CN206807854U - A kind of novel high-temperature resistant double-layer circuit board - Google Patents

A kind of novel high-temperature resistant double-layer circuit board Download PDF

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Publication number
CN206807854U
CN206807854U CN201720667644.5U CN201720667644U CN206807854U CN 206807854 U CN206807854 U CN 206807854U CN 201720667644 U CN201720667644 U CN 201720667644U CN 206807854 U CN206807854 U CN 206807854U
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China
Prior art keywords
heat conducting
conducting pipe
top plate
circuit board
big heat
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CN201720667644.5U
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Chinese (zh)
Inventor
朱晓方
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Meizhou Baode Electronics Co Ltd
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Meizhou Baode Electronics Co Ltd
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Priority to CN201720667644.5U priority Critical patent/CN206807854U/en
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Abstract

The utility model discloses a kind of novel high-temperature resistant double-layer circuit board, including top plate, the bottom of top plate is provided with big heat conducting pipe, the bottom of big heat conducting pipe is provided with nut, the side of top plate is provided with screw rod, the side of internal thread is provided with assembling seat, and the side of assembling seat is provided with screw, and the bottom of screw is provided with blower fan.The utility model between top plate and lower plywood by being provided with big heat conducting pipe, small heat conducting pipe is additionally provided between adjacent several big heat conducting pipes, it is compact-sized, big heat conducting pipe and small heat conducting pipe are made by copper pipe material, with good heat dispersion, the side of big heat conducting pipe and small heat conducting pipe is provided with blower fan, its caused airflow direction is consistent with big heat conducting pipe and the hollow direction of small heat conducting pipe, the speed of radiating can be accelerated, due to can will heat quickly disperses caused by electronic component thereon, so as to bear higher temperature, without reducing its performance.

