CN206685349U

CN206685349U - Wiring tool

Info

Publication number: CN206685349U
Application number: CN201720418000.2U
Authority: CN
Inventors: 陈泰甲; 古峰锜; 何嘉哲
Original assignee: CHINA EMERG WHEEL ENTERPRISE Co Ltd
Current assignee: CHINA EMERG WHEEL ENTERPRISE Co Ltd; Kinik Co
Priority date: 2017-04-20
Filing date: 2017-04-20
Publication date: 2017-11-28
Anticipated expiration: 2027-04-20

Abstract

The utility model discloses a kind of wiring tool, includes a work block；One binder course, it is arranged on the side of the work block；One first these diamond layers, it is arranged on side of the binder course away from the work block and directly contacts the binder course, first these diamond layers has a single Rotating fields；And a dozen the end of a thread, it is arranged on the side of first these diamond layers away from the binder course and directly contacts first these diamond layers, and the routing head is to be mixed by a diamond micro mist and formed with a silicon carbide micro-powder.First these diamond layers not only help the engagement strengthened between the work block and the routing head, while reduce the working face deformation extent of the wiring tool under high temperature, and then lift the life-span of the wiring tool.

Description

Wiring tool

Technical field

A kind of wiring tool is the utility model is related to, espespecially a kind of abrasion performance lifting, bond strength improves, and in high temperature Under on-deformable wiring tool.

Background technology

Routing engagement (wire bonding) is one of method that chip and external circuit are attached by current industry.Perhaps It is multifactor can all influence engage the good and the bad, for example, through thermocompression bonding technique routing engagement used in wiring tool, its Surface should have good heat endurance and abrasion performance characteristic, be able to will not occur to beat in the heating process of line connection process The bad result such as the Line tool thermal deformation.In order to pursue better quality, many research teams are endeavoured in lifting routing engagement Technological level, meanwhile, carry out various research and development also for wiring tool and improve.

For example, the apllied TaiWan, China new patent notification number M539149 of present utility model application people proposes that one kind is beaten The Line tool, it is arranged on the binder course and a dozen the end of a thread of the side of the work block comprising a work block, one, wherein, the routing Head is to be mixed by a diamond micro mist and a silicon carbide micro-powder and formed.

Or in U.S. patent Nos US6,840, the 424B2 wiring tools disclosed, include a tool body, one Connect the tool body and the supporting member formed by superhard material and one connect the supporting member pressing element, and The pressing element forms a diamond film.

Or such as U.S. patent Nos US6,270, the 898B1 engagement instruments proposed, comprising a tool body and The tool tip of one group of front end for being located at the tool body.The tool tip includes a substrate, a polycrystalline diamond film, Yi Jiyi Contacted with the polycrystalline diamond film and used in conductive metal level.Wherein, the polycrystalline diamond film may be formed at the one of the tool tip Installment surface, a composition surface or at least two are intersected on the side on the installment surface Yu the composition surface, and are situated between with one 1 × 10^-4 Ω cm to 1 × 10³Resistance between Ω cm, and the polycrystalline diamond film includes the first conductive polycrystalline with relative high boron content for one Diamond film and the sandwich construction with the second conductive polycrystalline diamond film of low boron content relatively.

More than in the prior art, TaiWan, China new patent notification number M539149 wiring tool, only transmits a solder To engage a work block and a dozen the end of a thread, a working face (the namely face of the routing head away from the work block) for its routing head and One non-working surface (the namely face of the nearly work block of the routing head rest) is not provided with the material of further auxiliary engagement, except this The abrasion performance degree of working face is poor outer, still there is deficiency on bond strength；U.S. patent Nos US6,840,424B2 routing The working face that instrument is only disclosed in a dozen the end of a thread sets a film layer, but does not have the material of auxiliary engagement in its non-working surface, because This still suffers from the problem of above-mentioned bond strength；Although U.S. patent Nos US6,270,898B1 is implied the one of its routing head Working face and the settable polycrystalline diamond film of a non-working surface, can so find from figure with interior text, though the patent is disclosed in The polycrystalline diamond film can be set on the non-working surface, but in the content specifically disclosed, this being arranged on the non-working surface is more Brilliant diamond film engages not with a work block or similar to the base material of the work block, but is engaged with a metal electrode, thereby The electric current that needs and heat when providing work, therefore, the polycrystalline diamond film that actually patent discloses simultaneously can do nothing to help the work Bond strength between seat and the routing head, in addition to foregoing problems, its wiring tool is complex in structure, will raise routing The manufacturing cost of instrument.

