ml/L;
In this step, the processing condition of described gross area electroplating activity are: adopt thionamic acid to regulate the pH value of described electroplate liquid to be 1.8, the temperature of described electroplate liquid is 42 DEG C, the current density D that described electroplating activity adopts
kfor 12A/dm
2, the anode material that described electroplating activity adopts is sulfur-bearing nickel cake, and in described electroplating activity process, described electroplate liquid adopts recycle pump and pressurized air to stir;
3. when step 2. in electroplating time reach product requirement top 150mm cladding region needed for electroplating time time, accurately tap valve is opened by the liquid level sensor in plating tank and PLC servo-control system, electroplate liquid in plating tank is precisely put by processing requirement and falls, reduce 150mm, carry out the plating of continuous casting crystallizer copper plate bottom 150-900mm cladding region;
Continuous casting crystallizer copper plate lower region electroplated Ni-Co-P/Co-Fe/P-W/Mn-W/Mn-Mo in the present embodiment, electroplating current is according to functional relation I=D
k× (S-h × L) determines, according to the size requirements of product coating, determines S=175.5dm
2, h=150mm, L=1950mm, setting current density D
k=10A/dm
2, can I=1450A be drawn.
4. while the electroplate liquid in described plating tank is precisely put and is down to processing requirement, in the electroplate liquid of described copper coin lower surface areas, add alloying element additive continuously, start to implement electroplating activity to the lower surface areas of described copper coin;
The electroplate liquid adopted in this step consists of:
Nickel sulfamic acid: 650g/L;
Nickelous chloride: 4.7g/L;
Boric acid: 24g/L;
Sodium lauryl sulphate: 3.5g/L;
Benzyl-thiazolinyl pyridinium inner salt: 9.2mL/L;
Alloying element additive: 17.8ml/Ah; Wherein, alloying element additive is Co-P or Co-Fe or P-W or Mn-W or Mn-Mo additive;
The additive capacity sum of two kinds of alloy combination reaches processing requirement amount, unrestricted to the dosage of wherein any one alloy, can mix by processing requirement with arbitrary proportion.The array configuration of two kinds of alloys is not limited to above-mentioned several, can be any form that can combinationally use in prior art.The compound method that the compound method of above-mentioned each alloying element additive can refer to cobalt-base alloy element additive is implemented.Preparation method for the alloying element additive of combination can refer to following methods and carries out: first prepare single alloying element additive respectively, then several alloying elements of combination is mixed to processing requirement dosage with arbitrary ratio.
The processing condition that the electroplating activity of described copper coin lower region adopts are: utilize thionamic acid to regulate electroplate liquid pH value to be 2.0, temperature of electroplating solution is 42 DEG C, current density D
kfor 10A/dm
2, anode material is sulfur-bearing nickel cake, and electroplating process electroplate liquid adopts pressurized air to stir;
Calculate according to electroplating process, when electroplating time needed for the bottom cladding region that electroplating time reaches product requirement, electroplating activity stops, and now electroplates edge under liquid level to copper coin base.
Utilize continuous casting crystallizer copper plate electrolytic coating prepared by the electro-plating method of the even alloy layer of continuous casting crystallizer copper plate non-uniform of the present invention, compared with original conventional electroplating method, plated material saves nearly 1/3rd, production cycle reduces 1/3rd, the work-ing life of copper plate of crystallizer is extended for 791 present stoves by 385 original stoves, casting efficiency improves 28.2%, coating and matrix in conjunction with intact, coating surface flawless, peel off, the defect such as bubbling.
Embodiment four
Take specification as the continuous casting crystallizer copper plate of 2000mm × 900mm be example, its top 0 ~ 150mm cladding region is pure Ni, and thickness is 0.2mm; Bottom 150 ~ 900mm is Ni-P/Co/Fe/Mn/Mo/W, and thickness is by 0.1mm to 1.5mm linear transitions.
