CN206680571U - A kind of magnetron sputtering coater - Google Patents
A kind of magnetron sputtering coater Download PDFInfo
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- CN206680571U CN206680571U CN201720302687.3U CN201720302687U CN206680571U CN 206680571 U CN206680571 U CN 206680571U CN 201720302687 U CN201720302687 U CN 201720302687U CN 206680571 U CN206680571 U CN 206680571U
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Abstract
The utility model is a kind of magnetron sputtering coater for revolving target cast column unbalanced closed field.Belong to technical field of vacuum plating.The installation rotation target cast column non-balance magnetically controlled sputter target in coating machine, magnetic polarity reversed arrangement adjacent and to magnet steel in the rotation target cast column non-balance magnetically controlled sputter target target to installation, forms closed magnetic field.Closed magnetic field can improve the plasma density in magnetic controlled sputtering target coating machine, be advantageous to be coated with various excellent thin-film materials.Rotation target cast column non-balance magnetically controlled sputter target is compared with plane non-balance magnetically controlled sputter target, has the advantages that simple in construction, easy for installation, cost is low, target utilization is high.
Description
Technical field [0001] the utility model belongs to vacuum coating equipment, more particularly to a kind of magnetron sputtering coater.
Background technology
At present field of vacuum coating application unbalanced closed field magnetron sputtering plating vacuum equipment using
The nonequilibrium magnetic controlled sputtering target of planar shaped.Installation kicker magnet material N (S) in the nonequilibrium magnetic controlled sputtering target of planar shaped is and strong
The connected magnetic pole piece of magnetic material is weak magnet material S (N).Adjacent non-balance magnetically controlled sputter target kicker magnet material N, S magnetic pole
Property opposed alignment, the magnetic line of force between adjacent magnetic field is cross-linked with each other, and forms closed magnetic field form.Closed magnetic field can be to workpiece
Front extends, and can extend to the periphery again.The plasma density in plated film space is improved, the integral energy of film layer particle is high, has
Beneficial to being coated with excellent thin-film material.And the target-substrate distance of plated film increases, workpiece useful load is big.But planar shaped is non-equilibrium magnetic controlled to splash
Shooting at the target, complicated, cost is high, the size of occupancy plated film locular wall is big, target utilization is low.
Rotation target tubing string shape magnetic controlled sputtering target is complete using balancing fields, the N poles of balancing fields and S poles magnet material at present
All use kicker magnet material.Before electronics is tightly constrained in target surface by the high-intensity magnetic field formed before target surface, the only argon of target surface annex
Gas is ionized, and the action space scope of plasma is small, and the target-substrate distance of plated film is closer, and workpiece useful load is small.Away from before target surface
The plasma density of side is low.And there is no magnetically confined electron motion, plated film because being crosslinked without the magnetic line of force between two targets
The plasma density in this indoor section is low.So the overall plasma density in coating chamber is low.
Also the coating machine of useful rotation target tubing string shape non-balance magnetically controlled sputter target, but adjacent non-balance magnetically controlled sputter target at present
Kicker magnet material N, S magnetic polarity are collectively aligned, and the magnetic line of force between adjacent magnetic field can not be cross-linked with each other, and do not become closure
Magnetic field, so the plasma density in coating chamber space is not high enough.
Utility model content
The purpose of this utility model is to overcome above-mentioned technical deficiency, there is provided one kind rotation non-equilibrium closed magnetic of target cast column
The magnetron sputtering coater of field.The structure for revolving the magnetic controlled sputtering target of target cast column unbalanced closed field is more non-flat than planar shaped
Weigh closed magnetic field magnetic controlled sputtering target is simple in construction, simple installation, cost is low, small, the target utilization that takes the space of coating chamber
It is high.Rotation target tubing string shape shape non-balance magnetically controlled sputter target can form multidirectional closed magnetic field in coating chamber, the rotation with balance
Target tubing string shape shape magnetic controlled sputtering target is compared, and can increase the plasma density in coating chamber, it is easier to plate out excellent film
Material.
Technical scheme is used by the utility model solves technical problem：It is non-equilibrium magnetic controlled using rotation target cast column shape
Sputtering target is arranged in closed magnetic field form in coating chamber.Concrete scheme is a kind of magnetron sputtering coater, including coating chamber,
Workpiece rotating frame and magnetic controlled sputtering target, wherein, magnetic controlled sputtering target includes target pipe, the magnetron configuration in target pipe and for assembling
The target end socket of target pipe and magnetron configuration；Target pipe can be rotated, and magnetron configuration is fixed, composition rotation target cast column magnetic
Control sputtering target；The magnetron configuration in the target pipe is non-equilibrium structure, includes high magnetic steel and is connected with high magnetic steel
Weak magnetic pole shoe；The multiple rotation target cast column non-balance magnetically controlled sputter targets of plated film indoor location, two neighboring target pipe is interior to be installed
The magnetic polarity reversed arrangement of magnetron configuration forms closed magnetic field in coating chamber.
