CN206467285U - The arrangement of rotatable sputter equipment and rotatable sputter equipment pair - Google Patents
The arrangement of rotatable sputter equipment and rotatable sputter equipment pair Download PDFInfo
- Publication number
- CN206467285U CN206467285U CN201621194387.XU CN201621194387U CN206467285U CN 206467285 U CN206467285 U CN 206467285U CN 201621194387 U CN201621194387 U CN 201621194387U CN 206467285 U CN206467285 U CN 206467285U
- Authority
- CN
- China
- Prior art keywords
- sputter equipment
- rotatable
- rotatable sputter
- rotary shaft
- magnet assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001816 cooling Methods 0.000 claims abstract description 84
- 239000000463 material Substances 0.000 claims abstract description 79
- 238000000151 deposition Methods 0.000 claims abstract description 67
- 239000012809 cooling fluid Substances 0.000 claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 238000000576 coating method Methods 0.000 claims description 69
- 239000011248 coating agent Substances 0.000 claims description 68
- 230000008021 deposition Effects 0.000 claims description 53
- 238000004544 sputter deposition Methods 0.000 claims description 33
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 238000005452 bending Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 12
- 238000006073 displacement reaction Methods 0.000 description 9
- 238000005240 physical vapour deposition Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 239000011148 porous material Substances 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 238000005546 reactive sputtering Methods 0.000 description 5
- 230000006978 adaptation Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 239000013077 target material Substances 0.000 description 4
- 229910001369 Brass Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- -1 Such as Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000010951 brass Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Abstract
The utility model describes the arrangement of rotatable sputter equipment and rotatable sputter equipment pair.Describe a kind of rotatable sputter equipment in depositing materials on substrates.The rotatable sputter equipment includes：Target backing pipe with rotary shaft；Magnet assembly, the magnet assembly is arranged in the target backing pipe；Cooling duct, the cooling duct is used to provide cooling fluid, the cooling duct is arranged in the target backing pipe, the magnet assembly is arranged on the direction of the rotary shaft, and relative to the rotation axle offset, the cooling duct is arranged on the direction of the rotary shaft, and relative to the rotation axle offset；Flange connector, the flange connector is used to provide cooling fluid to the cooling duct, and the flange connector is arranged with the rotating shaft coaxle；And crossing member, the crossing member is contacted with the flange connector, wherein the flange connector is connected by the crossing member with the cooling duct.
Description
Technical field
Embodiment of the present utility model is related to the sputter equipment for deposition chambers.Embodiment of the present utility model is especially related to
And rotatable sputter equipment, relate in particular to the rotatable sputter equipment in sputter deposition chamber.
Background technology
If drying method becomes known in depositing materials on substrates.For example, physical vapour deposition (PVD) (physical can be passed through
vapor deposition；PVD) technique (such as, sputtering technology) carrys out coated substrate.Generally, technique of the technique in coating equipment
Performed in chamber, substrate to be coated is located in the processing chamber or be conducted through the processing chamber.Carry in a device
For deposition materials.In the case where performing PVD, for example, deposition materials are provided with solid phase, and can add during technique
Plus reacting gas.Multiple material can be used for being deposited on substrate；In the material, ceramics can be used.
Coated material can be used in some applications and some technical fields.For example, applying in microelectronics domain
In, such as, generate semiconductor devices.In addition, coating the substrate for display often through PVD.Other application can be wrapped
Include insulating panel, Organic Light Emitting Diode (organic light emitting diode；OLED) panel, and hard disk, CD,
DVD etc..
Substrate arranged is in the deposition chambers for performing coating processes or is conducted through the deposition chambers.Film is applied
Coating equipment is available for different deposition purposes.For example, can be by some guide devices (such as, coat roller) by volume to be coated
The deposition chambers that material (web) guiding passes through coiled material coating equipment., can be around coating rolling in the deposition chambers of coiled material coating equipment
Cylinder provides some deposition stages.Deposition stage can be provided as multiple compartments.
Guiding substrate to be coated passes through sputter equipment so that reached from the material that target discharges when by sputtering equipment
Substrate.In order to deposit different deposition materials, the sputter equipment with the target being made up of different materials may be arranged at different
In compartment.By adjusting the species of sputter equipment and/or target material, customizablely using thin film coated equipment for deposition
Different deposition materials or the different stackings of deposition materials.In order to realize the depositing operation of customization, there is provided each compatible compartment
Different types of sputter equipment be beneficial.
In view of above, the utility model, which is provided, is used for the sputter equipment of the deposition materials on coiled material, the coiled material is provided
It is used for the high degree of flexibility used in different type or various sizes of thin film coated equipment.
Utility model content
In view of above there is provided the rotatable sputter equipment of small yardstick, wherein cooling duct is arranged in target backing pipe
In (backing tube), the target backing pipe has the skew relative to rotary shaft.It is of the present utility model other aspect, it is excellent
Point and feature are obvious from specification and drawings.
According to one embodiment, there is provided rotatable sputter equipment.The rotatable sputter equipment includes：With rotary shaft
Target backing pipe；It is arranged in the magnet assembly in target backing pipe；Cooling duct for providing cooling fluid, wherein cooling is logical
Road is arranged in target backing pipe.Magnet assembly arrange in the direction of the axis of rotation, and relative to rotation axle offset.Cooling is logical
Road arrange in the direction of the axis of rotation, and relative to rotation axle offset.Rotatable sputter equipment further comprise be used for will be cold
But fluid is provided to the flange connector of cooling duct, and the flange connector is arranged with rotating shaft coaxle.Crossing member is with being connected
Hp contacts, wherein flange connector is connected by the crossing member with cooling duct.
Brief description of the drawings
Therefore, in order to which the mode of features described above of the present utility model is understood in detail, it can be carried out by reference to embodiment pair
That summarizes briefly above of the present utility model more specifically describes.Appended accompanying drawing on embodiment of the present utility model, and
Described in hereafter：
Fig. 1 shows the partial cross-section of the target backing pipe according to the rotatable sputter equipment of embodiment described herein
Figure；
Fig. 2 shows the cross-sectional view of the rotatable sputter equipment according to embodiment described herein；
Fig. 3 shows the arrangement of two rotatable sputter equipments according to embodiment described herein；And
Fig. 4 shows the film deposition equipment according to embodiment described herein.
Embodiment
Various embodiments of the present utility model are reference will be made in detail now, and one or more examples illustrate to implement in the accompanying drawings
One or more examples of example.Below in the description of accompanying drawing, identical component symbol refers to identical part.Generally, only
Difference relative to separate embodiment is described.Each example is provided by explaining the utility model, and this is not intended to pair
Limitation of the present utility model.In addition, explaination or be described as one embodiment part feature can be used for other embodiment or with
It is used in combination to produce further embodiment.Specification is intended to include such modifications and variations.
In addition, in the following description, " sputter equipment " is understood to include to be deposited on the deposition materials on substrate or heavy
The device of the component of product material.Specifically, sputter equipment is provided with the deposition materials of target form.Target can be by material to be deposited
Or at least one component of material to be deposited is made.In addition, sputter equipment may be designed as the rotatable sputtering dress with rotary shaft
Put.According to some embodiments, sputter equipment can include target backing pipe, be made up of the component of deposition materials or deposition materials
Target may be arranged on the target backing pipe.Sputter equipment can include the magnet assembly for being used to generate magnetic field.In sputtering dress
In the case of putting offer magnet assembly, sputter equipment is properly termed as sputter magnetron.Furthermore, it is possible to be provided in sputter equipment
Cooling duct is to cool down some of sputter equipment or sputter equipment.According to some embodiments, sputter equipment is adaptable to be
It is connected to the sputter equipment support member in depositing device or deposition compartment.For example, connection can be provided in sputter equipment end
Flange.According to some embodiments, sputter equipment is operable as negative electrode or operation is anode.
Term " depositing operation " can generally refer to wherein material and be discharged from the target of sputter equipment and be deposited on substrate
On any technique, such as, physical gas-phase deposition (physical vapor deposition；PVD techniques), reaction splash
Penetrate technique, etc..
The material from sputter equipment release that is available for that term " coating window " can be regarded as depositing device reaches base by it
The region of plate.For example, can surround around coating roller to wind substrate.Specifically, can coating roller on conveying substrate.More
In detail, material to be deposited discharges from the target of sputter equipment.
, can be by for stopping covering for some deposition materials according to some embodiments that can be combined with other embodiment
Mould or stop portions limit coating window.Mask or stop portions can be provided by frame-shaped device.Frame-shaped device can provide to
A few hole.At least one hole can be provided by least one framework.At least one framework can include one or more frames
Frame element.At least one frame-shaped device that hole is provided can be arranged around coating roller.Can be many around coating roller arrangement
Individual frame-shaped device.Hole can be arranged along the tangent plane of the curvature with coating roller.The rotary shaft for coating roller can be beneficial
Ground is flatly arranged.
According to the embodiment described herein that can be combined with other embodiment, frame element can be further provided with reality
The shadowing elements upwardly extended in matter perpendicular to the side of hole.
" substantial " can refer in the presence of away from some deviation of the property of " substantial " instruction as used herein, the term.Example
Such as, term " substantial orthogonality " refers to the direction can with some deviations away from accurate vertical direction, such as, with accurately hanging down
Nogata to about 1% to about 20% deviation.
In certain embodiments, shadowing elements can be upwardly extended in the side substantially perpendicular to coating roller.Masking member
Part can have the direction generally radially relative to coating roller.Shadowing elements may be disposed to be used to protect coiled material painting to cover
Standby chamber wall exempts from side wall deposition.Shadowing elements (for example, shield) may be disposed to for being formed with cross wall and bottom wall
Case or cabinet.At least one in wall, which can be provided, can limit the hole of coating window.In case or cabinet, it can arrange that at least one splashes
Injection device.According to embodiment described herein, a pair of sputter equipments can be arranged in the case or cabinet with coating window.
According to embodiment described herein, coating window can be described as adjacent substrates plane.Base plan can be at it
The plane of middle moving substrate.Carry out plane of motion substrate along face substrate path.When guiding flexible base board on roller is coated, base
Plate circuit footpath can be the surface limited by the drum surface of the bending of cylindrical shape coating roller.Coating window may be arranged at coating roller
The section and sputter equipment towards sputter equipment between.Coating window can be along the planar cloth tangent with coating roller curvature
Put.
According to some embodiments, hole can be provided as the opening limited by three-dimensional framework.Specifically, three frameworks can
Adaptation extremely coats the curvature of roller.For example, the hole limited by three-dimensional framework can be quadrangle.Three-dimensional pore space can by
The two-dimensional surface arranged in a curved fashion in three dimensions is described.Three-dimensional pore space can along cylinder surface layout.Cylinder
Surface can be the surface for coating roller., can be by being rolled along coating in order to which the curved surface along coating roller provides three-dimensional pore space
Two straight line frame elements of the rotary shaft arrangement of cylinder provide the frame element of three-dimensional framework.Two straight line frame elements can be by
Adaptation is coupled to two further frame elements of the curvature of coating roller.Two straight line frame elements and two bending frames
Frame element provides three-dimensional pore space.Multiple three-dimensional box rack-like apparatus can be arranged around coating roller.Multiple three-dimensional frameworks can be carried
For multiple three-dimensional pore spaces.Three-dimensional pore space can limit three-dimensional coating window.
According to some embodiments, the special rotatable sputter equipment of small yardstick, the special rotatable sputtering dress are disclosed
Put the limited size of the adapted sputtering compartment for coiled material coating equipment.The rotatable sputter equipment of small yardstick includes small straight
The target backing pipe in footpath.The target backing pipe of minor diameter is provided for arranging magnet assembly and cooling duct in target backing pipe
Reduction space.In existing solution, cooling duct and the rotary shaft of rotatable sputter equipment are disposed concentrically upon.
In the rotatable sputter equipment of small yardstick, the remaining space between cooling duct and target backing pipe reduces.
The rotatable sputter equipment for designing small yardstick is not meant to apply the ratio less than 1 to the rotatable sputter equipment of standard
The example factor is coupled in the target backing pipe of smaller diameter until the component in target backing pipe.Some aspects are considered as, such as,
Cooling duct or the yardstick and capacity of the cross section of support component.Crossing the cooling duct of minor diameter can not almost provide adapted
Hot property.
In addition to permanent magnetic sheet material, the intensity in the magnetic field generated by magnet assembly is also substantially dependent on permanent magnetic sheet
Size or volume.Weak magnetic field strength may be caused by reducing magnet assembly with the scale factor less than 1, and this causes sputter plasma
Poorer performance.
According to some embodiments that can be combined with other embodiment, the rotatable sputter equipment of small yardstick is provided with magnet group
Part, wherein the rotatable sputter equipment of size comparison with standard of permanent magnetic sheet is kept essentially constant.Permanent magnetic sheet can have edge
The height of pole orientation and the width and length perpendicular to pole orientation.For example, the magnet assembly suitable for sputtering technology is forever
The height that long magnetic sheet can have but be not limited between about 5mm and about 15mm, and have but be not limited between about 5mm and about 15mm
Width.Permanent magnetic sheet can have various length, such as, from about 5mm until about 50mm.Due to the permanent magnetic sheet of magnet assembly
Can for example to arrange, circumference, rectangle or ellipse place, therefore can use the permanent magnetic sheet of appropriate length.