Description

A kind of novel high-temperature resistant double-layer circuit board
Technical field
A kind of circuit board is the utility model is related to, more particularly to a kind of novel high-temperature resistant double-layer circuit board.
Background technology
The title of circuit board has:Ceramic circuit board, aluminium oxide ceramics circuit board, aluminium nitride ceramics circuit board, wiring board, Pcb board, aluminium base, high frequency plate, thick copper coin, impedance plate, PCB, ultra-thin wiring board, ultrathin circuit board, printed circuit board (PCB) etc., circuit Plate makes circuit miniaturization, directly perceivedization, and the batch production and optimization electrical appliance layout for permanent circuit play an important role, wiring board It is divided into single sided board, dual platen, and three big classification of multilayer circuit board if dividing by the number of plies, is single sided board first, in most base On this PCB, part is concentrated wherein simultaneously, and wire is then concentrated on another side, because wire is only present in wherein one side, institute Just to claim this PCB to be called one-sided circuit board, single sided board generally makes simple, low cost, but a disadvantage is that can not be applied to too On complicated product, dual platen is the extension of single sided board, when individual layer wiring can not meet the needs of electronic product it is necessary to using Dual platen, it is two-sided have cover copper and have cabling, and the circuit between two layers can be turned on by via, be allowed to be formed needed for The network connection wanted, multi-layer sheet refer to more than three layers conductive pattern layer with therebetween insulating materials be separated by be laminated and Into, and the printed board that conductive pattern interconnects on request therebetween.
In recent ten years, printed circuit board manufacturing in China's is quickly grown, by lamina to doubling plate and then to multilayer Plate, but it is following but have also discovered that many problems are to be solved, and people are pursuing high benefit, make doubling plate so as to will be more Component it is integrated on circuit boards, some components can produce substantial amounts of heat in the course of the work, if these heats are not It can quickly disperse, local temperature will be caused too high and cause its cisco unity malfunction, so as to reduce the performance of circuit board, and The most doubling plate of in the market itself can not will quickly produce the substantial amounts of heat of meeting in the course of the work and quickly disperse.
Utility model content
The technical problems to be solved in the utility model is the defects of overcoming prior art, there is provided a kind of novel high-temperature resistant double-layer Circuit board, due to can will heat quickly disperses caused by electronic component thereon, so as to bear higher temperature, and Its performance is not reduced.
In order to solve the above-mentioned technical problem, the utility model provides following technical scheme:
A kind of novel high-temperature resistant double-layer circuit board of the utility model, including top plate, the bottom of the top plate are provided with Big heat conducting pipe, the bottom of the lower plywood are provided with lower plywood, and the bottom of the big heat conducting pipe is provided with nut, the top plate Side be provided with screw rod, the side of the screw rod is provided with internal thread, and the side of the internal thread is provided with assembling seat, The side of the assembling seat is provided with screw, and the bottom of the screw is provided with blower fan.
As a kind of optimal technical scheme of the present utility model, the side of the big heat conducting pipe is provided with small heat conducting pipe.
As a kind of optimal technical scheme of the present utility model, the big heat conducting pipe and small heat conducting pipe are by copper pipe material system Form.
As a kind of optimal technical scheme of the present utility model, the top plate, lower plywood and assembling seat pass through Internal thread and mode connects for screw.
As a kind of optimal technical scheme of the present utility model, the top plate and lower plywood are connected by screw rod and nut Connect.
Compared with prior art, the beneficial effects of the utility model are as follows:
The utility model between top plate and lower plywood by being provided with big heat conducting pipe, in adjacent several big heat conducting pipes Between be additionally provided with small heat conducting pipe, compact-sized, big heat conducting pipe and small heat conducting pipe are made by copper pipe material, have good Heat dispersion, the side of big heat conducting pipe and small heat conducting pipe is provided with blower fan, its caused airflow direction and big heat conducting pipe and The small hollow direction of heat conducting pipe is consistent, can accelerate radiating speed, due to can will thereon heat caused by electronic component it is fast Speed disperses, so as to bear higher temperature, without reducing its performance.
Brief description of the drawings
Accompanying drawing is used for providing further understanding to of the present utility model, and a part for constitution instruction, with this practicality New embodiment is used to explain the utility model together, does not form to limitation of the present utility model.In the accompanying drawings:
Fig. 1 is overall structure diagram of the present utility model;
Fig. 2 is front view of the present utility model;
In figure:1st, top plate;2nd, lower plywood;3rd, screw rod;4th, internal thread;5th, motor mount;6th, screw;7th, blower fan;8、 Nut;9th, big heat conducting pipe;10th, small heat conducting pipe.
Embodiment
Preferred embodiment of the present utility model is illustrated below in conjunction with accompanying drawing, it will be appreciated that described herein excellent Select embodiment to be merely to illustrate and explain the utility model, be not used to limit the utility model.
Embodiment 1
As shown in Figure 1-2, the utility model provides a kind of novel high-temperature resistant double-layer circuit board, including top plate 1, top plate 1 bottom is provided with big heat conducting pipe 9, and the bottom of lower plywood 2 is provided with lower plywood 2, and the bottom of big heat conducting pipe 9 is provided with nut 8, The side of top plate 1 is provided with screw rod 3, and the side of screw rod 3 is provided with internal thread 4, and the side of internal thread 4 is provided with assembling Seat 5, the side of assembling seat 5 is provided with screw 6, and the bottom of screw 6 is provided with blower fan 7.
Further, the side of big heat conducting pipe 9 is provided with small heat conducting pipe 10, between adjacent several big heat conducting pipes 9 also Small heat conducting pipe 10 is provided with, so can not only accelerate radiating rate also makes structure compacter.
Big heat conducting pipe 9 and small heat conducting pipe 10 are made by copper pipe material, and copper pipe is good Heat Conduction Material, is designed to Hollow tubular, allow air-flow caused by blower fan 7 from pipe by so as to take away heat.
Top plate 1, lower plywood 2 are connected with assembling seat 5 by internal thread 4 and screw 6, are easy to upper strata using screw thread Dismounting between plate 1, lower plywood 2 and assembling seat 5.
Top plate 1 and lower plywood 2 are connected by screw rod 3 and nut 8, and big heat conduction is provided between top plate 1 and lower plywood 2 Pipe 9 and small heat conducting pipe 10, can be by top plate 1, lower plywood 2, big heat conducting pipe 9 and small heat conducting pipe by screw rod 3 and the connection of nut 8 10 are fastened together.
Specifically, the bottom of top plate 1 is provided with big heat conducting pipe 9, big heat conducting pipe 9 is made by copper pipe material, copper pipe It is the transmission that good Heat Conduction Material can accelerate heat, the bottom of big heat conducting pipe 9 is provided with lower plywood 2, the bottom of lower plywood 2 Nut 8 is provided with, the side of top plate 1 is provided with screw rod 3, can be by top plate 1, lower plywood by screw rod 3 and the connection of nut 8 2nd, big heat conducting pipe 9 and small heat conducting pipe 10 are fastened together, and the side of screw rod 3 is provided with internal thread 4, the side of internal thread 4 Assembling seat 5 is provided with, top plate 1, lower plywood 2 are connected with assembling seat 5 by internal thread 4 and screw 6, blower fan peace The side of dress seat 5 is provided with screw 6, and the bottom of screw 6 is provided with blower fan 7, its caused airflow direction and big heat conducting pipe 9 and small 10 hollow direction of heat conducting pipe is consistent, can accelerate the speed of radiating.
The utility model several is led greatly by being provided with big heat conducting pipe 9 between top plate 1 and lower plywood 2 adjacent Small heat conducting pipe 10 is additionally provided between heat pipe 9, it is compact-sized, big heat conducting pipe 9 and small heat conducting pipe 10 by copper pipe material make and Into there is good heat dispersion, the side of big heat conducting pipe 9 and small heat conducting pipe 10 is provided with blower fan 7, its caused air-flow side To consistent with big heat conducting pipe 9 and 10 hollow direction of small heat conducting pipe, the speed of radiating can be accelerated, due to can will electronics member thereon Heat quickly disperses caused by device, so as to bear higher temperature, without reducing its performance.
Finally it should be noted that:Preferred embodiment of the present utility model is the foregoing is only, is not limited to this Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art For, it can still modify to the technical scheme described in foregoing embodiments, or to which part technical characteristic Carry out equivalent substitution.All any modification, equivalent substitution and improvements within the spirit and principles of the utility model, made etc., It should be included within the scope of protection of the utility model.