One magnet steel is only installed in target cast column non-balance magnetically controlled sputter target is revolved, magnet steel is kicker magnet material, and strong
The magnetic pole piece of magnet material connection is weak magnet material.That is the magnet material of N poles and S poles varying strength.N is high, and S is extremely weak,
Or S is high, N is extremely weak.This set, the periphery passage to target to the front passage away from target surface and again by the magnetic field before target surface,
Non-balance magnetically controlled sputter target is so become.
The magnetic polarity for the adjacent non-equilibrium interior magnet material of rotation target cast column being transversely mounted on the periphery of coating chamber
In reversed arrangement, the circumferential magnetic line of force between two targets is circumferentially crosslinked, and can form circumferential closure magnetic field.This is non-with planar shaped
The magnetron sputtering coater in balance closure magnetic field is the same, and circumferential closure magnetic field is formed between adjacent magnetic controlled sputtering target.
The utility model can also both be transversely mounted the rotation non-equilibrium interior magnetron sputtering of target cast column on the periphery of coating chamber
Target, and the rotation non-equilibrium interior magnetic controlled sputtering target of target tubing string shape is installed in coating chamber center portion.It is between adjacent two target of internal layer and outer
The transverse magnetic line of force between adjacent two target of layer is circumferentially crosslinked, and can form outer layer circumferential closure magnetic field and internal layer circumferentially closes
Close magnetic field.The radial magnetic force line between inside and outside two layers of rotation target tubing string shape non-balance magnetically controlled sputter target is cross-linked with each other simultaneously, forms footpath
To closed magnetic field.So that multi-faceted closed magnetic field in coating chamber be present.
Closed magnetic field can control before two targets and periphery electronics to do spinning roller motion, increase electronics with gas, with
The collision probability of film layer particle, more gas ions and film layer ion are obtained, strengthen the plasma density in coating chamber.Have
Compound, improvement morphology are formed beneficial to improving film-substrate cohesion, being advantageous to raising, obtains various excellent thin-film materials.
The beneficial effects of the utility model are：It can make plated film space using target cast column non-balance magnetically controlled sputter target is revolved
Action of plasma region during than rotation target tubing string shape unbalanced magnetron sputtering expands, non-balance magnetically controlled sputter target is more in coating chamber
Orientation closed magnetic field, space plasma density is big, is advantageous to improve film quality；The rotation target tubing string shape utilized is non-equilibrium magnetic controlled
Sputtering target is simpler than the structure of plane non-balance magnetically controlled sputter target, and target utilization is high.
Brief description of the drawings
Illustrated below in conjunction with accompanying drawing with embodiment
The present invention has the magnetron sputtering coater of two kinds of rotation target cast column unbalanced closed field.
The characteristics of magnetron sputtering coater of the first rotation target cast column unbalanced closed field is to revolve target cast column
Non-balance magnetically controlled sputter target is arranged along plated film locular wall periphery and installed, and forms circumferential closure magnetic field.As shown in Figure 2.
Second rotation target cast column unbalanced closed field magnetron sputtering coater the characteristics of be, revolve target cast column
Non-balance magnetically controlled sputter target is installed both along the transversely arranged installation in coating chamber periphery in coating chamber center portion.This two layers column is non-
Unbalanced magnetron sputtering target can form inside and outside two layers of circumferential closure magnetic field, can form radial closure magnetic field again.As shown in Figure 3.
Fig. 1 revolves the structural representation of target cast column non-balance magnetically controlled sputter target.
The magnetron sputtering coater structural representation of the first rotation target cast column unbalanced closed field of Fig. 2.
The magnetron sputtering coater structural representation of second of rotation target cast column unbalanced closed field of Fig. 3.
In Fig. 1：1- revolves the target pipe of target cast column non-balance magnetically controlled sputter target, the weak magnet magnetic pole piece S in 2- target pipes
(N), in 3- targets pipe installation high magnetic steel N (S), the magnetic line of force before 4- targets, the circumferential magnetic line of force of 5- targets, the radial magnetic force of 6- targets
Line.Magnetic direction is N → S.
