CN206557704U - Power supply unit radiator structure - Google Patents
Power supply unit radiator structure Download PDFInfo
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- CN206557704U CN206557704U CN201720104899.0U CN201720104899U CN206557704U CN 206557704 U CN206557704 U CN 206557704U CN 201720104899 U CN201720104899 U CN 201720104899U CN 206557704 U CN206557704 U CN 206557704U
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- Prior art keywords
- heat sink
- shell
- supply unit
- power supply
- power
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model proposes a kind of power supply unit radiator structure, the power supply unit has a shell, and one is contained in circuit module in the shell, and the power supply unit radiator structure includes：An at least heat sink, the heat sink is to be embedded to the inside that injection molding method is arranged at the shell, and the shell forms material layer and outer material layer in one respectively in the medial surface and lateral surface of heat sink；There is a (PCC) power, the position of the interior material layer correspondence (PCC) power of shell sets a notch part so that power chip is contacted with heat sink by notch part on the circuit substrate.The utility model can promote the radiating efficiency of power supply unit by above-mentioned technological means, and simplify its assembly program, and reaching reduces the purpose of cost.
Description
Technical field
The utility model is related to a kind of power supply unit radiator structure, more particularly to one kind is used in external power source supply
The power supply unit radiator structure of device.
Background technology
Power supply is used as using the power supply unit of circumscribed more than existing notebook computer or mobile electronic device
Source, power supply unit can produce Electromagnetic Interference when in use and circuit unit can send hyperpyrexia, therefore power supply unit
Anti-electromagnetic wave interference is must take into consideration during design, and the problem of radiating.
As shown in Figures 1 and 2, it is a kind of existing external power source supply, existing external power source supply
Construction generally includes a housing 1, and housing 1 is internally formed a receiving space to house a circuit module 2, the outside of circuit module 2
Further one insulating trip 3 of cladding, a metal division board 4 is coated then at the outside of insulating trip 3.
As shown in Fig. 2 after power supply unit is completed, metal division board 4 is coated on the outside of circuit module 2, and
Solid 5 is filled between the lateral surface of metal division board 4 and the medial surface of housing 1, makes the lateral surface and shell of metal division board 4
The medial surface of body 1 is attached onto.The temperature that circuit unit on circuit module 2 is produced can be transmitted to metal isolation indirectly
Plate 4, is then delivered to housing 1 from metal division board 4 by solid 5 again, then is rejected heat to via housing 1 in outside air, by
This causes circuit module 2 to cool.In addition, one end of metal division board 4 is provided with a junction 6, pass through the junction 6 and circuit
The circuit substrate connection of module 2, is thus electrically connected with the ground path and metal division board 4 of circuit module 2, so that
The effect of metal division board 4 with the Electromagnetic Interference for shielding and eliminating circuit module 2.
Existing power supply unit uses above-mentioned radiator structure, must wherein be adopted between circuit module 2 and metal division board 4
Isolated with an insulating trip 3, hence in so that add the barrier of a piece of insulating trip 3 more in the temperature conduction path of circuit module 2,
Therefore the radiating efficiency of power supply unit is reduced.In addition, the assembly program of existing power supply unit, it is necessary in order by electricity
Outside coated insulation piece 3, the metal division board 4 of road module 2, then then at the coated solid 5 of lateral surface of metal division board 4
Afterwards, then by circuit module 2 it is assembled in together with insulating trip 3, metal division board 4 inside housing 1.Above-mentioned assembly program is quite complicated,
And a large amount of man-hours can be also expended in the coated solid in the outside of metal division board 4, therefore cause that assembly program is complicated, efficiency is not good
Shortcoming.
Due to above reason, cause existing power supply supply radiating effect not good, the increased shortcoming of assembly cost, therefore, such as
What is by the improvement of structure design, to overcome above-mentioned defect, it has also become one of this cause important topic to be solved.
The content of the invention
The utility model main purpose is that the power supply unit radiating efficiency for solving existing circumscribed is not good, and is assembled into
This high shortcoming.