Magnet assembly is arranged in the target backing pipe of rotatable sputter equipment.In addition, for providing the cold of cooling fluid
But passage is arranged in target backing pipe.In order to which field strength is to field strength of the sufficient space offer of magnet assembly suitable for sputtering technology,
In embodiment described herein, cooling duct is arranged in rotation axle offset with target backing pipe.It is inclined relative to rotary shaft
The cooling duct that heart is arranged in the target backing pipe according to the rotatable sputter equipment of embodiment described herein.Cooling is logical
Road extends in the direction of the axis of rotation, and is arranged to, relative to rotation axle offset, such as, substantially parallel to rotary shaft prolong
Stretch.
Cooling in the different sections of the magnet assembly of some of the embodiments described herein and target backing pipe is led to
The arrangement in road can provide enough spaces for magnet assembly.By aforementioned arrangement, can small diameter target backing pipe
It is middle that the magnet assembly with enough field strength is provided.The target backing pipe that small diameter can be provided splashes for the rotatable of small yardstick
Injection device.
Fig. 1 explains the office of the rotatable sputter equipment 100 with rotary shaft 200 according to embodiment described herein
Cross section figure.According to some of the embodiments described herein, magnet assembly is arranged in target backing pipe 110.Magnet assembly
On the direction for being arranged in rotary shaft 200, and offset relative to rotary shaft 200.Magnet assembly can valuably be arranged in target
On the direction of the rotary shaft of first section of penstock, and relative to rotation axle offset.
According to some further embodiments, cooling duct 180 is arranged in target backing pipe 110.Cooling duct 180 can
With on the direction for the rotary shaft 200 being valuably arranged in the second section of target backing pipe, and it is inclined relative to rotary shaft 200
Move.Second section of target backing pipe is different from the first section of target backing pipe.First and second sections of target backing pipe
It can be located on the relative side in target backing pipe.According to some of the embodiments described herein, the first of target backing pipe
Can be the first half portion and the second half portion of target backing pipe with the second section.First half portion and the second half portion can be the target back ofs the body
First and second semicircles of the transverse section of bushing pipe 110.According to some embodiments, the transverse direction of the first section and/or the second section
Section can be overlapping with rotary shaft 200.
According to some embodiments, it is coaxially arranged with rotary shaft 200 to the target backing pipe 110 with rotary shaft 200
The supply of cooling fluid.Rotatable sputter equipment 100 includes the flange connector 232 for cooling fluid.In order to coaxially provide
Cooling fluid, target backing pipe 110 is provided with flange connector 232.It is convex for cooling fluid to be provided to connection to cooling duct 180
Edge 232 is coaxially arranged with rotary shaft 200.Flange connector 232 can be arranged at the first end of target backing pipe.Connection is convex
Edge, which can be attached to crossing member 234, to be used for cooling fluid from coaxial feed conduit is directed to cooling duct.
Flange connector 232 can include the double-wall pipe for being used to introducing and discharging cooling fluid.Flange connector 232 can be wrapped
Include the interior conduit (pipe) 185 and Outer Tube 186 of double-wall pipe.The interior conduit 185 of double-wall pipe can be the inside portion of flange connector
Point.The interior conduit 185 of double-wall pipe may be connected to crossing member 234.By the way that the interior conduit 185 of flange connector is connected into intersection member
Part 234, flange connector 232 is connected to crossing member.Interior conduit 185 can be the interior section of double-wall pipe.Double-wall pipe it is interior
Pipeline 185 can have rotationally symmetrical cross section, such as, pipe.
According to some embodiments, the interior conduit 185 of flange connector can include flange shape end section.In some embodiments
In, the flange shape end section of the interior conduit 185 of flange connector can be attached to crossing member 234.By by flange connector
The flange shape end section of interior conduit 185 is connected to crossing member 234, and flange connector 232 is connected to crossing member connection.It is close
Sealing 191 can provide watertight connection between the interior conduit and crossing member of flange connector.
According to some embodiments, flange connector 232 may further include Outer Tube 186.The Outer Tube 186 of double-wall pipe can
To be the Part II of flange connector.Outer Tube 186 can be the exterior section of double-wall pipe.The Outer Tube 186 of flange connector can
With with rotationally symmetrical cross section, such as, pipe.The Outer Tube 186 of double-wall pipe can around double-wall pipe interior conduit 185.Double-walled
The Outer Tube 186 of pipe can be attached to target backing pipe.Seal 192 can double-wall pipe Outer Tube 186 and target backing
Watertight connection is provided between pipe 110.
According to further embodiment, flange connector can include static part and rotatable portion.Flange connector
Interior conduit 185 can be the static part of double-wall pipe.The interior conduit 185 of flange connector is positively retained at fixed position.Connection is convex
The interior conduit 185 of edge can be attached to cooling duct.Magnet assembly can be attached to cooling duct.By by the inner tube of double-wall pipe
Road 185 is maintained at fixed position, magnet assembly can be maintained at into fixed position.
The Outer Tube 186 of flange connector can be the rotatable portion of double-wall pipe.The Outer Tube 186 of flange connector can be with
It is the part of swivel joint or rotation feedthrough 175.Swivel joint or rotation feedthrough 175 can be arranged in the chamber wall of depositing device
In 215.The rotatable Outer Tube of flange connector can be attached to target backing pipe.By the Outer Tube 186 for the flange that is rotatably connected,
Can be with rotary target material backing pipe.Rotation is felt ashamed and agonized and can provide vacuum tightness between static chamber wall 215 and rotatable Outer Tube
Sealing.
During operation, target backing pipe 110 and target tube 230 (not shown in Fig. 1) can revolve around rotary shaft 200
Turn.In target backing pipe just during rotation, can be by the part being arranged in target backing pipe (such as, magnet assembly and cold
But passage) it is maintained at fixed position.By the way that the part being arranged in target backing pipe is maintained at into fixed position, magnet assembly can
At the position for being statically maintained at the magnet assembly.Along with the magnet assembly of static arrangement, from the release of rotatable target pipe
The flow directions of deposition materials can be directed to or point to coating window.
According to some embodiments that can be combined with other embodiment, rotatable sputter equipment further comprises crossing member
234.Crossing member 234 is contacted with flange connector.Flange connector 232 is connected by crossing member 234 with cooling duct 180.Intersect
Flange connector 232 is connected by element 234 in waterproof mode with cooling duct 180.According to some embodiments, crossing member 234
There is provided the displacement to cooling fluid is used to cooling fluid being directed in the cooling duct 180 through arranged offset.Cooling fluid
Displacement can be radial displacement.
According to some embodiments, crossing member 234 can be ducted body., can be by cooling fluid from even in ducted body
The interior conduit 185 for connecing flange 232 is directed to cooling duct 180.In ducted body, cooling fluid can be guided with radial displacement
Into the cooling duct through arranged offset.
According to some other embodiments, the displacement of cooling fluid can be substantially to have from accurate radial direction to deviate
Cross stream component radial displacement.In order to provide cross stream component to the displacement of cooling fluid, crossing member 234 can be angled
(angular) ducted body.Angled ducted body can provide the radial direction and transverse shift of cooling fluid.Radial displacement can be with
Cooling fluid is guided away substantially from rotary shaft 200.Transverse shift can be booted up further in the side away from interior conduit 185
Cooling fluid.
