CN205056379U - Quick head of gluing - Google Patents
Quick head of gluing Download PDFInfo
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- CN205056379U CN205056379U CN201520853011.4U CN201520853011U CN205056379U CN 205056379 U CN205056379 U CN 205056379U CN 201520853011 U CN201520853011 U CN 201520853011U CN 205056379 U CN205056379 U CN 205056379U
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- glue
- jiao kou
- dripping head
- cover plate
- upper cover
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Abstract
The utility model relates to a resistor apparatus for producing field, concretely relates to quick head of gluing, upper cover plate and lower apron including detachable cooperation connection, being provided with the jiao kou that advances who is used for the encapsulating on the upper cover plate face, being provided with the branch solation way that is used for shunting glue on another face, the end that divides the solation to say is a plurality of minutes jiaokou, under lap to correspond with a minute jiao kou on the face and be provided with a plurality of receipts jiaokou, receive jiao kou and lap the glue outlet pipe intercommunication that another face stretches out down, the upper cover plate hardens with the lower cover and closes the face seal cooperation. This quick head of gluing can carry out a little gluing the operation to a plurality of resistor products simultaneously, and the point is glued efficiently, is favorable to improving production efficiency.
Description
Technical field
The utility model relates to a kind of resistor process units, particularly a kind of Glue dripping head fast.
Background technology
Piezoresistor is the solid-state voltage sensing element having nonlinear wind vibration and have the effect of transient suppression overvoltage; mainly be used for protecting those to be subject to a kind of resistance of the welding such as electrostatic and high pressure; integrated higher at some; apply more in application function complex environment; wherein type piezoresistor volume is little, is adapted to the electronic environment of Highgrade integration.
Piezoresistor production technology is mainly: shell fills back-up sand → encapsulating → solidification → cutting, packaging → warehouse-in in pressure-sensitive body → shell, wherein encapsulating link is one of important step of production, generally adopt the mode of encapsulating manually at present, be specially: install syringe needle additional with syringe, adopt air pressure to control flow and one by one encapsulating is carried out to product, the sizing material of this embedding is liquid-state epoxy resin, but the inefficiency of encapsulating; Commercially there is automatically dropping glue equipment at present, glue valve above syringe arranges PLC and controls its plastic emitting time and gel quantity, realize auto feed and automatically dropping glue, but owing to only having a syringe and syringe needle, can only carry out a glue to a product, production efficiency is not high yet at every turn.
Utility model content
Goal of the invention of the present utility model is: during for existing piezoresistor production glue, no matter be manual operation or automatically dropping glue, once put glue action and all can only carry out a glue to single product, the problem that production efficiency is not high, a kind of Glue dripping head is fast provided, can carry out a glue operation to multiple product, some glue efficiency is high, is conducive to enhancing productivity simultaneously.
To achieve these goals, the technical solution adopted in the utility model is:
A kind of Glue dripping head fast, comprise the detachable upper cover plate that is connected and lower cover, described upper cover plate plate face is provided with the glue-feeder for encapsulating, point solation road that be provided with for shunt glue corresponding to glue-feeder on another plate face, the end dividing solation road is multiple points of Jiao Kou, on described lower cover plate face, be provided with corresponding with point glue mouth multiplely receives Jiao Kou, and the sebific duct that goes out that described receipts Jiao Kou and lower cover stretch out in another plate face is communicated with, and described upper cover plate and lower cover faying face are sealed and matched.
This quick Glue dripping head is by arranging upper cover plate and lower cover, and a glue-feeder is set on upper cover plate, upper cover plate arranges point solation road corresponding with glue-feeder, and multiple points of Jiao Kou are set in a point glue flow field end, on lower cover, corresponding setting with a point Jiao Kou receives Jiao Kou, the sebific duct that goes out on lower cover is communicated with receipts glue mouth is corresponding, and passes through sebific duct discharge glue; Glue is divided into multiply by a point solation road by this quick Glue dripping head, and by multiple go out sebific duct discharge, be equal to and multiple syringe needle is integrated on one block of plate, remove the installation of syringe needle from, make syringe needle accurate positioning, realize simultaneously to the object of multiple piezoresistor encapsulating, some glue efficiency is high, be conducive to enhancing productivity.
The glue-feeder of this quick Glue dripping head matches with glue valve, can arrange plastic emitting time and gel quantity that PLC controls glue valve, and then control the glue quantity and the pressure that enter this Glue dripping head on glue valve, and glue quantity and actual demand from going out sebific duct outflow are adapted.
As preferred version of the present utility model, described multiple points of Jiao Kou are equal with the distance of glue-feeder.Multiple points of Jiao Kou are all set to equal with the distance of glue-feeder, are conducive to making glue arrive the time of each point of Jiao Kou and measure all equal, make the time finally going out sebific duct outflow glue identical with amount, be easier to control point glue operation.
As preferred version of the present utility model, described glue-feeder is arranged on the center of upper cover plate.The glue-feeder being arranged on upper cover plate center is conducive on upper cover plate, arrange more point Jiao Kou.
As preferred version of the present utility model, the quantity of described point of Jiao Kou be greater than 2 even number.
As preferred version of the present utility model, the quantity of described point of Jiao Kou is 16, and becomes two parallel rows to be evenly arranged on upper cover plate plate face.A point Jiao Kou is put in two parallel arrangements, can to greatest extent arrange and glue-feeder equidistant point of Jiao Kou more, can ensure that the glue entered from glue-feeder can arrive a point Jiao Kou with amount simultaneously, make finally to meet user demand from the glue quantity going out sebific duct outflow, correspondingly, the distance between two row's point glue mouths and between point glue mouth is suitable with the layout size of the piezoresistor product stock treating encapsulating.
As preferred version of the present utility model, described receipts Jiao Kou and point Jiao Kou are arranged to the setting of two rows accordingly, described in go out that sebific duct is corresponding with receiving glue mouth to be arranged to two parallel arrangements and to put.
As preferred version of the present utility model, be provided with the Glue dripping head suitable with it at the sebific duct overcoat that goes out of same row, the height of described Glue dripping head is less than sebific duct.The object that Glue dripping head is arranged is to discharge sebific duct location to one, using the some glue position stability of sebific duct, improves some colloid amount; And go out the height of the mouth of pipe higher than Glue dripping head of sebific duct, avoid the casting glue stopped between the plastic emitting mouth of pipe to contact, pile up, cause discharging inequality or stop more, cause embedding pins of products wire is stained with glue.
As preferred version of the present utility model, described in go out sebific duct gum outlet be flat hole.Flat hole is in order to can be adaptive with the cavity geometry of piezoresistor, is convenient to, smoothly by sizing material embedding to sub-sensitive resistor, increase casting glue flow, reduce resistance, ensure encapsulating amount.
In sum, owing to have employed technique scheme, the beneficial effects of the utility model are:
1, this quick Glue dripping head is by arranging upper cover plate and lower cover, and a glue-feeder is set on upper cover plate, upper cover plate arranges point solation road corresponding with glue-feeder, and multiple points of Jiao Kou are set in a point glue flow field end, on lower cover, corresponding setting with a point Jiao Kou receives Jiao Kou, the sebific duct that goes out on lower cover is communicated with receipts glue mouth is corresponding, and passes through sebific duct discharge glue; Glue is divided into multiply by a point solation road by this quick Glue dripping head, and by multiple go out sebific duct discharge, be equal to and multiple syringe needle is integrated on one block of plate, remove the installation of syringe needle from, make syringe needle accurate positioning, realize simultaneously to the object of multiple piezoresistor encapsulating, some glue efficiency is high, be conducive to enhancing productivity;
2, a point Jiao Kou is put in two parallel arrangements, can to greatest extent arrange and glue-feeder equidistant point of Jiao Kou more, can ensure that the glue entered from glue-feeder same amount can arrive a point Jiao Kou simultaneously, make finally to meet user demand from the glue quantity going out sebific duct outflow;
3, utilizing Glue dripping head to discharging sebific duct location, using the some glue position stability of sebific duct, improve some colloid amount; And go out the height of the mouth of pipe higher than Glue dripping head of sebific duct, avoid the casting glue stopped between the plastic emitting mouth of pipe to contact, pile up, cause discharging inequality or stop more, cause embedding pins of products wire is stained with glue;
4, the gum outlet going out sebific duct is set to flat hole, increases encapsulating flow, reduce resistance, ensure encapsulating amount.
Accompanying drawing explanation
Fig. 1 is the structural representation of the quick Glue dripping head of the utility model.