Claims (5)

1. a kind of novel high-temperature resistant double-layer circuit board, including top plate (1), it is characterised in that the bottom of the top plate (1) is set Big heat conducting pipe (9) is equipped with, the bottom of the big heat conducting pipe (9) is provided with lower plywood (2), and the bottom of the lower plywood (2) is set There is nut (8), the side of the top plate (1) is provided with screw rod (3), and the side of the screw rod (3) is provided with internal thread (4), The side of the internal thread (4) is provided with assembling seat (5), and the side of the assembling seat (5) is provided with screw (6), The bottom of the screw (6) is provided with blower fan (7).
A kind of 2. novel high-temperature resistant double-layer circuit board according to claim 1, it is characterised in that the big heat conducting pipe (9) Side be provided with small heat conducting pipe (10).
A kind of 3. novel high-temperature resistant double-layer circuit board according to claim 2, it is characterised in that the big heat conducting pipe (9) It is made with small heat conducting pipe (10) by copper pipe material.
A kind of 4. novel high-temperature resistant double-layer circuit board according to claim 1, it is characterised in that the top plate (1), under Laminate (2) is connected with assembling seat (5) by internal thread (4) and screw (6).
A kind of 5. novel high-temperature resistant double-layer circuit board according to claim 4, it is characterised in that the top plate (1) and Lower plywood (2) is connected by screw rod (3) and nut (8).
CN201720667644.5U 2017-06-09 2017-06-09 A kind of novel high-temperature resistant double-layer circuit board Active CN206807854U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720667644.5U CN206807854U (en) 2017-06-09 2017-06-09 A kind of novel high-temperature resistant double-layer circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720667644.5U CN206807854U (en) 2017-06-09 2017-06-09 A kind of novel high-temperature resistant double-layer circuit board

Publications (1)

Publication Number Publication Date
CN206807854U true CN206807854U (en) 2017-12-26

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
CN (1) CN206807854U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111336412A (en) * 2018-12-18 2020-06-26 正扬科技有限公司 uV LED array with electrical interconnect and heat sink and high power device with both interconnect and heat sink

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111336412A (en) * 2018-12-18 2020-06-26 正扬科技有限公司 uV LED array with electrical interconnect and heat sink and high power device with both interconnect and heat sink
CN111336412B (en) * 2018-12-18 2022-08-09 正扬科技有限公司 uV LED array with electrical interconnect and heat sink and high power device with both interconnect and heat sink
US11664484B2 (en) 2018-12-18 2023-05-30 Soulnano Limited UV LED array with power interconnect and heat sink

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