CN206720732U - Mems - Google Patents
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- Publication number
- CN206720732U CN206720732U CN201720450978.7U CN201720450978U CN206720732U CN 206720732 U CN206720732 U CN 206720732U CN 201720450978 U CN201720450978 U CN 201720450978U CN 206720732 U CN206720732 U CN 206720732U
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- Prior art keywords
- mems
- sublayer
- signalling channel
- movable valve
- package structure
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000011664 signaling Effects 0.000 claims abstract description 56
- 238000004891 communication Methods 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 23
- 238000003825 pressing Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 230000007547 defect Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010926 purge Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 206010000234 Abortion spontaneous Diseases 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000008141 laxative Substances 0.000 description 1
- 208000015994 miscarriage Diseases 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000001543 purgative effect Effects 0.000 description 1
- 208000000995 spontaneous abortion Diseases 0.000 description 1
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- Micromachines (AREA)
Abstract
The embodiment of the present application provides a kind of MEMS.Wherein, MEMS, including：MEMS package structure；And the interior MEMS component for being located at MEMS package structure and being electrically connected with MEMS package structure；Wherein, MEMS package structure is provided with the signalling channel for MEMS component communication with the outside world, and the movable valve being arranged in signalling channel.The defects of MEMS that the embodiment of the present application provides solves in the prior art, and the particulate in high pressure draught and air can impact damage to MEMS component.
Description
Technical field
The application is related to technical field of semiconductors, more particularly to a kind of MEMS.
Background technology
MEMS (MEMS, Micro-Electro-Mechanical System), it is collection microsensor, micro- execution
Device, micro mechanical structure, micro battery, micro- energy, signal transacting and control circuit, high-performance electronic integrated device, interface and logical
Believe the microdevice or system in one.Micro electro mechanical device is developed on the basis of microelectric technique (semiconductor fabrication)
Come, be the high-tech for having merged the fabrication techniques such as photoetching, burn into film, silicon micromachined, non-silicon micromachined and precision optical machinery processing
Skill electromechanical devices.
At present, open MEMS includes encapsulated layer and MEMS component, and the intensity of MEMS component is not general high, to provide
Corresponding susceptibility., it is necessary to be cleaned by air blowing flow to MEMS in the production procedure of MEMS.Cleaning
When, it is necessary to which high pressure draught, high pressure draught can impact damage to MEMS component.
Utility model content
The embodiment of the present application provides a kind of MEMS, and to solve in the prior art, high pressure draught is made to MEMS component
The defects of into impact failure.
The embodiment of the present application provides a kind of MEMS, including：
MEMS package structure；And interior electrically connect located at the MEMS package structure and with the MEMS package structure
MEMS component；
Wherein, the MEMS package structure is provided with the signalling channel for the MEMS component communication with the outside world, and card is set
In the movable valve in the signalling channel.
Still optionally further, the diameter of the movable valve is more than the signalling channel close to described MEMS component one end
Channel diameter, and less than the channel diameter for blocking the opening position for setting the movable valve in the signalling channel.
Still optionally further, the movable valve is provided with least one through hole.
Still optionally further, the MEMS package structure, including：Substrate, side panel and top plate；
The signalling channel is opened on the top plate and/or the substrate；Wherein, the MEMS component by wire with
The top plate and/or substrate electrical connection.
Still optionally further, the movable valve includes the fixture of valve body and the connection valve body；Institute
State top plate and/or the substrate is provided with the valve neck being adapted to the fixture.
Still optionally further, the substrate or the top plate include：First sublayer and the second sublayer；The signalling channel is opened
The predeterminated position relative located at first sublayer and second sublayer；
First sublayer and/or second sublayer are provided with the valve neck being adapted to the fixture, and it is described can
Movable valve is fixedly arranged between first sublayer and second sublayer.
Still optionally further, the signalling channel is shoulder hole, and the shoulder hole includes counter sink and through hole.
Still optionally further, with welding or pressing mode, by the face where counter sink in first sublayer and described the
The relative fitting in face in two sublayers where counter sink.
