CN206691395U - A kind of packaging device for the production of LED upside-down mountings die bond solder paste - Google Patents
A kind of packaging device for the production of LED upside-down mountings die bond solder paste Download PDFInfo
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- CN206691395U CN206691395U CN201720424669.2U CN201720424669U CN206691395U CN 206691395 U CN206691395 U CN 206691395U CN 201720424669 U CN201720424669 U CN 201720424669U CN 206691395 U CN206691395 U CN 206691395U
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- packing
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- frame plate
- curing molding
- die bond
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Abstract
A kind of packaging device for the production of LED upside-down mountings die bond solder paste is the utility model is related to, including frame, barrel, peristaltic pump, major ingredient pipe, packing component and curing molding portion, second frame plate of the frame by the first frame plate and perpendicular to first frame plate one end form；Vertically fixed plate is provided with the side of second frame plate, the first frame plate other end of direction；Barrel is vertical in fixed plate；Peristaltic pump is on barrel, and in solution to be packed, outlet connects with barrel for its flexible pipe import；Major ingredient pipe one end is connected with barrel bottom, and the other end is connected by pipeline with packing component；The packing head of packing component connects with curing molding portion；Major ingredient pipe is provided with connecting rod, and curing molding portion is vertical on the one end of connecting rod away from major ingredient pipe；Second frame plate is provided with control device, and control device electrically connects with peristaltic pump, packing component.The utility model device can fast and accurately be dispensed when preparing LED upside-down mounting die bond solder pastes.
Description
Technical field
A kind of technical field of LED upside-down mountings die bond solder paste production is the utility model is related to, more particularly to one kind is fallen for LED
Fill the packaging device of die bond solder paste production.
Background technology
At present, in LED upside-down mountings die bond solder paste manufacturing field, it is impossible to fast and effectively to LED upside-down mounting die bond solder paste systems
Packing during standby before curing molding.
Also, in the prior art, during packing to LED upside-down mounting die bond solder pastes, the metering of packing is difficult to control, causes to dispense
The situation that amount is more, amount is few, so that the LED upside-down mounting die bond solder paste qualities produced are bad.
Utility model content
Technical problem to be solved in the utility model is entered when being and how to provide a kind of production for LED upside-down mountings die bond solder paste
The device of row packing, fast, accurately can be dispensed when preparing LED upside-down mounting die bond solder pastes.
The technical scheme that the utility model solves above-mentioned technical problem is as follows：
It is a kind of for LED upside-down mountings die bond solder paste production packaging device, including frame, barrel, peristaltic pump, major ingredient pipe, point
Arrangement and curing molding portion, the frame is by horizontally disposed first frame plate and perpendicular to described first frame plate one end
The second frame plate composition；Second frame plate is fixed towards vertical be provided with the side of the first frame plate other end
Plate；The barrel is vertical in the fixed plate；The peristaltic pump is on the barrel, and its flexible pipe import is located to be packed
In solution, flexible pipe outlet connects with the barrel；Described major ingredient pipe one end connects with the barrel bottom, and the other end passes through pipeline
Connected with the packing component；The packing head of the packing component connects with the curing molding portion, for by the feed liquid of packing
Inject curing molding in the curing molding portion；Connecting rod is additionally provided with the major ingredient pipe, the curing molding portion is located at described
On the one end of connecting rod away from the major ingredient pipe, and it is parallel with first frame plate；In being additionally provided with second frame plate
Device is controlled, the control device electrically connects with the peristaltic pump, the packing component.
Compared with prior art, the beneficial effects of the utility model are：The utility model product is treated point by peristaltic pump
The solution of dress is extruded, discharged so that solution-stabilized flowing, then solution flowed into through barrel and pipeline in packing component,
Solution is input to curing molding in curing molding portion by packing component, more stable, quick during packing.And filled by being controlled in setting
Put effectively to be controlled to packing running, improve the operability of the present apparatus.
On the basis of above-mentioned technical proposal, the utility model can also do following improvement：
Further, the control device located at second frame plate towards on the side of the barrel.
It is using the above-mentioned further beneficial effect of scheme：Convenient operation control device, to control each part of packaging device
Running.
Further, to be vertically arranged, its upper end connects the major ingredient pipe through the fixed plate and the bottom of the barrel
Connect, lower end connects with the packing component.
Further, the packing component includes motoring syringe, packing injection head and packing cylinder, the electric injection
Device is connected by pipeline with the major ingredient pipe, and it is injected outlet and connected by pipeline with the packing injection head, and described electronic
Syringe electrically connects with the control device；The packing cylinder has inlet and outlet, and is vertical at the curing molding portion
On, and its outlet connects with the curing molding portion；The outlet of the packing injection head is set towards the import of the packing cylinder.
It is using the above-mentioned further beneficial effect of scheme：By motoring syringe stabilization, quickly by solution to be packed
It is expelled in packing injection head, solution is injected into packing cylinder through dispensing injection head, then is flowed into curing molding portion by packing cylinder
Flow when the more preferable control solution of interior carry out curing molding, so energy dispenses.
Further, in addition to for controlling the flow control valves of LED upside-down mounting die bond solder paste curing molding flows, the stream
The import of control valve and the outlet of the packing cylinder, outlet connects with the curing molding portion.
It is using the above-mentioned further beneficial effect of scheme：Stream when being dispensed by the further control solution of flow control valve
Amount.
Further, in addition to for the fibre optical sensor to dispensing flow measurement, the fibre optical sensor is located at described
The injection exit of motoring syringe, and electrically connected with the control device.
It is using the above-mentioned further beneficial effect of scheme：It is electronic rationally to control by the detection information of fibre optical sensor
The injection speed and injection volume of syringe.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model preferred embodiment.
In accompanying drawing, the list of parts representated by each label is as follows：
1st, control device, 2, barrel, 3, peristaltic pump, 4, major ingredient pipe, 5, curing molding portion, the 6, first frame plate, 7, second
Frame plate, 8, fixed plate, 9, flow control valve, 10, fibre optical sensor, 11, connecting rod, 12, motoring syringe, 13, packing note
Penetrate head, 14, packing cylinder.
Embodiment
Principle of the present utility model and feature are described below in conjunction with accompanying drawing, example is served only for explaining this practicality
It is new, it is not intended to limit the scope of the utility model.
As shown in figure 1, a kind of packaging device for the production of LED upside-down mountings die bond solder paste, including frame, barrel 2, peristaltic pump
3rd, major ingredient pipe 4, packing component and curing molding portion 5, the frame is by horizontally disposed first frame plate 6 and perpendicular to described
Second frame plate 7 of the one end of the first frame plate 6 forms；Second frame plate 7 towards the other end of the first frame plate 6 one
Vertically fixed plate 8 is provided with side；The barrel 2 is vertical in the fixed plate 8；The peristaltic pump 3 is located at the barrel 2
On, in solution to be packed, flexible pipe outlet connects with the barrel 2 for its flexible pipe import；Described one end of major ingredient pipe 4 and the material
The connection of 2 bottoms of cylinder, the other end are connected by pipeline with the packing component；The packing head of the packing component is solidified into described
Type portion 5 connects, for the feed liquid of packing to be injected into curing molding in the curing molding portion 5；The company of being additionally provided with the major ingredient pipe 4
Extension bar 11, the curing molding portion 5 on the one end of the connecting rod 11 away from the major ingredient pipe 4, and with first machine
Frame plate 6 is parallel；It is additionally provided with control device 1 on second frame plate 7, the control device 1 and the peristaltic pump 3, described point
Arrangement electrically connects.The utility model product is extruded solution to be packed by peristaltic pump 3, discharged so that solution is steady
Fixed flowing, then solution is through in barrel 2 and pipeline inflow packing component, solution is input to curing molding portion 5 by packing component
Interior curing molding, it is more stable during packing, quick.And by setting control device 1 effectively can be controlled to packing running,
Improve the operability of the present apparatus.
Specifically, to be vertically arranged, its upper end connects the major ingredient pipe 4 through the fixed plate 8 and the bottom of the barrel 2
Connect, lower end connects with the packing component.The control device 1 is located at second frame plate 7 towards the side of the barrel 2
On, it is convenient to operate control device 1 to control the running of each part of packaging device.
Flow when being dispensed in order to more preferable control solution, the packing component include motoring syringe 12, packing note
Penetrate first 13 and dispense cylinder 14, the motoring syringe 12 is connected by pipeline with the major ingredient pipe 4, and it is injected outlet and passes through pipe
Road connects with the packing injection head 13, and the motoring syringe 12 electrically connects with the control device 1；The packing cylinder 14
With inlet and outlet, and it is vertical in the curing molding portion 5, and its outlet connects with the curing molding portion 5；It is described
The outlet for dispensing injection head 13 is set towards the import of the packing cylinder 14.By the stabilization of motoring syringe 12, will quickly treat
Packing solution is expelled in packing injection head 13, and solution is injected into packing cylinder 14 through dispensing injection head 13, then by packing cylinder 14
It is flowed into curing molding portion 5 and carries out curing molding.
The control of flow and the injection speed and note to motoring syringe 12 are dispensed to solution in view of further optimization
The control for the amount of penetrating, in addition to for controlling the flow control valve 9 of LED upside-down mounting die bond solder paste curing molding flows and for packing
The fibre optical sensor 10 of flow measurement, the import of the flow control valve 9 and the outlet of the packing cylinder 14, outlet and institute
Curing molding portion 5 is stated to connect；The fibre optical sensor 10 be located at the motoring syringe 12 injection exit, and with it is described in
Control device 1 electrically connects.