According to some embodiments, crossing member 234 can be ducted body, and the ducted body, which has, to be used to contact flange connector
The companion flange of 232 interior conduit 185.Crossing member can be ducted body, such as, cross pipeline or horizontal pipeline.Ducted body
Can be swan-neck or flexible hose.Crossing member 234 is by the same center input of cooling fluid and through eccentric or arranged offset
Cooling duct 180 is connected.Crossing member can be provided with the co-operating member for being used for that cooling duct 180 to be connected to crossing member 234
(not shown in Fig. 1).With the skew relative to rotary shaft co-operating member can be provided at crossing member 234.
Crossing member 234 can be attached to cooling duct 180.According to some embodiments, crossing member 234 can be provided with
Co-operating member for cooling duct to be connected to crossing member.Co-operating member can be arranged relative to rotation axle offset.
Can be with some embodiments that other embodiment described herein is combined, co-operating member can be any suitable connector
Or connecting element.For example, co-operating member can be the pipeline for adjusting device, engagement tabs or special size.Co-operating member can be but
Connector is not limited to, such as, socket, receptacle electrical connector, female connector, connection sleeve pipe or connecting hole.
As shown in Figures 1 and 2, the skew 207 between rotary shaft and cooling duct can be described as rotary shaft 200 away from
The distance of the center line 205 of cooling duct 180.According to some embodiments, cooling duct 180 can be with non-circular cross-section
The pipeline (not shown in Fig. 1 or Fig. 2) in face (such as, ellipse, circular segment or any irregular form).Enter one according to some
The embodiment of step, cooling duct 180 can be the pipe for DT circular cross section with external diameter.Outer diameter D T can be from cooling duct
180 outer surface is exported with the crosspoint of line 208.Line 208 can extend perpendicularly through rotary shaft 200, and along through permanent magnetic
The center line extension of body 131.
Measured along line 208, skew 207 yardstick can by cooling duct most narrow spacing of the outer surface away from rotary shaft 200
Limited from the half of the summation of ultimate range of the outer surface with cooling duct away from rotary shaft 200.Skew 207 can be from cooling
The calculation of ultimate range of the outer surface away from rotary shaft 200 of minimum range and cooling duct of the outer surface of passage away from rotary shaft 200
Art mean value calculation goes out.For the minimum and maximum distance on the not homonymy of rotary shaft 200, arithmetic average can be calculated
Value, wherein minimum and maximum distance have opposite algebraic symbol.Valuably, skew 207 is one in the length of cooling duct
Cause.
According to exemplary embodiment, the rotary shaft 200 of target backing pipe can be located at the external diameter and line of cooling duct 180
208 intersection.Cooling duct can be arranged relative to rotary shaft with the 50% of external diameter DT or lower skew.According to this
Exemplary embodiment, the internal diameter of target backing pipe can have the outer diameter D T of cooling duct size.According to aforementioned exemplary, such as scheme
The internal diameter D of target backing pipe shown in 2 can have 80mm or higher size, such as, 85mm or lower, for example, 82mm.
For example, the outer diameter D T of cooling duct can have 40mm size.Center line 205 of the rotary shaft 200 away from cooling duct 180
Skew 207 can have 20mm or lower size.
According to some embodiments explained in Fig. 2, the center line 205 of cooling duct 180 can valuably be arranged to have
Skew 207 away from rotary shaft 200.Magnet assembly in the target backing pipe 110 of minor diameter can be with the distance away from rotary shaft 200
To arrange, the distance extends in a first direction.The skew 207 of center line 205 may be located remotely from rotary shaft 200 in second direction
Upper extension, the first and second directions are opposite directions.Specifically, magnet assembly can be arranged in target backing pipe 110
In first half portion, and the cooling duct with skew 207 can be arranged in the second half portion of target backing pipe.According to some
Embodiment, rotatable sputter equipment 100 can be provided with the magnet assembly being arranged in the first half portion of target backing pipe 110, and
And cooling duct can offset 207 relative to rotary shaft 200 to arrange, skew 207 extends to the of target backing pipe 110
In two half portions, wherein the first half portion extends in a first direction away from rotary shaft 200, and the second half portion is away from rotary shaft 200
Extend in a second direction, the second direction is different from the first direction.
, can be medially by cooling fluid from cooling system according to some embodiments that can be combined with other embodiment
(not shown in Fig. 1) is fed in flange connector.Cooling fluid from the cooling system statically arranged can be fed to rotation
Turn in target backing pipe., can be by cooling fluid from the flange connector arranged with rotating shaft coaxle by crossing member 234
232 interior conduit 185 is directed to from the cooling duct 180 of the skew 207 of rotary shaft 200.Arrow 235 in Fig. 1 is explained
The displacement of the cooling fluid stream of the offer of crossing member 234 is provided.
According to some embodiments, cooling duct 180 is adapted to provide cooling fluid to target backing pipe 110.Can be by
Cooling fluid is directed in the internal capacity of target backing pipe 110 by cooling duct 180.Cooling duct can be included for each
The opening of cooling fluid on side.Cooling fluid can enter cooling duct 180 at the first end of target backing pipe.In cooling
Opening (not shown in Fig. 1) at the second end of passage 180 can provide the inside that cooling fluid enters target backing pipe
The access of volume.By the opening at second end, cooling fluid may be directed in target backing pipe.
In target backing pipe, cooling fluid can be toward the first end for being back to target backing pipe.At first end,
Target backing pipe can be provided with the outlet for cooling fluid.Outlet for cooling fluid can be by the double of flange connector 232
Wall pipe is provided.For example, the outlet for cooling fluid can be by the annular space between the interior conduit and Outer Tube of double-wall pipe
(as indicated by arrow 236) is provided.Certainly, direction or the flow direction of cooling fluid indicated by arrow 235 and 236 is only used
In explanation, and there can also be opposite direction.
Cooling fluid from cooling duct 180 to the internal capacity of target backing pipe 110 in.In order to cool down target backing pipe
110, cooling fluid back can flow between the inner surface in target backing pipe and the outer surface for the shell of magnet assembly.
In order to cool down target backing pipe, cooling fluid can be back in target backing pipe and outside cooling duct and outside magnet shell
Space in flow.Target tube 230 is attached to target backing pipe 110 using thermo-contact., can be with by cooling down target backing pipe
Cool down target tube.
According to embodiment described herein, rotatable sputter equipment is provided with magnet assembly.As explained in Fig. 2, magnet
Component is arranged in target backing pipe 110.According to some embodiments, magnet assembly may include plurality of rows of permanent magnet 130,131
With yoke 120.Magnet assembly valuably can be assembled with the permanent magnet 130,131 with pole center line 140.Permanent magnet
130th, 131 pole center line 140 substantially extends in the same direction.The magnetic pole of permanent magnet 130 can have and permanent magnetic
The opposite polarity of body 131.The orientation of the pole center line 140 as explained by the arrow in Fig. 2 has been selected as example.Make
It is also possible with the magnetic field with reversed polarity.Magnetic field line 290 explains the magnetic field generated by permanent magnet 130,131.