When the bond strength between the work block and the routing head is bad, easily because of heat under high temperature circulation at work Deform and interfacial failure occurs, cause the service life reduction of the wiring tool, even influence process rate.In view of this, one is needed badly Kind abrasion performance lifting, bond strength improves, and on-deformable wiring tool at high temperature, is engaged and walked in routing with sharp industry Rapid carrying out is more smoothly.

Utility model content

A purpose of the present utility model is the engagement between routing head and work block in the wiring tool for strengthen prior art Intensity, while the problem on deformation that the working face for solving the wiring tool often occurs at high operating temperatures.

In order to achieve the above object, the utility model provides a kind of wiring tool, the wiring tool not only abrasion performance it is good, With improved bond strength, and its working face is found after tested deflection is low at high operating temperatures, can solve prior art Wiring tool its surface smoothness is reached industry using standard because thermal deformation causes subsequently to cost work finishing at high temperature Problem.

Therefore, wiring tool of the present utility model, a work block is included；One binder course, it is arranged on the side of the work block； One first these diamond layers, it is arranged on side of the binder course away from the work block and directly contacts the binder course, first these diamond layers With a single Rotating fields；And a dozen the end of a thread, it is arranged on the side of first these diamond layers away from the binder course and directly contacts First these diamond layers, and the routing head is to be mixed by a diamond micro mist and formed with a silicon carbide micro-powder.

In the embodiment of the utility model one, the wiring tool also includes one second these diamond layers, and it is remote to be arranged on the routing head From the side of first these diamond layers.

In the embodiment of the utility model one, an intermediate layer is also included between second these diamond layers and the routing head.

In the embodiment of the utility model one, the material of the work block is to select free iron-nickel alloy, teleoseal, iron nickel Evanohm, iron cochrome, and combinations thereof the group that is formed.

In the embodiment of the utility model one, the material of the binder course is a solder, and the solder is selected certainly comprising at least one By silver, copper, indium, titanium, chromium, boron, silicon, iron, carbon, nickel, its alloy, and combinations thereof the group that is formed.

In the embodiment of the utility model one, the volume in the routing head shared by the diamond micro mist is more than the silicon carbide micro-powder Shared volume.

In the embodiment of the utility model one, the diamond micro mist separately has one to be situated between with the silicon carbide micro-powder Particle diameter between 0.1 μm to 50 μm.

In the embodiment of the utility model one, the routing head is one to be mixed to form by the diamond micro mist with the silicon carbide micro-powder Single Rotating fields.

Therefore the utility model is the effect of reaching compared to prior art：

(1) solder is only transmitted in the prior art as binder course to engage routing head and work block, the only engagement of the solder Power still has improved space, and the utility model passes through non-working surface (namely routing head and the binder course in the routing head Between) first these diamond layers are set, first these diamond layers can be strengthened between the routing head and the work block jointly with the binder course Engaging force.

(2) found via actual test, first these diamond layers set on the non-working surface of the routing head can be effective Ground improves the problem on deformation that the wiring tool often occurs at high operating temperatures.

(3) in the embodiment of the utility model one, except setting first diamond in the non-working surface of the wiring tool Layer is outer, also sets second these diamond layers in the working face of the routing head, further improves the abrasion performance degree of the wiring tool.

(4) for prior art in the case where the routing head is porous material, the flatness of the wiring tool still has improvement empty Between, and the utility model further sets first these diamond layers and second these diamond layers to help to lift the flat of the wiring tool Whole degree.

(5) in wiring tool of the present utility model, the work block, the binder course, first these diamond layers, second diamond Layer and the routing head are advantageous to the progress of processing so that conductive material forms and has superior electrical conductivity.

Brief description of the drawings

Fig. 1 is the wiring tool structural representation of the utility model first embodiment.