Fig. 2 is the structural representation of upper cover plate in Fig. 1.
Fig. 3 is the left view of Fig. 2.
Fig. 4 is the right view of Fig. 2.
The structural representation of lower cover in Fig. 5 Fig. 1.
Fig. 6 is the top view of Fig. 5.
Fig. 7 is the left view of Fig. 5.
Mark in figure: 1-upper cover plate, 101-glue-feeder, 102-upper cover plate body, 103-connects counterbore, and 104-divides Jiao Kou, and 105-divides solation road, 2-lower cover, 201-lower cover body, 202-threaded connection hole, 203-Glue dripping head, and 204-goes out sebific duct, and 205-receives Jiao Kou.
Detailed description of the invention
Below in conjunction with accompanying drawing, the utility model is described in detail.
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
embodiment 1
This quick Glue dripping head is used for the less model piezo-resistance encapsulating operation of the same race of product size by the present embodiment, as shown in Figures 1 to 7, the quick Glue dripping head of the present embodiment comprises the detachable upper cover plate 1 that is connected and lower cover 2, described upper cover plate 1 plate face is provided with the glue-feeder 101 for encapsulating, point solation road 105 that be provided with for shunt glue corresponding to glue-feeder 101 on another plate face, the end dividing solation road 105 is multiple points of glue mouths 104, described lower cover 2 plate face is provided with multiple receipts glue mouth 205 with point glue mouth 104 is corresponding, the sebific duct 204 that goes out that described receipts glue mouth 205 stretches out with another plate face of lower cover 2 is communicated with, described upper cover plate 1 is sealed and matched with lower cover 2 faying face.
As shown in Figures 2 to 6, be provided with at upper cover plate 1 edge and connect counterbore 103, at lower cover 2 edge, correspondence is provided with threaded connection hole 202, just can by upper cover plate 1 and lower cover 2 compact siro spinning technology through connection counterbore 103 and threaded connection hole 202 by mounting screw.
In the present embodiment, glue-feeder 101 is arranged on the center of upper cover plate 1, multiple points of glue mouths 104 are equal with the distance of glue-feeder 101, the quantity of point glue mouth 104 is set to 16 by the present embodiment, and become two parallel rows to be arranged on upper cover plate 1, correspondingly receive glue mouth 205 and be also 16 with the quantity going out sebific duct 204 and put in two arrangements; Be furnished with the advantage that it is exclusive like this: point Jiao Kou that parallel two arrangements are put, to greatest extent can arrange a point glue mouth quantity 16 more, can ensure that the glue entered from glue-feeder can arrive a point Jiao Kou with amount simultaneously, make finally to meet user demand from the glue quantity going out sebific duct outflow, correspondingly, the distance between two row's point glue mouths and between point glue mouth is suitable with the layout size of the piezoresistor product stock treating encapsulating.
In addition, the present embodiment is arranged with the Glue dripping head 203 suitable with it in going out outside sebific duct 204 of same row, as shown in Figures 5 to 7, Glue dripping head 203 is a strip plate object, Glue dripping head 203 being provided with the multiple installing holes suitable with going out sebific duct 204, being fixed on after on lower cover 2 Glue dripping head 203 one end, Glue dripping head 203 plays good position-limiting action to going out sebific duct 204, go out the position of sebific duct 203 fixing after, gel quantity more easy to control; In addition, the height of Glue dripping head 203 is less than sebific duct 204.The object that Glue dripping head is arranged is in order to discharging sebific duct location, uses the some glue position stability of sebific duct, improves encapsulating quality; And go out the height of the mouth of pipe higher than Glue dripping head of sebific duct, avoid the casting glue stopped between the plastic emitting mouth of pipe to contact, pile up, cause discharging inequality or stop more, cause embedding pins of products wire is stained with glue.
In the present embodiment, the gum outlet going out sebific duct 204 is set to flat hole.The gum outlet of flat can increase casting glue flow, reduces resistance, ensures enough encapsulating amounts.
The quick Glue dripping head of the present embodiment, glue is divided into multiply by a point solation road by this quick Glue dripping head, and by multiple go out sebific duct discharge, be equal to and multiple syringe needle is integrated on one block of plate, remove the installation of syringe needle from, make syringe needle accurate positioning, realize simultaneously to the object of multiple piezoresistor encapsulating, use reliable, some glue efficiency is high.Particularly, when adopting artificial some glue, each workman's per tour can do 6000-10000 piezo-resistance encapsulating operation, and after adopting the quick Glue dripping head of the present embodiment to carry out encapsulating operation, the per tour of every platform equipment can complete the process of 60,000 piezo-resistance encapsulatings.
embodiment 2
This quick Glue dripping head is used for the larger model piezo-resistance encapsulating operation of the same race of product size by the present embodiment, a point Jiao Kou, the quantity receiving Jiao Kou and go out sebific duct are set to 8 by the present embodiment, and be the setting with row, each point of Jiao Kou is identical to the distance of glue-feeder, and all the other settings are identical with embodiment 1.
embodiment 3
The quantity of glue-feeder is set to two by the present embodiment, a point Jiao Kou, the quantity receiving Jiao Kou and go out sebific duct are set to 16 two arrangements and put, arrange that the position of glue-feeder makes each point of Jiao Kou equal to the distance of the glue-feeder with its connection, the glue valve be connected with glue-feeder is controlled by PLC, make the glue quantity entering two glue-feeders consistent with interval time, all the other settings are identical with embodiment 1.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection domain of the present utility model.
Claims (8)
1. a quick Glue dripping head, it is characterized in that, comprise the detachable upper cover plate that is connected and lower cover, described upper cover plate plate face is provided with the glue-feeder for encapsulating, another plate face is provided with point solation road for shunting glue, the end in point solation road is multiple points of Jiao Kou, and on described lower cover plate face, be provided with corresponding with dividing glue mouth multiplely receives Jiao Kou, the sebific duct that goes out that described receipts another plate face of Jiao Kou and lower cover is stretched out is communicated with, and described upper cover plate and lower cover faying face are sealed and matched.
2. quick Glue dripping head according to claim 1, is characterized in that, described multiple points of Jiao Kou are equal with the distance of glue-feeder.
3. quick Glue dripping head according to claim 2, is characterized in that, described glue-feeder is arranged on the center of upper cover plate.
4. quick Glue dripping head according to claim 3, is characterized in that, the quantity of described point of Jiao Kou be greater than 2 even number.
5. quick Glue dripping head according to claim 4, is characterized in that, the quantity of described point of Jiao Kou is 16, and becomes two parallel rows to be evenly arranged on upper cover plate plate face.
6. quick Glue dripping head according to claim 5, is characterized in that, described receipts Jiao Kou and point Jiao Kou are arranged to the setting of two rows accordingly, described in go out that sebific duct is corresponding with receiving glue mouth to be arranged to two parallel arrangements and to put.
7. quick Glue dripping head according to claim 6, is characterized in that, is provided with the Glue dripping head suitable with it at the sebific duct overcoat that goes out of same row, and the height of described Glue dripping head is less than sebific duct.
8. quick Glue dripping head according to claim 7, is characterized in that, described in go out sebific duct gum outlet be flat hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520853011.4U CN205056379U (en) | 2015-10-30 | 2015-10-30 | Quick head of gluing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520853011.4U CN205056379U (en) | 2015-10-30 | 2015-10-30 | Quick head of gluing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205056379U true CN205056379U (en) | 2016-03-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520853011.4U Active CN205056379U (en) | 2015-10-30 | 2015-10-30 | Quick head of gluing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205056379U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111589642A (en) * | 2020-05-20 | 2020-08-28 | 安徽江淮汽车集团股份有限公司 | Encapsulating frock |
-
2015
- 2015-10-30 CN CN201520853011.4U patent/CN205056379U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111589642A (en) * | 2020-05-20 | 2020-08-28 | 安徽江淮汽车集团股份有限公司 | Encapsulating frock |
| CN111589642B (en) * | 2020-05-20 | 2021-08-27 | 安徽江淮汽车集团股份有限公司 | Encapsulating frock |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 610000 Sichuan province Chengdu city Chengdu district modern PI Du Industrial Area North Port Road No. 733 Patentee after: Chengdu Tieda electronic Limited by Share Ltd Address before: Pixian 611743 Sichuan Province, Chengdu city Chengdu modern industrial port area North Road No. 733 Patentee before: Tieda Electronic Co., Ltd., Chengdu |
|
| CP03 | Change of name, title or address |