CN105932874A - PCB arrangement method suitable for high-current output conversion circuit - Google Patents
PCB arrangement method suitable for high-current output conversion circuit Download PDFInfo
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- CN105932874A CN105932874A CN201610384906.7A CN201610384906A CN105932874A CN 105932874 A CN105932874 A CN 105932874A CN 201610384906 A CN201610384906 A CN 201610384906A CN 105932874 A CN105932874 A CN 105932874A
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- field effect
- effect transistor
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- filter capacitor
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
- H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
- H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/44—Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/0048—Circuits or arrangements for reducing losses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
- Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inverter Devices (AREA)
Abstract
The invention relates to a PCB arrangement method suitable for a high-current output conversion circuit, in particular to a PCB arrangement method suitable for a high-current output power supply employing a synchronous BUCK circuit, and belongs to the field of power electronic conversion. The circuit for achieving the PCB arrangement method comprises two current loops, wherein the loop 1 comprises an input filter capacitor Cin, an upper-end field effect tube Q1 and a lower-end field effect tube Q2; and the loop 2 comprises a lower-end field effect tube Q2, an output inductor Lout and an output capacitor Cout. By the method, PCB arrangement is achieved through reducing the loop area of the loop 1 and the loop 2; and the area of the two loops is reduced by the high-current output conversion circuit during high-current output, so that the interference of electromagnetic noise generated by the circuit to a control circuit is reduced; the loss of the DC resistance is reduced; and the efficiency of the power supply is improved. Meanwhile, the same-layer layout is adopted by a power device, so that heat-transfer heat dissipation is facilitated.
Description
Technical field
The present invention relates to a kind of PCB fabric swatch method, relate to a kind of PCB fabric swatch method of change-over circuit being applicable to High-current output.
Background technology
Low-voltage, High-current output application in, synchronize the mode that BUCK circuit generally uses multiple power device in parallel and carry out discrete devices loss, reach good thermal design and improve the purpose of reliability.Being the electric current of high frequency peak value due to flow through in circuit, power supply itself and peripheral circuit can be caused the biggest electromagnetic noise to disturb by irrational PCB fabric swatch method, affect the normal work of rear class equipment.And many devices mode in parallel must be avoided causing devices in parallel not current-sharing because impedance is different during PCB layout, affects the reliability of changer.
Summary of the invention
The wiring problem that the circuit that present invention is generally directed in prior art in low-voltage, High-current output application faces, a kind of PCB fabric swatch method of new a kind of change-over circuit being applicable to High-current output is provided, the method had both reduced the interference to control circuit of the electromagnetic noise of circuit generation, the loss reducing again DC impedance makes the efficiency of power supply be improved, and power device is beneficial to heat conducting and radiating with layout layer simultaneously.
The technical problem to be solved is to be realized by following technical scheme.The present invention is a kind of PCB fabric swatch method of change-over circuit being applicable to High-current output, it is characterized in: the circuit realizing this PCB fabric swatch method includes two current loops, loop 1 is made up of input filter capacitor Cin, upper end field effect transistor Q1, lower end field effect transistor Q2, and loop 2 is made up of lower end field effect transistor Q2, outputting inductance Lout, output capacitance Cout；This this method realizes PCB fabric swatch by reducing the loop area of loop 1 and loop 2；Making the change-over circuit of High-current output when High-current output, both reduced the electromagnetic noise interference to control circuit that circuit produces, the loss reducing again DC impedance makes the efficiency of power supply be improved, and power device uses and is beneficial to heat conducting and radiating with layout layer simultaneously.
