CN206521468U - A kind of supersonic wave wall breaking machine semiconductor temperature-lowering device - Google Patents
A kind of supersonic wave wall breaking machine semiconductor temperature-lowering device Download PDFInfo
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- CN206521468U CN206521468U CN201720139205.7U CN201720139205U CN206521468U CN 206521468 U CN206521468 U CN 206521468U CN 201720139205 U CN201720139205 U CN 201720139205U CN 206521468 U CN206521468 U CN 206521468U
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- plate
- heat
- breaking machine
- column
- supersonic wave
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Abstract
The utility model discloses a kind of supersonic wave wall breaking machine semiconductor temperature-lowering device, including base and column, the lower end surrounding of the base is respectively fixed with slipmat, the outer wall of the column is socketed with sliding sleeve, one end of the sliding sleeve is provided with locking device, the other end of the sliding sleeve is fixedly connected with supporting plate, the upper end of the supporting plate is provided with mounting groove, the upper end of the ultrasonic oscillator is provided with ultrasonic transducer, the upper end of the base is provided with fixed plate, the inside bottom of the fixed plate is provided with ventilating fan, the upper end of the fixed plate is provided with heat-conducting plate, the bottom of the heat-conducting plate is provided with several semiconductor chilling plates, placed cavity is provided with the upper end center of the heat-conducting plate, container is provided with the placed cavity, the external rings of the placed cavity are arranged with cyclic water tank.The utility model is simple in construction, good cooling effect, and radiating is stable, efficiency high, and the device is easy to use ingenious, is suitably widely popularized.
Description
Technical field
The utility model is related to technical field of medicament, more particularly to a kind of supersonic wave wall breaking machine is filled with semiconductor cooling
Put.
Background technology
Generally using ultrasound in the drug production process such as poly IC, coacetylase, L-Asparaginasum and phosphotransacetylase enzyme
Ripple wall-breaking machine carries out broken wall treatment to it, in broken wall treatment, with continuing for ultrasonic oscillation time, the temperature meeting of nutrient solution
Gradually rise, when the temperature of nutrient solution is more than 35 degree, active material is almost inactivated, therefore the temperature of control nutrient solution seems outstanding
To be important, the temperature control method of existing supersonic wave wall breaking machine is cooled using ice chest, that is, is holding the surrounding of culture liquid container
Ice cube is filled, cooling processing is carried out using ice cube；The quantity that cooling processing is difficult assurance ice cube is carried out using ice cube, is easily caused
The situation that cooling is excessive or cooling is not enough；Not only need constantly to change ice cube by ice block cooling simultaneously, and ice cube is in drop
With continuous fusing during temperature, cooling-down effect is also declining, and causes the less stable of cooling.
Utility model content
The technical problem that the utility model is solved is to overcome a kind of supersonic wave wall breaking machine semiconductor cooling of prior art
There is provided a kind of supersonic wave wall breaking machine semiconductor temperature-lowering device for the defect of device.The supersonic wave wall breaking machine semiconductor cooling
The features such as device has stable radiating, efficiency high.
To achieve the above object, the utility model provides following technical scheme：
A kind of supersonic wave wall breaking machine semiconductor temperature-lowering device, including base and column, the column are fixedly connected on bottom
The upper end of seat, the lower end surrounding of the base is respectively fixed with slipmat, and the outer wall of the column is socketed with sliding sleeve, the sliding sleeve
One end be provided with locking device, and column side be provided with several lockholes corresponding with locking device, the other end of the sliding sleeve
Supporting plate is fixedly connected with, the upper end of the supporting plate is provided with mounting groove, and mounting groove through there is ultrasonic oscillator, described super
The upper end of acoustic wave transducer is provided with ultrasonic transducer, and the upper end of the base is provided with fixed plate, the inside bottom of the fixed plate
Provided with ventilating fan, the upper end of the fixed plate is provided with heat-conducting plate, and the bottom of the heat-conducting plate is provided with several semiconductor chilling plates,
It is provided with the upper end center of the heat-conducting plate in placed cavity, the placed cavity and is provided with container, the external rings winding of the placed cavity
Have to be communicated with the downside of cyclic water tank, the outer wall of the cyclic water tank on the upside of water inlet pipe, the outer wall of the cyclic water tank and be communicated with out
Valve is equipped with water pipe, the water inlet pipe and outlet pipe.
It is preferred that, the column side is provided with 10-15 lockholes corresponding with locking device, and each lockhole is vertical etc.
Distance arrangement.
It is preferred that, temperature sensor is provided with the heat-conducting plate.
It is preferred that, the bottom of the heat-conducting plate is provided with 4-6 semiconductor chilling plate.
It is preferred that, the bottom of the fixed plate is provided with several heat emission holes.