The utility model embodiment provides a kind of power supply unit radiator structure, and the power supply unit has a shell,
And one be contained in circuit module in the shell, wherein the circuit module has a circuit substrate, it is characterised in that institute
Stating power supply unit radiator structure includes：An at least heat sink, the heat sink be embedded to injection molding method be arranged at it is described
The inside of shell, the heat sink has an at least flat part and is connected to the both sides plate portion of the side of flat part two, described
At least one of side plate described in flat part and two is adjacent to the circuit substrate and parallel with the circuit substrate；It is described
Shell forms material layer in one in the one side of the heat sink towards the circuit module, and in the heat sink relative to institute
State one side one outer material layer of formation of circuit module, the heat sink clamping in the outer material layer and the interior material layer it
Between, and the shell the interior material layer be located between heat sink and the circuit module；Have one on the circuit substrate
(PCC) power, and the position of the interior material layer correspondence (PCC) power of the shell is provided with a notch part so that it is described
Heat sink exposes from the notch part, and the (PCC) power can directly or indirectly through the notch part and it is described dissipate
Hot plate is contacted so that the temperature conduction that the (PCC) power is produced to the heat sink.
The preferred embodiment of the utility model one, wherein the (PCC) power be a power chip, the (PCC) power and
A heat-conductive assembly is provided between the surface of the heat sink at the notch part, the heat-conductive assembly is heat-conducting pad
Or heat-conducting glue.
The preferred embodiment of the utility model one, wherein the circuit substrate is provided with a contact assembly, the contact assembly
One end and the circuit substrate a ground path be electrically connected with, the other end of the contact assembly and the heat sink are electrical
Connection.
The preferred embodiment of the utility model one, wherein the contact assembly is a metallic rod body, and the heat sink pair
Answer the position of the contact assembly that one plug socket is set, the plug socket is electrically connected at the heat sink, and the plug socket
The position of the top surface correspondence contact assembly one jack, and multiple joint-cuttings around the jack are set, it is described to insert
The diametric fit of the diameter in hole and the contact assembly, and the contact assembly is inserted into the jack so that it is described
Contact assembly can be electrically connected with by the plug socket and the heat sink.
The preferred embodiment of the utility model one, wherein the contact assembly may be selected from following conductive component wherein it
One：Electroconductive elastic sheet, power spring, wire, conductive sponge.
The preferred embodiment of the utility model one, wherein the shell includes a upper shell and a lower house, the radiating
Plate is arranged separately in the lower house.
The preferred embodiment of the utility model one, wherein the shell includes a upper shell and a lower house, wherein described
Heat sink described in one is set respectively inside upper shell and the lower house, and the upper shell and the lower house are combined
Afterwards, heat sink described in two in the upper shell and the lower house, which contacts with each other, reaches electric connection.
The utility model has the advantage that the radiating efficiency for promoting power supply unit, and its simplified assembly program,
Reaching reduces the purpose of cost.
Feature of the present utility model and technology contents are further understood that to enable, are referred to below in connection with the utility model
Detailed description and accompanying drawing, but appended accompanying drawing only provide with reference to and explanation use, not for being any limitation as to the utility model.
Brief description of the drawings
Fig. 1 is a kind of three-dimensional exploded view of existing power supply unit radiator structure.
Fig. 2 is the combination section of existing power supply unit radiator structure.
Fig. 3 is the three-dimensional exploded view of the utility model power supply unit radiator structure.
Fig. 4 is the decomposing section of the utility model power supply unit radiator structure.
Fig. 4 A are the decomposing section of the utility model power supply unit radiator structure.
Fig. 5 is the combination section of the utility model power supply unit radiator structure.
Fig. 6 is the combination section of the utility model power supply unit radiator structure second embodiment.
Fig. 7 is the combination section of the utility model power supply unit radiator structure 3rd embodiment.
Fig. 8 is the combination section of the utility model power supply unit radiator structure fourth embodiment.
Embodiment
(first embodiment)
As shown in Figures 3 to 5, it is one using the power supply supply made by power supply unit radiator structure of the present utility model
The construction of device.The power supply unit includes a shell 10, and a circuit module 20, and the circuit module 20 is placed in shell
10 inside, and a heat sink 30, the heat sink 30 inlay the inside for being embedded in shell 10, and are covered in the outer of circuit module 20
Side.