PCB fabric swatch method of the present invention, its further preferred technical scheme is: PCB uses 6 laminates；Top layer components and parts are the input filter capacitor Cin of close input terminal, the output filter capacitor Cout of close lead-out terminal and drive circuit；Top layer is signal wiring layer, and the 1st layer, centre, middle 2nd layer of cabling are Power Groud, and the 3rd layer, centre, the 4th layer, centre, bottom cabling are for just with output just inputting；Bottom components and parts are near the input filter capacitor Cin of input terminal, upper end field effect transistor Q1 of many fabric swatch in parallel, lower end field effect transistor Q2 of many fabric swatch in parallel, the output inductance Lout of many fabric swatch in parallel, the output filter capacitor Cout of close lead-out terminal；Input filter capacitor Cin is connected by large stretch of copper clad layers with the drain electrode of upper end field effect transistor Q1, input filter capacitor Cin is connected by large stretch of copper clad layers with the source electrode of lower end field effect transistor Q2, junction point between the source electrode of upper end field effect transistor Q1 and drain electrode and the output inductance Lout of lower end field effect transistor Q2 is connected by large stretch of copper clad layers, connects with the cabling of large area copper clad layers between output inductance Lout and output filter capacitor Cout.
PCB fabric swatch method of the present invention, its further preferred technical scheme is: input filter capacitor Cin brings to Front and bottom is near input positive and negative terminal, output filter capacitor Cout brings to Front and bottom is near output positive and negative terminal, the positive and negative terminal of filter capacitor is connected with intermediate layer by pad via, reduces the ESL of filter capacitor；Drive circuit is placed between the printed board top layer input filter capacitor Cin and output filter capacitor Cout directly over upper end field effect transistor Q1, lower end field effect transistor Q2, makes that driver circuit is the shortest, drive loop minimum；Upper end field effect transistor Q1 and lower end field effect transistor Q2 are many and are mounted side by side, input filter capacitor Cin is connected by large stretch of copper clad layers with the drain electrode of upper end field effect transistor Q1, the source electrode of input filter capacitor Cin and lower end field effect transistor Q2 is connected by large stretch of copper clad layers and is connected with pass through the input with 1 layer, centre, 2 layers, centre and top layer of the pad via, the drain electrode of upper end field effect transistor Q1 just is being connected to input by pad via and intermediate layer, reduces input filter capacitor Cin, upper end field effect transistor Q1 and the loop area of lower end field effect transistor Q2 composition and the High-frequency Interference of generation；Output inductance Lout is many and is mounted side by side, output inductance Lout input is connected by large stretch of copper clad layers with the source electrode of upper end field effect transistor Q1 and the drain electrode of lower end field effect transistor Q2, output inductance Lout outfan is just connected with output filter capacitor Cout and output through intermediate layer by pad via, reduces output inductance Lout, lower end field effect transistor Q2 and the loop area of output filter capacitor Cout composition and the High-frequency Interference of generation.
PCB fabric swatch method of the present invention, its further preferred technical scheme is: upper end field effect transistor Q1 is many fabric swatch in parallel of equal number with lower end field effect transistor Q2, it is encapsulated as PG-TDSON-8 or PowerFLATTM(8 × 8), its heat is conducted to housing by heat conductivity gap filling material；Output inductance Lout is that many surface-mount type power inductances in parallel are close to housing heat radiation；Upper end field effect transistor Q1, lower end field effect transistor Q2, output inductance Lout use many fabric swatch in parallel and peripheral PCB trace identical, and line impedance is consistent.
PCB fabric swatch method of the present invention, its further preferred technical scheme is: the change-over circuit of described High-current output is for synchronizing BUCK circuit.
Compared with prior art, a kind of PCB fabric swatch method being applicable to synchronize BUCK circuit of the present invention, reduce the area of two loops, both the electromagnetic noise interference to control circuit that circuit produces had been reduced, the loss reducing again DC impedance makes the efficiency of power supply be improved, and power device is beneficial to heat conducting and radiating with layout layer simultaneously.