Fig. 2 is the wiring tool operating diagram of the utility model second embodiment.

Fig. 3 is the wiring tool structural representation of other aspects of the utility model second embodiment.

Fig. 4 is the wiring tool structural representation of other aspects of the utility model second embodiment.

Fig. 5 is the wiring tool structural representation of the utility model 3rd embodiment.

Fig. 6 is the utility model first embodiment, second embodiment, the first comparative example and the second comparative example at 500 DEG C The test result of deflection.

Embodiment

It is related to detailed description of the present utility model and technology contents, now just coordinates brief description of the drawings as follows：

First embodiment

Fig. 1 is the structural representation of wiring tool 1 of the utility model first embodiment, comprising：One work block 10；One combines Layer 20；A dozen the end of a thread 30；And one be folded in the first these diamond layers 40 between the binder course 20 and the routing first 30.The routing head 30 have a working face 31 and a non-working surface 32, and first these diamond layers 40 are arranged on the non-working surface 32.

In the wiring tool 1 of the present embodiment, the material of work block 10 can include iron-nickel alloy, teleoseal, iron nickel Evanohm, iron cochrome or its any combination, instantiation include Invar or Kovar alloy, right the utility model Not limited to this, the metal or alloy of other low thermal coefficient of expansion also can be used.

The binder course 20 is arranged on the side of the work block 10.In this embodiment, the material of the binder course 20 is a weldering Material, and the solder can include at least one be selected from by silver, copper, indium, titanium, chromium, boron, silicon, iron, carbon, nickel, its alloy, and combinations thereof institute The group of composition.In the non-limiting example of the utility model one, the binder course 20 is preferably one silver-copper-indium-titanium alloy.

First these diamond layers 40 are arranged on the side of the binder course 20 away from the work block 10, and first these diamond layers 40 are straight Ground connection contacts the binder course 20.In the embodiment of the utility model one, first these diamond layers 40 are the diamond of a single Rotating fields Film.

The routing first 30 is arranged on the side of the first these diamond layers 40 away from the binder course 20 and directly contacts first brill Rock layers 40, that is, make first these diamond layers 40 be folded between the routing first 30 and the binder course 20.In the present embodiment, this dozen The end of a thread 30 is to be mixed by a diamond micro mist and formed with a carborundum (silicon carbide) micro mist, wherein, the diamond micro mist Separately there is a particle diameter being situated between 10nm to 100 μm with the silicon carbide micro-powder, preferably the diamond micro mist is with being somebody's turn to do Silicon carbide micro-powder separately has the particle diameter between 0.1 μm to 50 μm, is more preferably the diamond micro mist and the silicon carbide micro-powder Separately there is the particle diameter between 1 μm to 20 μm.

In the routing first 30, the volume shared by the diamond micro mist is more than the volume shared by the silicon carbide micro-powder.For example, On the basis of the cumulative volume of the diamond micro mist and the silicon carbide micro-powder, the diamond micro mist has one to be situated between in 70vol.% extremely 98vol.% percent by volume；Preferably the diamond micro mist has one to be situated between in 75vol.% to 90vol.% volume basis Than；More preferably the diamond micro mist has one to be situated between in 78vol.% to 85vol.% percent by volume；The most preferably diamond micro mist Percent by volume with a 80vol.%.Routing first 30 in this embodiment is not by single one layer or more diamond and ceramic institute's shape Into sandwich construction, an also non-formation membrane structure, but the list for being mixed and being formed with the silicon carbide micro-powder by the diamond micro mist One Rotating fields.

In practical application, the routing first 30 is fixed on the work block 10, and it is to be processed to one on a workbench 60 Thing 70 carries out routing engagement.In the embodiment of the utility model one, the thing 70 to be processed includes a chip and an external circuit, So it can also coordinate routing demand and include other different components, the utility model has no special limit for the thing 70 to be processed System.

Second embodiment

It refer to Fig. 2, the wiring tool 1 of the utility model second embodiment and the structure of wiring tool 1 of first embodiment Upper roughly the same, difference is also including one second these diamond layers 50 in the present embodiment.Second these diamond layers 50 are arranged on this The working face 31 of routing first 30 simultaneously directly contacts the routing first 30.

Due to the group of the work block 10 of this embodiment, the binder course 20, the routing first 30 and first these diamond layers 40 It is identical with above-mentioned first embodiment into, structure and feature, do not repeat in addition herein.

Fig. 3 and Fig. 4 is the wiring tool schematic diagram of the utility model other embodiment aspects, and the shape of the routing first 30 can be according to Actual demand is designed adjustment and is not particularly limited, as long as between the binder course 20 and the routing first 30 of the wiring tool 1 Being folded with this has the first these diamond layers 40 of single Rotating fields, and optionally in the working face 31 of the routing first 30 Second these diamond layers 50 are set to strengthen the abrasion performance degree of the working face 31.

3rd embodiment

It refer to Fig. 5.The wiring tool 1 of the utility model 3rd embodiment and the structure of wiring tool 1 of second embodiment Upper roughly the same, difference is also included among one in the present embodiment between second these diamond layers 50 and the routing first 30 Layer 80.

Specifically, the wiring tool of the utility model 3rd embodiment includes：The work block 10；It is arranged on the work block The binder course 20 of 10 side；It is arranged on first these diamond layers 40 of the side of the binder course 20 away from the work block 10；If Put routing first 30 in the side of the first these diamond layers 40 away from the binder course 20；Be arranged on the routing first 30 away from this first The intermediate layer 80 of the side of these diamond layers 40；And it is arranged on second brill of side of the intermediate layer 80 away from the routing first 30 Rock layers 50.

In the present embodiment, the thickness of the thickness in the intermediate layer 80 is situated between 0.1 μm to 20 μm, preferably 0.1 μm to 5 μm Between, and in this embodiment, the intermediate layer 80 is a titanium layer.

Because the work block 10, the binder course 20, the routing of this embodiment are first 30, first these diamond layers 40 and should Composition, structure and the feature of second these diamond layers 50 are identical with above-mentioned first embodiment and second embodiment, herein not in addition Repeat.

In wiring tool of the present utility model, led except the work block 10 formed with metal and the binder course 20 have Electrically outer, first these diamond layers 40, second these diamond layers 50 and the routing first 30 can be conductive, particularly this One these diamond layers 40 and second these diamond layers 50, for example, first these diamond layers can formed with the chemical vapour deposition technique 40 and second these diamond layers 50 during by doping make material that it can be conductive (as doping boron, nitrogen phosphate and sulfur, Lithium etc.) to reach make first these diamond layers 40 and the conductive effect of second these diamond layers 50.First these diamond layers 40, The purpose that second these diamond layers 50 and the routing first 30 are respectively provided with electric conductivity is that electro-discharge machining can be carried out, such as processes shape Into an aspirating hole, with the progress of a sharp routing processing procedure.

First comparative example

In the first comparative example, in addition to the non-working surface 32 of the routing first 30 is not provided with first these diamond layers 40, Remaining composition structure and material are identical with the wiring tool 1 of first embodiment.

Second comparative example

In the second comparative example, except the material of the routing first 30 is carborundum (SiC), and the non-working surface 32 is not formed Have outside first these diamond layers 40, remaining composition structure and material are identical with the wiring tool 1 of second embodiment.

Experimental example

Further compared using laser interferometer measurement first embodiment, second embodiment, the first comparative example and second Example is in the operation 6,000,000 times to 8,000,000 times of (450 DEG C -510 DEG C) of operating temperature, an actual high temperature deformation of the wiring tool 1 Amount, actual test result refer to Fig. 6, and its test temperature is 500 DEG C.

It is in the non-working surface 32 formation of the routing first 30 first diamond in first embodiment of the present utility model Layer 40, therefore the actual high temperature deformation amount of the wiring tool 1 is that the routing first 30 and a high temperature of first these diamond layers 40 become Between the summation of shape amount, that is, 1.00 μm to 2.50 μm, preferably between 1.00 μm to 1.80 μm, more preferably 1.5 μm or so； In second embodiment of the present utility model, it is while distinguishes in the non-working surface 32 of the routing first 30 and the working face 31 First these diamond layers 40 and second these diamond layers 50 are formed, therefore the actual high temperature deformation amount of the wiring tool 1 is this dozen The summation of the high temperature deformation amount of the end of a thread 30, first these diamond layers 40 and second these diamond layers 50, that is, at 0.05 μm extremely Between 1.00 μm, preferably between 0.05 μm to 0.25 μm, more preferably 0.15 μm or so.Referring to Fig. 6, it is new for this practicality The result that first embodiment, second embodiment, the first comparative example and the second comparative example of type are tested, wherein, this is not formed (in first comparative example, the actual high temperature deformation amount is the height of the routing first 30 to first comparative example of the first these diamond layers 40 Warm deformation amount) and the second comparative example (in second comparative example, the actual high temperature deformation amount be the routing first 30 and this second The summation of the high temperature deformation amount of these diamond layers 50) the actual high temperature deformation amount scope be 3.00 μm to 5.00 μm between, preferably Between 3.00 μm to 3.50 μm, more preferably 3.5 μm or so, as shown in fig. 6, the deflection of first embodiment is 1.5 μm, the The deflection of two embodiments is 0.15 μm, and the deflection of the first comparative example is 3.5 μm, and the deflection of the second comparative example is 3.5 μm. Therefore, first embodiment of the present utility model can effectively reduce the change of the wiring tool 1 under high temperature with second embodiment really Shape degree.

In summary, the utility model has the advantage of：

(1) it is to engage routing head and work block as binder course through solder in the prior art, the only engagement of the solder Power still has improved space, and the utility model passes through non-working surface (namely routing head and the binder course in the routing head Between) first these diamond layers are set, first these diamond layers can be strengthened between the routing head and the work block jointly with the binder course Engaging force.

(2) found via actual test, first these diamond layers set on the non-working surface of the routing head can also have Effect ground improves the problem on deformation that the wiring tool often occurs at high operating temperatures.

(3) in the embodiment of the utility model one, except setting first diamond in the non-working surface of the wiring tool Layer is outer, also sets second these diamond layers in the working face of the routing head, further strengthens the abrasion performance degree of the wiring tool.

The utility model is described in detail above, only as described above, only of the present utility model one is preferably real Example is applied, when the scope that can not limit the utility model implementation.All equivalent changes made according to present utility model application scope With modification etc., all should still belong in patent covering scope of the present utility model.

Claims

1. a kind of wiring tool, it is characterised in that include：

One work block；

One binder course, it is arranged on the side of the work block；

One first these diamond layers, it is arranged on side of the binder course away from the work block and directly contacts the binder course, first brill Rock layers have a single Rotating fields；And

A dozen the end of a thread, it is arranged on the side of first these diamond layers away from the binder course and directly contacts first these diamond layers, and should Routing head is to be mixed by a diamond micro mist and formed with a silicon carbide micro-powder.

2. wiring tool as claimed in claim 1, it is characterised in that also comprising one second these diamond layers, be arranged on the routing head Side away from first these diamond layers.

3. wiring tool as claimed in claim 2, it is characterised in that one is also included between second these diamond layers and the routing head Intermediate layer.

4. wiring tool as claimed in claim 1, it is characterised in that the material of the work block is to select free iron-nickel alloy, iron Nickel cobalt (alloy), iron-nickel-chromium, iron cochrome, and combinations thereof the group that is formed.

5. wiring tool as claimed in claim 1, it is characterised in that the material of the binder course is a solder, and the solder bag Containing at least one select free silver, copper, indium, titanium, chromium, boron, silicon, iron, carbon, nickel, its alloy, and combinations thereof the group that is formed.

6. wiring tool as claimed in claim 1, it is characterised in that in the routing head, the volume shared by the diamond micro mist is big In the volume shared by the silicon carbide micro-powder.

7. wiring tool as claimed in claim 1, it is characterised in that the diamond micro mist and the silicon carbide micro-powder are separately With the particle diameter between 0.1 μm to 50 μm.

8. wiring tool as claimed in claim 1, it is characterised in that the routing head is one by the diamond micro mist and the carborundum The single Rotating fields that micro mist is mixed to form.

9. wiring tool as claimed in claim 2, it is characterised in that first these diamond layers, second these diamond layers and this dozen The end of a thread is respectively provided with electric conductivity.