Plurality of rows of permanent magnet can be arranged in yoke 120.Yoke can include the substrate plate with umbo.Substrate
The length of plate can be upwardly extended in the side of rotary shaft 200.The width of substrate plate can be in the cross section of target backing pipe 110
The side of chord member is upwardly extended.The thickness of substrate plate can be upwardly extended in the side of umbo.According to more described herein
Embodiment, the yoke with umbo can make a monolithic.According to alternate embodiment, yoke and umbo can be
The different parts that can be assembled.
Umbo can be upwardly extended in the side of the chord member across rotary shaft and the cross section of target backing pipe.Dash forward at center
Rising can the extension of the thickness with than substrate plate greatly.Specifically, umbo can be with least substrate plate thickness
100% extension.
According to some embodiments, permanent magnet can be arranged along the outward flange of substrate plate.Further permanent magnet can be with
It is arranged on the umbo of yoke.The width of umbo is upwardly extended in the side of substrate plate width.Valuably, in yoke
Heart projection has adaptation to the width of the width of the permanent magnet 131 of central row.The width of permanent magnet can be wide in substrate plate
The side of degree is upwardly extended.The permanent magnet 130 of outer row and the permanent magnet 131 of central row can have identical height.
In certain embodiments, magnet assembly may further include the filling component between plurality of rows of permanent magnet
150.Magnetic sheet is maintained on its position by filling component 150, so that the position of fixed maintenance magnetic sheet.When magnetic sheet changes position,
Magnetic field may be deformed.
The magnetic field intensity of permanent magnet is relevant with the size of permanent magnet.As explained in Fig. 2, center magnet row's is permanent
Magnet 131 can have the width of the width big at least 50% for the permanent magnet arranged than outer magnet.Specifically, center magnet is arranged
Permanent magnet 131 can have the permanent magnet arranged than outer magnet width big at least 100% width.Center magnet row's
Permanent magnet 131 can have the width in the permanent magnet arranged than outer magnet about 50% to about 150%, specifically, have
Width between the permanent magnet about 75% and about 125% arranged than outer magnet, more specifically, with being arranged forever than outer magnet
(such as, width about 100%) between long magnet about 90% and about 110%.
Magnetic field by force can be by being influenceed between the permanent magnet of central row and the permanent magnet of outer row apart from S.It is beneficial
Ground, measure on the external diameter of target backing pipe 110, and the pole center line 140 between the row of permanent magnet can be apart from S
30mm or lower.Can be 15mm or higher apart from S, for example, 30mm or lower.Apart from S and the width of permanent magnet 130,131
Degree can be relevant with the minimum widith of yoke.Can be valuably nearer with the inwall away from target backing pipe 110 in target backing pipe
Distance arrange the yoke of smaller width.
Sputter plasma of the magnetically confined adjacent to the outer surface of target tube 230.As exemplarily explained in Fig. 2, forever
The orientation of magnet is provided in front of target for the sufficiently strong magnetic field of adapted sputtering performance.By what is be substantially parallel orientated
The magnetic field of permanent magnet generation further provides for the sputter plasma of narrow width.In addition, the larger width of center magnet is provided
The magnetic field of sputter plasma of the generation with narrow width.Be constrained on sputter plasma in narrower width magnetic field provide compared with
Narrow sputtering profile.Compared with the angle of distribution of standard-sized rotatable sputter equipment, narrower sputter profile can be by from splashing
The deposition material stream that injection device sprays is concentrated in narrower angle of distribution.Narrower angle of distribution more concentrates deposition material stream
To coating window, and deposition material stream is less focused on into shield.
Yoke 120 can be fixed to supporting plate 160.Magnet assembly can be surrounded by shell.Cover 170 and branch for yoke
Fagging 160 can limit the shell for magnet assembly.Magnet shell can include cover 170 and supporting plate 160.Yoke
Valuably it is made up of soft magnetic materials (such as, soft iron).
Supporting plate 160 can be made up of nonmagnetic substance.The material of supporting plate 160 can be antirust or resistant material,
Such as, stainless steel, copper, brass.Cover 170 can be made up of nonmagnetic substance.Cover 170 can be by antirust or corrosion-resistant
Material (such as, copper or brass) is made.Seal 190 can be arranged between cover 170 and supporting plate 160.Seal 190
The water-tight seal of shell for magnet assembly is provided.Watertight housing is avoided between cooling fluid and permanent magnet or yoke
Contact.
The cooling duct 180 for cooling fluid is arranged in the target backing pipe 110 of rotatable sputter equipment.Cooling
Passage is with the arranged offset relative to rotary shaft 200 in target backing pipe.The cooling duct that installing plate 210 can be attached
180.Magnet assembly can be attached to buck plate 210.Shell for magnet assembly can be attached to buck plate 210.In shell
Magnet assembly can be attached to buck plate 210.
Buck plate 210 and cooling duct 180 can be made up of non magnetic, resistant material (such as, copper or brass).Root
According to some embodiments, buck plate 210 and cooling duct 180 can be made up of identical material.Although such as the cooling explained in Fig. 2
Passage has circular cross section, however, it is understood that can use with any other cross section (such as, semicircle, rectangle or three
Angular cross section) cooling duct.According to some embodiments, cooling duct can be provided as two-tube or multitube.
Magnet assembly as explained in Fig. 2 is adapted to the target backing pipe of minor diameter.Although the yardstick of permanent magnet piece and
The thickness of yoke 120 still keeps standard magnet component quite, but the width of magnet assembly can be adapted to the target back of the body of minor diameter
The diameter of the reduction of bushing pipe.The position for the permanent magnet piece being arranged on yoke can be adapted to the song of the target backing pipe of minor diameter
Rate.In addition, skew of the magnet assembly relative to rotary shaft can be adapted to the target backing pipe of minor diameter.According to described herein
Embodiment, magnet assembly can have 35mm away from rotary shaft 200 or lower skew, for example, 15mm or higher is (such as,
Skew 20mm).
According to some embodiments, where applicable (and in the case where feature is not conflicted with one another), with reference to rotary shaft 200 with
The feature that skew 207 between cooling duct 180 is described accordingly can be applied between rotary shaft 200 and magnet assembly
Skew.
According to some embodiments that can be combined with other embodiment, target backing pipe 110 can have 95 mm or lower
Internal diameter D, for example, the internal diameter D with 70mm or higher.Specifically, target backing pipe 110 can have 85mm or lower
Internal diameter D.Target backing pipe 110 can have 80mm or higher external diameter, for example, with 100mm or lower external diameter.Specifically
For, target backing pipe 110 can have 89mm external diameter.