Further, PCB uses 6 laminates, and the drain electrode of Cin with Q1 is connected by large stretch of copper clad layers, and the source electrode of Cin with Q2 is connected by large stretch of copper clad layers, and therefore Cin will not produce bigger ESL and reduce its High frequency filter ability because circuit is oversize.Being the current waveform of high frequency peak value on junction point between the source electrode of Q1 and the drain electrode of Q2 and Lout, the common port connecting Q1, Q2, Lout by large stretch of copper clad layers makes Q1, Q2, Lout rely on recently, and reduces the high frequency noise interference to control circuit.The cabling of large area copper clad layers reduces the loss of DC impedance makes the efficiency of power supply be improved.
Accompanying drawing explanation
Fig. 1 is a kind of circuit diagram realizing the inventive method；
Fig. 2 is the circuit fabric swatch cross-sectional schematic of PCB fabric swatch method of the present invention；
Fig. 3 is that the top layer circuit fabric swatch of PCB fabric swatch method of the present invention regards schematic diagram；
Fig. 4 is that the bottom circuit fabric swatch of PCB fabric swatch method of the present invention regards schematic diagram.
Detailed description of the invention
Below in conjunction with accompanying drawing, the inventive method is specifically described, so that those skilled in the art are further understood that the present invention, and does not constitute the restriction to right of the present invention.
Embodiment 1, with reference to Fig. 1-4, a kind of PCB fabric swatch method of the change-over circuit being applicable to High-current output, the circuit realizing this PCB fabric swatch method includes two current loops, loop 1 is made up of input filter capacitor Cin, upper end field effect transistor Q1, lower end field effect transistor Q2, and loop 2 is made up of lower end field effect transistor Q2, outputting inductance Lout, output capacitance Cout；This this method realizes PCB fabric swatch by reducing the loop area of loop 1 and loop 2；Making the change-over circuit of High-current output when High-current output, both reduced the electromagnetic noise interference to control circuit that circuit produces, the loss reducing again DC impedance makes the efficiency of power supply be improved, and power device uses and is beneficial to heat conducting and radiating with layout layer simultaneously.
Embodiment 2, in the PCB fabric swatch method described in embodiment 1: the change-over circuit of described High-current output is for synchronizing BUCK circuit.
Embodiment 3, in the PCB fabric swatch method described in embodiment 1 or 2: PCB uses 6 laminates；Top layer components and parts are the input filter capacitor Cin of close input terminal, the output filter capacitor Cout of close lead-out terminal and drive circuit；Top layer is signal wiring layer, and the 1st layer, centre, middle 2nd layer of cabling are Power Groud, and the 3rd layer, centre, the 4th layer, centre, bottom cabling are for just with output just inputting；Bottom components and parts are near the input filter capacitor Cin of input terminal, upper end field effect transistor Q1 of many fabric swatch in parallel, lower end field effect transistor Q2 of many fabric swatch in parallel, the output inductance Lout of many fabric swatch in parallel, the output filter capacitor Cout of close lead-out terminal；Input filter capacitor Cin is connected by large stretch of copper clad layers with the drain electrode of upper end field effect transistor Q1, input filter capacitor Cin is connected by large stretch of copper clad layers with the source electrode of lower end field effect transistor Q2, junction point between the source electrode of upper end field effect transistor Q1 and drain electrode and the output inductance Lout of lower end field effect transistor Q2 is connected by large stretch of copper clad layers, connects with the cabling of large area copper clad layers between output inductance Lout and output filter capacitor Cout.