The MEMS that the embodiment of the present application provides, it is movable by being set up in the signalling channel of MEMS package structure setting
Valve, solve in the prior art, the defects of high pressure draught impacts damage to MEMS component, effectively prevent MEMS portions
The decline of part electric property.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, drawings in the following description are
Some embodiments of the utility model, for those of ordinary skill in the art, on the premise of not paying creative work,
Other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation for the MEMS that the embodiment of the present application provides；
Fig. 2 a are the schematic diagrames for the MEMS package structure that the embodiment of the present application provides；
Fig. 2 b are a schematic diagrames of the encapsulating structure that the substrate that the embodiment of the present application provides offers signalling channel；
Fig. 2 c are a schematic diagrames of the encapsulating structure that the top plate that the embodiment of the present application provides offers signalling channel；
Fig. 2 d are the substrate that the embodiment of the present application provides and top plate while offer the one of the encapsulating structure of signalling channel and show
It is intended to；
Fig. 3 a are an optional exemplary plots of the movable valve that the embodiment of the present application provides；
Fig. 3 b are the one of the valve neck being adapted to the movable valve shown in Fig. 3 a that the embodiment of the present application provides optional to show
Illustration；
Fig. 3 c are that the signalling channel that the embodiment of the present application provides one is shown close to what MEMS component one end was blocked by movable valve
Illustration；
Fig. 3 d are another optional exemplary plots for the movable valve that the embodiment of the present application provides；
Fig. 4 a are the structural representations of the top plate that the embodiment of the present application provides and/or substrate；
Fig. 4 b are the structural representations for the another MEMS that the embodiment of the present application provides；
Fig. 5 a are the structural representations for the another MEMS that the embodiment of the present application provides；
Fig. 5 b are the structural representations for the another MEMS that the embodiment of the present application provides.
Embodiment
It is new below in conjunction with this practicality to make the purpose, technical scheme and advantage of the utility model embodiment clearer
Accompanying drawing in type embodiment, the technical scheme in the embodiment of the utility model is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model part of the embodiment, rather than whole embodiments.Based on the implementation in the utility model
Example, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, is belonged to
The scope of the utility model protection.
Fig. 1 is the structural representation for the MEMS that the embodiment of the present application provides.
With reference to Fig. 1, the MEMS includes：MEMS package structure 10 and interior it is located at MEMS package structure 10 and and MEMS
The MEMS component 11 that encapsulating structure 10 electrically connects.
Wherein, MEMS package structure 10 is provided with the signalling channel 12 for the communication with the outside world of MEMS component 11, and is arranged in
Movable valve 13 in signalling channel 12.
As shown in figure 1, MEMS package structure 10 is a cavity body structure, in the inside cavity of MEMS package structure 10, set
There is MEMS component 11.MEMS component 11 may include MEMS chip, MEMS sensor etc..MEMS component can use MEMS (micro electronmechanical
System) technique making, its quantity and type are associated with device actual demand.The pin of the shell of MEMS component 11 can pass through
Wire electrically connects with MEMS package structure 10, and then is connected by MEMS package structure 10 with other outside devices, in realization
The signal of portion's MEMS component and external circuit transmits.
Signalling channel 12, it can be the hole in MEMS package structure 10, can connect inside MEMS package structure 10
With outside, and then MEMS component can pass through the signalling channel 12 receive outer signals.
The movable valve 13 being arranged in signalling channel 12, for being filtered to extraneous unwanted signals.Movable valve 13
Threshold value is closed with one, if the intensity of unwanted signals is more than the closing threshold value of movable valve 13, movable valve 13 can produce resistance
Hinder effect.For example, under a certain specific closing threshold value, normal signal can enter MEMS package structure by movable valve 13
Inside 10, but it is more than the unwanted signals of the closing threshold value for intensity, such as purge flow, movable valve 13 can be to purgative gas
The raw inhibition of miscarriage, completely cuts off or weakens the entrance of extraneous unwanted signals, reach MEMS adaptive guard MEMS component
Effect.
Fig. 2 a are the dimensional structure diagrams for the MEMS package structure 10 that the embodiment of the present application provides.
As shown in Figure 2 a, MEMS package structure 10 is by a substrate 101 with carrying effect and with covering effect
Four side plates 102 and the fixing and packaging of top plate 103 into.
Optionally, signalling channel 12 can be opened on substrate 101 as shown in Figure 2 b, can be opened in top as shown in Figure 2 c
On plate 103, it can also be opened in simultaneously on substrate 101 and top plate 103 as shown in Figure 2 d.Signalling channel 12 is in MEMS package knot
It is good to provide MEMS component 11 and external world's progress depending on the specific position for opening up the visual MEMS component 11 in position and installing on structure 10
Good communication is standard.For example, the signal receiving end of MEMS component 11 at top plate 13, then signalling channel 12 should be opened in
The position corresponding with the signal receiving end of MEMS component 11 on top plate 13.