Preferred embodiment of the present utility model is the foregoing is only, it is all in this practicality not to limit the utility model
Within new spirit and principle, any modification, equivalent substitution and improvements made etc., guarantor of the present utility model should be included in
Within the scope of shield.
Claims (6)
1. a kind of packaging device for the production of LED upside-down mountings die bond solder paste, it is characterised in that including frame, barrel (2), wriggle
Pump (3), major ingredient pipe (4), packing component and curing molding portion (5), the frame by horizontally disposed first frame plate (6) and
The second frame plate (7) perpendicular to described first frame plate (6) one end forms；Second frame plate (7) is towards described first
Vertically fixed plate (8) is provided with the side of frame plate (6) other end；The barrel (2) is vertical in the fixed plate (8)；
The peristaltic pump (3) is on the barrel (2), and its flexible pipe import is in solution to be packed, flexible pipe outlet and the barrel
(2) connect；Described major ingredient pipe (4) one end is connected with the barrel (2) bottom, and the other end is connected by pipeline and the packing component
It is logical；The packing head of the packing component connects with the curing molding portion (5), for being solidified into described in the feed liquid injection by packing
Type portion (5) interior curing molding；Connecting rod (11) is additionally provided with the major ingredient pipe (4), the curing molding portion (5) is located at the company
On the one end of extension bar (11) away from the major ingredient pipe (4), and it is parallel with first frame plate (6)；Second frame plate (7)
On be additionally provided with control device (1), the control device (1) electrically connects with the peristaltic pump (3), the packing component.
2. the packaging device according to claim 1 for the production of LED upside-down mountings die bond solder paste, it is characterised in that in described
Device (1) is controlled located at second frame plate (7) towards on the side of the barrel (2).
3. the packaging device according to claim 1 for the production of LED upside-down mountings die bond solder paste, it is characterised in that the master
To be vertically arranged, its upper end is connected expects pipe (4) through the fixed plate (8) with the bottom of the barrel (2), lower end and described point
Arrangement connects.
4. the packaging device according to claim 1 for the production of LED upside-down mountings die bond solder paste, it is characterised in that described point
Arrangement includes motoring syringe (12), packing injection head (13) and packing cylinder (14), the motoring syringe (12) and passed through
Pipeline connects with the major ingredient pipe (4), and it is injected outlet and connected by pipeline with the packing injection head (13), and described electronic
Syringe (12) electrically connects with the control device (1)；The packing cylinder (14) has inlet and outlet, and is vertical at described
In curing molding portion (5), and its outlet connects with the curing molding portion (5)；The outlet direction of the packing injection head (13)
The import of the packing cylinder (14) is set.
5. the packaging device according to claim 4 for the production of LED upside-down mountings die bond solder paste, it is characterised in that also include
For controlling the flow control valve (9) of LED upside-down mounting die bond solder paste curing molding flows, the import of the flow control valve (9) with
The outlet of the packing cylinder (14), outlet connect with the curing molding portion (5).
6. the packaging device according to claim 4 for the production of LED upside-down mountings die bond solder paste, it is characterised in that also include
For the fibre optical sensor (10) to dispensing flow measurement, the fibre optical sensor (10) is located at the motoring syringe (12)
Exit is injected, and is electrically connected with the control device (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720424669.2U CN206691395U (en) | 2017-04-20 | 2017-04-20 | A kind of packaging device for the production of LED upside-down mountings die bond solder paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720424669.2U CN206691395U (en) | 2017-04-20 | 2017-04-20 | A kind of packaging device for the production of LED upside-down mountings die bond solder paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206691395U true CN206691395U (en) | 2017-12-01 |
Family
ID=60445620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720424669.2U Active CN206691395U (en) | 2017-04-20 | 2017-04-20 | A kind of packaging device for the production of LED upside-down mountings die bond solder paste |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206691395U (en) |
-
2017
- 2017-04-20 CN CN201720424669.2U patent/CN206691395U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Zhang Mingxuan Inventor after: Wang Shuai Inventor before: Wang Shuai |
|
| CB03 | Change of inventor or designer information | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180417 Address after: 523000 Dongguan, Guangdong, Tianhuang village, Huang River, 8F-1 Patentee after: Guangdong Jinhang Electronic Material Co., Ltd. Address before: 518000 East Baoan District, No. 2, No. 2, pine white Industrial Park, Songgang street, Baoan District, Shenzhen Patentee before: Shenzhen Jin Hang Optoelectronic Technology Co., Ltd. |
|
| TR01 | Transfer of patent right |