Compared with prior art, the beneficial effects of the utility model are：The lower end surrounding of base is respectively fixed with slipmat,
The skin-friction force with contact surface is increased, so that base is more stablized, the upper end of base is fixed with column, and column
Be socketed with sliding sleeve, and one end of sliding sleeve is provided with locking device, and column side be provided with 10-15 it is corresponding with locking device
Lockhole, and each lockhole is vertically spaced substantially equidistant, and supporting plate can be adjusted according to different demands to different height, and then by ultrasound
Ripple oscillator is through the mounting groove in supporting plate, because the external diameter of ultrasonic transducer is more than the external diameter of ultrasonic oscillator, therefore super
Acoustic wave transducer is able to fix on the supporting plate, and base upper end is provided with fixed plate, and the upper end of fixed plate is provided with heat-conducting plate,
Temperature sensor is provided with heat-conducting plate, when the temperature in container is more than certain numerical value, heat sink is opened；When in container
Temperature when being less than certain numerical value, heat sink is closed, and the bottom even of heat-conducting plate is provided with 4-6 semiconductor refrigerating
Piece so that container can Homogeneouslly-radiating, and radiating effect is more preferably, and is internally provided with ventilating fan in fixed plate, plays into one
Cooling effect is walked, container is provided with while being provided with the upper end center of heat-conducting plate in placed cavity, placed cavity, and placed cavity
Outside, which is surrounded with the downside of cyclic water tank, the outer wall of cyclic water tank, is communicated with water inlet pipe, and is communicated with outlet pipe on the upside of outer wall, and enters
Valve, the size of water volume adjustable, energy-conserving and environment-protective are provided with water pipe and outlet pipe.The utility model is simple in construction, easily behaviour
Make, good cooling effect, and radiating is stable, efficiency high, the device is easy to use ingenious, is suitably widely popularized.
Brief description of the drawings
Fig. 1 is the utility model structural representation；
Fig. 2 is the mounting structure schematic diagram of the utility model fixed plate；
Fig. 3 is the utility model overlooking the structure diagram.
In figure：1st, base；2nd, column；3rd, slipmat；4th, sliding sleeve；5th, supporting plate；6th, ultrasonic transducer；7th, ultrasonic wave shakes
Son；8th, container；9th, cyclic water tank；10th, fixed plate；11st, locking device；12nd, heat-conducting plate；13rd, water inlet pipe；14th, outlet pipe；15、
Valve；16th, placed cavity；17th, temperature sensor；18th, semiconductor chilling plate；19th, ventilating fan.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belongs to the scope of the utility model protection.
Fig. 1-3, a kind of supersonic wave wall breaking machine semiconductor temperature-lowering device, including base 1 and column 2 are referred to, column 2 is consolidated
Surely the upper end of base 1 is connected to, the lower end surrounding of base 1 is respectively fixed with slipmat 3, and the outer wall of column 2 is socketed with sliding sleeve 4,
One end of sliding sleeve 4 is provided with locking device 11, and the side of column 2 is provided with several and the corresponding lockhole of locking device 11, sliding sleeve 4
The other end is fixedly connected with supporting plate 5, and the upper end of supporting plate 5, which is provided with to run through in mounting groove, and mounting groove, ultrasonic oscillator 7,
The upper end of ultrasonic oscillator 7 is provided with ultrasonic transducer 6, and the upper end of base 1 is provided with fixed plate 10, the inside bottom of fixed plate 10
Provided with ventilating fan 19, the upper end of fixed plate 10 is provided with heat-conducting plate 12, and the bottom of heat-conducting plate 12 is provided with several semiconductor chilling plates
18, it is provided with placed cavity 16, placed cavity 16 at the upper end center of heat-conducting plate 12 and is provided with container 8, the external rings winding of placed cavity 16
Have to be communicated with the downside of cyclic water tank 9, the outer wall of cyclic water tank 9 on the upside of water inlet pipe 13, the outer wall of cyclic water tank 9 and be communicated with outlet pipe
14, valve 15 is equipped with water inlet pipe 13 and outlet pipe 14.
Specifically, the side of column 2 is provided with 10-15 and the corresponding lockhole of locking device 11, and each lockhole is vertical etc.
Distance arrangement, can adjust supporting plate 5 to different height according to different demands.
Specifically, temperature sensor 17 is provided with heat-conducting plate 12, and when the temperature in container 8 is more than certain numerical value, drop
Warm device is opened；When the temperature in container 8 is less than certain numerical value, heat sink is closed.
Specifically, the bottom of heat-conducting plate 12 is provided with 4-6 semiconductor chilling plate 18 so that container 8 can Homogeneouslly-radiating, and
Radiating effect is more preferable.
Specifically, the bottom of fixed plate 10 is provided with several heat emission holes, heat is distributed by heat emission hole, so as to reach cooling
Effect.