In Fig. 2：1- arranges the target pipe of the rotation target cast column non-balance magnetically controlled sputter target of installation, 2- along plated film locular wall periphery
Weak magnet magnetic pole piece S (N) in target pipe, the high magnetic steel N (S) of installation in 3- targets pipe, the magnetic line of force before 4- targets, the circumference of 5- targets
The magnetic line of force, the magnetic polarity opposed alignment of magnet steel in two neighboring target pipe, magnetic direction are N → S, 8- coating chambers, 7- workpiece rotating frames
Center line.
In Fig. 3：1.1- arranges the rotation target cast column non-balance magnetically controlled sputter target of installation, 2- target pipes along plated film locular wall periphery
Interior weak magnet magnetic pole piece S (N), the high magnetic steel N (S) of installation in 3- targets pipe, the magnetic line of force before 4- outer layer targets, 5- outer layer targets
The circumferential magnetic line of force, the magnetic polarity opposed alignment of magnet steel in two neighboring target pipe, magnetic direction are N → S, 1.2- coating chambers center portion peace
The target pipe of the rotation target cast column non-balance magnetically controlled sputter target of dress, the magnetic line of force before 4- internal layer targets, the circumferential magnetic of 5- internal layer targets
The line of force, the magnetic polarity of the magnet steel in two neighboring target pipe is on the contrary, magnetic direction is N → S；The target of 6- outer layers installation is installed with center portion
Target, the magnetic polarity of magnet steel is on the contrary, form radial magnetic force line, magnetic direction is N → S between inside and outside two layers of target in target pipe；7- works
Part pivoted frame center line；8- coating chambers.
Embodiment
The utility model aims to provide a kind of magnetron sputtering coater, has rotation target cast column non-balance magnetically controlled sputter
Target, and closed magnetic field is formed in coating chamber.
The magnetron sputtering coater, including coating chamber, workpiece rotating frame and magnetic controlled sputtering target, wherein：
Magnetic controlled sputtering target includes target pipe, the magnetron configuration in target pipe and the target for assembling target pipe and magnetron configuration
End socket；
Wherein, target pipe can be rotated, and magnetron configuration is fixed, composition rotation target cast column-shape magnetron sputtering target；
The magnetron configuration in target pipe is non-equilibrium structure, includes high magnetic steel and is connected with high magnetic steel weak
Magnetic pole piece；
The multiple rotation target cast column non-balance magnetically controlled sputter targets of plated film indoor location, the interior installation magnetic of two neighboring target pipe
The magnetic polarity reversed arrangement of control structure forms closed magnetic field in coating chamber.
The magnetic controlled sputtering target is circumferentially installed along coating chamber, and the magnetic polarity of installation magnetron configuration is reversely arranged in phase target pipe each other
Row, form circumferential closure magnetic field.
Further, it is also possible to while arranging installation rotation target cast column-shape magnetron sputtering target on plated film locular wall periphery, also plating
Film chamber interior also installs rotation target cast column-shape magnetron sputtering target；Inside and outside two layers circumferentially-adjacent rotation target cast column-shape magnetron sputtering
The magnetic polarity of interior installation magnetron configuration is in opposite direction, and circumferential closure magnetic field is all formed in internal layer and outer layer；In inside and outside two layers, phase
To magnetic controlled sputtering target in the magnetic polarity direction of magnetron configuration is installed also on the contrary, forming radial closure magnetic field.
A high magnetic steel can only be filled in the target pipe, the shape of high magnetic steel can be polygon or cylinder, weak magnetic pole
Boot-shaped shape can be tabular, circular tube shaped, cylindric or U-shaped.
The quantity for the nonequilibrium magnetic controlled sputtering target of rotation target cast column installed in every magnetron sputtering coater is even
It is several.
The form of the coating machine can be vertical, horizontal, unit or tinuous production.
The cross sectional shape of the coating chamber can be cylindrical shape, polygon or processing produce agaric room.
The coating chamber is also equipped with pumped vacuum systems, gas handling system, workpiece rotating frame system and auxiliary heating system.
The coating machine is furnished with magnetron sputtering power supply and workpiece variation voltage, can be dc source or alternation
Power supply.