Wherein, the shell 10 is to use plastic material and the housing made with injection molding method, the inside of shell 10
An accommodating chamber is formed, to accommodate the circuit module 20.Circuit module 20 has a circuit substrate 21, and on circuit substrate 21
With multiple circuit units 25, multiple circuit units 25 constitute the circuits such as the rectification of power supply unit, transformation.It is described to dissipate
Hot plate 30 is made (such as using the material with good heat conductive and electric conductivity：Metallic plate), and using embedment ejection formation
(Insert molding) mode, the edge of heat sink 30 is embedded in the shell 10 of power supply unit, each 30 points of heat sink
Not Ju You a flat part 31, and be connected to the side plate 32 of the both sides of the edge of flat part 31, and the flat part 31 and both sides
At least one of plate portion 32 is adjacent to the circuit substrate 21 and parallel with circuit substrate 21, hence in so that circuit module 20
The temperature of generation can be transmitted to heat sink 30, to promote the heat dissipation of circuit module 20, and can be used to screened circuit mould
The Electromagnetic Interference that block 20 is produced.
In the first embodiment of power supply unit radiator structure of the present utility model, shell 10 is by a upper shell 11 and once
Housing 12 is combined, after the completion of upper shell 11 is combined with lower house 12, and it is described to accommodate that it is internally formed a receiving space
Circuit module 20.Plastic material is respectively adopted and by injection molding method system in the upper shell 11 and lower house 12 of the shell 10
Into while the heat sink 30 is then in upper shell 11 and during 12 ejection formation of lower house, being placed in mould, by burying
Enter ejection formation (Insert molding) technique and upper shell 11 is combined together with lower house 12, therefore as shown in Figure 4 A,
From the schematic partial sectional view of shell 10, shell 10 forms material layer in one in the one side of heat sink 30 towards circuit module 20
102, and in one side formation one outer material layer 101 of the heat sink 30 relative to circuit module 20, hence in so that shell 10 is disconnected
Face forms the sandwich by the clamping of heat sink 30 between outer material layer 101 and interior material layer 102.
As shown in Figures 4 and 5, after the upper shell 11 of shell 10 is combined with lower house 12, heat sink 30 is towards circuit mould
The one side of block 20 is covered by interior material layer 102, hence in so that heat sink 30 can be by the He of interior material layer 102 of shell 10
The formation insulation of circuit module 20, sets insulating trip to be isolated without extra.
As shown in Figures 4 and 5, in the utility model first embodiment, among the upper shell 11 and lower house 12 of shell 10
Respectively set one described in heat sink 30, and two heat sinks 30 flat part 31 respectively be located at upper shell 11 upper side and lower casing
Among the bottom side of body 12, and the side plate 32 of two heat sinks 30 is then located at the two sides of upper shell 11 and lower house 12 respectively.
Therefore as shown in figure 5, after upper shell 11 and lower house 12 are relatively combined, circuit module 20 is wrapped by
In upper shell 11 and the medial surface of lower house 12, while the flat part 31 of two heat sinks 30 is located at the upside of circuit module 20 respectively
Face and downside, and two heat sinks 30 side plate 32 respectively be located at circuit module 20 two sides, therefore formed fully wrap
It is overlying on the state of 20 4 sides of circuit module.
As shown in figure 5, the temperature produced by the circuit module 20, can conduct via the interior material layer 102 of shell 10
To after heat sink 30, then via heat sink 30 by the temperature conduction of circuit module 20 to outer material layer 101, then again via outer
Temperature is dispersed into air by the outer surface of shell 10.Because heat sink 30 is the circuit group on heat conductor, therefore circuit module 20
Temperature produced by part 25 can be diffused into whole heat sink 30 via conduction of heat, therefore, it is possible to increase circuit module 20
Area of dissipation, to improve the radiating efficiency of circuit module 20.
In addition, as shown in Fig. 3, Fig. 4 A and Fig. 5, the circuit substrate 21 of the circuit module 20 is provided with (PCC) power 23.