The electro-plating method of the even alloy layer of above-mentioned continuous casting crystallizer copper plate non-uniform, realizes by following steps:
1. Pre-treatment before plating is carried out to continuous casting crystallizer copper plate surface, comprise machine tooling, cleaning is deoiled, mechanical sandblasting plucking, electrolytic degreasing, ultrasonic cleaning and acid solution activation treatment, can refer to prior art;
2. be installed vertically in plating tank by the described continuous casting crystallizer copper plate after 1. processing through described step, described copper coin and electroplate liquid achieving full-area contact, start to implement gross area electroplating activity to described copper coin surface, the electroplate liquid of employing is composed as follows:
Nickel sulfamic acid: 680g/L;
Nickelous chloride: 6.2g/L;
Boric acid: 22g/L;
Sodium lauryl sulphate: 4.1g/L;
In the process, concrete processing condition are: adopt thionamic acid to regulate electroplate liquid pH value to be 2.0, temperature of electroplating solution is 45 DEG C, current density D
kfor 15A/dm
2, anode material is sulfur-bearing nickel cake, and in electroplating process, electroplate liquid adopts recycle pump and pressurized air to stir;
3. when step 2. in electroplating time reach product requirement top 150mm cladding region needed for electroplating time time, accurately tap valve is opened by the liquid level sensor in plating tank and PLC servo-control system, electroplate liquid in plating tank is precisely put by processing requirement and falls, reduce 150mm, carry out the plating of continuous casting crystallizer copper plate bottom 150-900mm cladding region;
Continuous casting crystallizer copper plate lower region electroplated Ni-P/Co/Fe/Mn/Mo/W in the present embodiment, electroplating current is according to functional relation I=D
k× (S-h × L) determines, according to the size requirements of product coating, determines S=180dm
2, h=150mm, L=2000mm, setting current density D
k=20A/dm
2, can I=3000A be drawn.
4. while the electroplate liquid in described plating tank is precisely put and is down to processing requirement, alloying element additive is added continuously in the electroplate liquid of described copper coin lower surface areas, start to implement electroplating activity to the lower surface areas of described copper coin, the electroplate liquid adopted is composed as follows:
Nickel sulfamic acid: 680g/L;
Nickelous chloride: 6.2g/L;
Boric acid: 22g/L;
Sodium lauryl sulphate: 4.1g/L;
Benzyl-thiazolinyl pyridinium inner salt: 14.70mL/L
Alloying element additive: 21.3ml/Ah, wherein, alloying element additive is selected from cobalt or phosphorus or iron or manganese or molybdenum or W elements additive; The compound method of alloying element, with the description of embodiment one, repeats no more.
The processing condition adopted are specially: utilize thionamic acid to regulate electroplate liquid pH value to be 2.5, temperature of electroplating solution is 47 DEG C, current density D
kfor 20A/dm
2, anode material is sulfur-bearing nickel cake, and electroplating process electroplate liquid adopts recycle pump to stir.
Calculate according to electroplating process, when electroplating time needed for the bottom cladding region that electroplating time reaches product requirement, electroplating activity stops, and now electroplates edge under liquid level to copper coin base.
Utilize continuous casting crystallizer copper plate electrolytic coating prepared by the electro-plating method of the even alloy layer of continuous casting crystallizer copper plate non-uniform of the present invention, compared with former conventional electroplating method, plated material saves nearly 1/3rd, production cycle reduces 1/3rd, the work-ing life of copper plate of crystallizer is extended for 782 present stoves by 382 original stoves, casting efficiency improves 26.8%, coating and matrix in conjunction with intact, coating surface flawless, peel off, the defect such as bubbling.
Embodiment five
Take specification as the continuous casting crystallizer copper plate of 2000mm × 900mm be example, its top 0 ~ 150mm cladding region is pure Ni, and thickness is 0.2mm; Bottom 150 ~ 900mm is Ni-P/Co/Fe/Mn/Mo/W, and thickness is by 0.1mm to 1.5mm linear transitions.