According to some further embodiments, the external diameter of the target tube 230 of rotatable sputter equipment can be in about 90mm extremely
In the range of about 120mm, specifically, between about 95mm and about 115mm, more specifically, between about 100mm and about 110mm, it is all
Such as, 105mm.Specifically, can be determined before the generation of any sputtering operation rotatable sputter equipment target tube 230 it is outer
Footpath.
For some reactive sputter-deposition applications, reasonably using twin cathode sputter equipment, such as, double sputter equipments.Example
Such as, for isolated material or dielectric substance (as SiO2) reactive sputtering, use double sputter equipments.Generally, using in MF frequencies
Conductive targets (such as, metal targets) of AC (exchange) power operation two in the range of rate use pair sputter equipments.According to one
A little embodiments, or, the first sputter equipment and the second sputter equipment just serve as male or female respectively, and reacting gas is added
To technique.According to embodiment described herein, double sputter equipments include a pair of rotatable sputter equipments (for example, such as this paper institutes
Rotatable sputter equipment described in the embodiment of description), such as, double rotatable sputter equipments.Double rotatable sputter equipments
First rotatable sputter equipment and the second rotatable sputter equipment can be connected to the AC power in MF frequency ranges.
Term " double rotatable sputter equipments " refers to a pair of rotatable sputtering dresses as described in embodiment herein
Put.First rotatable sputter equipment and the second rotatable sputter equipment can form double rotatable sputter equipments pair.For example, double can
Two rotatable sputter equipments of rotatable sputtering device pair can be in same depositing operation simultaneously using to coat same substrate.
Double rotatable sputter equipments can be used for the same section in synchronization coated substrate.In addition, can design in a similar way
Double rotatable sputter equipments, the similar mode means that double rotatable sputter equipments can be provided and target identical material
Material, can substantially be of the same size with substantially the same shape etc..In some cases, double rotatable sputter equipments
Arranged in depositing device or in deposition compartment (such as, sputtering compartment) adjacent to each other.
For example, rotatable sputter equipment can be retained on by one or more sputter equipment support members in deposition compartment, with
Just provided in coating window to be deposited on the material on substrate.According to can be combined with other embodiment described herein one
A little embodiments, the rotatable sputter equipments of double rotatable sputter equipments is to can be with the alternating current in intermediate frequency range
(alternative current；AC), pulse direct current (direct current；DC) pulse or Constant Direct Current power are supplied
Should.
Known rotatable sputter equipment design is not suitable for double in the compartment of the typical sizes as Coil coaters
Sputter equipment.In the past, the rotatable pair of sputter equipment that only flat double sputter equipments are used as in Coil coaters is disabled.
Embodiment described herein describes the particular design of rotatable pair of sputter equipment, and the particular design rotatable is splashed as a pair
Injection device (such as, double rotatable sputter equipments) and be coupled in the standard sputter compartment for Coil coaters.Coiled material is coated
Sputtering compartment in equipment has limited size, because sputtering compartment is around coating roller arrangement.In order to install standard scale
A pair of rotatable sputter equipments (such as, two rotatable sputter equipments), larger deposition compartment can be provided.Due to around
The space for coating roller is that limited therefore larger deposition compartment reduces the number of compartment.The number for reducing compartment is reduced
The number for the different layers that can be deposited on the substrate of a coating roller guiding.
It is not economical to expand sputtering compartment.According to double rotatable cathodes of the small yardstick of embodiment described herein very
It is coupled to well in the sputtering compartment of Coil coaters.Furthermore it is possible to adjust the magnet system in rotatable sputter equipment to enter
One step improves deposition.
For flexible or customization manufacturing purpose, thin film coated equipment can valuably be provided with the sputter equipment of appropriate type
For performing the best in quality of deposited layer by producing low cost.If can be performed in each compartment each
Individual depositing operation, then valuably may use Coil coaters or coiled material coating equipment to customization.
According to further embodiment described herein, there is provided the arrangement of a pair of rotatable sputter equipments, the arrangement
Including the first rotatable sputter equipment according to embodiment described herein and second according to embodiment described herein
Rotatable sputter equipment.As explained in Fig. 3, the arrangement may further include the deposit cavity for sputter deposition craft
Room, wherein the first rotatable sputter equipment and the second rotatable sputter equipment are arranged in a deposition chambers.Small a pair yardstick
Rotatable sputter equipment 100,101 can be arranged in deposition chambers (such as, the sputtering compartment 275 of coiled material coating equipment 300)
It is interior.A pair of rotatable double rotatable sputter equipments of the formation of sputter equipment 100,101.Double rotatable sputter equipments can be with coating roller
220 are relatively arranged.
Flexible base board can be guided by coating roller 220, such as, coiled material or paper tinsel.Coat roller 220 and gas separation unit
280 limit gap 260.Flexible base board can be guided to pass through gap 260.Sputtering compartment 275 includes shadowing elements or shield
240.It can arrange that shield is used to avoid the sidewall deposition in compartment 270.Shadowing elements can be arranged to form tool
There are the case or cabinet of hole 250.Hole 250 limits coating window.
Rotatable sputter equipment 100 and 101 each may comprise and is made up of the component of material to be deposited or material to be deposited
Target tube 230.Rotatable sputter equipment 100 and 101 is adjusted to deposit the deposition materials for substrate by coating window.
In addition, according to some embodiments, the first magnet assembly is located in the first sputter equipment, and the second magnet assembly position
In the second sputter equipment.First magnet assembly and the second magnet assembly each generate magnetic field.The magnetic generated by magnet assembly
Field generally helps to improve deposition efficiency.Furthermore, it is possible to by pro influenceing to sink using magnet assembly in sputter equipment
Product rate.
According to some embodiments, the first magnet assembly of the first rotatable sputter equipment and the second rotatable sputter equipment
Second magnet assembly can be arranged in mode inclined toward each other.The magnet assembly meaning arranged in mode inclined toward each other
The magnetic field generated by magnet assembly to point to each other.For example, extending to magnet assembly or essence from the rotary shaft 200 of sputter equipment
The radial axle at upper magnet component center can relative to the corresponding axle of other sputter equipments angle beta.
In figure 3 it can be seen that the radial axle of the first rotatable sputter equipment 101 of rotatable sputter equipment 100 and second.
First rotary shaft 200 of the first radial axle 195 from the first rotatable sputter equipment 100 extends to the center of the first magnet assembly.
Second rotary shaft 201 of the second radial axle 196 from the second rotatable sputter equipment 101 extends to the center of the second magnet assembly.
Between radial axle 195 and 196, angle beta is shown, the angle beta indicates the inclination of magnet assembly toward each other.According to some realities
Example is applied, the angle (such as, the angle beta in Fig. 3) between magnet assembly can be in following scope：About 5 ° to about 50 ° of model
In enclosing, specifically, between about 10 ° and about 40 °, or even more specifically, between about 10 ° and about 30 °.