In general, the circuit module of power supply unit is in running, (PCC) power 23 can produce most heats, hence in so that circuit
The temperature of module 20 is concentrated at (PCC) power 23.Therefore, the utility model is to promote the radiating efficiency of circuit module 20,
One notch part especially is set in the position of the (PCC) power 23 corresponded in the interior material layer 102 of shell 10 on circuit substrate 21
13 so that the heat sink 30 at the position of notch part 13 can expose from notch part 13 and not covered by lower house 12, and work(
Rate component 23 can in the way of directly contact or mediate contact and heat sink 30 in notch part 13 surface contact, with
The temperature that (PCC) power 23 is produced is not transmitted to heat sink 30 by the obstruction of shell 10, thus promotes circuit mould
The radiating efficiency of block 20.In the embodiment, (PCC) power 23 is contacted with heat sink 30 via a heat-conductive assembly 24.The heat conduction group
Part 24 can be a heat-conducting pad, or be a heat-conducting glue.The heat-conductive assembly 24 has the good capacity of heat transmission, therefore, it is possible to
So that the temperature of (PCC) power 23 is promptly transmitted to heat sink 30.
Heat sink 30 of the present utility model is in addition to heat sinking function, while with shielding and eliminating circuit module 20
Effect of Electromagnetic Interference.As depicted in figs. 3 and 5, also with ground path (not shown) on the circuit substrate 21, and in
Circuit substrate 21 is provided with a contact assembly 22, one end of the contact assembly 22 and the ground path electricity of the circuit substrate 21
Property connection, the other end and the heat sink 30 of the contact assembly 22 are electrically connected with.By the contact assembly 22 and described
Heat sink 30 is connected so that the ground path and heat sink 30 of circuit module 20 are connected, so that the ground connection of circuit substrate 21
Circuit and heat sink 30 are electrically connected with.
In the embodiment, the contact assembly 22 is the metallic rod body of a round bar shape, and the correspondence of the heat sink 30 is described
The position of contact assembly 22 sets a plug socket 33.In the embodiment, the external form outline of plug socket 33 is square, plug socket 33
Top surface center is provided with a jack 331, and sets multiple tracks grooving 332 in the surrounding of jack 331 so that the jack 331 of plug socket 33
The material of surrounding has the space of flexural deformation, to enable the diameter of jack 331 flexibly to change.Plug socket 33 is welded in
On heat sink 30, and it is exposed to interior material layer 102, and center and the contact assembly of circuit module 20 of the jack 331
22 mutually correspondences, and the external diameter mutual cooperation of the diameter and contact assembly 22 of jack 331, therefore circuit module 20 is assembled in shell
During 10 inside, contact assembly 22 can be directed at the jack 331 of plug socket 33, and cause contact assembly 22 and the phase mutual connection of jack 331
Touch so that the ground path and heat sink 30 of circuit substrate 21 reach electric connection.
It is public that the construction of contact assembly 22 in this mandatory declaration, the circuit module 20 is not limited to above-described embodiment institute
Open, it is any to reach so that the ground path and heat sink 30 of circuit module 20 reach the technological means of electric connection, all
It can operate with the utility model.For example, embodiment illustrated in fig. 8, wherein contact assembly 22a are a shell fragment, in addition, the contact
Component 22a can also further replace with other kinds of conductive component, for example：Spring, wire, conductive sponge etc., can be answered
It is used as circuit substrate 21 and heat sink 30 is electrically connected with the contact assembly used.
As shown in figure 5, in first embodiment, the side of the both sides plate portion 32 of the heat sink 30 in upper shell 11 and lower house 12
Edge is respectively partially exposed to the edge of upper shell 11 and 12 liang of sides of lower house, and works as upper shell 11 and lower house 12 relatively
When combining, upper shell 11 and the edge of the both sides plate portion 32 of the heat sink 30 in lower house 12 can mutually be overlapped on one
Rise, hence in so that the heat sink 30 in upper and lower casing 11,12 can be electrically connected with each other, therefore formation one is completely coated on electricity
The electric conductor in the outside of road module 20, and it is capable of the electromagnetic wave of effectively screened circuit module 20.
The utility model and existing power supply unit radiator structure are compared, its be mainly characterized by the heat sink 30 because
Directly to be embedded to the inside that injection molding method is arranged at shell 10, hence in so that heat sink 30 and shell 10 are integrated into same group
Part, and can effectively reduce the quantity of part.And it is outer along with being separated between the medial surface and circuit module 20 of heat sink 30
The interior material layer 102 of shell 10, hence in so that self-assembling formation state of insulation between heat sink 30 and circuit module 20, without again
It is extra that insulating trip is set.Hence in so that during power supply unit radiator structure assembling of the present utility model, it is only necessary to merely will be outer
The upper shell 11 of shell 10 is combined in the outside of circuit module 20 with lower house 12, just can complete the assembling of power supply unit.And this
The assembly program of utility model and existing power supply unit assembly program are compared, and can be omitted insulating trip and heat sink cladding
Program on the outside of circuit module, and be omitted on the outside of heat sink and be coated with solid and then again stick in heat sink outer
The program of shell medial surface, hence in so that assembly program of the present utility model significantly simplifies, and reaches the purpose of reduction manufacturing cost.
In addition, from the point of view of with regard to radiating efficiency, heat sink 30 of the present utility model directly passes through the He of interior material layer 102 of shell 10
Circuit module 20 insulate so that be not required to additionally set insulating trip between heat sink 30 and circuit module 20, and heat sink 30 and outer
It is not required to bind with solid again between shell 10, hence in so that the heat dissipation path of circuit module 20 reduces insulating trip and solid
Obstruction, and being capable of improving heat radiation efficiency.
(second embodiment)
As shown in fig. 6, among the utility model second embodiment, shell 10 is same by 12 groups of upper shell 11 and lower house
Into, but second embodiment only sets heat sink 30 in the inside of lower house 12, upper shell 11 is simultaneously not provided with heat sink 30.The implementation
The flat part 31 of heat sink 30 is placed in the bottom side of lower house 12 in example, and both sides plate portion 3 is respectively positioned at lower house 12
Two sides.Therefore when circuit module 20 is assembled in 10 inside of shell, the bottom surface of circuit substrate 21 is adjacent to the flat of heat sink 30
Plate portion 31, and flat part 31 is parallel with the bottom surface of circuit substrate 21.
In the embodiment, the flat part 31 of heat sink 30 and the clamping of both sides plate portion 32 are in the outer material layer 101 of shell 10
Between interior material layer 102, and the interior material layer 102 of shell 10 is set in the position of the (PCC) power 23 corresponding to circuit module 20
It is equipped with a notch part 12 so that heat sink 30 exposes from notch part 13, and (PCC) power 23 can pass through the He of heat-conductive assembly 24
Positioned at the surface contact of the heat sink 30 of the part of notch part 13, or heat sink 30 is directly contacted, so that (PCC) power
23 temperature can be transmitted to heat sink 30.
(3rd embodiment)
As shown in fig. 7, in the utility model 3rd embodiment, shell 10 is in horizontal channel section, and the side of shell 10
Face has an opening, and one lid 14 of setting at the opening of shell.After shell 10 and lid 14 are combined, a bag can be formed
Housing is covered, circuit module 20 is contained in the inside of shell 10 and lid 14.In the embodiment, heat sink 30 is projected into being embedded to
Type mode inlays the inside for being embedded in shell 10, and the flat part 31 of heat sink 30 is coated on the lateral location of shell 10, and radiates
The both sides plate portion 32 of plate 30 is then coated on the upside and downside of shell 10, hence in so that the formation flat part 31 of heat sink 30 is covered
In the one side of circuit module 20, while both sides plate portion 32 is then covered in the upside of circuit module 20 and the state of downside.
In the embodiment, heat sink 30 is equally coated on wherein by the outer material layer 101 and interior material layer 102 of shell 10,
And the interior material layer 102 of shell 10 corresponds to one notch part 13 of position setting of the (PCC) power 23 of circuit module 20, for radiating
Plate 30 exposes from notch part 13, and (PCC) power 23 is contacted by heat-conductive assembly 24 and heat sink 30.
(possibility effect of embodiment)
In summary, heat sink 30 is integrated in shell 10 by the utility model due to being embedded to injection molding method using plastics
Structure in, therefore heat sink 30 and circuit module 20 are isolated without the use of insulating trip, therefore reach enhancement power supply unit
Effect of radiating efficiency, while the assembly program of the circuit module 20 of power supply unit and shell 10 is significantly simplified, is eliminated
The program of spacer, heat sink and coated solid is assembled, therefore assembling man-hour has been greatly reduced, reaching reduces the mesh of cost
's.
It the foregoing is only preferable possible embodiments of the present utility model, non-therefore limitation patent model of the present utility model
Enclose, therefore the equivalence techniques change that all utilization the utility model specifications and accompanying drawing content are done, it is both contained in of the present utility model
In protection domain.
Claims (7)
1. a kind of power supply unit radiator structure, the power supply unit has a shell, and one is contained in the shell
Circuit module, wherein the circuit module have a circuit substrate, it is characterised in that the power supply unit radiator structure bag
Include：
An at least heat sink, the heat sink is to be embedded to the inside that injection molding method is arranged at the shell, the heat sink
With an at least flat part and it is connected to the both sides plate portion of the side of flat part two, side plate described in the flat part and two
At least one is adjacent to the circuit substrate and parallel with the circuit substrate；
The shell forms material layer in one in the one side of the heat sink towards the circuit module, and in the heat sink
Relative to the circuit module one side formation one outer material layer, the heat sink clamping in the outer material layer with it is described interior
Between material layer, and the interior material layer of the shell is located between heat sink and the circuit module；
There is a (PCC) power, and the position of the interior material layer correspondence (PCC) power of the shell on the circuit substrate
Install a notch part so that the heat sink exposes from the notch part, and the (PCC) power can be direct or indirect
Ground is contacted by the notch part and the heat sink so that the temperature conduction that the (PCC) power is produced to the heat sink.
2. power supply unit radiator structure as claimed in claim 1, it is characterised in that wherein described (PCC) power is a power
A heat-conductive assembly, institute are provided between the surface of chip, the (PCC) power and the heat sink at the notch part
Heat-conductive assembly is stated for heat-conducting pad or heat-conducting glue.
3. power supply unit radiator structure as claimed in claim 2, it is characterised in that wherein described circuit substrate connects provided with one
Touch component, a ground path of one end of the contact assembly and the circuit substrate is electrically connected with, the contact assembly it is another
One end and the heat sink are electrically connected with.
4. power supply unit radiator structure as claimed in claim 3, it is characterised in that wherein described contact assembly is a metal
The body of rod, and the position of the heat sink correspondence contact assembly sets a plug socket, the plug socket is electrically connected at described
Heat sink, and the position of the top surface correspondence contact assembly of the plug socket sets a jack, and it is multiple positioned at described slotting
The diametric fit of joint-cutting around hole, the diameter of the jack and the contact assembly, and the contact assembly be inserted into
In the jack so that the contact assembly can be electrically connected with by the plug socket and the heat sink.
5. power supply unit radiator structure as claimed in claim 3, it is characterised in that wherein described contact assembly may be selected from down
One of row conductive component：Electroconductive elastic sheet, power spring, wire, conductive sponge.
6. the power supply unit radiator structure as described in claim 1 to 5 any of which, it is characterised in that wherein described shell
Including a upper shell and a lower house, the heat sink is arranged separately in the lower house.
7. the power supply unit radiator structure as described in claim 1 to 5 any of which, it is characterised in that wherein described shell
Including a upper shell and a lower house, wherein heat sink described in one is set respectively inside the upper shell and the lower house, and
After the upper shell and the lower house are combined, in the upper shell and the lower house two described in heat sink it is mutual
Electric connection is reached in contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720104899.0U CN206557704U (en) | 2017-01-25 | 2017-01-25 | Power supply unit radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720104899.0U CN206557704U (en) | 2017-01-25 | 2017-01-25 | Power supply unit radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206557704U true CN206557704U (en) | 2017-10-13 |
Family
ID=60010138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720104899.0U Active CN206557704U (en) | 2017-01-25 | 2017-01-25 | Power supply unit radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206557704U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108345368A (en) * | 2017-01-25 | 2018-07-31 | 联昌电子企业股份有限公司 | Power supply unit radiator structure and its heat dissipating method |
-
2017
- 2017-01-25 CN CN201720104899.0U patent/CN206557704U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108345368A (en) * | 2017-01-25 | 2018-07-31 | 联昌电子企业股份有限公司 | Power supply unit radiator structure and its heat dissipating method |
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