CN206748777U - Double-deck linear cutting equipment - Google Patents

Abstract

The application provides a kind of double-deck linear cutting equipment, including workpiece carrying system and System of HS-WEDM, System of HS-WEDM includes cutting rack structure and upper strata cutting net and lower floor's cutting net in cutting rack structure, in cutting, after cutting rack structure is adjusted in place by shift mechanism, the workpiece to be cut that net and the corresponding cutting workpiece carrying system of lower floor's cutting net are carried is cut by upper strata, so, the workpiece of carrying is cut using bilayer cutting net, whole process is simple to operate, cutting operation efficient stable, settle at one go, realize automation mechanized operation.

Description

Double-deck linear cutting equipment

Technical field

The application is related to wire cutting technology field, more particularly to a kind of double-deck linear cutting equipment.

Background technology

When manufacturing various semiconductors, photovoltaic device, the semiconductor of the hard brittle materials such as silicon, sapphire or ceramics will be included Work piece cut operation is to require the chip of thickness.Because chip cutting is the important procedure that restricts follow-up finished product, thus it is right Its job requirements also more and more higher.At present, multi-wire cutting technology is due to production efficiency is high, operating cost is low, homework precision The features such as high, it is widely used in the crystal-cut production of industry.

Multi-wire cutting technology is relatively advanced crystal-cut technology in the world at present, and its principle is to pass through high-speed motion Diamond wire treat operation crystalline silicon workpiece and carry out cutting and form secondary products.So that polycrystal silicon ingot is cut as an example, usually, substantially Flow chart include：Evolution operation first is carried out to primary silicon cube to form secondary silicon cube, evolution using silicon ingot excavation machine After, reuse silicon ingot shear and to secondary silicon cube block operation to form silicon cube finished product, subsequently reuse and cut Piece machine carries out section operation to silicon cube finished product, then obtains silicon chip.But current silicon ingot shear still have it is many not Foot, such as：Cut-off efficiency is low, is once blocking the limited amount for the primary silicon cube that can be blocked in operation.It is in addition, required The primary silicon cube blocked it is large number of, the storage and carrying and the conversion of workbench etc. of primary silicon cube to be blocked are one Hang-up, the problems such as efficiency is low, potential safety hazard is big be present.

The content of the invention

Disadvantages in view of the above, the purpose of the application is to disclose a kind of double-deck linear cutting equipment, for solving The problems such as certainly cutting efficiency present in correlation technique is low.

To achieve the above object and other purposes, the application disclose a kind of double-deck linear cutting equipment, including work on the one hand Part bearing system and System of HS-WEDM, wherein, the System of HS-WEDM includes：Cutting rack structure, is advanced by shift mechanism；If In the upper cutting roller group in the cutting rack structure, lower cutting roller group and line of cut, wherein, it is around in the upper cutting roller group Between line of cut formed upper strata cutting net, be around in it is described it is lower cutting roller group between line of cut formed lower floor cutting net；Cutting During cutting, after being adjusted in place by the cutting rack structure by shift mechanism so that the upper strata cutting net and the lower floor The corresponding workpiece to be cut for cutting the workpiece carrying system and being carried of cutting net.

Double-deck linear cutting equipment disclosed in the present application, including：Workpiece carrying system and System of HS-WEDM, System of HS-WEDM bag Cutting rack structure and upper strata cutting net and lower floor's cutting net in cutting rack structure are included, in cutting, cutting rack structure is led to Cross after shift mechanism is adjusted in place, net is cut by upper strata and the corresponding cutting workpiece carrying system of lower floor's cutting net carried it is to be cut The workpiece cut, in this way, being cut using bilayer cutting net to the workpiece of carrying, whole process is simple to operate, cutting operation Efficient stable, settle at one go, realize automation mechanized operation.

In some embodiments, the workpiece carrying system includes single layer workpieces bearing structure；The shift mechanism bag Include vertical shift mechanism；Using the vertical shift mechanism, the cutting rack structure is subjected to vertical traveling and is displaced to predetermined Position so that upper strata cutting net and lower floor's cutting net in the cutting rack structure correspond to the cutting single layer workpieces carrying respectively Upper strata cutting net and lower floor's cutting net in structure in different workpiece to be cut or the cutting rack structure correspond to respectively Cut the different cutting positions of workpiece to be cut in the single layer workpieces bearing structure.

In some embodiments, the vertical shift mechanism includes vertical guide rail and vertical sliding block.

In some embodiments, the vertical guide rail is layed in fixing support rack, and the vertical sliding block is cut located at described Frame structure is cut with the vertical guide rail to coordinate.

In some embodiments, the workpiece carrying system includes：Upper strata Workpiece carrier platform and lower floor's Workpiece carrier platform； The shift mechanism includes：Vertical shift mechanism and horizontal dislodgment feature；Using the vertical shift mechanism, by the cutting rack Structure carries out vertical traveling and is displaced to the first precalculated position so that lower floor's cutting net in the cutting rack structure corresponds to Clearance zone between the upper strata Workpiece carrier platform and lower floor's Workpiece carrier platform；Using the horizontal dislodgment feature, by institute State cutting rack structure to carry out horizontal line and then be displaced to the second precalculated position from the first precalculated position so that the cutting rack structure The upper strata cutting net of upper configuration corresponds to the cutting position of workpiece to be cut in the upper strata workpiece-carrying structure, the cutting The lower floor's cutting net configured in frame structure corresponds to the cutting position of workpiece to be cut in lower floor's workpiece-carrying structure.

In some embodiments, the vertical shift mechanism includes vertical guide rail and vertical sliding block, the horizontal shift Mechanism includes horizontal guide rail and cross sliding clock.

In some embodiments, the vertical guide rail is layed in fixing support rack, and the vertical sliding block is located at adjustable shelf And coordinate with the vertical guide rail, the horizontal guide rail is layed in the cutting rack structure, and the cross sliding clock is located at the work Moving frame and with the horizontal guide rail coordinate.

In some embodiments, the horizontal guide rail is layed in fixed horizontal beam, and the cross sliding clock is located at adjustable shelf And coordinate with the horizontal guide rail, the vertical guide rail is layed in the cutting rack structure, and the vertical sliding block is located at the work Moving frame and coordinate with the vertical guide rail.

In some embodiments, the upper strata workpiece-carrying structure is provided with the upper strata Workpiece carrier for carrying workpiece Disk, lower floor's workpiece-carrying structure are provided with lower floor's Workpiece carrier disk for carrying workpiece.

In some embodiments, the workpiece carrying system also includes：Upper strata workpiece fetching device, for being pointed to Upper strata Workpiece carrier disk at layer handling station carries out picking and placeing workpiece operation；Lower floor's workpiece fetching device, for being pointed to lower floor Lower floor's Workpiece carrier disk at handling station carries out picking and placeing workpiece operation.

Brief description of the drawings

Fig. 1 is schematic perspective view of the application bilayer linear cutting equipment under the first visual angle.

Fig. 2 is the front view of the application bilayer linear cutting equipment.

Fig. 3 is the side view of the application bilayer linear cutting equipment.

Fig. 4 is Fig. 3 rough schematic view.

Fig. 5 is the schematic flow sheet of the application bilayer linear cutting equipment in double-deck wire cutting application in one embodiment.

Fig. 6 to Figure 14 performs the shape in work piece cut operation process for the application bilayer linear cutting equipment in a certain example State schematic diagram.

Embodiment

Presently filed embodiment is illustrated by particular specific embodiment below, those skilled in the art can be by this explanation Content disclosed by book understands other advantages and effect of the application easily.

Fig. 1 is referred to Figure 14.It should be clear that structure, ratio, size depicted in this specification institute accompanying drawings etc., is only used To coordinate the content disclosed in specification, so that those skilled in the art understands and reads, being not limited to the application can The qualifications of implementation, therefore do not have technical essential meaning, the tune of the modification of any structure, the change of proportionate relationship or size It is whole, in the case where not influenceing the effect of the application can be generated and the purpose that can reach, all should still fall in skill disclosed herein Art content is obtained in the range of covering.Meanwhile in this specification it is cited as " on ", " under ", "left", "right", " centre " and The term of " one " etc., understanding for narration is merely convenient to, and is not used to limit the enforceable scope of the application, its relativeness It is altered or modified, in the case where changing technology contents without essence, when being also considered as the enforceable category of the application.

Disclosure has a kind of double-deck linear cutting equipment, including workpiece carrying system and System of HS-WEDM, wherein, it is described System of HS-WEDM includes：Cutting rack structure, is advanced by shift mechanism；Upper cutting roller group in the cutting rack structure, Lower cutting roller group and line of cut, wherein, the line of cut being around between the upper cutting roller group forms upper strata cutting net, is around in Line of cut between the lower cutting roller group forms lower floor's cutting net；In cutting process, shifting is passed through by the cutting rack structure After the institutional adjustment in place of position so that the upper strata cutting net and lower floor cutting net correspond to and cut the workpiece carrying system institute The workpiece to be cut of carrying.In this way, the workpiece of carrying is cut using bilayer cutting net, whole process operation letter Single, cutting operation efficient stable, settles at one go, realizes automation mechanized operation.

Under a kind of implementation situation：Workpiece carrying system includes single layer workpieces bearing structure, and shift mechanism includes vertical shifting Position mechanism.So, using vertical shift mechanism, cutting rack structure can be subjected to vertical traveling and is displaced to precalculated position so that Upper strata cutting net and lower floor's cutting net in cutting rack structure correspond to different to be cut in cutting single layer workpieces bearing structure respectively Upper strata cutting net and lower floor's cutting net in the workpiece or cutting rack structure that cut correspond to cutting single layer workpieces bearing structure respectively In workpiece to be cut different cutting positions.In this way, in actual applications, can be by cutting by mobile cutting rack structure Upper strata cutting net and lower floor's cutting net in frame structure are simultaneously or sequentially carried to be cut to single layer workpieces bearing structure Workpiece is cut.Such as：If cutting rack structure cuts net at the middle and upper levels and lower floor's cutting net is arranged side by side for left and right, then upper strata The different workpiece to be cut that cutting net and lower floor's cutting net can be carried simultaneously or sequentially to single layer workpieces bearing structure enter Row cutting.If cutting rack structure cuts net at the middle and upper levels and lower floor's cutting net is set to be front and rear, then net is cut on upper strata and lower floor cuts The different parts for cutting the same workpiece to be cut that net can be carried simultaneously or sequentially to single layer workpieces bearing structure are cut Cut.As can be seen here, the cutting of the different cutting positions of different workpieces or workpiece in individual layer, whole mistake can be completed in single cut Journey is simple to operate, cutting operation efficient stable, settles at one go, realizes automation mechanized operation.

Under another implementation situation：Workpiece carrying system includes：Upper strata Workpiece carrier platform and lower floor's Workpiece carrier platform, move Position mechanism includes：Vertical shift mechanism and horizontal dislodgment feature.So, using vertical shift mechanism, cutting rack structure is carried out Vertical traveling and be displaced to the first precalculated position so that lower floor in cutting rack structure cutting net corresponds to upper strata Workpiece carrier Clearance zone between platform and lower floor's Workpiece carrier platform；Using horizontal dislodgment feature, by cutting rack structure carry out horizontal line so that from First precalculated position is displaced to the second precalculated position so that the upper strata cutting net configured in cutting rack structure corresponds to the upper strata The cutting position of workpiece to be cut in workpiece-carrying structure, the lower floor's cutting net configured in the cutting rack structure correspond to institute State the cutting position of workpiece to be cut in lower floor's workpiece-carrying structure.In this way, in actual applications, pass through mobile cutting rack knot Structure, the workpiece to be cut that net is carried to upper strata workpiece-carrying structure can be cut by upper strata and is cut, meanwhile, by lower floor The workpiece to be cut that cutting net is carried to lower floor's workpiece-carrying structure is cut.As can be seen here, can be in single cut The cutting of double-deck workpiece is completed, whole process is simple to operate, cutting operation efficient stable, settles at one go, realizes automation mechanized operation.

Hereinafter, we will combine schema to illustrate the application bilayer linear cutting equipment.

Fig. 1 to Fig. 3 is referred to, is the structural representation of the application bilayer linear cutting equipment in one embodiment, wherein, figure 1 is schematic perspective view of the application bilayer linear cutting equipment under the first visual angle, Fig. 2 be the application bilayer linear cutting equipment just View, Fig. 3 are the side view of the application bilayer linear cutting equipment.The application bilayer linear cutting equipment can be used for including silicon, indigo plant The semiconductor workpiece of the hard brittle material such as jewel or ceramics carries out cutting operation, (is removed in other words not with cutting into the structure of conjunction rule Meet the part of specification).In the examples below, we select the cutting operation of siliceous crystalline silicon workpiece to be explained. With reference to Fig. 1 to Fig. 3, the application bilayer linear cutting equipment includes：Support 1, workpiece carrying system 3, System of HS-WEDM 5, wherein, work Part bearing system 3 is used to carry workpiece to be cut, and System of HS-WEDM 5 is then to be cut for being carried to workpiece carrying system 3 The workpiece cut is cut.

Workpiece carrying system, for carrying workpiece to be cut.In the present embodiment, the workpiece is crystalline silicon workpiece 10, the cutting that crystalline silicon workpiece 10 is made is essentially to block operation.Crystalline silicon workpiece 10 may be, for example, polycrystalline silicon rod, and this waits to cut Disconnected polycrystalline silicon rod 10 is rectangular parallelepiped structure, and substantially, polycrystalline silicon rod 10 is to be made by primary silicon cube (polycrystal silicon ingot) through evolution Industry and the secondary silicon cube formed, in this way, the head of the polycrystalline silicon rod 10 formed through evolution and afterbody are original polycrystal silicon ingot Upper surface portion and bottom surface section, and polycrystal silicon ingot is the product formed by silicon material directional solidification, in general, described more In crystal silicon ingot surface portion compared to inside shaping it is poor and there may be the defects of certain (such as：Silicon material uniformity is poor, deposits In impurity and bubble etc.), therefore, it is typically necessary that the polycrystalline silicon rod after evolution is carried out blocking operation and is not inconsistent wherein with amputating Head and/or the afterbody of manufacturing technique requirent are closed, the crystalline silicon finished workpart for meeting product specification is formed so as to process.

For workpiece carrying system, in the present embodiment, workpiece carrying system 3 breaks through existing common individual layer bearing structure Design but originally designed using multiple field bearing structure.Herein, come for the time being by taking the design of two-layer equation bearing structure as an example Explanation, i.e. workpiece carrying system 3 includes upper strata workpiece-carrying structure 31 and lower floor's workpiece-carrying structure 33 setting up and down.With Under upper strata workpiece-carrying structure 31 and lower floor's workpiece-carrying structure 33 are described.

Upper strata workpiece-carrying structure 31 includes upper strata workpiece-carrying base 311 and is arranged on upper strata workpiece-carrying base Upper strata Workpiece carrier disk 313 on 311, polycrystalline silicon rod 10 is carried by upper strata Workpiece carrier disk 313.Upper strata workpiece-carrying base 311 may be, for example, the frame base with grid.In the first alternative embodiment, designed on upper strata workpiece-carrying base 311 There is a upper strata station platform, multiple upper strata Workpiece carrier disks 313, this multiple upper strata are provided with this upper strata station platform Workpiece carrier disk 313, which is horizontally spaced, sequentially to be set.Further, this upper strata station platform for fixed setting or passes through Upper strata station switching mechanism and change position.For fixed setting, region residing for this upper strata station platform is upper strata handling The coincidence of station and upper strata cutting work station, in actual applications, first polycrystalline silicon rod 10 to be blocked is loaded to this upper strata On each upper strata Workpiece carrier disk 313 of station platform, the polycrystalline silicon rod 10 on upper strata Workpiece carrier disk 313 is implemented to block work Industry, then polycrystalline silicon rod 10 after blocking are unloaded from each upper strata Workpiece carrier disk 313 of this upper strata station platform Under, and the polycrystalline silicon rod 10 for reloading to be blocked.For changing position by upper strata station switching mechanism, this upper strata Station platform can be loaded and unloaded between station and upper strata cutting work station on upper strata and changed, in this way, at a time, when on this When layer station platform is located at upper strata handling station, polycrystalline silicon rod 10 to be blocked can be loaded to this upper strata station platform On each upper strata Workpiece carrier disk 313, afterwards, this upper strata station platform station is by upper strata station switching mechanism by upper strata Handling station is changed to upper strata cutting work station to carry out the operation of blocking of polycrystalline silicon rod, after the completion of operation to be blocked, on this Layer station platform continues through upper strata station switching mechanism and changed by upper strata cutting work station to upper strata loader position to be unloaded The polycrystalline silicon rod 10 to be blocked of polycrystalline silicon rod and loading newly after blocking.In second of alternative embodiment, upper strata workpiece is held Being designed with least two upper strata station platforms on load base 311, (this at least two upper stratas station platform is horizontally spaced parallel Set), multiple upper strata Workpiece carrier disks 313 are then provided with each described upper strata station platform, and this multiple upper strata workpiece is held The first direction interval of load plate 313 horizontally sequentially sets that (first direction here may be, for example, X-axis as shown in Figure 1 To).Preferably, at least two workbench can change position by upper strata station switching mechanism, any so as to realize Upper strata station platform is loaded and unloaded between station and upper strata cutting work station on upper strata and changed, in this way, one of upper strata station Platform is the handling operation that polycrystalline silicon rod is carried out positioned at upper strata handling station, and another upper strata station platform therein is positioned at upper Layer cutting work station carries out the polycrystalline silicon rod completion section blocked operation, treat on another upper strata station platform therein of polycrystalline silicon rod After disconnected operation, so that it may change position by upper strata station switching mechanism and one of upper strata station platform so that wherein A upper strata station platform upper strata cutting work station is transformed into by upper strata handling station to carry out the blocking operation of polycrystalline silicon rod and Another upper strata station platform therein is transformed into upper strata handling station by upper strata cutting work station and carries out unloading the polycrystalline after blocking The polycrystalline silicon rod to be blocked of silicon rod and loading newly.It is more in second of alternative embodiment compared to the first alternative embodiment The design of upper strata station platform, on the one hand, the upper strata workpiece-carrying base 311 includes at least two upper strata stations being set up in parallel Platform, more upper strata station platforms can the more polycrystalline silicon rod 10 to be blocked of support, can be simultaneously by multiple polycrystalline to be blocked The head of silicon rod 10 and/or afterbody are cut off, and cutting speed is fast, it can also be ensured that the cut quality of cut surface, have been cut not With trimming, on the other hand, at least two upper strata station platforms in the workbench are turned by upper strata station switching mechanism Station position is changed, the automatic and accurate conversion of upper strata station platform can be realized so that wire-electrode cutting device can be to being loaded at least Polycrystalline silicon rod 10 to be blocked on two upper strata station platforms is realized and alternately cut, and ensures that more batches of polycrystalline silicon rods 10 can be orderly Cutting operation is carried out, greatly improves the efficiency for blocking operation.

As it was previously stated, upper strata station platform can load and unload station and upper strata cutting on upper strata by upper strata station switching mechanism Changed between station.As shown in figure 1, the upper strata station switching mechanism in the present embodiment can such as upper water translation stage machine Structure, using the upper water translation stage mechanism, the carry out level traveling of upper strata workpiece-carrying structure 31 can be driven so as to obtain upper strata work Part bearing structure 31 at the middle and upper levels the upper strata Workpiece carrier disk 313 on station platform upper strata cutting work station and upper strata handling station it Between changed.Specifically, the upper water translation stage mechanism may include：Upper strata sliding element and upper strata driver element.It is described Upper strata sliding element may include the horizontal tie 314 of upper strata horizontal guide rail 312 and upper strata, wherein, upper strata horizontal guide rail 312 is along dampening Put down to second direction (second direction here may be, for example, Y-axis as shown in Figure 1) be arranged at upper strata workpiece-carrying base 311 bottom, the horizontal tie 314 in upper strata are then arranged on support 1, and upper strata horizontal guide rail 312 is mutual with the horizontal tie in upper strata Coordinate.In more detail, in the upper strata sliding element, two upper strata horizontal guide rails 312 are may be configured with, this two upper strata levels Guide rail 312 is respectively in the opposite sides in the bottom of upper strata workpiece-carrying base 311 along a first direction, accordingly, in support 1 In opposite sides along a first direction be provided with two upper strata horizontal guide rails 312 for pillow bracket upper strata horizontal guide rail 312.To make The firm setting of the horizontal tie 314 in upper strata is obtained, can also be that the horizontal tie 314 in upper strata provides upper strata pillow platform 316, the horizontal tie in upper strata 314 be to rest the head on platform by upper strata to be fixedly installed on support 1.The upper strata driver element may include that upper strata motor (is not schemed Show) and upper strata transmission parts (not shown), the upper strata transmission parts are connected to be held in upper strata motor and upper strata workpiece Base 311 is carried, and is controlled by the control of upper strata motor and drives upper strata workpiece-carrying base 311 in upper strata horizontal guide rail 312 and the horizontal tie 314 in upper strata cooperation under advanced along second direction is horizontal.In an alternative embodiment, upper strata driving electricity Machine may be, for example, servomotor, and the upper strata transmission parts may be, for example, ball-screw, and ball-screw has high accuracy, invertibity With efficient feature, in this way, by the cooperation of servomotor and ball-screw, improve upper strata workpiece-carrying base 311 and its On the horizontal precision advanced in a second direction of upper strata Workpiece carrier disk 313.It should be noted that the foregoing upper water Structure, set-up mode and its operation shape of upper strata sliding element and upper strata driver element in translation stage mechanism not as Limit, in other embodiments, upper strata sliding element and upper strata driver element can still make other changes, such as：Slide on the upper strata Moving unit may include upper strata horizontal guide rail and upper strata sliding block, wherein, the upper strata horizontal guide rail can be fixedly installed on support, institute The bottom of upper strata workpiece-carrying base can be then fixedly installed on by stating upper strata sliding block, and the upper strata sliding block is arranged in pairs or groups horizontal in the upper strata Guide rail simultaneously slides the horizontal traveling of realization along the upper strata horizontal guide rail.In addition, the upper strata driver element may include upper strata tooth Rail, upper strata rotate gear and upper strata motor, the upper strata rack rails can be fixedly installed on the bottom of upper strata workpiece-carrying base Portion, the upper strata rotate gear can then be fixedly installed on support (or the upper strata rack rails can be fixedly installed on support, The upper strata rotate gear can then be fixedly installed on the bottom of upper strata workpiece-carrying base), the upper strata rotate gear is engaged in The upper strata rack rails, the upper strata rotate gear are controlled by the upper strata motor, are driven by the upper strata motor The upper strata rotate gear rotates simultaneously to be coordinated with the upper strata rack rails, realizes upper strata workpiece-carrying base and upper strata workpiece thereon The horizontal traveling of carrier.

Multiple upper strata Workpiece carrier disks are provided with each upper strata station platform on upper strata workpiece-carrying base 311 313, (first direction here may be, for example, as shown in Figure 1 to this first direction of multiple upper strata Workpiece carrier disks 313 horizontally X axis) interval sequentially set (spacing between two adjacent upper strata Workpiece carrier disks is not construed as limiting, and can be equidistant Can also it is non-at equal intervals).In addition, each upper strata Workpiece carrier disk 313 can carry at least one polycrystalline silicon rod 10, such as scheme Shown in 1 and Fig. 3, at least two polycrystalline silicon rods 10 are carried on the upper strata Workpiece carrier disk 313 that shows, this at least two polysilicon Rod 10 is placed side by side.

Further, upper strata Workpiece carrier disk 313 is provided with the upper strata workpiece for being used for positioning polycrystalline silicon rod 10 to be blocked Detent mechanism, the upper strata workpiece locating mechanism can treat the polycrystalline silicon rod 10 blocked and be positioned, so as in cutting During ensure that the position of polycrystalline silicon rod 10 to be blocked will not shift, it is ensured that the precision of cutting.

In a kind of alternative embodiment, the upper strata workpiece locating mechanism is chosen as a clamp system, and the clamp system can Including：Grip base and the Workpiece clamping tool 315 for being articulated with the grip base.In the clamp system, the clamping bottom Seat can be independent part, be arranged at the bottom of upper strata Workpiece carrier disk 313, but be not limited thereto, in fact, the clamping Base can also be saved, and Workpiece clamping tool 315 can be directly articulated with upper strata Workpiece carrier disk 313.In one case, workpiece Clamping fixture 315 is clamp arm, clamp arm controlled (such as motor or hydraulic jack etc.) and relatively described grip base is made The pinching action of opening and closing, so, after polycrystalline silicon rod 10 is positioned over upper strata Workpiece carrier disk 313, clamp arm is controlled to be collapsed and leads to Cross mutual cooperation and clamp polycrystalline silicon rod 10.In another scenario, Workpiece clamping tool is a pair of L-type support angle structures, institute Stating L-type support angle structure includes support angle bearing base and the clamping limb being connected with the support angle bearing base into angle, the support angle The bottom of bearing base is articulated with the grip base.Using the L-type support angle structure, according to lever principle, by polysilicon The support angle bearing base in the L-type support angle structure of both sides is pushed down in the deadweight of rod 10, and support angle bearing base is relative in the case of compression Overturn in the grip base so that the clamping limb that is connected with support angle bearing base towards it is middle extrude (this pair of clamp arms by Voluntarily closed after pressure) and polycrystalline silicon rod 10 is clamped by mutual cooperation.

In another alternative embodiment, the upper strata workpiece locating mechanism is chosen as a top-pressure mechanism.In a kind of situation Under, two polycrystalline silicon rods 10 placed side by side are carried on upper strata Workpiece carrier disk 313, top-pressure mechanism may include：It is fixedly arranged on On layer Workpiece carrier disk 313 and the support bar between two polycrystalline silicon rods 10 being arranged side by side, horizontal connection are in support bar Fix bar (fix bar is across two polycrystalline silicon rods 10 and two ends of fix bar correspond respectively to two polycrystalline silicon rods 10) and the both ends of fix bar is fixed in and are located at the press part of the top of polycrystalline silicon rod 10 to be blocked.In another situation Under, a polycrystalline silicon rod 10 or multiple polycrystalline silicon rods 10 of front and rear setting, the top pressure are carried on upper strata Workpiece carrier disk 313 Mechanism may include：It is fixedly arranged on upper strata Workpiece carrier disk 313 and is located at the support bar 311 of the side of polycrystalline silicon rod 10, horizontal connection In support bar fix bar (one of end of fix bar corresponds to polycrystalline silicon rod 10) and be fixed in fixed boom end simultaneously Press part above polycrystalline silicon rod 10 to be blocked.In actual applications, press part is chosen as elastic press, the elasticity The bottom of briquetting presses on the top of polycrystalline silicon rod 10 to be blocked.It is further, firm according to the size of polycrystalline silicon rod 10 and positioning Degree requires that the quantity of upper strata workpiece locating mechanism can adjust in good time, for example, usually, a polycrystalline silicon rod 10 is configured with two Individual upper strata workpiece locating mechanism, the two upper strata workpiece locating mechanisms are located at the front and rear two positions of polycrystalline silicon rod 10 respectively.

Further, it is mutually dry to avoid the multiple polycrystalline silicon rods 10 carried on upper strata Workpiece carrier disk 313 from producing Relate to, be arranged side by side or the two neighboring polycrystalline silicon rod 10 of front and rear setting between spacer block or dividing plate 317 can be set.

Lower floor's workpiece-carrying structure 33 includes lower floor's workpiece-carrying base 331 and is arranged on lower floor's workpiece-carrying base Lower floor's Workpiece carrier disk 333 on 331, polycrystalline silicon rod 10 is carried by lower floor's Workpiece carrier disk 333.Lower floor's workpiece-carrying base 331 may be, for example, that the platform base of tabular can also be the frame base for having grid.In the first alternative embodiment, lower floor Lower floor's station platform is designed with workpiece-carrying base 331, multiple lower floor's works are provided with this lower floor's station platform Part carrier 333, this multiple lower floor's Workpiece carrier disk 333, which is horizontally spaced, sequentially to be set.Further, this lower floor's work Bit platform for fixed setting or changes position by lower floor's station switching mechanism.For fixed setting, this lower floor's station Region residing for platform is the coincidence of lower floor's handling station and lower floor's cutting work station, in actual applications, first by polycrystalline to be blocked Silicon rod 10 is loaded to each lower floor's Workpiece carrier disk 333 of this lower floor's station platform, on lower floor's Workpiece carrier disk 333 Polycrystalline silicon rod 10 implement to block operation, then the polycrystalline silicon rod 10 after blocking is from each lower floor of this lower floor's station platform Unloaded on Workpiece carrier disk 333, and the polycrystalline silicon rod 10 for reloading to be blocked.For passing through lower floor's station switching mechanism And position is changed, this lower floor's station platform can be loaded and unloaded in lower floor and changed between station and lower floor's cutting work station, in this way, At a time, when this lower floor's station platform is located at lower floor's handling station, polycrystalline silicon rod 10 to be blocked can be unloaded To each lower floor's Workpiece carrier disk 333 of this lower floor's station platform, afterwards, this lower floor's station platform station passes through Lower floor's station switching mechanism is changed to lower floor's cutting work station by lower floor's handling station and blocks operation with carry out polycrystalline silicon rod, waits to cut After the completion of disconnected operation, this lower floor's station platform continues through lower floor's station switching mechanism and changed by lower floor's cutting work station under Layer loads and unloads station unload the polycrystalline silicon rod after blocking and load new polycrystalline silicon rod to be blocked.In second of optional reality Apply in example, at least two lower floor's station platforms (this at least two lower floors station platform is designed with lower floor's workpiece-carrying base 331 Horizontally interval is parallel is set), multiple lower floor's Workpiece carrier disks 333 are then provided with each described lower floor's station platform, This first direction interval of multiple lower floor's Workpiece carrier disks 333 horizontally sequentially sets that (first direction here may be, for example, X axis as shown in Figure 1).Preferably, at least two workbench can be by lower floor's station switching mechanism and translation bit Put, changed so as to realize that any lower floor's station platform loads and unloads in lower floor between station and lower floor's cutting work station, in this way, wherein Lower floor's station platform be positioned at lower floor handling station carry out polycrystalline silicon rod handling operation, another lower floor's work therein Bit platform is to block operation positioned at lower floor's cutting work station progress polycrystalline silicon rod, is treated on another lower floor's station platform therein Polycrystalline silicon rod is completed to block after operation, so that it may is changed by lower floor's station switching mechanism and one of lower floor's station platform Position so that one of lower floor's station platform is transformed into lower floor's cutting work station to carry out polycrystalline silicon rod by lower floor's handling station Block operation and another lower floor's station platform therein by lower floor's cutting work station be transformed into lower floor handling station unloaded The polycrystalline silicon rod to be blocked of polycrystalline silicon rod and loading newly after blocking.Compared to the first alternative embodiment, second optional The design of more lower floor's station platforms in embodiment, on the one hand, lower floor's workpiece-carrying base 331 includes being set up in parallel at least Liang Ge lower floors station platform, more lower floor's station platforms can the more polycrystalline silicon rod 10 to be blocked of support, can simultaneously will be multiple The head of polycrystalline silicon rod 10 to be blocked and/or afterbody are cut off, and cutting speed is fast, it can also be ensured that the cutting matter of cut surface Amount, has been cut and has not had to trimming, and on the other hand, at least two lower floor's station platforms in the workbench are turned by lower floor's station Converting mechanism and conversion station position, can realize the automatic and accurate conversion of lower floor's station platform so that wire-electrode cutting device can be right The polycrystalline silicon rod 10 to be blocked being loaded at least two lower floor's station platforms is realized and alternately cut, and ensures more batches of polycrystalline silicon rods 10 can carry out cutting operation in order, greatly improve the efficiency for blocking operation.

As it was previously stated, lower floor's station platform can load and unload station and lower floor's cutting by lower floor's station switching mechanism in lower floor Changed between station.As shown in figure 1, lower floor's station switching mechanism in the present embodiment can the horizontal moving stage machine of such as lower floor Structure, using horizontal moving stage mechanism of the lower floor, the carry out level traveling of lower floor's workpiece-carrying structure 33 can be driven so as to obtain lower floor's work Lower floor's Workpiece carrier disk 333 in part bearing structure 33 on lower floor's station platform lower floor's cutting work station and lower floor's handling station it Between changed.Specifically, horizontal moving stage mechanism of the lower floor may include：Lower floor's sliding element and lower floor's driver element.It is described Lower floor's sliding element may include lower floor's horizontal guide rail 332 and lower floor's sliding block 334, wherein, lower floor's horizontal guide rail 332 along level to Second direction (second direction here may be, for example, Y-axis as shown in Figure 1) be arranged on support 1, lower floor's sliding block 334 is then It is arranged at the bottom of lower floor's workpiece-carrying base 331, lower floor's sliding block 334 is cooperated with lower floor horizontal guide rail 332.It is more detailed Carefully, in lower floor's sliding element, Liang Tiao lower floors horizontal guide rail 332 is may be configured with, this Liang Tiao lower floors horizontal guide rail 332 divides Opposite sides along a first direction in the central region of lower support 1 is listed in, accordingly, at the bottom of lower floor's workpiece-carrying base 331 The opposite sides in portion is provided with for taking the Liang Tiao lower floors sliding block 334 on lower floor's horizontal guide rail 332.To cause lower floor's level to lead Rail 332 is firm to be set, and can also be that lower floor's horizontal guide rail 332 provides lower floor guide rail pillow platform 336, lower floor's horizontal guide rail 332 is to pass through Lower floor guide rail is rested the head on platform 336 and is fixedly installed on support 1.Lower floor's driver element may include lower floor's motor (not shown) With lower floor's transmission parts (not shown), lower floor's transmission parts are connected in lower floor's motor and lower floor's Workpiece carrier bottom Seat 331, and be controlled by the control of lower floor's motor and drive lower floor's workpiece-carrying base 331 in lower floor's sliding block 334 and lower floor Advanced under the cooperation of horizontal guide rail 332 along second direction is horizontal.In an alternative embodiment, lower floor's motor may be, for example, Servomotor, lower floor's transmission parts may be, for example, ball-screw, and ball-screw has high accuracy, invertibity and efficient Feature, in this way, by the cooperation of servomotor and ball-screw, improve lower floor's workpiece-carrying base 331 and lower floor's work thereon The precision that level is advanced in a second direction of part carrier 333.It should be noted that horizontal moving stage mechanism of the foregoing lower floor In lower floor's sliding element and structure, set-up mode and its operation shape of lower floor's driver element be not limited thereto, at other In embodiment, lower floor's sliding element and lower floor's driver element can still make other changes, such as：Lower floor's sliding element can wrap The horizontal tie of lower floor's horizontal guide rail and lower floor is included, wherein, lower floor's horizontal guide rail can fix the bottom of lower floor's workpiece-carrying base Portion, the horizontal tie of lower floor are arranged on support, restriction lower edge of the lower floor's horizontal guide rail in the horizontal tie of the lower floor The horizontal tie sliding of the lower floor and realize horizontal advance.

In addition, lower floor's driver element may include lower floor's rack rails, lower floor's rotate gear and lower floor's motor, institute The bottom of lower floor's workpiece-carrying base can be fixedly installed on by stating lower floor's rack rails, and lower floor's rotate gear can then be fixedly installed on machine On seat (or lower floor's rack rails can be fixedly installed on support, lower floor's rotate gear can then be fixedly installed on lower floor's work The bottom of part bearing base), lower floor's rotate gear is engaged in lower floor's rack rails, and lower floor's rotate gear is controlled by institute Lower floor's motor is stated, drives lower floor's rotate gear to rotate by lower floor's motor and matches somebody with somebody with lower floor's rack rails Close, realize the horizontal traveling of lower floor's workpiece-carrying base and lower floor's Workpiece carrier disk thereon.

Multiple lower floor's Workpiece carrier disks are provided with each lower floor's station platform on lower floor's workpiece-carrying base 331 333, (first direction here may be, for example, as shown in Figure 1 to this first direction of multiple lower floor's Workpiece carrier disks 333 horizontally X axis) interval sequentially set (spacing between adjacent Liang Ge lower floors Workpiece carrier disk is not construed as limiting, and can be equidistant Can also it is non-at equal intervals).In addition, each lower floor's Workpiece carrier disk 333 can carry at least one polycrystalline silicon rod 10, such as scheme Shown in 1 and Fig. 3, at least two polycrystalline silicon rods 10 are carried on lower floor's Workpiece carrier disk 333 for showing, this at least two polysilicon Rod 10 is placed side by side.

Further, lower floor's Workpiece carrier disk 333 is provided with the lower floor's workpiece for being used for positioning polycrystalline silicon rod 10 to be blocked Detent mechanism, lower floor's workpiece locating mechanism can treat the polycrystalline silicon rod 10 blocked and be positioned, so as in cutting During ensure that the position of polycrystalline silicon rod 10 to be blocked will not shift, it is ensured that the precision of cutting.

In a kind of alternative embodiment, lower floor's workpiece locating mechanism is chosen as a clamp system, and the clamp system can Including：Grip base and the Workpiece clamping tool 335 for being articulated with the grip base.In the clamp system, the clamping bottom Seat can be independent part, be arranged at the bottom of lower floor's Workpiece carrier disk 333, but be not limited thereto, in fact, the clamping Base can also be saved, and Workpiece clamping tool 335 can be directly articulated with lower floor's Workpiece carrier disk 333.In one case, workpiece Clamping fixture 335 is clamp arm, clamp arm controlled (such as motor or hydraulic jack etc.) and relatively described grip base is made The pinching action of opening and closing, so, after polycrystalline silicon rod 10 is positioned over lower floor's Workpiece carrier disk 333, clamp arm is controlled to be collapsed and leads to Cross mutual cooperation and clamp polycrystalline silicon rod 10.In another scenario, Workpiece clamping tool is a pair of L-type support angle structures, institute Stating L-type support angle structure includes support angle bearing base and the clamping limb being connected with the support angle bearing base into angle, the support angle The bottom of bearing base is articulated with the grip base.Using the L-type support angle structure, according to lever principle, by polysilicon The support angle bearing base in the L-type support angle structure of both sides is pushed down in the deadweight of rod 10, and support angle bearing base is relative in the case of compression Overturn in the grip base so that the clamping limb that is connected with support angle bearing base towards it is middle extrude (this pair of clamp arms by Voluntarily closed after pressure) and polycrystalline silicon rod 10 is clamped by mutual cooperation.

In another alternative embodiment, lower floor's workpiece locating mechanism is chosen as a top-pressure mechanism.In a kind of situation Under, two polycrystalline silicon rods 10 placed side by side are carried on lower floor's Workpiece carrier disk 333, top-pressure mechanism may include：It is fixedly arranged on down On layer Workpiece carrier disk 333 and the support bar between two polycrystalline silicon rods 10 being arranged side by side, horizontal connection are in support bar Fix bar (fix bar is across two polycrystalline silicon rods 10 and two ends of fix bar correspond respectively to two polycrystalline silicon rods 10) and the both ends of fix bar is fixed in and are located at the press part of the top of polycrystalline silicon rod 10 to be blocked.In another situation Under, a polycrystalline silicon rod 10 or multiple polycrystalline silicon rods 10 of front and rear setting, the top pressure are carried on lower floor's Workpiece carrier disk 333 Mechanism may include：It is fixedly arranged on lower floor's Workpiece carrier disk 333 and is located at the support bar 311 of the side of polycrystalline silicon rod 10, horizontal connection In support bar fix bar (one of end of fix bar corresponds to polycrystalline silicon rod 10) and be fixed in fixed boom end simultaneously Press part above polycrystalline silicon rod 10 to be blocked.In actual applications, press part is chosen as elastic press, the elasticity The bottom of briquetting presses on the top of polycrystalline silicon rod 10 to be blocked.It is further, firm according to the size of polycrystalline silicon rod 10 and positioning Degree requires that the quantity of lower floor's workpiece locating mechanism can adjust in good time, for example, usually, a polycrystalline silicon rod 10 is configured with two Individual lower floor's workpiece locating mechanism, the two lower floor's workpiece locating mechanisms are located at the front and rear two positions of polycrystalline silicon rod 10 respectively.

Further, it is mutually dry to avoid the multiple polycrystalline silicon rods 10 carried on lower floor's Workpiece carrier disk 333 from producing Relate to, be arranged side by side or the two neighboring polycrystalline silicon rod 10 of front and rear setting between spacer block or dividing plate 337 can be set.

Continue to return to have a talk about workpiece carrying system, the workpiece carrying system also includes corresponding to upper strata workpiece-carrying structure Upper strata workpiece fetching device and lower floor's workpiece fetching device corresponding to lower floor's workpiece-carrying structure, wherein, upper strata workpiece takes Device is put, for being picked and placeed to being located at the upper strata Workpiece carrier disk 313 at upper strata handling station in the workpiece-carrying structure of upper strata Workpiece operation, lower floor's workpiece fetching device, for being located at lower floor's work at lower floor's handling station in lower floor's workpiece-carrying structure Part carrier 333 carries out picking and placeing workpiece operation.By taking the workpiece fetching device of upper strata as an example：On the one hand, before implementing to block operation, When a upper strata station platform in the workpiece-carrying structure of upper strata is positioned at upper strata handling station, then picked and placeed using upper strata workpiece Polycrystalline silicon rod 10 to be blocked sequentially is loaded on each upper strata Workpiece carrier disk 313 on the upper strata station platform by device； On the other hand, after completing to block operation, when a upper strata station platform in the workpiece-carrying structure of upper strata is cut by upper strata When station is changed to upper strata loader position, then the polycrystalline silicon rod 10 after being blocked using upper strata workpiece fetching device is sequentially from this Unloaded on each upper strata Workpiece carrier disk 313 on layer station platform.Similarly, by taking lower floor's workpiece fetching device as an example：On the one hand, Before implementing to block operation, when lower floor's station platform in lower floor's workpiece-carrying structure is positioned at lower floor's handling station When, then polycrystalline silicon rod 10 to be blocked sequentially is loaded into using lower floor's workpiece fetching device each on lower floor's station platform On lower floor's Workpiece carrier disk 333；On the other hand, after completing to block operation, when under one in lower floor's workpiece-carrying structure When layer station platform is changed to lower floor's handling station by lower floor's cutting work station, then after being blocked using lower floor's workpiece fetching device Polycrystalline silicon rod 10 sequentially unloads from each lower floor's Workpiece carrier disk 333 on lower floor's station platform.

Upper strata workpiece fetching device more may include upper strata workpiece picking and placing unit 32 and upper strata travel mechanism, wherein, upper strata work Part picking and placing unit 32 is used to pick and place polycrystalline silicon rod 10, and upper strata travel mechanism is used to drive upper strata workpiece picking and placing unit 32 to move.

Upper strata workpiece picking and placing unit 32 may include：Upper strata casing 322, the upper strata machinery for being movably connected on upper strata casing 322 Telescopic arm 324 (Z axis that upper strata mechanical-stretching arm 324 can be vertically is flexible up and down), it is arranged at the end of upper strata mechanical-stretching arm 324 Upper strata pick and place part 326, polycrystalline silicon rod 10 to be loaded can be captured by picking and placeing part 326 using upper strata.Upper strata picks and places part 326 can be such as For adsorption element, the end that upper strata picks and places part 326 has vacuum suction chamber or sucker, adsorbs polycrystalline silicon rod to be loaded accordingly 10 (for example, upper strata picks and places one of side of the vacuum suction chamber face polycrystalline silicon rod 10 in part 326 and adsorbed accordingly more Crystalline silicon rod 10 carries out transfer loading in a manner of the straight placement of polycrystalline silicon rod).The structure of foregoing upper strata workpiece fetching device, set Put mode and its operation shape is not limited thereto, in other embodiments, upper strata workpiece fetching device can still make other changes Change, for example, upper strata workpiece fetching device can use manipulator, the manipulator is for capturing picking and placeing part and being for polycrystalline silicon rod 10 Holder, the holder include a pair can opening and closing clamping limb, this pair of clamping limbs are controlled and make opening and closing action, and are closing up When clamp polycrystalline silicon rod 10 and open when discharge polycrystalline silicon rod 10.Further, the form of the holder can be according to institute The type and dimensions of the polycrystalline silicon rod 10 that need to be captured and have different changes.Just by taking polycrystalline silicon rod 10 as an example, polycrystalline silicon rod 10 It is just corresponding using the fixture for being in ㄇ for rectangular parallelepiped structure, the holder.Preferably, in the relative inner arm face of a pair of clamping limbs Cushion pad modes such as (such as by) pasting can be set up on (that is, the clamping face contacted with polycrystalline silicon rod 10), to avoid with polycrystalline Silicon rod 10 directly contacts and produces damage.

The upper strata travel mechanism more may include：First direction mobile unit, second direction mobile unit and mobile control Unit processed.The mobile control unit is connected with the first direction mobile unit and the second direction mobile unit, is used for According to the position of each upper strata Workpiece carrier disk 313 in the upper strata station platform of upper strata workpiece-carrying structure 31 and carried more The placement location of crystalline silicon rod 10 and control the first direction mobile unit and the second direction mobile unit to drive upper strata work Part picking and placing unit 32 moves, so that polycrystalline silicon rod 10 is transferred into upper strata workpiece-carrying structure 31 using upper strata workpiece picking and placing unit 32 In upper strata Workpiece carrier disk 313 on.In one embodiment, mobile control unit may be, for example, one to carry data processing chip Control terminal.

Similarly, lower floor's workpiece fetching device more may include lower floor's workpiece picking and placing unit 34 and travel mechanism of lower floor, wherein, Lower floor's workpiece picking and placing unit 34 is used to pick and place polycrystalline silicon rod 10, and travel mechanism of lower floor is used to drive lower floor's workpiece picking and placing unit 34 to move It is dynamic.Further, lower floor's workpiece picking and placing unit 34 may include：Lower floor's casing 342, the lower floor for being movably connected on lower floor's casing 342 Mechanical-stretching arm 344 (Z axis that lower floor's mechanical-stretching arm 344 can be vertically is flexible up and down), it is arranged at lower floor's mechanical-stretching arm 344 The lower floor of end picks and places part 346, and polycrystalline silicon rod 10 to be loaded can be captured by picking and placeing part 346 using lower floor.Lower floor picks and places part 346 can For example, adsorption element, the end that lower floor picks and places part 346 have vacuum suction chamber or sucker, adsorb polycrystalline to be loaded accordingly Silicon rod 10 is (for example, lower floor picks and places one of side of the vacuum suction chamber face polycrystalline silicon rod 10 in part 346 and adsorbed accordingly Firmly polycrystalline silicon rod 10 carries out transfer loading in a manner of the straight placement of polycrystalline silicon rod).The knot of foregoing lower floor's workpiece fetching device Structure, set-up mode and its operation shape are not limited thereto, and in other embodiments, lower floor's workpiece fetching device can still make other Change, for example, lower floor's workpiece fetching device can use manipulator, what the manipulator was used to capturing polycrystalline silicon rod 10 picks and places part Can be holder, the holder include a pair can opening and closing clamping limb, this pair of clamping limbs are controlled and make opening and closing action, and Polycrystalline silicon rod 10 is clamped when closing up and discharges polycrystalline silicon rod 10 when opening.Further, the form of the holder can root There are different changes according to the type and dimensions of the polycrystalline silicon rod 10 of required crawl.Just by taking polycrystalline silicon rod 10 as an example, polysilicon Rod 10 is rectangular parallelepiped structure, and the holder is just corresponding using the fixture for being in ㄇ.Preferably, in the relative inner arm of a pair of clamping limbs Cushion pad modes such as (such as by) pasting can be set up on face (that is, the clamping face contacted with polycrystalline silicon rod 10), to avoid with more Crystalline silicon rod 10 directly contacts and produces damage.

The travel mechanism of lower floor more may include：First direction mobile unit, second direction mobile unit and mobile control Unit processed.The mobile control unit is connected with the first direction mobile unit and the second direction mobile unit, is used for According to the position of each lower floor's Workpiece carrier disk 333 in lower floor's station platform of lower floor's workpiece-carrying structure 33 and carried more The placement location of crystalline silicon rod 10 and control the first direction mobile unit and the second direction mobile unit to drive lower floor's work Part picking and placing unit 34 moves, so that polycrystalline silicon rod 10 is transferred into lower floor's workpiece-carrying structure 33 using lower floor's workpiece picking and placing unit 34 In lower floor's Workpiece carrier disk 333 on.In one embodiment, mobile control unit may be, for example, one to carry data processing chip Control terminal.

System of HS-WEDM, the workpiece to be cut for being carried to workpiece carrying system are cut.In the present embodiment In, the workpiece is polycrystalline silicon rod 10, and therefore, it is to polycrystalline silicon rod 10 to carry out cutting to workpiece using the System of HS-WEDM Cut to complete to block.

For System of HS-WEDM, in the present embodiment, System of HS-WEDM 5 carries in response to the two-layer equation of workpiece carrying system 3 Structure design and be two-layer equation cutting net design.Specifically, Fig. 2 and Fig. 4 (Fig. 4 is Fig. 3 rough schematic view) are referred to, line is cut Cutting system 5 includes：Cutting rack structure 51, the upper cutting roller group 53 being arranged in cutting rack structure 51 and it is lower cutting roller group 55, with And line of cut 57, wherein, be around in cutting roller group 53 between line of cut formed upper strata cutting net, be around in it is lower cutting roller group 55 it Between line of cut formed lower floor cutting net.

In the present embodiment, cutting rack structure 51 can be set up on support 1 and be held positioned at workpiece by frames 52 Carry put 13 top, in cutting rack structure 51 can configure on cut roller group 53 and it is lower cutting roller group 55, in upper cutting roller group In 53, including multiple upper cutting rollers pair, two neighboring upper cutting roller to setting at a certain distance, cutting roller centering on each Two upper cutting rollers 531 are oppositely arranged, similarly, in lower cutting roller group 55, including multiple lower cutting rollers pair, two neighboring incision Roller is cut to setting at a certain distance, two lower cutting rollers 551 of each lower cutting roller centering are oppositely arranged, there is provided line of cut (be preferably single cutting cord) is according under each in each upper cutting roller 531 in upper cutting roller group 53 and lower cutting roller group 55 The layout of cutting roller 551 and be sequentially set around each upper cutting roller 531 and each lower cutting roller 551, so as in upper cutting roller group 53 each upper cutting roller to it is upper formed a plurality of upper cutting line segment (each on two of cutting roller centering go up cutting roller 531 it Between form a upper cutting line segment) and to form a plurality of lower cutting line section (every to upper in each lower cutting roller of lower cutting roller group 55 A lower cutting line section is formed between two lower cutting rollers 551 of one lower cutting roller centering), wherein, belong to cutting roller group Each upper cutting line segment in 53 forms upper strata cutting net, and each lower cutting line section belonged in lower cutting roller group 55 forms lower floor Cut net.In specific implementation, cutting rack structure 51 further includes main pedestal 511 and the line being arranged on main pedestal 511 Cutting support 513, herein, wire cutting support 513 have it is multiple, two neighboring wire cutting support 513 is set at a certain distance, It can be provided with the upper cutting rollers 531 of go up cutting roller centering two and one and cut on each wire cutting support 513 Two lower cutting rollers 551 of roller centering.In actual applications, wire cutting support 513 is that (frame structure can example for frame structure It is such as rectangular, can be built by crossbeam and mullion), the top of wire cutting support 513 is connected to main pedestal 511, wire cutting branch The bottom of frame 513 can install two lower cutting rollers 551 of lower cutting roller centering, and the middle part of wire cutting support 513 can install The upper cutting roller 531 of two of upper cutting roller centering.Further, as shown in Figure 4：The upper cutting roller of two of upper cutting roller centering 531 be to be set along second direction spacing, and two lower cutting rollers 551 of lower cutting roller centering are to be set along second direction spacing Put.In addition, the upper cutting roller 531 of two of upper cutting roller centering and two lower cutting rollers 551 of lower cutting roller centering are mutually corresponding： For example, two of upper cutting roller centering go up the upper cutting roller 531 for being located at left side in cutting roller 531 and lower cutting roller centering two Lower cutting roller 551 in lower cutting roller 551 positioned at left side aligns in a second direction, two upper cutting rollers of upper cutting roller centering Positioned at the upper cutting roller 531 on right side and the lower cutting roller for being located at right side in two lower cutting rollers 551 of lower cutting roller centering in 531 551 align in a second direction；Further, the upper cutting in left side is located in two of upper cutting roller centering upper cutting rollers 531 Roller 531 aligns in a first direction with being located at the lower cutting roller 551 in left side in two lower cutting rollers 551 of lower cutting roller centering (that is, the roll surface of upper cutting roller 531 aligns with the roll surface of lower cutting roller 551), two of upper cutting roller centering are gone up in cutting rollers 531 Lower cutting roller 551 positioned at right side in the upper cutting roller 531 on right side and two lower cutting rollers 551 of lower cutting roller centering exists (that is, the roll surface of upper cutting roller 531 aligns with the roll surface of lower cutting roller 551) is alignd on first direction.It above are only exemplary theory It is bright, be not intended to limit the structure of wire cutting support and the upper cutting roller centering that is configured on cutting roller and lower cutting roller centering The distribution of cutting roller, such as：Wire cutting support can use staged frame structure, two upper cutting rollers of upper cutting roller centering and The lower cutting roller of lower cutting roller centering is by staged frame structure and front and rear setting in a first direction；Upper cutting roller centering Spacing between two upper cutting rollers also can be between two lower cutting rollers of lower cutting roller centering spacing be not equal, for example, (spacing between two upper cutting rollers are more than the spacing between two lower cutting rollers) wide at the top and narrow at the bottom, or, it is up-narrow and down-wide (on two The spacing being smaller than between two lower cutting rollers between cutting roller).It should be noted that as it was previously stated, upper strata Workpiece carrier Base 311 may be, for example, the frame base with grid, to cause follow-up cutting rack structure 51 carrying out vertical traveling and level Advance and cut the smooth traveling of roller group 55 at present, the grid as the frame base of upper strata workpiece-carrying base 311 will meet one Fixed size requirement：The length of grid will can meet the lower lower cutting roller cut in roller group 55 to that can pass through, and the width of grid will The horizontal traveling of lower cutting roller pair can be met.

Usually, blocked in polycrystalline silicon rod in operation, the head of polycrystalline silicon rod 10 and afterbody may be required to be truncated.Cause This, in some alternative embodiments：For System of HS-WEDM, upper cutting roller pair in upper cutting roller group 53 in cutting rack structure 51 Quantity is consistent with the quantity of the upper strata Workpiece carrier disk 313 of a certain upper strata station platform in upper strata workpiece-carrying structure 31, is somebody's turn to do Upper cutting roller pair and the upper cutting line segment being around on this on upper cutting roller 531 of cutting roller centering two correspond to upper strata workpiece and held The head of load plate 313 or afterbody, the quantity of lower cutting roller pair is and lower floor's workpiece in lower cutting roller group 55 in cutting rack structure 51 The quantity of lower floor's Workpiece carrier disk 333 of a certain lower floor's station platform is consistent in bearing structure 33, the lower cutting roller pair and is around in Lower cutting line section on the lower lower cutting roller 551 of cutting roller centering two correspond to lower floor's Workpiece carrier disk 333 head or Afterbody, in this way, using System of HS-WEDM, by each upper cutting line segment in upper strata cutting net respectively to corresponding each upper strata work The head of polycrystalline silicon rod 10 on part carrier 313 or afterbody carry out blocking operation, by each lower cutting in lower floor's cutting net Line segment carries out blocking operation to the head or afterbody of the polycrystalline silicon rod 10 on corresponding each lower floor's Workpiece carrier disk 333 respectively. Subsequently, in order to causing the afterbody that is not truncated in the polycrystalline silicon rod 10 on each upper strata Workpiece carrier disk 313 or head and each The afterbody or head not being truncated in polycrystalline silicon rod 10 on individual lower floor's Workpiece carrier disk 333 can be also truncated, and can be taken a variety of Mode：First, the head of the polycrystalline silicon rod 10 on upper strata Workpiece carrier disk 313 to be done or afterbody block operation and lower floor's upper strata work The head of polycrystalline silicon rod 10 on part carrier 313 or afterbody are blocked after operation, will directly on upper strata Workpiece carrier disk 313 Polycrystalline silicon rod 10 is commutated and the afterbody of polycrystalline silicon rod 10 or head is corresponded into upper cutting line segment and directly in lower floor's work Polycrystalline silicon rod 10 is commutated on part carrier 333 and the afterbody of polycrystalline silicon rod 10 or head are corresponded into lower cutting line section. 2nd, the head of the polycrystalline silicon rod 10 on upper strata Workpiece carrier disk 313 to be done or afterbody are blocked after operation, upper strata station platform On upper strata Workpiece carrier disk 313 changed by upper strata station switching mechanism by upper strata cutting work station to upper strata loader position, directly It is connected at upper strata handling station and the polycrystalline silicon rod 10 on upper strata Workpiece carrier disk 313 is commutated so as to obtain polycrystalline silicon rod 10 Afterbody or head correspond to upper cutting line segment 571, or, will be more on upper strata Workpiece carrier disk 313 at upper strata handling station Crystalline silicon rod 10 is first unloaded and after repositioning that the feeding of polycrystalline silicon rod 10 is more on upper strata Workpiece carrier disk 313 to cause The afterbody of crystalline silicon rod 10 or head correspond to lower cutting line section 573.3rd, the polysilicon on upper strata Workpiece carrier disk 313 to be done The head of rod 10 or afterbody are blocked after operation, the cutting rack structure 51 in mobile System of HS-WEDM so that wire cutting support 513 In in upper cutting roller group 53 upper cutting roller pair and the upper cutting line segments being around on this on upper cutting roller 531 of cutting roller centering two be Cutting roller pair is descended in afterbody or head and lower cutting roller group 55 corresponding to upper strata Workpiece carrier disk 313 and is around in the lower cutting Lower cutting line section on the lower cutting roller 551 of roller centering two corresponds to afterbody or the head of lower floor's Workpiece carrier disk 333.4th, Workpiece carrier is set to spiral rotation mechanism on upper strata Workpiece carrier disk 313 and lower floor's Workpiece carrier disk 333, upper strata Workpiece carrier disk 313 and lower floor's Workpiece carrier disk 333 corresponding Workpiece carrier spiral rotation mechanism driving under can rotate (example in the horizontal plane Such as rotate 180 °), so, the head-tail of upper strata Workpiece carrier disk 313 and its polycrystalline silicon rod 10 carried is exchanged on to cause The afterbody of polycrystalline silicon rod 10 on layer Workpiece carrier disk 313 or head correspond to upper cutting line segment 571, and, lower floor's workpiece is held The head-tail of load plate 333 and its polycrystalline silicon rod 10 carried is exchanged to cause the polycrystalline silicon rod on lower floor's Workpiece carrier disk 333 10 afterbody or head correspond to lower cutting line section 573.In an alternative embodiment, Workpiece carrier spirals rotation mechanism including rotating Axle, support are in the support plate of Workpiece carrier tray bottom, the bearing assembly between rotary shaft and support plate and for branch Support plate carries out spacing banking stop.In actual applications, rotary shaft rotation drives support plate to rotate, and is held by support dish driving workpiece Load plate rotates 180 ° in the horizontal plane so that the position end to end of the polycrystalline silicon rod to be blocked on Workpiece carrier disk is exchanged, and can Support plate is carried out by stirring banking stop again spacing so that support plate can not be rotated further by.In other alternative embodiments：Pin To System of HS-WEDM, the quantity of upper cutting roller pair is upper strata workpiece-carrying structure 31 in upper cutting roller group 53 in cutting rack structure 51 In twice of quantity of upper strata Workpiece carrier disk 313 of a certain upper strata station platform, i.e. each upper strata Workpiece carrier disk 313 It is corresponding to be configured with two upper cutting rollers pair, wherein, a upper cutting roller pair and line of cut section corresponds to upper strata Workpiece carrier thereon The head of disk, on another cutting roller pair and thereon line of cut section correspond to upper strata Workpiece carrier disk afterbody, similarly, each Lower floor's Workpiece carrier disk 333 is corresponding to be configured with two lower cutting rollers pair, wherein, lower cutting roller pair and its lower cutting line a section is right Should be in the head of lower floor's Workpiece carrier disk, another lower cutting roller pair and its lower cutting line section correspond to lower floor's Workpiece carrier disk Afterbody.In this way, using System of HS-WEDM, by each upper cutting line segment in upper strata cutting net respectively to corresponding each upper strata work The head of polycrystalline silicon rod 10 on part carrier 313 and afterbody carry out blocking operation simultaneously, by under each in lower floor's cutting net The head to the polycrystalline silicon rod 10 on corresponding each lower floor's Workpiece carrier disk 333 and afterbody are cut cutting line segment simultaneously respectively Disconnected operation, i.e. once being blocked operation can complete to block while head and the afterbody to polycrystalline silicon rod 10.By upper Understand, compared with preceding alternative embodiment, this alternative embodiment structure and operation it is relatively easy (in structure only need repeat increase Upper cutting roller pair and lower cutting roller are to without carrying out excessive structural modification to cutting rack structure, execution one is also only needed in operation It is secondary to block operation), and can be obviously improved cutting efficiency effect (preceding alternative embodiment, it is necessary to perform for the first time block+workpiece Bogey rotation silicon ingot end for end+block for the second time；This alternative embodiment, it is only necessary to which operation is once blocked in execution).

Open-wire line diced system 5 for continuation, the cutting rack structure 51 in System of HS-WEDM 5 can be carried out at least two dimensions Advance, for driving the upper cutting roller group 53 of assembling and its upper strata cutting net and lower cutting roller group 55 and its lower floor's cutting net to enter Row position adjustment simultaneously can drive the upper strata cut in roller group 53 to cut net to corresponding upper strata work respectively after being adjusted in place The polycrystalline silicon rod 10 and the lower lower floor cut in roller group 55 that upper strata Workpiece carrier disk 313 in part bearing structure 31 is carried are cut The polycrystalline silicon rod 10 that net carries lower floor's Workpiece carrier disk 333 in corresponding lower floor's workpiece-carrying structure 33 is cut to cut Cut.In the present embodiment, cutting rack structure 51, which at least two dimensions advance, is realized by multi-dimensional shift mechanism 59. Further, multi-dimensional shift mechanism 59 further includes：Vertical shift mechanism and horizontal dislodgment feature, wherein, utilize vertical shifting machine Cutting rack structure 51 can be carried out vertical traveling by structure, can be carried out the cutting rack structure using the horizontal dislodgment feature horizontal Advance.(that is, upper strata workpiece-carrying structure 31 is designed in response to the two-layer equation bearing structure of the workpiece carrying system 3 in the present embodiment With lower floor workpiece-carrying structure 33), therefore, vertical traveling and water are carried out respectively using vertical shift mechanism and horizontal dislodgment feature It is parallel enter with adjustment position, after the cutting rack structure 51 in System of HS-WEDM is adjusted in place, configured in cutting rack structure 51 Upper strata cutting net corresponds to the workpiece 10 to be cut that upper strata workpiece-carrying structure 31 is carried, and is configured in cutting rack structure 51 Lower floor's cutting net corresponds to the workpiece 10 to be cut that lower floor's workpiece-carrying structure 33 is carried.Further, utilization is vertical Shift mechanism and horizontal dislodgment feature carry out vertical traveling and horizontal traveling with adjustment position respectively, including：By cutting rack structure 51 carry out vertical traveling using vertical shift mechanism and are displaced to the first precalculated position, in first precalculated position, cutting rack The headroom that lower floor's cutting net in structure 51 is corresponded between upper strata workpiece-carrying structure 31 and lower floor's workpiece-carrying structure 33 Area (in fact, in cutting rack structure 51 carries out vertical traveling process, lower cutting roller group 55 in cutting rack structure 51 and its under Layer cutting net be through the frame base as upper strata workpiece-carrying base 311 grid after and be displaced to upper strata Workpiece carrier The lower section of base 311)；Cutting rack structure 51 is subjected to horizontal line using horizontal dislodgment feature and then shifted from the first precalculated position To the second precalculated position (in fact, during cutting rack structure 51 carries out horizontal traveling, the lower cutting in cutting rack structure 51 Roller group 55 and its lower floor's cutting net are entered along the width of the grid of the frame base as upper strata workpiece-carrying base 311 Row displacement), in second precalculated position, the upper strata cutting net configured in cutting rack structure 51 corresponds to upper strata Workpiece carrier knot The cutting position of polycrystalline silicon rod 10 to be blocked in structure 31, the lower floor's cutting net configured in cutting rack structure 51 correspond to lower floor's work The cutting position of polycrystalline silicon rod 10 to be blocked in part bearing structure 33.In specific implementation, multi-dimensional shift mechanism 59 can use two Nested structure, being respectively arranged at cutting rack structure 51, (first direction here may be, for example, X as shown in Figure 1 along a first direction Front and rear sides axially), every suit multi-dimensional shift mechanism 59 include：Adjustable shelf 591, vertical shift mechanism and horizontal shift Mechanism, vertical shift mechanism further include：Vertical guide rail 593, vertical sliding block 595 and vertical driving source (not shown), level are moved Position mechanism further includes：Horizontal guide rail 597, cross sliding clock 599 and horizontal drive source (not shown), wherein, vertical guide rail 593 Frames 52 are layed in, vertical sliding block 595 coordinates on adjustable shelf 591 and with vertical guide rail 593, and horizontal guide rail 597 is spread Located at cutting rack structure 51, cross sliding clock 599 coordinates on adjustable shelf and with horizontal guide rail 597, can by vertical driving source Driving adjustable shelf 591 and cutting rack structure 51 thereon carry out vertical traveling, by horizontal drive source can drive adjustable shelf 591 and Cutting rack structure 51 thereon carries out horizontal traveling.In the present embodiment, cutting rack structure 51 is driven using horizontal dislodgment feature Horizontal advance of progress refers to that driving cutting rack structure 51 carries out horizontal direction first direction traveling, and therefore, horizontal guide rail 597 is Wire cutting support 513 is layed in horizontal direction first direction.Vertical guide rail 593 and vertical sliding block in above-mentioned vertical shift mechanism The setting of horizontal guide rail 597 and cross sliding clock 599 is merely illustrative in 595 setting and horizontal dislodgment feature, but simultaneously It is not limited, for example, in another alternative embodiment, the position of vertical guide rail 593 and vertical sliding block 595 in vertical shift mechanism Put interchangeable, the position of horizontal guide rail 597 and cross sliding clock 599 is interchangeable in horizontal dislodgment feature.In another alternative embodiment In, first direction that horizontal guide rail 597 can be horizontally and be layed on a fixation horizontal beam that (fixed horizontal beam is located at cutting rack The top of structure 51), cross sliding clock 599 coordinates located at the top of adjustable shelf 591 and with horizontal guide rail 597, and vertical guide rail 593 is spread Located at the sidepiece of cutting rack structure 51, vertical sliding block 595 coordinates located at adjustable shelf 591 and with vertical guide rail 593.It is in addition, vertical Vertical driving source in shift mechanism may be, for example, servomotor, cylinder or oil cylinder etc., the horizontal drive in horizontal dislodgment feature Source may be, for example, servomotor, cylinder or oil cylinder etc..

After by the cutting rack structure 51 in System of HS-WEDM by vertical traveling and horizontal completion position adjustment of advancing, The upper strata cutting net configured in cutting rack structure 51 corresponds to polycrystalline silicon rod 10 to be blocked in upper strata workpiece-carrying structure 31 Cutting position, the lower floor's cutting net configured in cutting rack structure 51 correspond to polycrystalline to be blocked in lower floor's workpiece-carrying structure 33 The cutting position of silicon rod 10, then cut by the way that the cutting rack structure 51 in System of HS-WEDM is carried out into vertical traveling with driving respectively Cut what the cutting net of the upper strata in roller group 53 was carried to the upper strata Workpiece carrier disk 313 in corresponding upper strata workpiece-carrying structure 31 Net cuts to lower floor's work in corresponding lower floor's workpiece-carrying structure 33 in lower floor in polycrystalline silicon rod 10 and lower cutting roller group 55 The polycrystalline silicon rod 10 that part carrier 333 is carried is cut.Thus can introduce one it is new the problem of, be completely cut off polysilicon Rod 10, upper strata cutting line segment 571 and lower floor's line of cut 573 are bound to completely through corresponding polycrystalline silicon rod 10.

The head of polycrystalline silicon rod 10 correspondingly to be blocked and/or afterbody on the upper strata Workpiece carrier disk of upper strata workpiece-carrying structure One or both sides offer and have one with the corresponding upper strata locating slot 317 of upper strata cutting line segment 571, upper strata locating slot 317 Fixed depth and the width of notch are greater than the line footpath of upper strata line of cut, in this way, upper strata cutting line segment 571 is cutting out polycrystalline completely It can be fallen into upper strata locating slot 317 after the head of silicon rod 10 and/or afterbody, realize the head of polycrystalline silicon rod 10 and/or tail While blocking of portion, it can play a part of protecting upper strata cutting line segment 571, avoid upper strata cutting line segment 571 and upper strata workpiece Carrier 313 produces friction and damaged.Similarly, it is correspondingly to be blocked more on lower floor's Workpiece carrier disk of lower floor's workpiece-carrying structure The head of crystalline silicon rod 10 and/or the one or both sides of afterbody offer the lower floor locating slot 337 corresponding with lower floor line of cut 573, Lower floor's locating slot 337 has the line footpath that the width of certain depth and notch is greater than lower floor's line of cut, in this way, lower floor's line of cut 573 can fall into lower floor's locating slot 337 after the head of polycrystalline silicon rod 10 and/or afterbody is cut out completely, realize polysilicon The head of rod 10 and/or while blocking of afterbody, it can play a part of protecting lower floor's line of cut 573, avoid lower floor's line of cut 573 produce friction with lower floor's Workpiece carrier disk 333 and damage.Moreover, it is noted that for ease of follow-up System of HS-WEDM 5 Carry out vertical traveling and level is advanced, upper strata locating slot 317 and lower floor's Workpiece carrier disk 333 on upper strata Workpiece carrier disk 313 On lower floor's locating slot 337 correspond to the grid of the frame base as upper strata workpiece-carrying base 311.

System of HS-WEDM 5 can also configure directive wheel 542 and tensioning wheel 544 etc., wherein, directive wheel 542, which is used to guide, to be cut The trend of line, tensioning wheel 544 are used for the tension force for adjusting line of cut.In the present embodiment, directive wheel 542 both can be only fitted to cutting It can also configure and be may also be disposed on cutting on line support 513 in frames 52 on the main pedestal 511 of frame structure 51, tensioning wheel 544 are configurable on support 1 or in frames 52.

From the foregoing, it will be observed that double-deck linear cutting equipment in the present embodiment, including：Workpiece carrying system and System of HS-WEDM, Workpiece carrying system includes upper strata workpiece-carrying structure and lower floor's workpiece-carrying structure, System of HS-WEDM include cutting rack structure and Upper strata cutting net and lower floor's cutting net in cutting rack structure, in cutting, cutting rack structure passes through vertical traveling and water It is parallel enter be adjusted in place after, by upper strata cut workpiece to be cut that the corresponding cutting upper strata workpiece-carrying structure of net carried and The corresponding workpiece to be cut for cutting lower floor's workpiece-carrying structure and being carried of net is cut by lower floor simultaneously, in this way, can be cut in single Blocking for the double-deck workpiece of middle completion is cut, whole process is simple to operate, cutting operation efficient stable.Further, upper strata workpiece is held Carrying structure may include at least two upper strata station platforms, and this at least two upper stratas station platform can pass through upper strata station switching mechanism And load and unload between station and upper strata cutting work station and changed on upper strata, lower floor's workpiece-carrying structure may include at least two lower floors Station platform, this at least two lower floors station platform can be cut by lower floor's station switching mechanism in lower floor's handling station and lower floor Cut and changed between station, so, it can be ensured that there is a upper strata station platform performing polycrystalline in the cutting work station of upper strata all the time All the time lower floor's station platform is performing the cutting operation of polycrystalline silicon rod on the cutting operation and lower floor's cutting work station of silicon rod, Wire-electrode cutting device is realized to the polycrystalline silicon rod to be blocked being loaded at least two upper strata station platforms alternately to cut, Ensure that more batches of polycrystalline silicon rods can carry out cutting operation in order, greatly improve the efficiency for blocking operation.

Illustrated below based on the application of the application bilayer linear cutting equipment in practice, the application bilayer wire cutting is set It is standby to can be used for carrying out double-deck wire cutting operation to corresponding workpiece.

Double-deck wire cutting operation is carried out based on the application bilayer linear cutting equipment, first by work-piece to be cut in workpiece On bearing system, then by the cutting rack structural adjustment in System of HS-WEDM in place, by cutting rack structure upper strata cut net and The workpiece to be cut that the corresponding cutting workpiece carrying system of lower floor's cutting net is carried, then carries out vertical row by cutting rack structure Enter, the workpiece to be cut carried by upper strata cutting net and lower floor's cutting net to workpiece carrying system is cut.In this way, can The workpiece of carrying is cut using bilayer cutting net, whole process is simple to operate, cutting operation efficient stable, and a step arrives Position, realizes automation mechanized operation.

Under a kind of implementation situation：Workpiece carrying system includes single layer workpieces bearing structure, and shift mechanism includes vertical shifting Position mechanism, then corresponding double-deck wire cutting operation include：

By work-piece to be cut in the single layer workpieces bearing structure of workpiece carrying system.

Cutting rack structure in System of HS-WEDM is adjusted in place by vertical traveling, after being adjusted in place, cutting rack structure In upper strata cutting net and lower floor's cutting net correspond to respectively in cutting single layer workpieces bearing structure different workpiece to be cut or Workpiece to be cut in upper strata cutting net and the corresponding cutting single layer workpieces bearing structure of lower floor's cutting net in person's cutting rack structure Different cutting positions.

Cutting rack structure is subjected to vertical traveling, net is cut by upper strata and net cuts simultaneously or sequentially to single layer workpieces in lower floor The workpiece to be cut that bearing structure is carried is cut.

Thus, the cutting of the different cutting positions of different workpieces or workpiece in individual layer can be completed in single cut, entirely Process operation is simple, cutting operation efficient stable, settles at one go, realizes automation mechanized operation.

Under another implementation situation：Workpiece carrying system includes upper strata Workpiece carrier platform and lower floor's Workpiece carrier platform, moves Position mechanism includes vertical shift mechanism and horizontal dislodgment feature, then carries out double-deck wire cutting operation accordingly and see Fig. 5.Fig. 5 Show the schematic flow sheet of the application bilayer linear cutting equipment in double-deck wire cutting application in one embodiment.With reference to Fig. 1 extremely Fig. 5, double-deck wire cutting operation may include following steps：

Step S101, by work-piece to be cut in the upper strata workpiece-carrying structure and lower floor's workpiece of workpiece carrying system Bearing structure.By work-piece to be cut in the upper strata workpiece-carrying structure of workpiece carrying system be to be picked and placeed by upper strata workpiece Device complete, by work-piece to be cut in lower floor's workpiece-carrying structure of workpiece carrying system be to be taken by lower floor's workpiece Put device completion.In actual applications, by work-piece to be cut in the upper strata workpiece-carrying structure of workpiece carrying system, Including：A certain upper strata station platform in the upper strata workpiece-carrying structure 31 of workpiece carrying system 3 is changed to upper strata loader Position, extracts polycrystalline silicon rod 10 to be blocked by upper strata workpiece fetching device and is moved and be placed in positioned at upper strata loader On upper strata Workpiece carrier disk 313 at position.By work-piece to be cut in lower floor's workpiece-carrying structure of workpiece carrying system, Including：A certain lower floor's station platform in lower floor's workpiece-carrying structure 33 of workpiece carrying system 3 is changed to lower floor loader Position, extracts polycrystalline silicon rod 10 to be blocked by lower floor's workpiece fetching device and is moved and be placed in positioned at lower floor loader On lower floor's Workpiece carrier disk 333 at position.

Step S103, position adjustment is carried out to the cutting rack structure in System of HS-WEDM, to match somebody with somebody in cutting rack structure Under the workpiece to be cut and lower floor's cutting net that the upper strata cutting net put is carried corresponding to upper strata workpiece-carrying structure correspond to The workpiece to be cut that layer workpiece-carrying structure is carried.In fact, before step S103 is performed, in addition to Workpiece carrier Upper strata workpiece-carrying structure 31 and lower floor's workpiece-carrying structure 33 in system 3 carry out station platform adjustment, specifically, by workpiece That upper strata station platform for being loaded with workpiece to be cut in the upper strata workpiece-carrying structure 31 of bearing system 3 passes through upper The horizontal moving stage mechanism of layer is changed to upper strata cutting work station by previous upper strata handling station, by lower floor's work of workpiece carrying system 3 That lower floor's station platform for being loaded with workpiece to be cut in part bearing structure 33 by horizontal moving stage mechanism of lower floor by Previous lower floor's handling station is changed to lower floor's cutting work station.In step s 103, to the cutting rack structure in System of HS-WEDM Position adjustment is carried out, including：Cutting rack structure 51 is displaced to the first precalculated position by vertical traveling, it is pre- described first Positioning is put, and lower floor's cutting net in cutting rack structure 51 corresponds to upper strata workpiece-carrying structure 31 and lower floor's workpiece-carrying structure Between clearance zone；Cutting rack structure 51 is displaced to the second precalculated position by horizontal line and then from the first precalculated position, Second precalculated position, the upper strata cutting net configured in cutting rack structure 51 correspond to be cut in upper strata workpiece-carrying structure 31 The cutting position of the workpiece 10 cut, the lower floor's cutting net configured in cutting rack structure 51 correspond in lower floor's workpiece-carrying structure 33 The cutting position of workpiece 10 to be cut.In actual applications, cutting rack structure 51 is being displaced to by vertical traveling Before one precalculated position, it typically will also include and cutting rack structure 51 be displaced to a preparation position by level traveling from initial position Put, wherein, the initial position may, for example, be upper strata cutting net and lower floor's cutting net completion cutting in cutting rack structure 51 The position of playback is replied after operation.

Step S105, cutting rack structure is controlled, upper strata workpiece-carrying structure is carried by upper strata cutting net to be cut Workpiece cut, meanwhile, entered by lower floor's workpiece to be cut for being carried to lower floor's workpiece-carrying structure of cutting net Row cutting.In step S105, cutting rack structure is controlled, including：Cutting rack structure 51 is subjected to vertical traveling, cut by upper strata The workpiece 10 to be cut that net is carried to upper strata workpiece-carrying structure 31 is cut and cuts layer workpiece off the net by lower floor and held Carry the workpiece to be cut that structure is carried to be cut, treat the work that upper strata cutting net is carried upper strata workpiece-carrying structure 31 Part 10 blocked and lower floor cutting net the workpiece 10 that lower floor's workpiece-carrying structure 33 is carried is blocked after, pause is cut Cut frame structure 51 and carry out vertical traveling.

By above-mentioned steps S101 to S105, the cutting of double-deck workpiece, whole process operation can be completed in single cut Simply, cutting operation efficient stable, settle at one go, realize automation mechanized operation.Subsequently, in the application bilayer wire cutting operation, It may also include：Cutting rack structure 51 is subjected to vertical traveling and horizontal advance is playbacked with replying, and, by workpiece carrying system 3 Upper strata workpiece-carrying structure 31 in that upper strata station platform of workpiece that cutting finishes that is loaded with to pass through upper strata horizontal Moving stage mechanism is changed to upper strata loader position and lower floor's Workpiece carrier by workpiece carrying system 3 by previous upper strata cutting work station That lower floor's station platform for being loaded with workpiece to be cut in structure 33 is by horizontal moving stage mechanism of lower floor by previous Lower floor's cutting work station is changed to lower floor and loads and unloads station, so as at upper strata handling station that the cutting on the station platform of upper strata is complete Complete workpiece is unloaded and is unloaded the workpiece that the cutting on lower floor's station platform finishes at lower floor's handling station.

Below in conjunction with Fig. 6 to Figure 14, work piece cut operation is performed in a certain example to the application bilayer linear cutting equipment It is described in detail.In this example, following setting is first made：Workpiece 10 is chosen as polycrystalline silicon rod 10, what polycrystalline silicon rod 10 was made Cutting operation is essentially to block operation, and the polycrystalline silicon rod 10 to be blocked is rectangular parallelepiped structure.Each workpiece-carrying structure It is each equipped with two station platforms, i.e. upper strata workpiece-carrying structure 31 is configured with two upper strata station platforms, lower floor's Workpiece carrier Structure 33 is configured with Liang Ge lower floors station platform.In an initial condition, first upper strata station platform is located at upper strata handling station, Second upper strata station platform is located at upper strata cutting work station, and first lower floor's station platform is located at lower floor's handling station, second Lower floor's station platform is located at lower floor's cutting work station, and, cutting rack structure 51 is in initial position, under initial position, cutting rack Lower cutting roller group 55 in structure 51 and its lower floor's cutting net be located at second upper strata station platform at the cutting work station of upper strata it On.

First, polycrystalline silicon rod 10 to be blocked sequentially is extracted from hopper or bin by upper strata workpiece fetching device and incited somebody to action Polycrystalline silicon rod 10 is placed in by it after being moved to the top of each upper strata Workpiece carrier disk 313 of first upper strata station platform On layer Workpiece carrier disk 313, and that adjusts polycrystalline silicon rod 10 blocks position (for example, polycrystalline silicon rod 10 is blocked into position pair Should be in the upper strata locating slot 317 of upper strata Workpiece carrier disk 313), complete each upper strata workpiece on first upper strata station platform and hold The loading of the polycrystalline silicon rod 10 of load plate 313；Sequentially extracted from hopper or bin by lower floor's workpiece fetching device to be blocked Polycrystalline silicon rod 10 is simultaneously moved to polycrystalline behind the top of each lower floor's Workpiece carrier disk 333 of first lower floor's station platform Silicon rod 10 is placed on lower floor's Workpiece carrier disk 333, and that adjusts polycrystalline silicon rod 10 blocks position (for example, by polycrystalline silicon rod 10 block position correspondence in lower floor's locating slot 337 of lower floor's Workpiece carrier disk 333), complete on first lower floor's station platform The loading of the polycrystalline silicon rod 10 of each lower floor's Workpiece carrier disk 333.The state tool of double-deck linear cutting equipment after implementation aforesaid operations Body can be found in Fig. 6 and Fig. 7.

Then, carry out horizontal advance using upper water translation stage mechanism driving upper strata workpiece-carrying structure 31 and cause first Upper strata station platform and its each upper strata Workpiece carrier disk 313 are changed to upper strata cutting work station and second by upper strata handling station Upper strata station platform and its each upper strata Workpiece carrier disk 313 are changed to upper strata loader position (positioned at upper by upper strata cutting work station The second upper strata station platform and its each upper strata Workpiece carrier disk 313 of layer handling station can perform the loading of polycrystalline silicon rod 10 Operation), meanwhile, drive lower floor's workpiece-carrying structure 33 to carry out horizontal advance using horizontal moving stage mechanism of lower floor and cause under first Layer station platform and its each lower floor's Workpiece carrier disk 333 are changed to lower floor's cutting work station and second by lower floor's handling station Layer station platform and its each lower floor's Workpiece carrier disk 333 are changed to lower floor's handling station by lower floor's cutting work station (is located at lower floor Load and unload second lower floor's station platform of station and its each lower floor's Workpiece carrier disk 333 can perform the loading work of polycrystalline silicon rod 10 Industry).The state of double-deck linear cutting equipment for details, reference can be made to Fig. 8 after implementation aforesaid operations.

Then, position adjustment is carried out to the cutting rack structure 51 in System of HS-WEDM 5, including：Cutting rack structure 51 is led to Cross horizontal advance from initial position and be displaced to ready position (referring to Fig. 9), after by cutting rack structure 51 by vertical traveling by pre- Standby displacement is advanced from the first precalculated position to the first precalculated position (referring to Figure 10), then by cutting rack structure 51 by level The second precalculated position (referring to Figure 11 and Figure 12) is displaced to, in second precalculated position, is configured in cutting rack structure 51 upper Layer cutting net corresponds to cutting for the polycrystalline silicon rod 10 that each upper strata Workpiece carrier disk 313 is carried on first upper strata station platform Disconnected position, the lower floor's cutting net configured in cutting rack structure 51 correspond to each lower floor's workpiece on first lower floor's station platform and held The polycrystalline silicon rod 10 that load plate 333 is carried blocks position.

Then, cutting rack structure 51 is subjected to vertical traveling, net is cut to each on first upper strata station platform by upper strata The polycrystalline silicon rod 10 that individual upper strata Workpiece carrier disk 313 is carried is blocked, meanwhile, net is cut to first lower floor's work by lower floor The polycrystalline silicon rod 10 that each lower floor's Workpiece carrier disk 333 is carried on bit platform is blocked.Until cutting rack structure 51 is entered Row is vertical march to setting block position (it is, for example, extreme lower position to block position), complete blocking for polycrystalline silicon rod 10.Implement The state of double-deck linear cutting equipment for details, reference can be made to Figure 13 and Figure 14 after aforesaid operations.

Then, cutting rack structure 51 is subjected to vertical traveling and horizontal advance is playbacked with replying.Specifically, by cutting rack knot Structure 51 carries out vertical traveling and horizontal advance is playbacked with replying, including：Cutting rack structure 51 is subjected to vertical traveling from blocking position Put and be displaced to the second precalculated position；Horizontal advance from the second precalculated position of the progress of cutting rack structure 51 is displaced to the first pre-determined bit Put；Cutting rack structure 51 is subjected to vertical traveling and is displaced to ready position from the first precalculated position；Cutting rack structure 51 is carried out Level is advanced from ready position and is displaced to initial position.

Afterwards, carry out horizontal advance using upper water translation stage mechanism driving upper strata workpiece-carrying structure 31 and cause first Upper strata station platform and its each upper strata Workpiece carrier disk 313 are changed to upper strata loader position and second by upper strata cutting work station Upper strata station platform and its each upper strata Workpiece carrier disk 313 are changed to upper strata cutting work station by upper strata handling station, meanwhile, profit With driving lower floor of horizontal moving stage mechanism of lower floor workpiece-carrying structure 33 carry out it is horizontal advance cause first lower floor's station platform and Its each lower floor's Workpiece carrier disk 333 by lower floor's cutting work station change to lower floor load and unload station and second lower floor's station platform and Its each lower floor's Workpiece carrier disk 333 is changed to lower floor's cutting work station by lower floor's handling station.

Finally, each upper strata Workpiece carrier disk 313 by upper strata workpiece fetching device from first upper strata station platform On sequentially unload and complete the polycrystalline silicon rod 10 that blocks and new polycrystalline silicon rod 10 to be blocked of reloading again, pass through lower floor's workpiece Fetching device sequentially unloads the polysilicon for completing to block from each lower floor's Workpiece carrier disk 333 of first lower floor's station platform Rod 10 and new polycrystalline silicon rod 10 to be blocked of reloading again.

The principle and its effect of above-described embodiment only illustrative the application, not for limitation the application.It is any ripe Know the personage of this technology all can without prejudice to spirit herein and under the scope of, modifications and changes are carried out to above-described embodiment.Cause This, those of ordinary skill in the art is complete without departing from spirit disclosed herein and institute under technological thought such as Into all equivalent modifications or change, should be covered by claims hereof.

Claims (10)

1. a kind of double-deck linear cutting equipment, including workpiece carrying system and System of HS-WEDM, it is characterised in that the wire cutting system System includes：

Cutting rack structure, is advanced by shift mechanism；

Upper cutting roller group, lower cutting roller group and line of cut in the cutting rack structure, wherein, it is around on described and cuts Cut the line of cut between roller group and form upper strata cutting net, the line of cut being around between the lower cutting roller group forms lower floor's cutting Net；

Wherein, in cutting process, after being adjusted in place by the cutting rack structure by shift mechanism so that the upper strata cutting Net and the corresponding workpiece to be cut for cutting the workpiece carrying system and being carried of lower floor cutting net.

2. double-deck linear cutting equipment according to claim 1, it is characterised in that

The workpiece carrying system includes single layer workpieces bearing structure；

The shift mechanism includes vertical shift mechanism；

Using the vertical shift mechanism, the cutting rack structure is subjected to vertical traveling and is displaced to precalculated position so that institute State the upper strata cutting net in cutting rack structure and lower floor's cutting net corresponds to difference in the cutting single layer workpieces bearing structure respectively Workpiece to be cut or upper strata cutting net in the cutting rack structure and lower floor's cutting net correspond to the cutting list respectively The different cutting positions of workpiece to be cut in layer workpiece-carrying structure.

3. double-deck linear cutting equipment according to claim 2, it is characterised in that the vertical shift mechanism includes vertical lead Rail and vertical sliding block.

4. double-deck linear cutting equipment according to claim 3, it is characterised in that the vertical guide rail is layed in fixed support Frame, the vertical sliding block coordinate located at the cutting rack structure and the vertical guide rail.

5. double-deck linear cutting equipment according to claim 1, it is characterised in that

The workpiece carrying system includes：Upper strata Workpiece carrier platform and lower floor's Workpiece carrier platform；

The shift mechanism includes：Vertical shift mechanism and horizontal dislodgment feature；

Using the vertical shift mechanism, the cutting rack structure is subjected to vertical traveling and is displaced to the first precalculated position, is made Obtain the cutting net of the lower floor in the cutting rack structure and correspond to the upper strata Workpiece carrier platform and lower floor's Workpiece carrier platform Between clearance zone；

Using the horizontal dislodgment feature, the cutting rack structure is subjected to horizontal line and then is displaced to the from the first precalculated position Two precalculated positions so that the upper strata cutting net configured in the cutting rack structure, which corresponds in the upper strata workpiece-carrying structure, to be treated The cutting position of the workpiece of cutting, the lower floor's cutting net configured in the cutting rack structure correspond to lower floor's Workpiece carrier knot The cutting position of workpiece to be cut in structure.

6. double-deck linear cutting equipment according to claim 5, it is characterised in that the vertical shift mechanism includes vertical lead Rail and vertical sliding block, the horizontal dislodgment feature include horizontal guide rail and cross sliding clock.

7. double-deck linear cutting equipment according to claim 6, it is characterised in that the vertical guide rail is layed in fixed support Frame, the vertical sliding block coordinate located at adjustable shelf and with the vertical guide rail, and the horizontal guide rail is layed in the cutting rack knot Structure, the cross sliding clock coordinate located at the adjustable shelf and with the horizontal guide rail.

8. double-deck linear cutting equipment according to claim 6, it is characterised in that the horizontal guide rail is layed in fixed level Beam, the cross sliding clock coordinate located at adjustable shelf and with the horizontal guide rail, and the vertical guide rail is layed in the cutting rack knot Structure, the vertical sliding block coordinate located at the adjustable shelf and with the vertical guide rail.

9. double-deck linear cutting equipment according to claim 1, it is characterised in that the upper strata workpiece-carrying structure is provided with Upper strata Workpiece carrier disk for carrying workpiece, lower floor's workpiece-carrying structure are provided with lower floor's Workpiece carrier for carrying workpiece Disk.

10. double-deck linear cutting equipment according to claim 1, it is characterised in that the workpiece carrying system also includes：

Upper strata workpiece fetching device, carry out picking and placeing workpiece work for being pointed to the upper strata Workpiece carrier disk at upper strata handling station Industry；And

Lower floor's workpiece fetching device, carry out picking and placeing workpiece work for being pointed to lower floor's Workpiece carrier disk at lower floor's handling station Industry.