Magnet assembly can be arranged in mode inclined toward each other so that the material of the most quantity discharged from sputtering target material
Through coating window.The sputter material of most quantity is deposited to by coating window and deposition is improved on substrate.Make magnet assembly
Deposition can be improved by tilting toward each other.Adaptation improves to the orientation of the magnet assembly of the position warp of coating window and is deposited on base
The amount of deposition materials on plate.
Magnet assembly can be arranged so as to treat that the material discharged from double rotatable sputter equipments is overlapping in coating window.Deposition
Chamber can include coating window, wherein arrange the first magnet assembly and the second magnet assembly be used for by same coating window deposition from
First rotatable sputter equipment and the material of the second rotatable sputter equipment release.
According to embodiment described herein, the first rotary shaft 200 and second of the first rotatable sputter equipment is rotatable
Second rotary shaft 201 of sputter equipment 101 is arranged in the longitudinal direction with 200mm or lower distance 225.As explained in Fig. 3
Release, the sputtering compartment 275 of coiled material coating equipment is used to providing the first rotary shaft 200 of the first rotatable sputter equipment 100 to the
The distance 225 less than about 200mm of second rotary shaft 201 of two rotatable sputter equipments 101.First rotatable sputter equipment
The distance 225 of second rotary shaft 201 of the 100 rotatable sputter equipment 101 of the first rotary shaft 200 to the second 150mm with
Between 200mm, specifically, between 160mm and 190mm, more specifically, between 170mm and 185mm, such as, 180mm.
As illustrated in fig. 3, sputter equipment is orientated in surface.However, it should be understood that this is only example, and sputter
The orientation of device and substrate can arrange that such as, sputter equipment draws close to substrate arranged, or above sputter equipment in another way
Lead substrate.
Fig. 4 explaination coiled materials coating equipment 300.Coiled material coating equipment can include being used to unwinding and/or rewinding flexibility
At least one winding chamber of substrate.Coiled material coating equipment 300 can include withdrawal roller 310, rewind roller 311 and guide reel
312.Flexible base board 330 (such as, coiled material or paper tinsel) to be coated is guided by coating roller.In addition, coiled material coating equipment can be wrapped
Include deposition chambers.In deposition chamber, some sputtering compartments 275 can be arranged.During the operation of coiled material coating equipment, wait to sink
Long-pending material (that is, deposition materials) discharges from rotatable sputter equipment 100 and/or from flat sputter equipment 320.Particle is from splashing
Injection device is sputtered out, and is deposited on coiled material or paper tinsel.
In the deposition chamber, some sputtering compartments 275 can be arranged around coating roller 220.Sputtering compartment can pass through
Compartment 270 is separated each other.In compartment, discrete atmosphere can be provided.Discrete atmosphere can be used for different deposition works
Skill.For the stacking of the sedimentary on substrate, substrate to be coated is guided to pass through different compartments.Different compartments can be provided with
It is best suited for the sputter equipment of the depositing operation performed in corresponding compartment.
However, the sputtering compartment provided in the deposition chambers of Fig. 4 coiled material coating equipment 300 has limited size.
Difference sputtering compartment can substantially have similar size.The number of sputtering compartment in deposition chambers is limited.In order to
The coiled material coating equipment in terms of sequence of layer with optimal flexibility is provided, valuably the sputtering with a variety of yardsticks can be used to fill
Put so that each compartment can be provided with each type of sputter equipment.Such sputter equipment can be for example single flat splashes
Injection device, double sputter equipments with flat target, rotatable sputter equipment and/or double rotatable sputter equipments.
The coating window limited by hole 250 can have 200mm or higher (for example, 250mm or lower) size, specifically
Ground, with the size between about 210mm and about 240mm, more specifically, with the chi between about 220mm and about 230mm
It is very little.For example, the coating window limited by hole 250 can have about 215mm size.In above-described coiled material coating equipment
In, the collection efficiency (percentage for reaching institute's releasable material of substrate) provided by 215mm coating window is about 49%.It will apply
53% can be brought up to by deposition efficiency by covering window and being widened to about 240mm size.
According to some embodiments, above-described sputter equipment can be used for the depositing isolation material on coiled material.For example, splashing
Injection device can provide target material, such as, silicon, titanium, aluminium.Together with gas access, it can for example pass through reactive sputtering process
In depositing materials on substrates, such as, silica, silicon nitride, titanium oxide, aluminum oxide, etc..In addition, rolling up as described above
Material coating equipment can be used for reactive sputtering process, such as SiO2 reactive sputtering.According to can be with other realities described herein
Apply some embodiments that example is combined, coiled material coating equipment can be provided with further equipment, such as, vavuum pump, for technique
The gas access of gas (such as, oxygen or nitrogen), heater, cooling component, drive device, etc..
According to some embodiments, above-described coiled material coating equipment and arrangement can be used in process, wherein in
Frequently (middle frequency；MF two metals) are operated (such as, with about 10kHz to the frequency range between about 100kHz)
Sputter equipment.In one embodiment, coiled material coating equipment by one sputter equipment suitable for being used as anode and by phase
Another answered is used as negative electrode.Generally, depositing device is adjusted so that sputter equipment can be handed over as the operation of anode and negative electrode
Replace.That means that the sputter equipment for being previously used as anode may be used as negative electrode, and be previously used as the sputter equipment of negative electrode can be with
Operate as anode.
Although foregoing teachings are related to embodiment of the present utility model, can also design it is of the present utility model other and enter one
Embodiment is walked without departing from base region of the present utility model, and scope of the present utility model is by appended claims are Lai really
It is fixed.
Claims (20)
1. a kind of rotatable sputter equipment (100), the rotatable sputter equipment includes：
Target backing pipe (110), the target backing pipe has rotary shaft (200)；
Magnet assembly, the magnet assembly is arranged in the target backing pipe；
Cooling duct (180), the cooling duct is used to provide cooling fluid, and the cooling duct is arranged in the target backing
In pipe；
The magnet assembly is arranged on the direction of the rotary shaft (200), and relative to the rotary shaft (200) skew；
The cooling duct is arranged on the direction of the rotary shaft (200), and relative to the rotary shaft (200) skew；
Flange connector (232), the flange connector is used to provide cooling fluid to the cooling duct, the flange connector with
Arrange the rotating shaft coaxle；And
Crossing member, the crossing member is contacted with the flange connector,
The flange connector is connected by wherein described crossing member (234) with the cooling duct.
2. rotatable sputter equipment according to claim 1, it is characterised in that the flange connector (232) includes being used for
Introduce and discharge the double-wall pipe of the cooling fluid.
3. rotatable sputter equipment according to claim 1, it is characterised in that the crossing member (234) is that have to use
In the ducted body for the companion flange for contacting the flange connector (232).
4. rotatable sputter equipment according to claim 1, it is characterised in that the crossing member (234), which is provided with, to be used for
The cooling duct (180) are connected to the co-operating member of the crossing member (234).