Embodiment 1, referring to the drawings 1
Fig. 1 are mounted in the magnetic controlled sputtering target in the magnetron sputtering coater of rotation target cast column unbalanced closed field
Structural representation.Magnetic controlled sputtering target is Style Columu Talget, is made up of the magnetron configuration in target pipe and target pipe and the end socket of target.The end socket of target
After magnetron configuration in target pipe and target pipe is connected into an entirety, it is installed on coating chamber.The end socket of target, ensure target Guan Xuan
Turn, the magnetron configuration in target pipe is motionless.Column-shape magnetron sputtering target of this overall structure rotation target cast.The end socket of target ensures this
Insulate, seal between individual column-shape magnetron sputtering target and coating chamber.The material of target pipe is made by the film material plated.
Rotation target cast column-shape magnetron sputtering target is made up of the magnetron configuration in target pipe 1 and pipe by 2,3.Magnetron configuration magnet
Material makes.3 be high magnetic steel, and 2 be the weak magnetic pole shoe of connection high magnetic steel.High magnetic steel 3 is made using neodymium iron boron etc., can be upper N
Lower S, or N under upper S.One high magnetic steel 3 is only installed, cross sectional shape is polygon or cylinder in one target pipe.With high magnetic steel
The weak magnetic pole shoe 2 of connection makes of weak permeability magnetic material, and shape can be tabular, tubulose, column or U-shaped.This magnetron configuration
Form forms Nonequilibrium magnetic field structure.It is overall to be rotation target cast column non-balance magnetically controlled sputter target.Target surface front space magnetic field intensity
It is the weak S- weak S of strong N-, or the weak N of the strong S- of weak N-.Compared with rotation target tubing string shape unbalanced magnetron sputtering target, revolve target tubing string shape Nonequilibrium magnetic
Sputtering target is controlled, not only has the magnetic line of force 4 before target surface but also the front of the oriented target passage magnetic line of force 6, the side directions of also oriented target extends
The magnetic line of force 5.This makes the electronics away from target surface also to be controlled by electromagnetic field, and collision electricity can be produced with more argon gas
From obtaining more argon ion bombardment sputtering target materials, sputter rate improves.Rotation target cast column in magnetron sputtering coater
The quantity of non-balance magnetically controlled sputter target is even number.
Embodiment 2, referring to the drawings 2
The utility model is a kind of magnetron sputtering coater.It is non-equilibrium along the periphery installation rotation target cast column of coating chamber 8
Magnetic controlled sputtering target.The magnetic polarity direction phase of magnet steel used in adjacent rotation target cast column non-balance magnetically controlled sputter target inner magnet structure
Reciprocal permutation.I.e. one is that the strong S of N are weak, and another is that the strong N of S are weak, and target surface front space magnetic field is the weak S- weak S of strong N-, or the strong S- of weak N- weak
N.There is the magnetic line of force 4,6 extended forward before target, there is the circumferential magnetic line of force 5 along side between two targets again.Adjacent rotation
The magnetic line of force of target tubing string shape non-balance magnetically controlled sputter target side is cross-linked to form circumferential closure magnetic field.Workpiece is enterprising in workpiece rotating frame 7
Row rotation.The film layer atomic deposition that gets off is sputtered from the magnetic controlled sputtering target of rotation target cast column unbalanced closed field to workpiece
Upper carry out plated film.
Embodiment 3, referring to the drawings 3
The utility model is a kind of magnetron sputtering coater.It is non-equilibrium along the periphery installation rotation target cast column of coating chamber 8
Magnetic controlled sputtering target 1.1, and in the center portion installation rotation target cast column non-balance magnetically controlled sputter target 1.2 of coating chamber.Peripheral outer
Magnetic polarity direction all reversed arrangements of magnet steel in the rotation target cast column non-balance magnetically controlled sputter target adjacent with internal layer.I.e. one
It is that the strong S of N are weak, another is that the strong N of S are weak, and target surface front space magnetic field is the weak S- weak S of strong N-, or the weak N of the strong S- of weak N-.Before target
Still there is the magnetic line of force 4,6 extended forward, there is the circumferential magnetic line of force 5 along side between two targets again.The magnetic force of adjacent target side
Line is crosslinked, and forms outer layer circumferential closure magnetic field and internal layer circumferential closure magnetic field.
The magnetic polarity of magnet steel also arranges outer layer target in the opposite direction in relative target pipe with two of internal layer target.Inside, outer layer target
Between being cross-linked with each other for radial magnetic force line 6 also be present, form radial closure magnetic field.Shape in this style of magnetron sputtering coater
Into multidirectional closed magnetic field, further increase the probability of ionization by collision in coating chamber, obtain more gas ions and film layer
Metal ion so that the plasma density in coating chamber space is big, is more beneficial for obtaining excellent thin-film material.Workpiece is in workpiece
It is rotated on pivoted frame 7.The film layer atomic deposition to get off from the magnetron sputtering of rotation target cast column unbalanced closed field
Plated film is carried out on workpiece.
The utility model is the magnetron sputtering coater for revolving target cast column unbalanced closed field, and coating machine, which is configured with, to be taken out
Vacuum system, gas handling system, auxiliary heating system, workpiece rotating frame system.The section of coating chamber can be cylindrical shape, polygon,
Coating chamber processing produce agaric room type.The form of coating machine can be vertical, horizontal, unit or tinuous production.
Claims (9)
1. a kind of magnetron sputtering coater, including coating chamber, workpiece rotating frame and magnetic controlled sputtering target, it is characterised in that：
Magnetic controlled sputtering target includes target pipe, the magnetron configuration in target pipe and the target for assembling target pipe and magnetron configuration and sealed
Head；
Wherein, target pipe can be rotated, and magnetron configuration is fixed, composition rotation target cast column-shape magnetron sputtering target；
The magnetron configuration in target pipe is non-equilibrium structure, the weak magnetic pole for including high magnetic steel and being connected with high magnetic steel
Boots；
The multiple rotation target cast column non-balance magnetically controlled sputter targets of plated film indoor location, the interior installation magnetic control knot of two neighboring target pipe
The magnetic polarity reversed arrangement of structure forms closed magnetic field in coating chamber.
2. magnetron sputtering coater according to claim 1, it is characterised in that：Magnetic controlled sputtering target is circumferentially pacified along coating chamber
Dress, the magnetic polarity reversed arrangement of magnetron configuration is installed each other in phase target pipe, forms circumferential closure magnetic field.
3. magnetron sputtering coater according to claim 1, it is characterised in that：Installation rotation target is arranged on plated film locular wall periphery
While cast column-shape magnetron sputtering target, also target cast column-shape magnetron sputtering target is revolved in installation inside coating chamber；Inside and outside two layers week
It is in opposite direction that the magnetic polarity of magnetron configuration is installed into adjacent rotation target cast column-shape magnetron sputtering, all shape in internal layer and outer layer
Circumferentially closed magnetic field；In inside and outside two layers, the magnetic polarity direction of installation magnetron configuration is also on the contrary, shape in relative magnetic controlled sputtering target
Radially closed magnetic field.
4. magnetron sputtering coater according to claim 1, it is characterised in that：A high magnetic steel, Qiang Ci are only filled in target pipe
The shape of steel can be polygon or cylinder, and weak magnetic pole shoe shape can be tabular, circular tube shaped, cylindric or U-shaped.
5. magnetron sputtering coater according to claim 1, it is characterised in that installed in every magnetron sputtering coater
The quantity of the nonequilibrium magnetic controlled sputtering target of rotation target cast column be even number.
6. magnetron sputtering coater according to claim 1, it is characterised in that the cross sectional shape of coating chamber can be cylinder
Shape, polygon or processing produce agaric room.
7. magnetron sputtering coater according to claim 1, it is characterised in that the form of coating machine can be vertical, sleeping
Formula, unit or tinuous production.
8. magnetron sputtering coater according to claim 1, it is characterised in that coating chamber is also equipped with pumped vacuum systems, entered
Gas system, workpiece rotating frame system and auxiliary heating system.
9. magnetron sputtering coater according to claim 1, it is characterised in that magnetron sputtering power supply that coating machine is matched somebody with somebody and
Workpiece bias power supply makes dc source or alternating source.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2017200785059 | 2017-01-22 | ||
| CN201720078505 | 2017-01-22 |
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| Publication Number | Publication Date |
|---|---|
| CN206680571U true CN206680571U (en) | 2017-11-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201720302687.3U Active CN206680571U (en) | 2017-01-22 | 2017-03-27 | A kind of magnetron sputtering coater |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112210752A (en) * | 2019-07-12 | 2021-01-12 | 王福贞 | Magnetron sputtering technology for depositing DLC film and film coating machine |
| CN113774351A (en) * | 2021-11-09 | 2021-12-10 | 武汉中维创发工业研究院有限公司 | Magnetron sputtering coating chamber, coating machine and coating method |
-
2017
- 2017-03-27 CN CN201720302687.3U patent/CN206680571U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112210752A (en) * | 2019-07-12 | 2021-01-12 | 王福贞 | Magnetron sputtering technology for depositing DLC film and film coating machine |
| CN113774351A (en) * | 2021-11-09 | 2021-12-10 | 武汉中维创发工业研究院有限公司 | Magnetron sputtering coating chamber, coating machine and coating method |
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