CN206524315U - A kind of heat insulating package structure of gas sensor - Google Patents
A kind of heat insulating package structure of gas sensor Download PDFInfo
- Publication number
- CN206524315U CN206524315U CN201720285184.XU CN201720285184U CN206524315U CN 206524315 U CN206524315 U CN 206524315U CN 201720285184 U CN201720285184 U CN 201720285184U CN 206524315 U CN206524315 U CN 206524315U
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- China
- Prior art keywords
- encapsulating housing
- shell
- heat insulating
- flexible base
- package structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
The utility model is related to a kind of heat insulating package structure of gas sensor, sensor has sensor chip, encapsulating structure includes shell, it is fixedly installed on the encapsulating housing with inner chamber in shell, the connecting wire being connected for the flexible base board of install sensor chip and one end with flexible base board, the inner chamber of encapsulating housing is in communication with the outside by one end of encapsulating housing and one end of shell, the other end sealing of encapsulating housing, flexible base board is fixedly installed with encapsulating housing and flexible base board is located in encapsulating housing so that sensor chip is suspended in encapsulating housing, the other end of connecting wire sequentially passes through the sealed end of encapsulating housing, the other end of shell extends outside shell.The utility model installs sensor chip on flexible substrates and sensor chip is suspended in encapsulating housing, and sensor chip is not contacted directly with encapsulating housing, and fabulous solves the problem of heat scatters and disappears, and sensor preheating time is less than 5min.
Description
Technical field
The utility model belongs to the encapsulation technology field of sensor, and in particular to a kind of heat insulating package knot of gas sensor
Structure.
Background technology
Traditional gas sensor encapsulation technology mainly includes TO encapsulation, DIP ceramic packages etc., but above-mentioned encapsulation
The subject matter that structure is present is that substrate is the higher metal and ceramic material of thermal conductivity, and the base material of high thermal conductivity causes
For maintaining the heat of chip operation to be scattered and disappeared by substrate and various contact components, biosensor power consumption is caused to increase（Account for
70%）, and it is longer to be heated to the stabilization time of operating temperature needs（More than 15min）, the practical application to gas sensor brings
Problems.Therefore, the effect that technology is thermally isolated for hydrogen gas sensor performance indications is extremely notable.
And the existing technology that is thermally isolated is mainly by selecting heat-insulating material or part being thermally isolated to realize, for example,
Sensor chip is suspended on pedestal top by many leads, and made between chip and encapsulation base by air insulated, but
It is reliable in structure that this encapsulating structure needs substantial amounts of lead just to can guarantee that, the increase of one side sensor bulk, and the opposing party
For face, substantial amounts of heat is scattered and disappeared by lead.In practice, this heat insulating construction that effect is thermally isolated is not notable.
Therefore, existing gas sensor can not obtain preferable effect of heat insulation by the hanging mode of lead, and
More complicated sensor construction is brought, causes complicated, cost increases.
The content of the invention
Technical problem to be solved in the utility model is to overcome the deficiencies in the prior art there is provided one kind is simple in construction, is had
There is the heat insulating package structure of the gas sensor of preferable effect of heat insulation.
To solve above technical problem, the utility model is adopted the following technical scheme that：
A kind of heat insulating package structure of gas sensor, the gas sensor has sensor chip, the adiabatic envelope
Assembling structure includes the shell with inner chamber and the encapsulating housing with inner chamber being fixedly installed in the shell, the encapsulating shell
The inner chamber of body is in communication with the outside by one end of the encapsulating housing and one end of the shell, the other end of the encapsulating housing
Sealing, the heat insulating package structure also includes the flexible base board and one end and the flexible base for being used to install the sensor chip
The connecting wire of plate connection, the flexible base board is fixedly installed with the encapsulating housing and the flexible base board is located at the encapsulation
The sensor chip is suspended in the encapsulating housing in housing, the other end of the connecting wire sequentially passes through described
The sealed end of encapsulating housing, the other end of the shell extend outside the shell.
In order to further solve the lost problem of heat, the material of the encapsulating housing is high polymer material, the shell
Material also selects high polymer material.Again for the use condition of suitable gas sensor, high polymer material need to be selected being capable of corrosion resistant
The performances such as corrosion, oxidative resistance, acid and alkali-resistance, resistance to mineral oil, -40 DEG C of temperature ~ 150 DEG C can be used, it is preferable that high polymer material can
Select polyphenylene sulfide.
Preferably, the flexible base board is PI flexible base boards.
Preferably, have in the flexible base board on wire, the sensor chip and connect leaded and described sensor
Chip is electrically connected by the wire in the lead and the flexible base board, the wire in the flexible base board also with the company
Connect wire electrical connection.
Preferably, the interior intracavitary of the shell is provided with for preventing the encapsulating housing from departing from the spacing of the shell
Portion.
Preferably, between the sealed end of the other end of the shell and the encapsulating housing, the madial wall of the shell
Fluid sealant is separately filled between the lateral wall of encapsulating housing.
Preferably, the shell is the cylindrical shell that two ends are in communication with the outside respectively, is made up of two semicircular shells,
The position that the lateral surface of two semicircular shells is relative opens up annular groove respectively, and two semicircular shells are by setting
The elastic ring in the annular groove is put to be relatively fixed.
Preferably, the encapsulating housing is the cylindrical encapsulation housing that one end is in communication with the outside, by two semicircular shells
Constitute, two sidepieces of the flexible base board are located between two semicircular shells respectively.
Due to the implementation of above-mentioned technical proposal, the utility model has the following advantages that compared with prior art：
Heat insulating package structure of the present utility model installs sensor chip on flexible substrates and sensor chip is suspended
In the interior intracavitary of encapsulating housing, sensor chip is not contacted directly with encapsulating housing, and fabulous solves the problem of heat scatters and disappears,
Reliability is significantly reduced in structure and simple in construction simultaneously, hence it is evident that reduce heating power consumption level, sensor preheating time
Less than 5min.
Heat insulating package structure of the present utility model by sensor chip install on flexible substrates, connecting wire again with flexibility
Substrate connection so that the utility model has a fabulous insulation effect, and solve the electric of sensor chip and connecting wire
Connectivity problem, it is ensured that sensor stabilization works.
Brief description of the drawings
Fig. 1 is the heat insulating package structural representation of the utility model gas sensor；
Fig. 2 is the heat insulating package structure schematic cross-sectional view of the utility model gas sensor；
Fig. 3 is enlarged drawing at A in Fig. 2；
In figure：1st, shell；2nd, encapsulating housing；3rd, sensor chip；4th, flexible base board；5th, connecting wire；6th, groove；7th, bullet
Property circle；8th, limiting section.
Embodiment
The utility model is further described below by specific embodiment.
As shown in Fig. 1 ~ 3, a kind of heat insulating package structure of gas sensor, gas sensor has sensor chip 3, should
Heat insulating package structure includes the shell 1 with inner chamber and the encapsulating housing 2 with inner chamber being fixedly installed in shell 1, encapsulation
The inner chamber of housing 2 is in communication with the outside by one end of encapsulating housing 2 and one end of shell 1, the other end sealing of encapsulating housing 2,
The heat insulating package structure also includes the connection being connected for the flexible base board 4 of install sensor chip 3 and one end with flexible base board 4
With wire in wire 5, flexible base board 4, leaded and sensor chip 3 is connected on sensor chip 3 and passes through lead and flexibility
Wire in wire electrical connection in substrate 4, flexible base board 4 is also electrically connected with connecting wire 5, flexible base board 4 and encapsulation
Housing 2 be fixedly installed and flexible base board 4 be located at encapsulating housing 2 in cause sensor chip 3 is suspended in encapsulating housing 2, connect
The other end of wire 5 sequentially passes through the sealed end of encapsulating housing 2, the other end of shell 1 and extended outside shell 1.
Scattered and disappeared problem to further solve heat, the material of encapsulating housing 2 and shell 1 selects high polymer material, such as
The two selects polyphenylene sulfide.
In this example, flexible base board 4 selects PI flexible base boards.
To prevent encapsulating housing 2 from departing from shell 1, the interior intracavitary of shell 1 is provided with limiting section 8, the side of limiting section 8 with
The end face of the one end of encapsulating housing 2 offsets.
Between the sealed end of the other end of shell 1 and encapsulating housing 2, shell 1 and madial wall and encapsulating housing 2 it is outer
Fluid sealant is separately filled between the wall of side, the fluid sealant plays sealing function and fixing shell 1, encapsulating housing 2 and connecting wire 5
Effect.
Specifically, shell 1 is the cylindrical shell that two ends are in communication with the outside respectively, is made up of two semicircular shells, two
The position that the lateral surface of individual semicircular shell is relative opens up annular groove 6 respectively, and two semicircular shells are by being arranged on annular
Elastic ring 7 in groove 6 is relatively fixed；Encapsulating housing 2 is in communication with the outside for one end, the sealed cylindrical encapsulation shell of the other end
Body, is made up of two semicircular shells, and two sidepieces of flexible base board 4 are located between two semicircular shells and pass through two respectively
Semicircular shell is fixedly clamped, and the sealed end of the other end through the encapsulating housing 2 of connecting wire 5 extends outside encapsulating housing 2.
Cylindrical shell and cylindrical encapsulation housing are coaxially disposed.
Heat insulating package structure of the present utility model installs sensor chip on flexible substrates, and flexible base board is fixed on again
In the encapsulating housing of high polymer material and sensor chip is suspended in encapsulating housing, it is fabulous solve heat and scatter and disappear ask
Topic, and high polymer material low thermal conductivity, the heat insulating package structure also reduce the sensor thermally equilibrated time.On the other hand, pass
Sensor chip is electrically connected by the wire in lead and flexible base board, and the wire in flexible base board is also electric with connecting wire
Connection, the sensor chip is also electrically connected with connecting wire, and this connected mode has fabulous insulation effect, and heat will not
Scattered and disappeared by lead, and this connected mode also solves the electrical connection problem of sensor chip and connecting wire, it can be ensured that
Sensor stabilization works.
The heat insulating package method of gas sensor of the present utility model, comprises the following steps：
（1）Sensor chip 3 is arranged on into inside has on the flexible base board 4 for covering copper conductor so that sensor chip 3 passes through
Lead in flexible base board 4 with covering copper conductor electrical connection；
（2）Will be through step（1）Flexible base board 4 after processing is connected with one end of connecting wire 5 so that connecting wire 5 passes through
The copper conductor that covers in flexible base board 4 is electrically connected with lead；
（3）Will be through step（2）Flexible base board 4 after processing is fixedly installed to be in communication with the outside and the other end is sealed at one end
And in the encapsulating housing 2 with inner chamber, and cause the sealed end of the other end through the encapsulating housing 2 of connecting wire 5 to extend envelope
Fill outside housing 2；
（4）Will be through step（3）Encapsulating housing 2 after processing is arranged on that both ends are in communication with the outside respectively and with inner chamber
Shell 1 in so that the inner chamber of encapsulating housing 2 is in communication with the outside by one end of encapsulating housing 2 and one end of shell 1, connection
The other end of the other end of wire 5 through shell 1 extends outside shell 1；
（5）From through step（4）The other end of shell 1 after processing filling with sealant into shell 1 causes the another of shell 1
It is separately filled between the sealed end of end and encapsulating housing 2, between the lateral wall of the madial wall of shell 1 and encapsulating housing 2 close
Sealing.
Encapsulating housing 2 in above-mentioned uses cylindrical encapsulation housing, material selection polyphenylene sulfide, by two semicircular shells
Constitute, two sidepieces of flexible base board 4 are located between two semicircular shells respectively, and flexible base board 4 passes through two semicircular shells
It is fixedly clamped；Shell 1 uses cylindrical shell, and material selection polyphenylene sulfide is made up of two semicircular shells, two semicircles
The position that the lateral surface of housing is relative opens up annular groove 6 respectively, and two semicircular shells are by being arranged on bullet in annular groove 6
Property circle 7 is relatively fixed.Cylindrical encapsulation housing and cylindrical shell are coaxially disposed.
The utility model is described in detail above, its object is to allow the personage for being familiar with this art can be much of that
Solve content of the present utility model and be carried out, protection domain of the present utility model can not be limited with this, it is all according to this practicality
The equivalent change or modification that new Spirit Essence is made, should all cover in protection domain of the present utility model.
Claims (10)
1. a kind of heat insulating package structure of gas sensor, the gas sensor has sensor chip, the heat insulating package
Structure includes the shell with inner chamber and the encapsulating housing with inner chamber being fixedly installed in the shell, the encapsulating housing
Inner chamber be in communication with the outside by one end of the encapsulating housing and one end of the shell, the other end of the encapsulating housing is close
Envelope, it is characterised in that：The heat insulating package structure also include be used for install the sensor chip flexible base board and one end with
The connecting wire of the flexible base board connection, the flexible base board is fixedly installed and flexible base board position with the encapsulating housing
In causing the sensor chip to be suspended in the encapsulating housing in the encapsulating housing, the other end of the connecting wire according to
Secondary sealed end, the other end of the shell through the encapsulating housing extends outside the shell.
2. the heat insulating package structure of gas sensor according to claim 1, it is characterised in that：The material of the encapsulating housing
Matter is high polymer material.
3. the heat insulating package structure of gas sensor according to claim 2, it is characterised in that：The material of the encapsulating housing
Matter includes polyphenylene sulfide.
4. the heat insulating package structure of gas sensor according to claim 1, it is characterised in that：The material of the shell is
High polymer material.
5. the heat insulating package structure of gas sensor according to claim 4, it is characterised in that：The material bag of the shell
Include polyphenylene sulfide.
6. the heat insulating package structure of gas sensor according to claim 1, it is characterised in that：Have in the flexible base board
Have and leaded and described sensor chip is connected on wire, the sensor chip pass through in the lead and the flexible base board
Wire electrical connection, the wire in the flexible base board is also electrically connected with the connecting wire.
7. the heat insulating package structure of gas sensor according to claim 1, it is characterised in that：The other end of the shell
It is separately filled between the sealed end of portion and the encapsulating housing, between the lateral wall of the madial wall of the shell and encapsulating housing
Fluid sealant.
8. the heat insulating package structure of the gas sensor according to any one of claim 1 ~ 7 right, it is characterised in that：Institute
It is the cylindrical shell that two ends are in communication with the outside respectively to state shell, is made up of two semicircular shells, two semicircle shells
The position that the lateral surface of body is relative opens up annular groove respectively, and two semicircular shells are by being arranged on the annular groove
Interior elastic ring is relatively fixed.
9. the heat insulating package structure of the gas sensor according to any one of claim 1 ~ 7 right, it is characterised in that：Institute
It is the cylindrical encapsulation housing that one end is in communication with the outside to state encapsulating housing, is made up of two semicircular shells, the flexible base board
Two sidepieces be located at respectively between two semicircular shells.
10. the heat insulating package structure of gas sensor according to claim 1, it is characterised in that：The flexible base board is
PI flexible base boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720285184.XU CN206524315U (en) | 2017-03-22 | 2017-03-22 | A kind of heat insulating package structure of gas sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720285184.XU CN206524315U (en) | 2017-03-22 | 2017-03-22 | A kind of heat insulating package structure of gas sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206524315U true CN206524315U (en) | 2017-09-26 |
Family
ID=59903099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720285184.XU Active CN206524315U (en) | 2017-03-22 | 2017-03-22 | A kind of heat insulating package structure of gas sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206524315U (en) |
-
2017
- 2017-03-22 CN CN201720285184.XU patent/CN206524315U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190315 Address after: Room A4-407, 218 Xinghu Street, Suzhou Industrial Park, Jiangsu Province Patentee after: Suzhou Zheng Qin Electric Co., Ltd. Address before: Room A4-407, 218 Xinghu Street, Suzhou Industrial Park, Jiangsu Province Patentee before: Haizhuosaisi (Suzhou) Sensor Technology Co Ltd |
|
| TR01 | Transfer of patent right | ||
| CP02 | Change in the address of a patent holder |
Address after: 215000 Room 302, 17 Blocks, Northwest District of Suzhou Namicheng, 99 Jinjihu Avenue, Suzhou Industrial Park, Jiangsu Province Patentee after: Suzhou Zheng Qin Electric Co., Ltd. Address before: Room A4-407, 218 Xinghu Street, Suzhou Industrial Park, Jiangsu Province Patentee before: Suzhou Zheng Qin Electric Co., Ltd. |
|
| CP02 | Change in the address of a patent holder |