In the utility model, the lower end surrounding of base 1 is respectively fixed with slipmat 3, and the surface increased with contact surface is rubbed
Power is wiped, so that base 1 is more stablized, the upper end of base 1, which is fixed with column 2, and column 2, is socketed with sliding sleeve 4, and sliding sleeve
4 one end is provided with locking device 11, and the side of column 2 is provided with 10-15 and the corresponding lockhole of locking device 11, and each
Lockhole is vertically spaced substantially equidistant, and can be adjusted supporting plate 5 according to different demands and be worn to different height, and then by ultrasonic oscillator 7
The mounting groove crossed in supporting plate 5, because the external diameter of ultrasonic transducer 6 is more than the external diameter of ultrasonic oscillator 7, therefore ultrasonic wave shakes
Son 7 is able to be fixed in supporting plate 5, and the upper end of base 1 is provided with fixed plate 10, and the upper end of fixed plate 10 is provided with heat-conducting plate
12, temperature sensor 17 is provided with heat-conducting plate 12, and when the temperature in container 8 is more than certain numerical value, heat sink is opened；
When the temperature in container 8 is less than certain numerical value, heat sink is closed, and the bottom even of heat-conducting plate 12 is provided with 4-6
Semiconductor chilling plate 18 so that container 8 can Homogeneouslly-radiating, and radiating effect is more preferably, and being internally provided with fixed plate 10
Ventilating fan 19, plays further cooling effect, while placed cavity 16 is provided with the upper end center of heat-conducting plate 12, placed cavity 16
Container 8 is inside provided with, and the outside of placed cavity 16 is surrounded with cyclic water tank 9, the outer wall downside of cyclic water tank 9 is communicated with water inlet pipe
13, and be communicated with the upside of outer wall on outlet pipe 14, and water inlet pipe 13 and outlet pipe 14 and be provided with valve 15, water volume adjustable
Size, energy-conserving and environment-protective.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out in the case where not departing from principle of the present utility model and spirit a variety of changes, repaiies
Change, replace and modification, scope of the present utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of supersonic wave wall breaking machine semiconductor temperature-lowering device, including base（1）And column（2）, the column（2）It is fixed to connect
It is connected on base（1）Upper end, it is characterised in that：The base（1）Lower end surrounding be respectively fixed with slipmat（3）, it is described vertical
Post（2）Outer wall be socketed with sliding sleeve（4）, the sliding sleeve（4）One end be provided with locking device（11）, and column（2）Side is provided with
Several and locking device（11）Corresponding lockhole, the sliding sleeve（4）The other end be fixedly connected with supporting plate（5）, the branch
Fagging（5）Upper end be provided with mounting groove, and mounting groove through there is ultrasonic oscillator（7）, the ultrasonic oscillator（7）Upper end
Provided with ultrasonic transducer（6）, the base（1）Upper end be provided with fixed plate（10）, the fixed plate（10）Inside bottom
Provided with ventilating fan（19）, the fixed plate（10）Upper end be provided with heat-conducting plate（12）, the heat-conducting plate（12）If bottom provided with
Dry semiconductor chilling plate（18）, the heat-conducting plate（12）Upper end center at be provided with placed cavity（16）, the placed cavity（16）
It is interior to be provided with container（8）, the placed cavity（16）External rings be arranged with cyclic water tank（9）, the cyclic water tank（9）Outer wall under
Side is communicated with water inlet pipe（13）, the cyclic water tank（9）Outer wall on the upside of be communicated with outlet pipe（14）, the water inlet pipe（13）With
Outlet pipe（14）On be equipped with valve（15）.
2. a kind of supersonic wave wall breaking machine semiconductor temperature-lowering device according to claim 1, it is characterised in that：The column
（2）Side is provided with 10-15 and locking device（11）Corresponding lockhole, and each lockhole is vertically spaced substantially equidistant.
3. a kind of supersonic wave wall breaking machine semiconductor temperature-lowering device according to claim 1, it is characterised in that：The heat conduction
Plate（12）It is interior to be provided with temperature sensor（17）.
4. a kind of supersonic wave wall breaking machine semiconductor temperature-lowering device according to claim 1, it is characterised in that：The heat conduction
Plate（12）Bottom provided with 4-6 semiconductor chilling plate（18）.
5. a kind of supersonic wave wall breaking machine semiconductor temperature-lowering device according to claim 1, it is characterised in that：The fixation
Plate（10）Bottom be provided with several heat emission holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720139205.7U CN206521468U (en) | 2017-02-15 | 2017-02-15 | A kind of supersonic wave wall breaking machine semiconductor temperature-lowering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720139205.7U CN206521468U (en) | 2017-02-15 | 2017-02-15 | A kind of supersonic wave wall breaking machine semiconductor temperature-lowering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206521468U true CN206521468U (en) | 2017-09-26 |
Family
ID=59891369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720139205.7U Expired - Fee Related CN206521468U (en) | 2017-02-15 | 2017-02-15 | A kind of supersonic wave wall breaking machine semiconductor temperature-lowering device |
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| Country | Link |
|---|---|
| CN (1) | CN206521468U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110442214A (en) * | 2019-08-05 | 2019-11-12 | 李阳 | A kind of computer main board ultrasonic nano cooling device |
-
2017
- 2017-02-15 CN CN201720139205.7U patent/CN206521468U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110442214A (en) * | 2019-08-05 | 2019-11-12 | 李阳 | A kind of computer main board ultrasonic nano cooling device |
| CN110442214B (en) * | 2019-08-05 | 2020-09-29 | 浙江广厦建设职业技术大学 | Computer mainboard supersound nanometer heat sink |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170926 Termination date: 20210215 |
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| CF01 | Termination of patent right due to non-payment of annual fee |