CN2520576Y - High-temp. high-voltage lead device - Google Patents
High-temp. high-voltage lead device Download PDFInfo
- Publication number
- CN2520576Y CN2520576Y CN 02221544 CN02221544U CN2520576Y CN 2520576 Y CN2520576 Y CN 2520576Y CN 02221544 CN02221544 CN 02221544 CN 02221544 U CN02221544 U CN 02221544U CN 2520576 Y CN2520576 Y CN 2520576Y
- Authority
- CN
- China
- Prior art keywords
- lead
- metal cup
- wire electrode
- lead device
- metallic cup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model relates to a lead device which leads out multi-core electrode from a high temperature pressure container, which comprises a metallic cup, a plurality of holes drilled evenly on the bottom of the metallic cup, and lead electrodes with concentric reducers in the same number of the holes. Thermostable insulating material is equipped on the concentric reducers of the lead electrodes which are further inserted in the holes on the bottom of the metallic cup. Ring-shaped gaps between the metallic cup and the lead electrodes are filled with sealing material with certain compression strength. The utility model can lead out a plurality of lead wires from the pressure container at a smaller installation position, have simple structure, and not need to be sintered at a high temperature, and the index of temperature and pressure resistances is high, and the manufacture cost is low.
Description
Technical field
The utility model relates to a kind of down-lead device of drawing the multicore electrode in the high temperature pressure vessel.
Background technology
Sensor installation or power supply is provided in pressure vessel in high temperature pressure vessel all must be installed the down-lead device of high temperature resistance High-Voltage Insulation on pressure vessel wall.Generally be that the high-tension ceramics lead wire device is installed on pressure vessel, less when pressure vessel, the installation site has in limited time, and it is very difficult to draw many lead-in wires.
Summary of the invention
The purpose of this utility model is to provide a kind of HTHP down-lead device, uses this down-lead device, can overcome the defective of prior art, draws many lead-in wires on very little installation site in pressure vessel.
In order to reach above technical purpose, the utility model provides following technical scheme.
The HTHP down-lead device, form by metal cup, several apertures that at the bottom of metal cup, evenly drill through, the lead-in wire electrode with concentric reducer suitable with little number of perforations, resistant to elevated temperatures insulating material is arranged on the microcephaly of described lead-in wire electrode, and in the aperture at the bottom of the insertion metal cup, described metal cup and the interior encapsulant of filling of the annular space of lead-in wire electrode with certain compression strength.
At the bottom of metal cup, evenly drill through the aperture that needs pin count, on the microcephaly of lead-in wire electrode the general available polytetrafluoroethylene of resistant to elevated temperatures insulating material is arranged, after being inserted into the aperture at the bottom of the metal cup, packing material in the metal cup should be the encapsulant with certain compression strength, the quartz sand of available 140～180 orders 50～60% and 40%～50% universal epoxy resin double-tube glue, cold curing 24 hours, 80 ℃ solidified 4 hours down with it, 160 ℃ solidified 4 hours down, can use.During use, with this down-lead device pressure vessel of packing into, after the temperature, pressure in the pressure vessel rises, the compression strength of the universal epoxy resin double-tube glue in the down-lead device metal cup will begin to descend, the extrapolability of concentric reducer lead-in wire electrode will mainly act on the quartz sand, because quartz sand compression strength height, particle slightly can not be by the intermittence of fairlead at the bottom of the down-lead device metal cup, and universal epoxy resin double-tube glue mainly seals, the working temperature of down-lead device can reach 200 ℃, and operating pressure can reach 90Mpa.
Compared with prior art, the utility model can be drawn many lead-in wires in pressure vessel on very little installation site, simple in structure, does not need high temperature sintering, temperature resistance resistance to compression index height, low cost of manufacture.
Description of drawings
Fig. 1 is that the utility model is installed on the section of structure in the pressure vessel.