Embodiment 4, in PCB fabric swatch method described in embodiment 3: input filter capacitor Cin brings to Front and bottom is near input positive and negative terminal, output filter capacitor Cout brings to Front and bottom is near output positive and negative terminal, the positive and negative terminal of filter capacitor is connected with intermediate layer by pad via, reduces the ESL of filter capacitor；Drive circuit is placed between the printed board top layer input filter capacitor Cin and output filter capacitor Cout directly over upper end field effect transistor Q1, lower end field effect transistor Q2, makes that driver circuit is the shortest, drive loop minimum；Upper end field effect transistor Q1 and lower end field effect transistor Q2 are many and are mounted side by side, input filter capacitor Cin is connected by large stretch of copper clad layers with the drain electrode of upper end field effect transistor Q1, the source electrode of input filter capacitor Cin and lower end field effect transistor Q2 is connected by large stretch of copper clad layers and is connected with pass through the input with 1 layer, centre, 2 layers, centre and top layer of the pad via, the drain electrode of upper end field effect transistor Q1 just is being connected to input by pad via and intermediate layer, reduces input filter capacitor Cin, upper end field effect transistor Q1 and the loop area of lower end field effect transistor Q2 composition and the High-frequency Interference of generation；Output inductance Lout is many and is mounted side by side, output inductance Lout input is connected by large stretch of copper clad layers with the source electrode of upper end field effect transistor Q1 and the drain electrode of lower end field effect transistor Q2, output inductance Lout outfan is just connected with output filter capacitor Cout and output through intermediate layer by pad via, reduces output inductance Lout, lower end field effect transistor Q2 and the loop area of output filter capacitor Cout composition and the High-frequency Interference of generation.
Embodiment 5, in PCB fabric swatch method described in embodiment 3 or 4: upper end field effect transistor Q1 is many fabric swatch in parallel of equal number with lower end field effect transistor Q2, it is encapsulated as PG-TDSON-8 or PowerFLATTM(8 × 8), its heat is conducted to housing by heat conductivity gap filling material；Output inductance Lout is that many surface-mount type power inductances in parallel are close to housing heat radiation；Upper end field effect transistor Q1, lower end field effect transistor Q2, output inductance Lout use many fabric swatch in parallel and peripheral PCB trace identical, and line impedance is consistent.
Embodiment 6, a kind of PCB fabric swatch method being applicable to synchronize BUCK circuit: PCB is 6 laminates；In Fig. 2, top layer is signal wiring layer, and middle 1 layer, middle 2 layers be the power stratum of synchronization BUCK circuit, the anode of Cin be the input of circuit just, the anode of Cout be the output of circuit just.The anode of Cin passes through to connect middle 3 layers, 4 layers, centre and bottom after via passes top layer, 1 layer, centre, 2 layers, centre and is connected with the drain electrode of Q1, the source electrode of Q1 and the drain electrode of Q2 are at bottom short circuit, the source electrode of Q2 is connected to Power Groud with 2 layers, centre, 1 layer, centre, top layer by via behind bottom, 4 layers, centre, 3 layers, centre, form loop 1, loop 1 is only in middle 3 layers and middle 2 layers of existence, and therefore the area of loop 1 is the least.The source electrode of Q1 and the drain electrode of Q2 form public connecting end by via with middle 4 layers, middle 3 layers with Lout at the junction point of bottom, Lout by via through middle 2 layers, middle 1 layer, top layer be just connected to the output that anode is power supply of Cout, loop 2 is formed with Power Groud, identical with loop 1, the area of loop 2 is the least.All layers all cover copper by carrying out large area by PCB breadth size shown in Fig. 3-4, the loss reducing DC impedance makes the efficiency of power supply be improved, big face is covered copper and is also beneficial to the heat radiation of heating element, is dispelled the heat by housing to bottom components and parts by via conduction by heat.Input filter capacitor Cin shown in Fig. 2, output filter capacitor Cout are the less components and parts of caloric value, are positioned over printed board top layer, and its heat is dispelled the heat through housing to bottom components and parts by the via conduction of each layer in the middle of pad and connection to bottom.Upper end field effect transistor Q1, lower end field effect transistor Q2, outputting inductance Lout are the components and parts that caloric value is big, be placed in printed board bottom by heat conductivity gap filling material be close to housing conduct heat to housing dispel the heat.Many of Q1, Q2 shown in Fig. 3-4 is used in parallel, meets the requirement of High-current output, and Q1, Q2 are evenly distributed on printed board bottom, it is ensured that PCB line impedance that each power tube is identical and radiating surface, ensures power tube current-sharing work.
Claims (5)
1. the PCB fabric swatch method of the change-over circuit being applicable to High-current output, it is characterized in that: the circuit realizing this PCB fabric swatch method includes two current loops, loop 1 is made up of input filter capacitor Cin, upper end field effect transistor Q1, lower end field effect transistor Q2, and loop 2 is made up of lower end field effect transistor Q2, outputting inductance Lout, output capacitance Cout；This this method realizes PCB fabric swatch by reducing the loop area of loop 1 and loop 2；Making the change-over circuit of High-current output when High-current output, both reduced the electromagnetic noise interference to control circuit that circuit produces, the loss reducing again DC impedance makes the efficiency of power supply be improved, and power device uses and is beneficial to heat conducting and radiating with layout layer simultaneously.
PCB fabric swatch method the most according to claim 1, it is characterised in that: PCB uses 6 laminates；Top layer components and parts are the input filter capacitor Cin of close input terminal, the output filter capacitor Cout of close lead-out terminal and drive circuit；Top layer is signal wiring layer, and the 1st layer, centre, middle 2nd layer of cabling are Power Groud, and the 3rd layer, centre, the 4th layer, centre, bottom cabling are for just with output just inputting；Bottom components and parts are near the input filter capacitor Cin of input terminal, upper end field effect transistor Q1 of many fabric swatch in parallel, lower end field effect transistor Q2 of many fabric swatch in parallel, the output inductance Lout of many fabric swatch in parallel, the output filter capacitor Cout of close lead-out terminal；Input filter capacitor Cin is connected by large stretch of copper clad layers with the drain electrode of upper end field effect transistor Q1, input filter capacitor Cin is connected by large stretch of copper clad layers with the source electrode of lower end field effect transistor Q2, junction point between the source electrode of upper end field effect transistor Q1 and drain electrode and the output inductance Lout of lower end field effect transistor Q2 is connected by large stretch of copper clad layers, connects with the cabling of large area copper clad layers between output inductance Lout and output filter capacitor Cout.
PCB fabric swatch method the most according to claim 2, it is characterized in that: input filter capacitor Cin brings to Front and bottom is near input positive and negative terminal, output filter capacitor Cout brings to Front and bottom is near output positive and negative terminal, the positive and negative terminal of filter capacitor is connected with intermediate layer by pad via, reduces the ESL of filter capacitor；Drive circuit is placed between the printed board top layer input filter capacitor Cin and output filter capacitor Cout directly over upper end field effect transistor Q1, lower end field effect transistor Q2, makes that driver circuit is the shortest, drive loop minimum；Upper end field effect transistor Q1 and lower end field effect transistor Q2 are many and are mounted side by side, input filter capacitor Cin is connected by large stretch of copper clad layers with the drain electrode of upper end field effect transistor Q1, the source electrode of input filter capacitor Cin and lower end field effect transistor Q2 is connected by large stretch of copper clad layers and is connected with pass through the input with 1 layer, centre, 2 layers, centre and top layer of the pad via, the drain electrode of upper end field effect transistor Q1 just is being connected to input by pad via and intermediate layer, reduces input filter capacitor Cin, upper end field effect transistor Q1 and the loop area of lower end field effect transistor Q2 composition and the High-frequency Interference of generation；Output inductance Lout is many and is mounted side by side, output inductance Lout input is connected by large stretch of copper clad layers with the source electrode of upper end field effect transistor Q1 and the drain electrode of lower end field effect transistor Q2, output inductance Lout outfan is just connected with output filter capacitor Cout and output through intermediate layer by pad via, reduces output inductance Lout, lower end field effect transistor Q2 and the loop area of output filter capacitor Cout composition and the High-frequency Interference of generation.
PCB fabric swatch method the most according to claim 2, it is characterized in that: upper end field effect transistor Q1 is many fabric swatch in parallel of equal number with lower end field effect transistor Q2, it is encapsulated as PG-TDSON-8 or PowerFLATTM(8 × 8), its heat is conducted to housing by heat conductivity gap filling material；Output inductance Lout is that many surface-mount type power inductances in parallel are close to housing heat radiation；Upper end field effect transistor Q1, lower end field effect transistor Q2, output inductance Lout use many fabric swatch in parallel and peripheral PCB trace identical, and line impedance is consistent.
5. according to the PCB fabric swatch method in any of the one of claim 1-4, it is characterised in that the change-over circuit of described High-current output is for synchronizing BUCK circuit.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610384906.7A CN105932874B (en) | 2016-06-02 | 2016-06-02 | A kind of PCB fabric swatch methods of conversion circuit suitable for High-current output |
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| CN201610384906.7A CN105932874B (en) | 2016-06-02 | 2016-06-02 | A kind of PCB fabric swatch methods of conversion circuit suitable for High-current output |
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| CN105932874A true CN105932874A (en) | 2016-09-07 |
| CN105932874B CN105932874B (en) | 2018-06-19 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109450249A (en) * | 2018-12-25 | 2019-03-08 | 江苏威尔曼科技有限公司 | A kind of step-down conversion circuit for robot servo system |
| CN109639140A (en) * | 2019-01-11 | 2019-04-16 | 武汉精立电子技术有限公司 | A kind of pcb board of DC-DC Switching Power Supply |
| CN110062518A (en) * | 2018-12-18 | 2019-07-26 | 厦门佐之记商贸有限公司 | A kind of PCB layout structure reducing electromagnetic interference |
| CN111934539A (en) * | 2020-10-09 | 2020-11-13 | 成都正扬博创电子技术有限公司 | Anti-electromagnetic interference non-isolation DC-DC circuit board |
| CN113007883A (en) * | 2021-03-02 | 2021-06-22 | 珠海拓芯科技有限公司 | Anti-interference device, electronic equipment and air conditioner |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080023785A1 (en) * | 2006-07-28 | 2008-01-31 | Alpha & Omega Semiconductor, Ltd | Bottom source LDMOSFET structure and method |
| CN103795384A (en) * | 2012-10-31 | 2014-05-14 | 台达电子企业管理（上海）有限公司 | Switch circuit packaging module |
-
2016
- 2016-06-02 CN CN201610384906.7A patent/CN105932874B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080023785A1 (en) * | 2006-07-28 | 2008-01-31 | Alpha & Omega Semiconductor, Ltd | Bottom source LDMOSFET structure and method |
| CN103795384A (en) * | 2012-10-31 | 2014-05-14 | 台达电子企业管理（上海）有限公司 | Switch circuit packaging module |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110062518A (en) * | 2018-12-18 | 2019-07-26 | 厦门佐之记商贸有限公司 | A kind of PCB layout structure reducing electromagnetic interference |
| CN109450249A (en) * | 2018-12-25 | 2019-03-08 | 江苏威尔曼科技有限公司 | A kind of step-down conversion circuit for robot servo system |
| CN109639140A (en) * | 2019-01-11 | 2019-04-16 | 武汉精立电子技术有限公司 | A kind of pcb board of DC-DC Switching Power Supply |
| CN111934539A (en) * | 2020-10-09 | 2020-11-13 | 成都正扬博创电子技术有限公司 | Anti-electromagnetic interference non-isolation DC-DC circuit board |
| CN113007883A (en) * | 2021-03-02 | 2021-06-22 | 珠海拓芯科技有限公司 | Anti-interference device, electronic equipment and air conditioner |
| CN113007883B (en) * | 2021-03-02 | 2022-04-19 | 珠海拓芯科技有限公司 | Anti-interference device, electronic equipment and air conditioner |
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| Publication number | Publication date |
|---|---|
| CN105932874B (en) | 2018-06-19 |
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