5. rotatable sputter equipment according to claim 4, it is characterised in that the co-operating member is provided with relative to described
The skew of the rotary shaft (200) of target backing pipe (110).
6. rotatable sputter equipment according to claim 1, it is characterised in that the crossing member (234) is bending
Pipe.
7. rotatable sputter equipment according to claim 1, it is characterised in that the crossing member (234) is flexible soft
Pipe.
8. rotatable sputter equipment according to claim 1, it is characterised in that the magnet assembly is arranged in the target
In first half portion of backing pipe (110)；And
The skew (207) of the cooling duct (180) relative to the rotary shaft (200) extends to the target backing pipe
(110) in the second half portion, wherein first half portion extends away from the rotary shaft (200) in a first direction, and institute
State the second half portion in a second direction away from the rotary shaft (200) to extend, the second direction is different from the first direction.
9. rotatable sputter equipment according to claim 1, it is characterised in that cover (170) and branch for yoke
Fagging (160) limits the shell for the magnet assembly.
10. rotatable sputter equipment according to claim 1, it is characterised in that the magnet assembly has away from the rotation
The 30mm of rotating shaft or lower skew.
11. rotatable sputter equipment according to claim 1, it is characterised in that the target backing pipe (110) has
85mm or lower internal diameter.
12. the rotatable sputter equipment according to any one of preceding claims, it is characterised in that the magnet assembly
It is used for producing magnetic field including the yoke (120) being arranged in rows and permanent magnet (130), the yoke includes having umbo
Substrate plate.
13. rotatable sputter equipment according to claim 12, it is characterised in that it is the base that the umbo, which has,
At least 100% extension of the thickness of bottom plate.
14. rotatable sputter equipment according to claim 12, it is characterised in that the permanent magnet has width, its
The width of middle center magnet row is bigger by least 50% than the width for the permanent magnet that outer body is arranged.
15. a kind of arrangement of rotatable sputter equipment pair, the arrangement is rotatable including the first rotatable sputter equipment and second
Sputter equipment, wherein the first rotatable sputter equipment is rotatable according to any one of claim 1 to 11
Sputter equipment, and the second rotatable sputter equipment is rotatable according to any one of claim 1 to 11
Sputter equipment.
16. the arrangement of rotatable sputter equipment pair according to claim 15, further comprises being used for sputter deposition craft
Deposition chambers, wherein the first rotatable sputter equipment and the second rotatable sputter equipment are arranged in a deposit cavity
In room.
17. the arrangement of rotatable sputter equipment pair according to claim 15, it is characterised in that described first rotatable splashes
The first rotary shaft (200) of injection device (100) and the second rotary shaft (201) of the second rotatable sputter equipment (101) with
200mm or lower distance (225) is arranged in the longitudinal direction.
18. the arrangement of the rotatable sputter equipment pair according to any one of claim 15 to 17, it is characterised in that institute
State the first magnet assembly of the first rotatable sputter equipment (100) and the second magnetic of the second rotatable sputter equipment (101)
Body component is arranged in mode inclined toward each other.
19. the arrangement of rotatable sputter equipment pair according to claim 16, it is characterised in that the deposition chambers include
Coat window, and the first magnet assembly and the second rotatable sputtering of wherein described first rotatable sputter equipment (100)
Second magnet assembly of device (101) is arranged for treating from the described first rotatable sputtering to deposit by the coating window
Device (100) and the material of second rotatable sputter equipment (101) release.
20. the arrangement of the rotatable sputter equipment pair according to any one of claim 15 to 17, it is characterised in that institute
State the first rotatable sputter equipment (100) and the second rotatable sputter equipment (101) is connected to AC in MF frequency ranges
Power.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621194387.XU CN206467285U (en) | 2016-10-28 | 2016-10-28 | The arrangement of rotatable sputter equipment and rotatable sputter equipment pair |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621194387.XU CN206467285U (en) | 2016-10-28 | 2016-10-28 | The arrangement of rotatable sputter equipment and rotatable sputter equipment pair |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206467285U true CN206467285U (en) | 2017-09-05 |
Family
ID=59710177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621194387.XU Active CN206467285U (en) | 2016-10-28 | 2016-10-28 | The arrangement of rotatable sputter equipment and rotatable sputter equipment pair |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206467285U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114481047A (en) * | 2022-01-26 | 2022-05-13 | 广东省新兴激光等离子体技术研究院 | Small-size workpiece coating device, vacuum coating machine and coating method thereof |
-
2016
- 2016-10-28 CN CN201621194387.XU patent/CN206467285U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114481047A (en) * | 2022-01-26 | 2022-05-13 | 广东省新兴激光等离子体技术研究院 | Small-size workpiece coating device, vacuum coating machine and coating method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI762170B (en) | Plasma processing apparatus comprising symmetric plasma process chamber and lid assembly for the same | |
| CN102859029B (en) | Apparatus for physical vapor deposition having centrally fed RF energy | |
| CN102985588A (en) | Process kit shield for improved particle reduction | |
| US20090308732A1 (en) | Apparatus and method for uniform deposition | |
| US10325763B2 (en) | Physical vapor deposition processing systems target cooling | |
| US20090308739A1 (en) | Wafer processing deposition shielding components | |
| TW201536943A (en) | Deposition system with multi-cathode and method of manufacture thereof | |
| TWI789790B (en) | Wafer processing deposition shielding components | |
| US20200185205A1 (en) | Sputtering apparatus including cathode with rotatable targets, and related methods | |
| JP2016519213A5 (en) | ||
| KR100642584B1 (en) | Direct ion deposition method using ion beam sputtering and device for the same | |
| TW201833359A (en) | Ring cathode for use in a magnetron sputtering device | |
| TWI567216B (en) | Mini rotatable sputter devices for sputter deposition | |
| CN206467285U (en) | The arrangement of rotatable sputter equipment and rotatable sputter equipment pair | |
| TWI686491B (en) | Method and process chamber for depositing material on a substrate | |
| CN104755650A (en) | Particle free rotary target and method of manufacturing thereof | |
| US20130256126A1 (en) | Substrate support with radio frequency (rf) return path | |
| TW202120722A (en) | Methods and apparatus for physical vapor deposition (pvd) dielectric deposition | |
| CN105349955B (en) | Integrated anode in magnetron sputtering apparatus and active reaction gas source device | |
| CN110100041A (en) | Depositing device, the method for being coated with flexible base board and the cated flexible base board of tool | |
| KR102195789B1 (en) | Process gas segmentation for static reactive sputter processes | |
| JP2014224284A (en) | Film deposition device and film deposition method | |
| CN111699277B (en) | Deposition apparatus, method of coating flexible substrate, and flexible substrate having coating layer | |
| CN206337307U (en) | A kind of large-scale DLC film vacuum coater | |
| CN215163072U (en) | Deposition apparatus and deposition system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |