CN206421122U - Board unit and liquid crystal display device - Google Patents

Board unit and liquid crystal display device Download PDF

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Publication number
CN206421122U
CN206421122U CN201720023190.8U CN201720023190U CN206421122U CN 206421122 U CN206421122 U CN 206421122U CN 201720023190 U CN201720023190 U CN 201720023190U CN 206421122 U CN206421122 U CN 206421122U
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China
Prior art keywords
board unit
glass substrate
covering layer
liquid crystal
contraposition
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CN201720023190.8U
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Chinese (zh)
Inventor
麻小明
都海艳
付烈稳
谭宇
陶斯思
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InfoVision Optoelectronics Kunshan Co Ltd
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InfoVision Optoelectronics Kunshan Co Ltd
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Priority to CN201720023190.8U priority Critical patent/CN206421122U/en
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Abstract

Disclose a kind of board unit and liquid crystal display device.The board unit includes:Glass substrate;Align mark, on the glass substrate, contraposition when being cut for the glass substrate;Covering layer, for covering the contraposition mark.The covering layer of the board unit covers the contraposition mark so that be assembled into using the board unit after liquid crystal display device, LCD device backlight is blocked by the covering layer, so as to prevent liquid crystal display device light leak.

Description

Board unit and liquid crystal display device
Technical field
The utility model is related to field of liquid crystal display, is filled more particularly, to a kind of board unit and a kind of liquid crystal display Put.
Background technology
Liquid crystal display module (LiquidCrystalModule, LCM) mainly includes:Backlight module, glass substrate and liquid Crystal layer.Some LCM products at this stage are in actual test application, it may occur that glass substrate edge light leak, it is glass to trace it to its cause Contraposition mark (Mark) place light leak for being used to cut contraposition of glass substrate edges.
During prepared by glass substrate, generally one piece of motherboard comprising multiple pieces of glass substrate is cut, with It is partitioned into multiple pieces of glass substrate.On motherboard, between every piece of glass substrate, generally there is contraposition mark, it is electric on cutting machine The contraposition of lotus coupling element (Charge-coupled Device, CCD) imaging sensor, the contraposition mark is, for example, one piece and engraved Dead zone.After cutting is finished, the vacancy section, which is cut, is divided into two openwork parts, in glass substrate edge, when the glass base Plate is assembled into after module, and module group backlight can cast out to form edge light leak from this hollow part.
Utility model content
In view of the above problems, the purpose of this utility model, which is to provide, a kind of can prevent the board unit of light leak.This practicality Another new purpose, which is to provide, a kind of can prevent the liquid crystal display device of light leak.
According to one side of the present utility model there is provided a kind of board unit, including:Glass substrate;Mark is aligned, positioned at institute State on glass substrate, contraposition when being cut for the glass substrate;Covering layer, for covering the contraposition mark.
Preferably, it is changed into multiple submounts after the glass substrate cutting, the contraposition mark is located at the multiple son The edge of substrate.
Preferably, the contraposition mark is multiple, and mark is aligned described in the covering layer covering part.
Preferably, the contraposition mark is the vacancy section being arranged on the glass substrate.
Preferably, the vacancy section is rectangle, circle, annular, cross.
Preferably, the covering layer is non-transparent state.
Preferably, the covering layer is pellucidity when the glass substrate is cut, and it is cut in the glass substrate After be changed into non-transparent state.
Preferably, the covering layer is located on two apparent surfaces of the glass substrate.
According to another aspect of the present utility model there is provided a kind of liquid crystal display device, including:First substrate;Second substrate; And the liquid crystal molecule between the first substrate and the second substrate;Wherein, the first substrate and described second At least one in substrate includes:According to the board unit of any of the above-described, and electrode, wherein, the liquid crystal molecule is in electricity Rotated under the electric field action that pole is produced.
According to board unit of the present utility model and the liquid crystal display device including the board unit, the covering layer hides Cover the contraposition mark so that be assembled into after liquid crystal display device using the board unit, LCD device backlight is by institute State covering layer to block, so as to prevent liquid crystal display device light leak.
In a preferred embodiment, the covering layer is pellucidity when the glass substrate is cut, in the glass It is changed into non-transparent state after substrate cut.So that easily aligned during the glass substrate cutting, and can anti-leak-stopping after cutting Light.
Brief description of the drawings
By description referring to the drawings to the utility model embodiment, of the present utility model above-mentioned and other mesh , feature and advantage will be apparent from, in the accompanying drawings:
Fig. 1 shows the top view of the board unit according to the utility model specific embodiment.
Fig. 2 shows the top view of one of submounts of the board unit according to the utility model specific embodiment.
Fig. 3 shows the partial enlargement of one of submounts of the board unit according to the utility model specific embodiment Figure.
Fig. 4 to Fig. 7 shows the schematic diagram of the cutting process of the board unit according to the utility model specific embodiment.
Embodiment
The utility model is more fully described hereinafter with reference to accompanying drawing.For the sake of clarity, the various pieces in accompanying drawing do not have Have drawn to scale.Furthermore, it is possible to not shown some known parts.It describe hereinafter of the present utility model many specific Details, but just as the skilled person will understand, this can not be realized according to these specific details Utility model.
It should be appreciated that in the structure of outlines device, being referred to as being located at another floor, another area when by a floor, a region When domain " above " or " top ", can refer to above another layer, another region, or its with another layer, it is another Also comprising other layers or region between individual region.Also, if device overturn, this layer, a region will be located at it is another Layer, another region " following " or " lower section ".
If, herein will be using " A is directly on B in order to describe located immediately at another layer, another region above scenario Face " or the form of presentation of " A is on B and abuts therewith ".In this application, " A is in B " represents that A is located in B, and And A and B is abutted directly against.
The utility model provides a kind of board unit, and it includes:Glass substrate, the contraposition on the glass substrate Mark and covering layer.The contraposition mark is used for contraposition when cutter device is cut to the glass substrate, the covering layer The contraposition mark is covered so that the board unit is assembled into after LCM, LCM backlights are blocked by the covering layer, so as to prevent The LCM light leaks.
1 and Fig. 3 illustrates the specific embodiment of board unit of the present utility model below in conjunction with the accompanying drawings.
Fig. 1 shows the substrate in batch in the top view of the board unit according to the utility model specific embodiment, the present embodiment Part includes:Glass substrate 100, contraposition mark 120 and covering layer 130.Wherein, the contraposition mark 120 is located at the glass On substrate 100, contraposition when being cut for cutter device to the glass substrate 100, the covering layer 130 covers the contraposition Mark 120.
The glass substrate 100 is changed into many height obtained after being cut in multiple submounts 110, the present embodiment after cutting Substrate 110 is, for example, rectangular slab, and multiple submounts 110 are arranged in array.The quantity of the submounts 110 obtained after cutting is not limited, A part of submounts 110 are only schematically shown in Fig. 1.In clearly showing often go in the boundary between submounts 110, Fig. 1 The boundary of adjacent submounts 110 is shown in broken lines.According to board unit of the present utility model, the contraposition mark 120 is located at The edge of the multiple submounts 110, to facilitate the contraposition of cutter device.
According to board unit of the present utility model, the submounts 110 that glass substrate 100 is obtained after cutting can be application In the color membrane substrates or array base palte of liquid crystal display device, naturally it is also possible to be other similar substrates.Due to glass substrate 100 On the covering layer 130 cover it is described contraposition mark 120 so that according to board unit of the present utility model be applied to liquid crystal After the color membrane substrates or array base palte of display device, LCD device backlight is blocked by the covering layer, so as to prevent liquid crystal Display device light leak.
Fig. 2 and Fig. 3 show the top view and partial enlargement of one of submounts 110 of the board unit of the present embodiment Figure, dotted line frame shows the amplification position of partial enlarged drawing wherein in top view.Clearly to show the position of the contraposition mark 120 And shape, in Fig. 3 partial enlarged drawing, the transparence of covering layer 130 is shown.
In the present embodiment, the contraposition mark 120 is multiple, also, the multiple contraposition mark 120 is with each two one The mode of group is arranged in the edge of the submounts 110.The covering layer 130 is also multiple, in the multiple covering layer 130 Each correspondence cover that one group (i.e. two) are described to align mark 120.It should be noted that the number of the contraposition mark 120 Amount, packet mode, the quantity of the covering layer 130 can be determined according to the actual requirements, be not limited to provide in the present embodiment Mode, for example, the multiple contraposition mark 120 is arranged in submounts using quantity such as each or three or four as one group 110 edge.For another example the covering layer 130 can cover the multiple contraposition mark 120 in one-to-one mode In each, or cover using the covering layer 130 the contraposition mark 120 of the other quantity such as three or four.
Contraposition mark 120 can be provided in the vacancy section on the edge of submounts 110, such as Fig. 2, the vacancy section It is shaped as rectangle.The covering layer 130 for covering the rectangle vacancy section is shaped as rectangle, and the covering layer 130 is in submounts It is non-transparent state on 110 so that the board unit is assembled into after LCM, was passed through originally at the contraposition mark 120 LCM backlights are blocked by the covering layer 130, so as to prevent light leakage phenomena.It is understood that the contraposition mark 120 can be with It is other forms, such as clear area, it is used for the contraposition of ccd image sensor on cutting machine, even if the contraposition mark 120 is used Vacancy section, its shape is also not necessarily limited to the other shapes such as rectangle or circle, annular, cross, hollow out cross, and The shape of covering layer 130 is not limited, as long as the contraposition mark 120 can be covered.In the present embodiment, the covering layer 130 On a surface of the glass substrate 100, in alternate embodiments, the covering layer 130 is located at the glass base On two apparent surfaces of plate 100.
Further, the contraposition mark 120 that the non-transparent material is made is, for example, red quinoid structure phenolphthalein, or Vulcanized lead, silver sulfide of black etc..Certainly, the contraposition mark 120 can be made of other non-transparent materials, but in view of institute The preparation process of board unit is stated, the quinoid structure phenolphthalein, vulcanized lead and silver sulfide are currently preferred material.
The cutting process of the board unit of the present embodiment is illustrated below in conjunction with Fig. 4 to Fig. 7, for convenience of description, with It is lower will by taking the cutting between two submounts 110 adjacent on glass substrate 100 as an example illustrate, other adjacent submounts 110 it Between cutting mode it is similar.
Such as Fig. 4, glass substrate is provided first, and it at least obtains two submounts 110 after cutting, and adjacent what is obtained Multiple contraposition marks 120 are formed at the line of demarcation of the submounts 110, the contraposition mark 120 is the vacancy section of rectangle, The multiple contraposition mark 120 is come on the line of demarcation by every predetermined quantity in the way of one group.
Such as Fig. 5, hyaline layer 140 is formed.The hyaline layer 140 is each right in the multiple hyaline layer 140 to be multiple Contraposition mark 120 described in one group should be covered.The hyaline layer 140 is made of clear material, the step of forming hyaline layer 140 E.g.:Correspond to the position wire mark colourless solution of the contraposition mark 120, the colourless solution example on the glass substrate Colourless phenolphthalein in this way.The material of the hyaline layer 140 is not limited to above-mentioned material, but in view of the preparation of the follow-up board unit Process, preferably can be with obtaining the transparent material of non-transparent material after other substance reactions.
Such as Fig. 6, adjacent submounts 110 are separated.The step can be cut using cutting machine along the line of demarcation, cut When cutting, the ccd image sensor that the cutting machine includes needs to carry out by the contraposition mark 120 on the glass substrate Contraposition, the hyaline layer 140 being covered on the contraposition mark 120 is made up of transparent material, thus does not influence the ccd image to pass The contraposition process of sensor.After cutting, the glass substrate as motherboard is divided into multiple submounts 110, the contraposition note Numbers 120 are located at the edge of the submounts 110, and its shape remains as rectangle.
Such as Fig. 7, covering layer 130 is formed.Reacted using reactant with the hyaline layer 140, form non-transparent material Covering layer 130, the covering layer 130 cover it is described contraposition mark 120, so as to prevent light leak.Form the covering layer 130 Step is, for example,:The submounts 110 that above-mentioned cutting is completed to obtain are cleaned using the solution for including the first reactant so that The hyaline layer 140 is changed into nontransparent covering layer 130.Wherein, it is phenolphthalein corresponding to the colourless solution, the present embodiment is adopted First reactant is that hydrogen ionexponent (Hydrogen ion concentration, PH) is 8.2-10.0 Alkaline solution, after cleaning, former colourless interior ester type structure phenolphthalein is changed into red quinoid knot after meeting first reactant Structure phenolphthalein, and then form the red covering layer 130.
In the above-described embodiments, the colourless solution used in the step of formation covering layer 130 is colourless phenolphthalein, correspondence The material of the covering layer 130 that the step of ground, formation covering layer 130 is formed is red quinoid structure phenolphthalein.It can manage Different colourless solutions and the combination of corresponding first reactant can be used in solution, above-mentioned steps, is finally given The material of the covering layer 130 can be corresponding different.In alternate embodiments:In the formation step of covering layer 130, Colourless phenolphthalein is replaced using colourless lead nitrate solution (or silver nitrate solution);Correspondingly, in the formation step of covering layer 130 In, use ammonium sulfide solution replace PH for 8.2-10.0 alkaline solution, then in cleaning process, the colourless solution with it is described Chemical reaction shown in following ion equation can occur for the first reactant:
Pb2++S2-=PbS ↓
(or 2Ag++S2-=Ag2S↓)
That is vulcanized lead (or silver sulfide) precipitation of generation black, namely the vulcanization that the obtained covering layer 130 is black Lead (or silver sulfide).So that the submounts 110 are assembled into after LCM, the backlight that passed through originally at the contraposition mark 120 Blocked by the covering layer 130, it is to avoid the side light leakage in the effective display area domain of the LCM (Active Area, AA) area, Improve the quality of the LCM.
According to glass substrate of the present utility model, the covering layer 130 is pellucidity when the glass substrate is cut, It is changed into non-transparent state after glass substrate cutting.So that easily being aligned during the glass substrate cutting, and cut After can prevent light leak.
The utility model also provides a kind of liquid crystal display device, including:First substrate, second substrate and positioned at described Liquid crystal molecule between one substrate and the second substrate.Wherein described second substrate includes the board unit in above-described embodiment And electrode, the liquid crystal molecule rotates under the electric field action that electrode is produced.The covering layer 130 can stop backlight, make The generation of light leakage phenomena can be prevented by obtaining the liquid crystal display device.
It should be noted that herein, such as first and second or the like relational terms are used merely to a reality Body or operation make a distinction with another entity or operation, and not necessarily require or imply these entities or deposited between operating In any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant are intended to Nonexcludability is included, so that process, method, article or equipment including a series of key elements not only will including those Element, but also other key elements including being not expressly set out, or also include being this process, method, article or equipment Intrinsic key element.In the absence of more restrictions, the key element limited by sentence "including a ...", it is not excluded that Also there is other identical element in process, method, article or equipment including the key element.
According to embodiment of the present utility model as described above, these embodiments do not have all details of detailed descriptionthe, Also it is only described specific embodiment not limit the utility model.Obviously, as described above, many modifications and change can be made Change.This specification is chosen and specifically describes these embodiments, be in order to preferably explain principle of the present utility model and it is actual should With so that skilled artisan can repairing using the utility model and on the basis of the utility model well Change and use.The utility model is only limited by claims and its four corner and equivalent.

Claims (9)

1. a kind of board unit, it is characterised in that including:
Glass substrate;
Align mark, on the glass substrate, contraposition when being cut for the glass substrate;
Covering layer, for covering the contraposition mark.
2. board unit according to claim 1, it is characterised in that be changed into multiple subbases after the glass substrate cutting Plate, the contraposition mark is located at the edge of the multiple submounts.
3. board unit according to claim 1, it is characterised in that the contraposition mark is multiple, and the covering layer hides Mark is aligned described in cover.
4. board unit according to claim 1, it is characterised in that the contraposition mark is to be arranged on the glass substrate On vacancy section.
5. board unit according to claim 4, it is characterised in that the vacancy section is rectangle, circle, annular, ten Font.
6. board unit according to claim 1, it is characterised in that the covering layer is non-transparent state.
7. board unit according to claim 6, it is characterised in that the covering layer is when the glass substrate is cut Pellucidity, non-transparent state is changed into after glass substrate cutting.
8. board unit according to claim 1, it is characterised in that the covering layer is located at two of the glass substrate On apparent surface.
9. a kind of liquid crystal display device, it is characterised in that including:
First substrate;
Second substrate;And
Liquid crystal molecule between the first substrate and the second substrate;
Wherein, at least one in the first substrate and the second substrate includes:
Board unit according to any one of claim 1-8, and
Electrode,
Wherein, the liquid crystal molecule is rotated under the electric field action that electrode is produced.
CN201720023190.8U 2017-01-10 2017-01-10 Board unit and liquid crystal display device Active CN206421122U (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107632441A (en) * 2017-10-12 2018-01-26 京东方科技集团股份有限公司 The manufacture method and display panel of display panel
CN108519709A (en) * 2018-06-01 2018-09-11 Oppo广东移动通信有限公司 Electrochromism motherboard, electrochromic cells, shell and electronic equipment
CN112719608A (en) * 2020-12-17 2021-04-30 江苏金发科技新材料有限公司 Compound capable of laser engraving red marks and preparation method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107632441A (en) * 2017-10-12 2018-01-26 京东方科技集团股份有限公司 The manufacture method and display panel of display panel
CN108519709A (en) * 2018-06-01 2018-09-11 Oppo广东移动通信有限公司 Electrochromism motherboard, electrochromic cells, shell and electronic equipment
CN112719608A (en) * 2020-12-17 2021-04-30 江苏金发科技新材料有限公司 Compound capable of laser engraving red marks and preparation method thereof
CN112719608B (en) * 2020-12-17 2023-11-24 江苏金发科技新材料有限公司 Compound capable of carrying out laser carving to obtain red marks and preparation method thereof

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Address after: 215301, 1, Longteng Road, Kunshan, Jiangsu, Suzhou

Patentee after: InfoVision Optoelectronics(Kunshan)Co.,Ltd.

Address before: 215301, 1, Longteng Road, Kunshan, Jiangsu, Suzhou

Patentee before: INFOVISION OPTOELECTRONICS (KUNSHAN) Co.,Ltd.