Fig. 3 a are an optional exemplary plots of the movable valve that the embodiment of the present application provides.
As shown in Figure 3 a, movable valve includes valve body 131 and is connected to the fixture 132 of valve body 131.
Wherein, valve body 131, which is used to reducing the direct of MEMS component 11 and air, contacts, and unwanted signals intensity compared with
The air isolated when big outside encapsulating structure 10 and internal MEMS component 11；Fixture 132 is used for, and movable valve 13 is fixed
Inside signalling channel 12.
Fig. 3 b are the one optional of the valve neck being adapted to the movable valve 13 shown in Fig. 3 a that the embodiment of the present application provides
Exemplary plot.
Correspondingly, as shown in Figure 3 b, it is the movable valve 13 of fixation, top plate and/or substrate are provided with and be adapted to fixture 132
Valve neck 133.Fixture 132 can be embedded in valve neck 133 by way of welding or pressing.In fig. 3 a,
The quantity of fixture 132 is only a kind of example, the embodiment of the present application is not construed as limiting.In actual applications, fixture
132 quantity can be by the knot of required movable the closing threshold value of valve 13, the material of movable valve 13 and valve body 131
Structure determines.
When MEMS is applied to different scenes, the closing threshold value of movable valve 13 may be different, and therefore, the application is real
Example is applied not to be limited the material and structure of movable valve 13.With lower part by the optional knot with reference to accompanying drawing to movable valve 13
Structure is described further.
In an optional embodiment, as shown in Figure 3 a, the valve body 131 of movable valve 13 is the face without through hole
Structure, the diameter of valve body 131 should be greater than channel diameter of the signalling channel 12 close to the one end of MEMS component 11, and be less than signal
Card sets the channel diameter of the opening position of movable valve 13 in passage 12.In the case of in the absence of unwanted signals, encapsulating structure 10
Internal MEMS component 11 is needed to be communicated with the external world, and therefore, signalling channel 12 can not be plugged completely, movable valve 13
Diameter needs to be less than the channel diameter that card in signalling channel 12 sets the opening position of movable valve 13, can be with so as to retain normal signal
The gap passed through.In addition, after increasing movable valve 13, outside air is entered inside encapsulating structure 10 by signalling channel 12
Amount is reduced, and corresponding particulates emission quantity is reduced, then 11 impaired probability of MEMS component reduces.
If unwanted signals be present, for example, purge flow be more than movable valve 13 closing threshold value when, movable valve 13 can become
Shape, and block signals passage 12 is close to the one end of MEMS component 11, to prevent purge flow from entering the inside of encapsulating structure 10 so as to right
MEMS component causes damage.As shown in Figure 3 c, blocked for signalling channel 12 close to the one end of MEMS component 11 by movable valve 13
One exemplary plot.In figure 3 c, the MEMS package structure 10 for offering signalling channel 13 is changed into the cavity of closing, is effectively protected
The MEMS component of inside cavity.
In another optional embodiment, as shown in Figure 3 d, the valve body 131 of movable valve 13 is provided with least one
The face structure of individual through hole.Under this configuration, at least one through hole on valve body 131, on the one hand ensure that encapsulating structure
The demand that MEMS component 11 inside 10 is communicated with the external world；On the other hand, outside air is effectively reduced by signal to lead to
The amount that road 12 enters inside encapsulating structure 10, and then effectively reduce the quantity of particulates emission, then MEMS component 11 is impaired general
Rate reduces.When the intensity of unwanted signals is larger, it is larger that the valve body 131 provided with least one through hole also can effectively delay intensity
Unwanted signals to the damaged condition of MEMS component 11.
Alternatively, in the case where the valve body 131 of movable valve 13 is provided with least one through hole, valve body 131
Diameter can be more than or equal to channel diameter of the signalling channel 12 close to the one end of MEMS component 11, and be less than signalling channel 12
The middle channel diameter for blocking the opening position for setting movable valve 13.Certainly, because valve body 131 be provided with least one through hole can be with
Meet MEMS component 11 and extraneous the needs of being communicated, therefore the diameter of valve body 131 can also be equal to signalling channel 12
The middle channel diameter for blocking the opening position for setting movable valve 13.
Fig. 4 a are the structural representations of the top plate that the embodiment of the present application provides and/or substrate.That is, top plate and/or substrate be all
Structure shown in Fig. 4 a can be used to realize, specifically whether use structure shown in Fig. 4 a, the visual movably installation situation of valve 13 and
It is fixed.In general, if desired movable valve 13 is installed then preferably use structure shown in Fig. 4 a.
In a kind of optional embodiment, for ease of the installation of movable valve 13, substrate 101 or top plate 103 include：The
One sublayer 1011 and the second sublayer 1012, so movable valve 13 can be located in the first sublayer 1011 and the second sublayer 1012 it
Between.Alternatively, the first sublayer 1011 is the sublayer contacted with the external world, and the second sublayer 1022 is with being connect inside MEMS package structure 10
Tactile sublayer.
Correspondingly, signalling channel can be by the first signalling channel 121 (as shown in Figure 4 b) for being opened in the first sublayer 1011
And it is opened in secondary signal passage 122 (as shown in Figure 4 b) composition in the second sublayer 1022.
Fig. 4 b are the structural representations for the another MEMS that the embodiment of the present application provides.As shown in Figure 4 b, the first signal
Diameter of the passage 121 close to the one end of MEMS component 11 is identical with diameter of the secondary signal passage 122 away from the one end of MEMS component 11,
So as to which the first sublayer 1011 and the second sublayer 1012 can be using the relative faces of the two diameter identical signalling channels as fitting
Face, it is combined into substrate 11 or top plate 13.In fig. 4b, illustrated so that signalling channel is opened in top plate as an example.
Optionally, it is remote to be less than secondary signal passage 122 for diameter of the secondary signal passage 122 close to the one end of MEMS component 11
The diameter of the one end of MEMS component 11.So as to which when being attacked by unwanted signals, movable valve 13 after a deformation, can be blocked
Diameter of the secondary signal passage 122 away from the one end of MEMS component 11, it is right to prevent that unwanted signals from can enter the inside of encapsulating structure 10
MEMS component causes damage.
When movable valve 13 is fixedly arranged between the first sublayer 1011 and the second sublayer 1012, the first signal can be fixedly arranged on and led to
Road 121 can also be fixedly arranged on secondary signal passage 122 away from the one end of MEMS component 11 close to the one end of MEMS component 11, can be with
It is fixedly arranged on the first signalling channel 121 and the opening position of the fitting of secondary signal passage 122.
Fig. 5 a are the structural representations for the another MEMS that the embodiment of the present application provides.In a kind of optional embodiment
In, signalling channel 12 be including at least two steps shoulder hole, the shoulder hole close to MEMS component 11 one end diameter compared with
It is small.In fig 5 a, so that MEMS component 11 is MEMS microphone as an example.
Optionally, as shown in Figure 5 a, substrate or top plate include：1012 when the first sublayer 1011 and the second sublayer.First son
The relative predetermined position of the sublayer 1012 of layer 1011 and second, offers the first signalling channel 121 and secondary signal passage respectively
122.First signalling channel 121 and secondary signal passage 122 form signalling channel 12.
As shown in Figure 5 a, the first signalling channel 121 is through hole, and secondary signal passage is coaxial counter sink and sets of vias
Into shoulder hole.The diameter of first signalling channel 121 is identical with the diameter of the counter sink of secondary signal passage 122.First signal
Passage 121 is bonded with secondary signal passage using channel diameter identical face as binding face, obtains signalling channel 12.
Optionally, as shown in Figure 5 b, the first signalling channel 121 and secondary signal passage 122 are coaxial counter sink
And the shoulder hole of through hole composition.The diameter of the counter sink of first signalling channel 121 and the counter sink of secondary signal passage 122
Diameter is identical.Then the first sublayer 1011 and the second sublayer 1022, with the counter sink and secondary signal of the first signalling channel 121
The face that the counter sink of passage 122 is relative is bonded for binding face, obtains offering the substrate 101 or top plate of signalling channel 12
103。
In an optional embodiment, if the valve body 131 of movable valve 13 is without through hole shown in Fig. 3 a
Face structure, the thickness of valve body 131 should be less than the counter sink of the first signalling channel 121 and sinking for secondary signal passage 122
The hole depth sum of head bore, so as to ensure valve body not fully jam signal passage 12, to ensure passing through for normal signal.
In another optional embodiment, if the valve body 131 of movable valve 13 is being provided with least shown in Fig. 3 d
The face structure of one through hole.Now, the thickness of valve body 131 can be equal to or less than the countersunk head of the first signalling channel 121
The hole depth sum of the counter sink of hole and secondary signal passage 122.
Finally it should be noted that：Above example is only to illustrate the technical solution of the utility model, rather than its limitations；
Although the utility model is described in detail with reference to the foregoing embodiments, it will be understood by those within the art that：
It can still modify to the technical scheme described in foregoing embodiments, or which part technical characteristic is carried out etc.
With replacement；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the utility model technology
The spirit and scope of scheme.
Claims (8)
- A kind of 1. MEMS, it is characterised in that including：MEMS package structure；AndThe interior MEMS component for being located at the MEMS package structure and being electrically connected with the MEMS package structure；Wherein, the MEMS package structure is provided with the signalling channel for the MEMS component communication with the outside world, and is arranged in institute State the movable valve in signalling channel.
- 2. MEMS according to claim 1, it is characterised in that the diameter of the movable valve leads to more than the signal Road and sets less than card in the signalling channel opening position of the movable valve close to the channel diameter of described MEMS component one end Channel diameter.
- 3. MEMS according to claim 1, it is characterised in that the movable valve is provided with least one through hole.
- 4. according to the MEMS described in claim 1 or 2 or 3, it is characterised in that the MEMS package structure, including：Substrate, side panel and top plate；The signalling channel is opened on the top plate and/or the substrate；Wherein, the MEMS component is electrically connected by wire with the top plate and/or the substrate.
- 5. MEMS according to claim 4, it is characterised in that the movable valve includes valve body and connection The fixture of the valve body；The top plate and/or the substrate are provided with the valve neck being adapted to the fixture.
- 6. MEMS according to claim 5, it is characterised in that the substrate or the top plate include：First sublayer and the second sublayer；The signalling channel is opened in first sublayer and the relative predeterminated position of second sublayer；First sublayer and/or second sublayer are provided with the valve neck being adapted to the fixture, and the movable valve Door is fixedly arranged between first sublayer and second sublayer.
- 7. MEMS according to claim 6, it is characterised in that the signalling channel is shoulder hole, the shoulder hole Including counter sink and through hole.
- 8. MEMS according to claim 7, it is characterised in that with welding or pressing mode, by first sublayer Face fitting relative with the face where counter sink in second sublayer where upper counter sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720450978.7U CN206720732U (en) | 2017-04-26 | 2017-04-26 | Mems |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720450978.7U CN206720732U (en) | 2017-04-26 | 2017-04-26 | Mems |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206720732U true CN206720732U (en) | 2017-12-08 |
Family
ID=60507465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720450978.7U Withdrawn - After Issue CN206720732U (en) | 2017-04-26 | 2017-04-26 | Mems |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206720732U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107200300A (en) * | 2017-04-26 | 2017-09-26 | 歌尔股份有限公司 | MEMS and encapsulating structure preparation method |
-
2017
- 2017-04-26 CN CN201720450978.7U patent/CN206720732U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107200300A (en) * | 2017-04-26 | 2017-09-26 | 歌尔股份有限公司 | MEMS and encapsulating structure preparation method |
| CN107200300B (en) * | 2017-04-26 | 2023-07-21 | 潍坊歌尔微电子有限公司 | MEMS device and packaging structure manufacturing method |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
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| TR01 | Transfer of patent right |
Effective date of registration: 20191121 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 No. 268 Dongfang Road, Weifang hi tech Industrial Development Zone, Shandong, Weifang Patentee before: GOERTEK Inc. |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: F / F, phase II, Qingdao International Innovation Park, 1 Keyuan Weiyi Road, Laoshan District, Qingdao City, Shandong Province, 266104 Patentee after: Geer Microelectronics Co.,Ltd. Address before: Room 103, 396 Songling Road, Laoshan District, Qingdao City, Shandong Province 266104 Patentee before: Goer Microelectronics Co.,Ltd. |
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| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20171208 Effective date of abandoning: 20230721 |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20171208 Effective date of abandoning: 20230721 |