The electro-plating method of the even alloy layer of above-mentioned continuous casting crystallizer copper plate non-uniform, realizes by following steps:
1. Pre-treatment before plating is carried out to continuous casting crystallizer copper plate surface, comprise machine tooling, cleaning is deoiled, mechanical sandblasting plucking, electrolytic degreasing, ultrasonic cleaning and acid solution activation treatment, can refer to prior art;
2. be installed vertically in plating tank by the described continuous casting crystallizer copper plate after 1. processing through described step, described copper coin and electroplate liquid achieving full-area contact, start to implement gross area electroplating activity to described copper coin surface, the electroplate liquid of employing is composed as follows:
Nickel sulfamic acid: 580g/L;
Nickelous chloride: 2.0g/L;
Boric acid: 20g/L;
Sodium lauryl sulphate: 1.2g/L;
In the process, concrete processing condition are: adopt thionamic acid to regulate electroplate liquid pH value to be 1.5, temperature of electroplating solution is 38 DEG C, current density D
kfor 2A/dm
2, anode material is sulfur-bearing nickel cake, and in electroplating process, electroplate liquid adopts recycle pump and pressurized air to stir;
3. when step 2. in electroplating time reach product requirement top 150mm cladding region needed for electroplating time time, accurately tap valve is opened by the liquid level sensor in plating tank and PLC servo-control system, electroplate liquid in plating tank is precisely put by processing requirement and falls, reduce 150mm, carry out the plating of continuous casting crystallizer copper plate bottom 150-900mm cladding region;
Continuous casting crystallizer copper plate lower region electroplated Ni-P/Co/Fe/Mn/Mo/W in the present embodiment, electroplating current is according to functional relation I=D
k× (S-h × L) determines, according to the size requirements of product coating, determines S=180dm
2, h=150mm, L=2000mm, setting current density D
k=1A/dm
2, can I=150A be drawn.
4. while the electroplate liquid in described plating tank is precisely put and is down to processing requirement, alloying element additive is added continuously in the electroplate liquid of described copper coin lower surface areas, start to implement electroplating activity to the lower surface areas of described copper coin, the electroplate liquid adopted is composed as follows:
Nickel sulfamic acid: 580g/L;
Nickelous chloride: 2.0g/L;
Boric acid: 20g/L;
Sodium lauryl sulphate: 1.2g/L;
Benzyl-thiazolinyl pyridinium inner salt: 2.0mL/L;
Alloying element additive: 2.4ml/Ah, wherein, alloying element additive is selected from cobalt or phosphorus or iron or manganese or molybdenum or W elements additive; The compound method of alloying element, with the description of embodiment one, repeats no more.
The processing condition adopted are specially: utilize thionamic acid to regulate electroplate liquid pH value to be 1.0, temperature of electroplating solution is 36 DEG C, current density D
kfor 1A/dm
2, anode material is sulfur-bearing nickel cake, and electroplating process electroplate liquid adopts pressurized air to stir.
Calculate according to electroplating process, when electroplating time needed for the bottom cladding region that electroplating time reaches product requirement, electroplating activity stops, and now electroplates edge under liquid level to copper coin base.
Utilize continuous casting crystallizer copper plate electrolytic coating prepared by the electro-plating method of the even alloy layer of continuous casting crystallizer copper plate non-uniform of the present invention, compared with former conventional electroplating method, plated material saves nearly 1/3rd, production cycle reduces 1/3rd, the work-ing life of copper plate of crystallizer is extended for 775 present stoves by 385 original stoves, casting efficiency improves 25.3%, coating and matrix in conjunction with intact, coating surface flawless, peel off, the defect such as bubbling.
Embodiment six
Take specification as the continuous casting crystallizer copper plate of 2000mm × 900mm be example, its top 0 ~ 150mm cladding region is pure Ni, and thickness is 0.2mm; Bottom 150 ~ 900mm is Ni-P-W-Mo/Mo-Co-P/Co-W-P/Mn/Fe, and thickness is by 0.1mm to 1.5mm linear transitions.
The electro-plating method of the even alloy layer of above-mentioned continuous casting crystallizer copper plate non-uniform, realizes by following steps:
1. Pre-treatment before plating is carried out to continuous casting crystallizer copper plate surface, comprise machine tooling, cleaning is deoiled, mechanical sandblasting plucking, electrolytic degreasing, ultrasonic cleaning and acid solution activation treatment, can refer to prior art;
2. be installed vertically in plating tank by the described continuous casting crystallizer copper plate after 1. processing through described step, described copper coin and electroplate liquid achieving full-area contact, start to implement gross area electroplating activity to described copper coin surface, the electroplate liquid of employing is composed as follows:
Nickel sulfamic acid: 700g/L;
Nickelous chloride: 7.5g/L;
Boric acid: 24g/L;
Sodium lauryl sulphate: 5.0g/L;
In the process, concrete processing condition are: adopt thionamic acid to regulate electroplate liquid pH value to be 2.5, temperature of electroplating solution is 47 DEG C, current density D
kfor 20A/dm
2, anode material is sulfur-bearing nickel cake, and in electroplating process, electroplate liquid adopts recycle pump and pressurized air to stir;
3. when step 2. in electroplating time reach product requirement top 150mm cladding region needed for electroplating time time, accurately tap valve is opened by the liquid level sensor in plating tank and PLC servo-control system, electroplate liquid in plating tank is precisely put by processing requirement and falls, reduce 150mm, carry out the plating of continuous casting crystallizer copper plate bottom 150-900mm cladding region;
Continuous casting crystallizer copper plate lower region electroplated Ni-P-W-Mo/Mo-Co-P/Co-W-P/Mn/Fe in the present embodiment, electroplating current is according to functional relation I=D
k× (S-h × L) determines, according to the size requirements of product coating, determines S=180dm
2, h=150mm, L=2000mm, setting current density D
k=15A/dm
2, can I=2250A be drawn.
4. while the electroplate liquid in described plating tank is precisely put and is down to processing requirement, alloying element additive is added continuously in the electroplate liquid of described copper coin lower surface areas, start to implement electroplating activity to the lower surface areas of described copper coin, the electroplate liquid adopted is composed as follows:
Nickel sulfamic acid: 700g/L;
Nickelous chloride: 7.5g/L;
Boric acid: 24g/L;
Sodium lauryl sulphate: 5.0g/L;
Benzyl-thiazolinyl pyridinium inner salt: 20mL/L;
Alloying element additive: 30ml/Ah, wherein, alloying element additive is selected from P-W-Mo or Mo-Co-P or Co-W-P or Mn or Fe additive; Wherein, the array configuration of alloying element is not limited to the array configuration cited by the present embodiment; The dosage of combined alloy element additive reaches processing requirement, also unrestricted to the content of any one element in combination, can mix according to processing requirement with arbitrary proportion; The compound method of alloying element of single or combination, all with embodiment one, repeats no more.
The processing condition that this step adopts are specially: utilize thionamic acid to regulate electroplate liquid pH value to be 2.2, temperature of electroplating solution is 45 DEG C, current density D
kfor 15A/dm
2, anode material is sulfur-bearing nickel cake, and electroplating process electroplate liquid adopts pressurized air to stir.
Calculate according to electroplating process, when electroplating time needed for the bottom cladding region that electroplating time reaches product requirement, electroplating activity stops, and now electroplates edge under liquid level to copper coin base.
Utilize continuous casting crystallizer copper plate electrolytic coating prepared by the electro-plating method of the even alloy layer of continuous casting crystallizer copper plate non-uniform of the present invention, compared with former conventional electroplating method, plated material saves nearly 1/3rd, production cycle reduces 1/4th, the work-ing life of copper plate of crystallizer is extended for 691 present stoves by 380 original stoves, casting efficiency improves 14.7%, coating and matrix in conjunction with intact, coating surface flawless, peel off, the defect such as bubbling.
In sum, the even alloy layer of a kind of continuous casting crystallizer copper plate non-uniform of the present invention every claim of addressing of electro-plating method and technical support clearly, all any amendments done according to technical support essence of the present invention and change still belong in the scope that the technology of the present invention supports.
Claims (6)
1. an electro-plating method for the even alloy layer of continuous casting crystallizer copper plate non-uniform, is characterized in that, comprise the following steps:
1. Pre-treatment before plating is carried out to continuous casting crystallizer copper plate surface, comprise machine tooling, cleaning is deoiled, mechanical sandblasting plucking, electrolytic degreasing, ultrasonic cleaning and acid solution activation treatment;
2. the described continuous casting crystallizer copper plate after 1. processing through described step is installed vertically in plating tank, described copper coin and electroplate liquid achieving full-area contact, starts to implement gross area electroplating activity to described copper coin surface;
3. after the thickness of coating of described copper coin top cladding region reaches setting processing requirement, the tap valve of described plating tank is accurately opened by the liquid level sensor in described plating tank and PLC servo-control system, electroplate liquid in described plating tank is precisely put by processing requirement and falls, carry out the plating of described copper coin lower surface areas, now, electroplating current I adjusts according to following functional relation:
I=D
k×(S-h×L)
In formula: I represents the electroplating current of continuous casting crystallizer copper plate lower region;
D
krepresent the current density of continuous casting crystallizer copper plate lower region;
S represents the total area of the continuous casting crystallizer copper plate of current electroplating activity;
H represents that in electroplating process, electroplate liquid puts the decline displacement of falling;
L represents the width of the continuous casting crystallizer copper plate of current electroplating activity;
4. while the electroplate liquid in described plating tank is precisely put and is down to processing requirement, alloying element additive is added continuously in the electroplate liquid of described copper coin lower surface areas, start to implement electroplating activity to the lower surface areas of described copper coin, after the thickness of coating of described copper coin lower surface areas reaches setting processing requirement, stop electroplating activity.
2. the electro-plating method of the even alloy layer of continuous casting crystallizer copper plate non-uniform as claimed in claim 1, is characterized in that: described step described electroplate liquid 2. consists of:
Nickel sulfamic acid: 550 ~ 700g/L;
Nickelous chloride: 1.5 ~ 7.5g/L;
Boric acid: 18 ~ 24g/L;
Sodium lauryl sulphate: 0.1 ~ 5g/L;
Benzyl-thiazolinyl pyridinium inner salt: 0 ~ 20ml/L.
3. the electro-plating method of the even alloy layer of continuous casting crystallizer copper plate non-uniform as claimed in claim 1 or 2, it is characterized in that: described step 2. with step 4. in, the processing condition of described continuous casting crystallizer copper plate electroplating surface operation are: the pH value of described electroplate liquid is 1.0 ~ 2.5, the temperature of described electroplate liquid is 35 ~ 47 DEG C, the current density D that described electroplating activity adopts
kbe 1 ~ 20A/dm2, the anode material that described electroplating activity adopts is sulfur-bearing nickel cake, and in described electroplating activity process, described electroplate liquid adopts recycle pump and pressurized air to stir.
4. the electro-plating method of the even alloy layer of continuous casting crystallizer copper plate non-uniform as claimed in claim 1, is characterized in that: described step 4. in the additive capacity of described alloying element additive be 0 ~ 30mL/Ah.
5. the electro-plating method of the even alloy layer of the continuous casting crystallizer copper plate non-uniform as described in claim 1 or 4, is characterized in that: described alloying element additive is the combination of one or more in cobalt element additive, phosphoric additive, ferro element additive, manganese additive, molybdenum element additive, W elements additive.
6. the electro-plating method of the even alloy layer of continuous casting crystallizer copper plate non-uniform as claimed in claim 5, it is characterized in that: the compound method of described alloying element additive is, first the solubility salt containing alloying element matched with the main salt of described electroplate liquid composition is chosen, then described solubility salt and water are prepared with the ratio of mass ratio 15:100, obtain alloying element additive.
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Application publication date: 20150812 |