Embodiment
Referring to Fig. 1, the HTHP down-lead device, by metal cup 2, several apertures 8 that at the bottom of metal cup, evenly drill through, the lead-in wire electrode with concentric reducer 1 suitable with little number of perforations formed, resistant to elevated temperatures insulating material polytetrafluoroethylene 5 is arranged on the microcephaly 9 of described lead-in wire electrode, and in the aperture 8 at the bottom of the insertion metal cup, described metal cup 2 and the interior quartz sand of 140～180 orders 50～60% and 40%～50% the universal epoxy resin double-tube glue 3 of filling of the annular space of lead-in wire electrode 1, with it cold curing 24 hours, 80 ℃ solidified 4 hours down, 160 ℃ solidified 4 hours down, can use.
Only need during installation to bore a stepped hole at pressure vessel outer wall 6, the sealing gasket 4 of packing on the step after down-lead device is packed into, compresses with hollow screw 7, and the down-lead device two ends can connect with high temperature scolding tin welding electric wire or with high temperature aviation connector.After the temperature, pressure in the pressure vessel rises, the compression strength of the universal epoxy resin double-tube glue in the down-lead device metal cup will begin to descend, the extrapolability of concentric reducer lead-in wire electrode will mainly act on the quartz sand, because quartz sand compression strength height, particle slightly can not be by the intermittence of fairlead at the bottom of the down-lead device metal cup, and universal epoxy resin double-tube glue mainly seals, so the working temperature of down-lead device can reach 200 ℃, and operating pressure can reach 90Mpa.
Claims (3)
1. HTHP down-lead device, form by metal cup (2), several apertures (8) that at the bottom of metal cup, evenly drill through, the lead-in wire electrode (1) with concentric reducer suitable with little number of perforations, resistant to elevated temperatures insulating material (5) is arranged on the microcephaly of described lead-in wire electrode (9), and in the aperture (8) at the bottom of the insertion metal cup, described metal cup (2) and the interior encapsulant (3) of filling of the annular space of lead-in wire electrode (1) with certain compression strength.
2. down-lead device as claimed in claim 1 is characterized in that, the resistant to elevated temperatures insulating material (5) on the microcephaly (9) of described lead-in wire electrode (1) is a polytetrafluoroethylene.
3. down-lead device as claimed in claim 1 is characterized in that, the packing material (3) in the annular space of described metal cup (2) and lead-in wire electrode (1) is the quartz sand of 140～180 orders 50～60% and 40%～50% universal epoxy resin double-tube glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02221544 CN2520576Y (en) | 2002-02-04 | 2002-02-04 | High-temp. high-voltage lead device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02221544 CN2520576Y (en) | 2002-02-04 | 2002-02-04 | High-temp. high-voltage lead device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2520576Y true CN2520576Y (en) | 2002-11-13 |
Family
ID=33699630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02221544 Expired - Fee Related CN2520576Y (en) | 2002-02-04 | 2002-02-04 | High-temp. high-voltage lead device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2520576Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102078781A (en) * | 2010-12-10 | 2011-06-01 | 中国石油大学(北京) | Thread guide |
| CN102506927A (en) * | 2011-10-20 | 2012-06-20 | 南京盛业达电子有限公司 | Wiring fixing method of direct lead wire |
| CN103017926A (en) * | 2012-12-14 | 2013-04-03 | 哈尔滨工程大学 | Universal type multi-thermocouple penetration device |
| CN106286828A (en) * | 2015-05-20 | 2017-01-04 | 国家电网公司 | The method for blocking of electric metering box through wires hole |
-
2002
- 2002-02-04 CN CN 02221544 patent/CN2520576Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102078781A (en) * | 2010-12-10 | 2011-06-01 | 中国石油大学(北京) | Thread guide |
| CN102506927A (en) * | 2011-10-20 | 2012-06-20 | 南京盛业达电子有限公司 | Wiring fixing method of direct lead wire |
| CN103017926A (en) * | 2012-12-14 | 2013-04-03 | 哈尔滨工程大学 | Universal type multi-thermocouple penetration device |
| CN106286828A (en) * | 2015-05-20 | 2017-01-04 | 国家电网公司 | The method for blocking of electric metering box through wires hole |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |