CN206402607U

CN206402607U - Board-level shield, component and electronic installation

Info

Publication number: CN206402607U
Application number: CN201621215350.0U
Authority: CN
Inventors: 贾森·L·斯特拉德; E·A·普拉斯; 理查德·F·希尔
Original assignee: Tianjin Laird Technologies Co Ltd
Current assignee: Tianjin Laird Technologies Co Ltd
Priority date: 2015-11-09
Filing date: 2016-11-09
Publication date: 2017-08-11
Anticipated expiration: 2026-11-09
Also published as: CN106686962A; CN106686962B

Abstract

Board-level shield, component and electronic installation.According to each side, the illustrative embodiments of the lid or cover for board-level shield are disclosed.In some illustrative embodiments, lid is typically included in the conductive porous material in thermal interfacial material.In other examples embodiment, the conductive porous material that the lid can be only including metal foam etc..

Description

Board-level shield, component and electronic installation

Technical field

The disclosure relates generally to can be used as the lid of board-level shield or the conductive porous material of cover.

Background technology

This part provides background information related to the disclosure but being not necessarily prior art.

Electronic unit (semiconductor, integrated circuit package, transistor etc.) generally has the temperature being pre-designed, at this One temperature, electronic unit is run with optimum state.Under ideal conditions, temperature of the temperature being pre-designed close to surrounding air.So And, the work of electronic unit produces heat.If not removing heat, electronic unit may be to be significantly higher than its normal or desired work Make the temperature operation of temperature.So too high temperature can be brought to the operation of the working characteristics of electronic unit and associated equipment Adverse effect.

To avoid or at least reducing due to the unfavorable working characteristics that heat is brought, heat should be removed, for example by by heat from The electronic unit of work is transmitted to radiator.Then it can cool down radiator by traditional convection current and/or radiotechnology. In conductive process, heat can contact by the direct surface between electronic unit and radiator and/or electronic unit and radiator every The contact of intermediate medium or thermal interfacial material (TIM) and be transmitted to radiator from the electronic unit in work.Thermal interfacial material Can be for the gap between filling heating surface, to be carried compared with the gap filled with air (relatively bad heat carrier) High heat transfer efficiency.

In addition, common issue is that producing electromagnetic radiation in the electronic circuit of equipment during electronic device.This radiation Electromagnetic interference (EMI) or Radio frequency interference (RFI) may be caused, this may interfere with the behaviour of other electronic equipments in certain distance Make.In the case of no fully shielding, EMI/RFI interference may cause the decay of signal of interest or lose completely, so as to cause Make electronic equipment inefficient or can not operate.

The common solution for mitigating EMI/RFI influences can be absorbed and/or reflected and/or redirect by use The shielding part of EMI energy.These shielding parts, which are typically used in, makes EMI/RFI be located in its source, and for isolation from EMI/RFI Other equipment near source.

Term " EMI " used herein above should be considered as generally including and referring to EMI transmittings and RFI transmittings, and term " electromagnetism " should be considered as generally including and referring to electromagnetism and radio frequency from external source and inside sources.Therefore, it is (used here ) term shielding widely include and refer to by absorb, reflection, stop and/or redirect energy or its it is a certain combination etc. To mitigate (or limitation) EMI and/or RFI so that EMI and/or RFI are for example for government regulation and/or for electronic unit system The built-in function of system is no longer disturbed.

Utility model content

It is applied to provide electricity at least one part on substrate there is provided a kind of according to one side of the present utility model The board-level shield BLS of magnetic disturbance EMI shieldings, it is characterised in that the BLS includes：One or more side walls, the side wall limit Fixed at least one described part for being open and being arranged to generally on the substrate is installed to the substrate；Lid, The lid is configured as the opening that covering is limited by one or more side wall, and the lid includes conductive porous material； Thus, when one or more side wall is generally installed to the substrate and described around at least one described part During the opening that lid covering is limited by one or more side wall：The lid limits the heat from least one part Conduct at least a portion on hot road；And the lid and one or more a side wall can operate for for it is described at least One part provides EMI shieldings.

Included according to one side of the present utility model there is provided one kind except heat/radiator structure, with least one part Printed circuit board (PCB) and foregoing BLS component, it is characterised in that：One or more side wall is installed to the print Printed circuit board so that the opening is above at least one described part；The lid is located in one or more side On wall so that the opening limited by one or more side wall is covered by the lid；It is described lid limit from it is described to At least a portion of a few part to the thermally conductive heat road for removing heat/radiator structure；And the BLS can be operated For providing EMI shieldings at least one described part.

According to one side of the present utility model, there is provided a kind of electronic installation including aforementioned components.

Brief description of the drawings

Accompanying drawing as described herein only for illustrating selected embodiment rather than all possible embodiment, and Be not intended to limit scope of the present disclosure.

Fig. 1 be show according to illustrative embodiments include be located in the overthe openings that are limited by BLS frameworks and The figure of the board-level shield (BLS) of the lid made electrical contact with BLS frameworks, wherein, the lid is included in the first thermal interfacial material (TIM1) conductive porous material (for example, conductive foam, net, fabric etc.) in, and also illustrate the second thermal interfacial material (TIM2) with allow to above BLS except heat/radiator structure or part are (for example, soaking device, other remove heat/radiator structure or portion Part etc.) heat transfer；

Fig. 2 is shown according to another exemplary embodiment including being located in the overthe openings limited by BLS frameworks And the figure of the board-level shield (BLS) of the lid made electrical contact with BLS frameworks, wherein, the lid is included in the first thermal interfacial material (TIM1) conductive porous material (for example, conductive foam, net, fabric etc.) in, wherein the TIM1 is configured (for example, upper It is face and more fully below extension, sufficiently thick etc.) to contact and allow to remove heat/radiator structure or part above from thermal source to BLS The heat transfer of (for example, soaking device, other except heat/radiator structure or part etc.)；

Fig. 3 is shown according to another exemplary embodiment including being located in the overthe openings limited by BLS frameworks And the figure of the board-level shield (BLS) of the lid made electrical contact with BLS frameworks, wherein, the lid is included in the second thermal interfacial material (TIM2) conductive porous material (for example, conductive foam, net, fabric etc.) in, and be also shown in below TIM2 and thermal source (example Such as, integrated circuit (IC), electronic installation, other thermals source etc.) contact the first thermal interfacial material (TIM1)；

Fig. 4 is shown according to another exemplary embodiment including being located in the overthe openings limited by BLS frameworks And the figure of the board-level shield (BLS) of the lid made electrical contact with BLS frameworks, wherein, the lid is included in thermal interfacial material Conductive porous material (for example, conductive foam, net, fabric etc.), wherein, the lid is configured (for example, molding etc.) with integratedly Including for contact thermal source (for example, integrated circuit (IC), electronic installation, other thermals source etc.) Part I (TIM1) and by Be configured to allow to above BLS except heat/radiator structure or part are (for example, soaking device, other remove heat/radiator structure or part Deng) heat transfer Part II (TIM2)；

Fig. 5 be show according to illustrative embodiments include be located in the overthe openings that are limited by BLS frameworks and The board-level shield (BLS) of the metal foam lid made electrical contact with BLS frameworks, and also illustrate that permission removes hot/scattered to above BLS The thermal interfacial material (TIM2) of the heat transfer of heat structure or part (for example, soaking device, other except heat/radiator structure or part etc.) Figure；

Fig. 6 is shown according to another exemplary embodiment including being located in the overthe openings limited by BLS frameworks And with BLS frameworks make electrical contact with metal foam lid board-level shield (BLS) figure, wherein, the metal foam lid by with (for example, fully extension, sufficiently thick etc. above and below) is put to contact and allow to remove hot/scattered above from thermal source to BLS The heat transfer of heat structure or part (for example, soaking device, other except heat/radiator structure or part etc.)；

Fig. 7 is shown according to another exemplary embodiment including being located in the overthe openings limited by BLS frameworks And with BLS frameworks make electrical contact with metal foam lid board-level shield (BLS), and be also shown in below metal foam lid with The figure of the thermal interfacial material (TIM1) of thermal source (for example, integrated circuit (IC), electronic installation, other thermals source etc.) contact；And

Fig. 8 is shown according to another exemplary embodiment including being located in the overthe openings limited by BLS frameworks And with BLS frameworks make electrical contact with metal foam lid board-level shield (BLS) figure, wherein, it is described lid be configured (for example, Molding etc.) it is used to contact the first of thermal source (for example, integrated circuit (IC), electronic installation, other thermals source etc.) to integrally comprise Part and being configured as allow to above BLS except heat/radiator structure or part are (for example, soaking device, other remove heat/radiating Structure or part etc.) heat transfer Part II.

Through multiple accompanying drawings, correspondence label indicates corresponding component.

Embodiment

Example embodiment is described in detail more fully hereinafter below with reference to accompanying drawings.

Disclosed herein is the illustrative embodiments of the lid for board-level shield or cover.In some illustrative embodiments In, BLS lids are typically included in conductive porous material or structure (for example, conductive foam, net, fabric etc.) in thermal interfacial material. In such illustrative embodiments, BLS lids can allow to improve from thermal source while enough shielding validity is maintained Heat transfer, be easy to do over again and/or reduce weight (for example, the weight of conductive porous material be smaller than standard steel BLS lid etc.).

As an example, thermal interfacial material (TIM) and conductive porous material or structure in thermal interfacial material are (for example, lead Electric foam, net, fabric etc.) it can be configured as playing a part of for providing the lid in the BLS that EMI is shielded or can be used as described Lid operation.Conductive structure in TIM can be TIM infiltrations and metal foam, the wire netting that can be made electrical contact with BLS fences Deng.In the exemplary embodiment, including the TIM of conductive mesh or foam may be disposed in BLS so that by with BLS fences Be grounded and provided by the continuous conduction structure of the opposite fine in TIM EMI shielding.Do not include conductive mesh or foam One or more additional TIM can be located at the top of TIM, above and/or below.TIM can be with integrated circuit or other thermals source Contact, one or more additional TIM it is accessible and/or allow soaking device above from from IC to BLS or it is other except heat/ The heat transfer of radiator structure.Alternatively, dielectric or non-conductive TIM can contact IC, including the TIM of conductive foam or net can be in dielectric TIM and BLS top is to realize shielding validity.

Other examples embodiment can only include having in TIM, the single TIM conductive network or structure with from IC (or other thermals source) except heat and by it is hot be outwards transferred to BLS or in addition to (to soaking device or other surfaces).With conductive structure TIM can be provided by being contacted with BLS fences EMI shielding.In additional example embodiment, including conductive foam, net Deng two or more various sizes of TIM can be stacked.As another example, include the single TIM of conductive foam, net etc. Can be molded so that the molding TIM including conductive foam, net etc. has to be used to contact IC's (or other thermals source) in side First smaller portions and opposite side will contact BLS fences the second major part.

Fig. 1 shows to implement the exemplary reality of the board-level shield (BLS) 100 of one or more various aspects of the disclosure Apply mode.As shown in figure 1, BLS 100 includes lid 104 and framework or fence 108.Framework 108 includes one or more sides Wall 112, the side wall 112 is arranged to install (for example, welding etc.) to (in a broad aspect, the base of printed circuit board (PCB) (PCB) 116 Plate) one or more parts (for example, device 120 etc.) generally on the PCB 116.In this example, framework 108 is wrapped Include the periphery flange 124 extended internally from the top of side wall 112.Periphery flange 124 limits opening 128.Alternatively, framework can not have There is flange (flange not extended internally).Therefore, BLS lids disclosed herein should be not limited to and any specific BLS Framework, fence or side wall are used together.

BLS lids 104 be included in conductive porous material in the first thermal interfacial material (TIM1) 132 or structure 148 (for example, Conductive foam, net, fabric etc.).BLS lids 104 and opening 128 are configured (for example, be sized with shape etc.) to cause opening 128 will be covered by BLS lids 104.BLS lids 104 can prevent or at least prevent EMI by (for example, into, leave, leak, escape Ease etc.) opening 128.BLS lids 104 and BLS frameworks 108 are operable for providing electromagnetic interference for internal device 120 (EMI) shield or shield the shell limited by BLS lids 104 and the cooperation of BLS frameworks 108.

First thermal interfacial material 132 can be along the outer surface of conductive porous material 148 or outside setting.First hot interface material Material 132 also may be disposed in hole, gap, opening, hole of conductive porous material 148 etc..Conductive porous material 148 can be In one thermal interfacial material 132 or inside provides or limited the continuous conduction structure of opposite fine.

In some illustrative embodiments, the first thermal interfacial material 132 can be dielectric or nonconducting.It is conductive Porous material 148 can be configured as making electrical contact with the flange 124 of BLS frameworks 108.For example, conductive porous material 148 may include to dash forward Go out or extend to the end for the flange 124 for outside the first thermal interfacial material 132 and directly contacting BLS frameworks 108.

In other examples embodiment, the first thermal interfacial material 132 can be conductive.In this case, lead Electric porous material 148 can still be configured as making electrical contact with the flange 124 of BLS frameworks 108.Alternatively, alternatively, conductive porous Material 148 can be included, cover and/or encapsulated by the first thermal interfacial material 132.In this later example, the first hot interface material Material 132 can make electrical contact with the flange 124 of BLS frameworks 108.

In this exemplary embodiment, the first thermal interfacial material (TIM1) 132 extend through BLS opening 128 in order to Contact device 120 (in a broad aspect, thermal source).Second thermal interfacial material (TIM2) 136 is on BLS lids 104 or top.The Two thermal interfacial materials 136 extend upwardly to BLS lids 104 above in order to the soaking device above BLS 100 or it is other except heat/ Radiator structure or component contact simultaneously allow to its heat transfer.First thermal interfacial material 132 and the second thermal interfacial material 136 can be wrapped Include identical or different thermal interfacial material.

First thermal interfacial material (TIM1) 132, conductive porous material 148, the second thermal interfacial material (TIM2) 136, BLS The size of framework 108 and opening 128 can change according to concrete application.For example, TIM1 and/or TIM2 size may depend on heat The relative size of performance requirement and/or other parts.TIM1 thickness may depend on the relatively high of BLS frameworks 108 and thermal source 120 Degree.For example, the thickness of BLS lids 104 (and its first thermal interfacial material 132 and conductive porous material 148) is preferably more than device The difference of height and the height of BLS frameworks 108, with allow in the final product the first thermal interfacial material 132 be located against device 120 and press Contracting.In addition, for example, area occupied or the periphery of BLS lids 104 (and its first thermal interfacial material 132 and conductive porous material 148) Length is smaller than, equal to or more than the area occupied of device 120.BLS lids 104 (and its first thermal interfacial material 132 and conductive porous Material 148) it is preferably sufficiently large with the whole opening 128 of covering.

Occupancy face of the area occupied or outer perimeter of second thermal interfacial material (TIM2) 136 preferably about with BLS frameworks 108 Product formed objects or the area occupied less than BLS frameworks 108 so that the second thermal interfacial material (TIM2) 136 will not be to extension Extend over BLS frameworks 108.For example, the area occupied or outer perimeter of the second thermal interfacial material (TIM2) 136 are smaller than BLS frameworks 108 area occupied, but it is greater than the area occupied of BLS lids 104.

BLS lids 104 can be configured as connection (for example, being attached by adhesive, mechanically and/or can departing from mode Attachment etc.) arrive BLS frameworks 108.For example, BLS lids 104 can be come such as by using conductive or dielectric contact adhesive (PSA) It is attached to the periphery flange 124 of BLS frameworks 108.BLS lids 104 can be attached to BLS frameworks 108 according to that can depart from mode so that BLS lids 104 can be removed to allow for close to the device 120 on PCB 116 or other parts (for example, for safeguarding, testing, repair Reason, replacing electronic unit etc.).

As shown in figure 1, BLS frameworks 108 can be coupled (for example, welding etc.) to PCB 116 so that BLS frameworks 108 are total Set on body around device 120.BLS lids 104 can be positioned relative to the opening 128 limited by BLS frameworks 108, so as to cover Or closing opening 128.In this example, the first thermal interfacial material 132 and conductive porous material 148 are located in opening 128 And extend through opening 128 so that the first thermal interfacial material 132 contact device 120 is (for example, directly contact, the first hot boundary There is no any intermediate member or gap between facestock material 132 and the grade of device 120).Second thermal interfacial material 136 can contact soaking device (not shown) is other except heat/radiator structure (for example, directly contacting, does not have between the second thermal interfacial material 136 and soaking device etc. There are any intermediate member or gap).Therefore, the first thermal interfacial material (TIM1) 132 and the second thermal interfacial material (TIM2) 136 can Cooperate with limit from device 120 (in a broad aspect, thermal source) to soaking device (in a broad aspect, except heat/radiator structure) can be from device 120 transmit or conduct thermally conductive heat road, hot joint, interface or the path of heat to soaking device.In addition, BLS lids 104 and BLS frameworks 108 it is operable for for device 120 provide electromagnetic interference (EMI) shielding.

Fig. 2 shows to implement another example of the board-level shield (BLS) 200 of one or more various aspects of the disclosure Property embodiment.As shown in Fig. 2 BLS 200 includes lid 204 and framework or fence 208.Framework 208 includes one or more (in a broad aspect, side wall 212, the side wall 212 is arranged to install (for example, welding etc.) to printed circuit board (PCB) (PCB) 216 Substrate) one or more parts (for example, device 220 etc.) generally on the PCB 216.In this example, framework 208 Including the periphery flange 224 extended internally from the top of side wall 212.Periphery flange 224 limits opening 228.Alternatively, framework can There is no flange (flange not extended internally).Therefore, BLS disclosed herein lid should be not limited to it is any specific BLS frameworks, fence or side wall are used together.

BLS lids 204 be included in conductive porous material in the first thermal interfacial material (TIM1) 232 or structure 248 (for example, Conductive foam, net, fabric etc.).BLS lids 204 and opening 228 are configured (for example, be sized with shape etc.) to cause opening 228 will be covered by BLS lids 204.BLS lids 204 can prevent or at least prevent EMI via opening 228 by (for example, into, Leave, leak, escape).BLS lids 204 and BLS frameworks 208 are operable for providing electromagnetic interference for internal device 220 (EMI) shield or shield the shell limited by BLS lids 204 and the cooperation of BLS frameworks 208.

First thermal interfacial material 232 can be along the outer surface of conductive porous material 248 or outside setting.First hot interface material Material 232 may be disposed in hole, gap, opening, hole of conductive porous material 248 etc..Conductive porous material 248 can be In one thermal interfacial material 232 or inside provides or limited the continuous conduction structure of opposite fine.

In some illustrative embodiments, the first thermal interfacial material 232 can be dielectric or nonconducting.It is conductive Porous material 248 can be configured as making electrical contact with the flange 224 of BLS frameworks 208.For example, conductive porous material 248 may include to dash forward Go out or extend to the end for the flange 224 for outside the first thermal interfacial material 232 and directly contacting BLS frameworks 208.

In other examples embodiment, the first thermal interfacial material 232 can be conductive.In this case, lead Electric porous material 248 can still be configured as making electrical contact with the flange 224 of BLS frameworks 208.Alternatively, alternatively, conductive porous Material 248 can be included, cover and/or encapsulated by the first thermal interfacial material 232.In this later example, the first hot interface material Material 232 can make electrical contact with the flange 224 of BLS frameworks 208.

In this exemplary embodiment, the first thermal interfacial material (TIM1) 232 is in BLS openings 228 and also extends Through BLS openings 228.First thermal interfacial material (TIM1) 232 is configured (for example, fully extending above and below, enough Thickness etc.) to contact and allow from device 220 (in a broad aspect, thermal source) to soaking device (not shown) (in a broad aspect, except heat/radiating Structure or part) heat transfer.Therefore, this illustrative embodiments does not include being located in or being layered in the first thermal interfacial material Second thermal interfacial material (TIM2) at 232 top.

First thermal interfacial material (TIM1) 232, conductive porous material 248, BLS frameworks 208 and be open 228 size can root Change according to concrete application.For example, TIM1 size may depend on the relative size of performance requirements and/or other parts. TIM1 thickness may depend on the relative altitude of BLS frameworks 208 and thermal source 220.For example, BLS lids 204 (and its first hot interface material Material 232 and conductive porous material 248) thickness be preferably more than element height and BLS frameworks 208 height difference and BLS The distance between the top of framework 208 and soaking device sum.This can allow in the final product the first thermal interfacial material 232 by Compressed by device 220 and soaking device.In addition, for example, BLS lids 204 (and its first thermal interfacial material 232 and conductive porous material 248) area occupied or outer perimeter is smaller than, equal to or more than the area occupied of device 220.BLS lids 204 (and its first heat Boundary material 232 and conductive porous material 248) it is preferably sufficiently large with the whole opening 228 of covering.

BLS lids 204 can be configured as connection (for example, being attached by adhesive, mechanically and/or can departing from mode Attachment etc.) arrive BLS frameworks 208.For example, BLS lids 204 can be come such as by using conductive or dielectric contact adhesive (PSA) It is attached to the periphery flange 224 of BLS frameworks 208.BLS lids 204 can be attached to BLS frameworks 208 according to that can depart from mode so that BLS lids 204 can be removed to allow for close to the device 220 on PCB 216 or other parts (for example, for safeguarding, testing, repair Reason, replacing electronic unit etc.).

As shown in Fig. 2 BLS frameworks 208 can be coupled (for example, welding etc.) to PCB 216 so that BLS frameworks 208 are total Set on body around device 220.BLS lids 204 can be positioned relative to the opening 228 limited by BLS frameworks 208, so as to cover Or closing opening 228.In this example, the first thermal interfacial material 232 and conductive porous material 248 are located in opening 228 And extend through opening 228 so that the first thermal interfacial material 232 contact device 220 is (for example, directly contact, the first hot boundary There is no any intermediate member or gap between facestock material 232 and the grade of device 220).First thermal interfacial material 232 also can contact soaking Device (not shown) is other except heat/radiator structure (for example, directly contacting, does not have between the first thermal interfacial material 232 and soaking device etc. There are any intermediate member or gap).Therefore, the first thermal interfacial material 232 can be limited from device 220 (in a broad aspect, thermal source) extremely The thermally conductive heat road that can be transmitted from device 220 to soaking device or conduct heat of soaking device (in a broad aspect, except heat/radiator structure), Hot joint, interface or path.In addition, BLS lids 204 and BLS frameworks 208 it is operable for for device 220 provide electromagnetic interference (EMI) shield.

Fig. 3 shows to implement another example of the board-level shield (BLS) 300 of one or more various aspects of the disclosure Property embodiment.As shown in figure 3, BLS 300 includes lid 304 and framework or fence 308.Framework 308 includes one or more (in a broad aspect, side wall 312, the side wall 312 is arranged to install (for example, welding etc.) to printed circuit board (PCB) (PCB) 316 Substrate) one or more parts (for example, device 320 etc.) generally on the PCB 316.In this example, framework 308 Including the periphery flange 324 extended internally from the top of side wall 312.Periphery flange 324 limits opening 328.Alternatively, framework can There is no flange (flange not extended internally).Therefore, BLS disclosed herein lid should be not limited to it is any specific BLS frameworks, fence or side wall are used.

BLS lids 304 be included in conductive porous material in the second thermal interfacial material (TIM1) 336 or structure 348 (for example, Conductive foam, net, fabric etc.).BLS lids 304 and opening 328 are configured (for example, be sized with shape etc.) to cause opening 328 will be covered by BLS lids 304.BLS lids 304 can prevent or at least prevent EMI via opening 328 by (for example, into, Leave, leak, escape).BLS lids 304 and BLS frameworks 308 are operable for providing electromagnetic interference for internal device 320 (EMI) shield or shield the shell limited by BLS lids 304 and the cooperation of BLS frameworks 308.

Second thermal interfacial material 336 can be along the outer surface of conductive porous material 348 or outside setting.Second hot interface material Material 336 also may be disposed in hole, gap, opening, hole of conductive porous material 348 etc..Conductive porous material 348 can be In two thermal interfacial materials 336 or inside provides or limited the continuous conduction structure of opposite fine.

In some illustrative embodiments, the second thermal interfacial material 336 can be dielectric or nonconducting.It is conductive Porous material 348 can be configured as making electrical contact with the flange 324 of BLS frameworks 308.For example, conductive porous material 348 may include to dash forward Go out or extend to the end for the flange 324 for outside the second thermal interfacial material 336 and directly contacting BLS frameworks 308.

In other examples embodiment, the second thermal interfacial material 336 can be conductive.In this case, lead Electric porous material 348 can still be configured as making electrical contact with the flange 324 of BLS frameworks 308.Alternatively, alternatively, conductive porous Material 348 can be included, cover and/or encapsulated by the second thermal interfacial material 336.In this later example, the second hot interface material Material 336 can make electrical contact with the flange 324 of BLS frameworks 308.

In this exemplary embodiment, the second thermal interfacial material (TIM2) 336 be located in BLS opening 328 top and The top of BLS frameworks 308.Second thermal interfacial material 336 can extend upwardly to BLS frameworks 308 above in order to on BLS 300 The soaking device in face other except heat/radiator structure or component contact and allows to its heat transfer.

First thermal interfacial material 332 can set or limit the bottom of BLS lids 304 along the bottom of BLS lids 304.First Thermal interfacial material 332 can contact device 320 (in a broad aspect, thermal source).First thermal interfacial material 332 and the second thermal interfacial material 336 may include identical or different thermal interfacial material.

First thermal interfacial material (TIM1) 332, conductive porous material 348, the second thermal interfacial material (TIM2) 336, BLS frames The size of frame 308 and opening 328 can change according to concrete application.For example, TIM1 and/or TIM2 size may depend on it is hot Energy requirement and/or the relative size of other parts.TIM1 thickness may depend on the relative altitude of BLS frameworks 308 and thermal source 320. For example, the thickness of the first thermal interfacial material 332 is preferably more than the difference of the height of element height and BLS frameworks 308, to allow The first thermal interfacial material 332 is located against device 320 and compressed in final products.In addition, for example, first thermal interfacial material 332 is accounted for It is smaller than with area or outer perimeter, equal to or more than the area occupied of device 320.

BLS lids 304 (and its second thermal interfacial material 336 and conductive porous material 348) are preferably sufficiently large whole to cover Opening 328.In this shown example, the area occupied of BLS lids 304 or periphery are about the area occupied with BLS frameworks 308 Formed objects.The thickness of BLS lids 304 can be more than the distance between top and soaking device of BLS frameworks 308, to allow final The second thermal interfacial material 336 is located against soaking device compression in product.

BLS lids 304 can be configured as connection (for example, being attached by adhesive, mechanically and/or can departing from mode Attachment etc.) arrive BLS frameworks 308.For example, BLS lids 304 can be come such as by using conductive or dielectric contact adhesive (PSA) It is attached to the periphery flange 324 of BLS frameworks 308.BLS lids 304 can be attached to BLS frameworks 308 according to that can depart from mode so that BLS lids 304 can be removed to allow for close to the device 320 on PCB 316 or other parts (for example, for safeguarding, testing, repair Reason, replacing electronic unit etc.).

As shown in figure 3, BLS frameworks 308 can be coupled (for example, welding etc.) to PCB 316 so that BLS frameworks 308 are total Set on body around device 320.BLS lids 304 can be positioned relative to the opening 328 limited by BLS frameworks 308, so as to cover Or closing opening 328.In this example, the first thermal interfacial material 332 is located in opening 328 and extends through opening 328.First thermal interfacial material 332 contact device 320 (for example, directly contact, the first thermal interfacial material 332 and the grade of device 320 it Between there is no any intermediate member or gap).Second thermal interfacial material 336 can contact soaking device (not shown) or other except hot/scattered Heat structure (for example, directly contacting, does not have any intermediate member or gap) between the second thermal interfacial material 336 and soaking device etc.. Therefore, the first thermal interfacial material (TIM1) 332 and the second thermal interfacial material (TIM2) 336 can be cooperated (wide from device 320 to limit Free burial ground for the destitute says, thermal source) can be transmitted from device 320 to soaking device or conduct heat to soaking device (in a broad aspect, except heat/radiator structure) Thermally conductive heat road, hot joint, interface or path.In addition, BLS lids 304 and BLS frameworks 308 are operable for for device 320 Electromagnetic interference (EMI) shielding is provided.

Fig. 4 shows to implement another example of the board-level shield (BLS) 400 of one or more various aspects of the disclosure Property embodiment.As shown in figure 4, BLS 400 includes lid 404 and framework or fence 408.BLS frameworks 408 include side wall 412 with And the periphery flange 424 extended internally from the top of side wall 412.Periphery flange 424 limits opening 428.Alternatively, framework can not have There is flange (flange not extended internally).Therefore, BLS lids disclosed herein should be not limited to and any specific BLS Framework, fence or side wall are used together.

BLS lids 404 be included in conductive porous material in thermal interfacial material 430 or structure 448 (for example, conductive foam, Net, fabric etc.).Thermal interfacial material 430 can be along the outer surface of conductive porous material 448 or outside setting.Thermal interfacial material 432 Also it may be disposed in hole, gap, opening, hole of conductive porous material 448 etc..Conductive porous material 148 can be at hot interface In material 432 or inside provides or limited the continuous conduction structure of opposite fine.

In this exemplary embodiment, BLS lids 404 are configured (for example, molding etc.) with including the He of Part I 432 Part II 436.Part I 432 can be arranged to contact PCB 416 on device 420 (for example, integrated circuit (IC), Electronic installation, other thermals source etc.).Part II 436 can be configured (for example, be sized with shape etc.) to cover opening 428, And prevent or at least prevent EMI from passing through (for example, into, leave, leak, escape) via opening 428.Part II 436 are also configured to contact and allow to the soaking device above BLS 400 or except the heat of heat/radiator structure or part is passed Pass.Therefore, the Part I 432 and Part II 436 of BLS lids 404 can also be respectively referred to as the first thermal interfacial material (TIM1) 432 and second thermal interfacial material (TIM2) 436.

In this exemplary embodiment, BLS lids 404 integrally comprise the first thermal interfacial material 432 and the second hot interface Both materials 436.BLS lids 404 and BLS frameworks 408 are operable for providing electromagnetic interference (EMI) for internal device 420 The shell that shielding or shielding are limited by BLS lids 404 and the cooperation of BLS frameworks 408.

In some illustrative embodiments, thermal interfacial material 430 can be dielectric or nonconducting.It is conductive porous Material 448 can be configured as making electrical contact with the flange 424 of BLS frameworks 408.For example, conductive porous material 448 may include to protrude Or extend to the end for the flange 424 for outside thermal interfacial material 430 and directly contacting BLS frameworks 408.

In other examples embodiment, thermal interfacial material 430 can be conductive.In this case, it is conductive many Porous materials 448 can still be configured as making electrical contact with the flange 424 of BLS frameworks 408.Alternatively, alternatively, conductive porous material 448 can be included, cover and/or be encapsulated by thermal interfacial material 430.In this later example, thermal interfacial material 430 can make electrical contact with The flange 424 of BLS frameworks 408.

First thermal interfacial material (TIM1) 432, conductive porous material 448, the second thermal interfacial material (TIM2) 436, BLS The size of framework 408 and opening 428 can change according to concrete application.For example, TIM1 and/or TIM2 size may depend on heat The relative size of performance requirement and/or other parts.TIM1 thickness may depend on the relatively high of BLS frameworks 408 and thermal source 420 Degree.For example, the thickness of Part I or the first thermal interfacial material (TIM1) 432 is preferably more than element height and BLS frameworks 408 Height difference, with allow in the final product the first thermal interfacial material 432 be located against device 420 and compress.In addition, for example, The area occupied or outer perimeter of one thermal interfacial material 432 are smaller than, equal to or more than the area occupied of device 420.

Part II or the second thermal interfacial material 436 are preferably sufficiently large with the whole opening 428 of covering.In this shown example In, the area occupied or periphery of Part II or the second thermal interfacial material 436 are about identical with the area occupied of BLS frameworks 408 Size.The thickness of Part II or the second thermal interfacial material 436 can be more than BLS frameworks 408 top and soaking device between away from From with permission, the second thermal interfacial material 436 is located against soaking device compression in the final product.

BLS lids 404 can be configured as connection (for example, being attached by adhesive, mechanically and/or can departing from mode Attachment etc.) arrive BLS frameworks 408.For example, BLS lids 404 can be come such as by using conductive or dielectric contact adhesive (PSA) It is attached to the periphery flange 424 of BLS frameworks 408.BLS lids 404 can be attached to BLS frameworks 408 according to that can depart from mode so that BLS lids 404 can be removed to allow for close to the device 420 on PCB 416 or other parts (for example, for safeguarding, testing, repair Reason, replacing electronic unit etc.).

As shown in figure 4, BLS frameworks 408 can be coupled (for example, welding etc.) to PCB 416 so that BLS frameworks 408 are total Set on body around device 420.BLS lids 404 can be positioned relative to the opening 428 limited by BLS frameworks 408, so as to cover Or closing opening 428.In this example, the first thermal interfacial material 432 is located in opening 428 and extends through opening 428 so that the first thermal interfacial material 432 contact device 420 is (for example, directly contact, the first thermal interfacial material 432 and device 420 There is no any intermediate member or gap Deng between).Second thermal interfacial material 436 can contact soaking device (not shown) or other remove Heat/radiator structure (for example, directly contact, do not have between the second thermal interfacial material 436 and soaking device etc. any intermediate member or Gap).Therefore, the first thermal interfacial material (TIM1) 432 and the second thermal interfacial material (TIM2) 436 can be cooperated to limit from device 420 (in a broad aspect, thermals source) to soaking device (in a broad aspect, except heat/radiator structure) can be transmitted from device 420 to soaking device or Conduct thermally conductive heat road, hot joint, interface or the path of heat.In addition, BLS lids 404 and BLS frameworks 408 it is operable for for Device 420 provides electromagnetic interference (EMI) shielding.

In other examples embodiment, BLS is covered (for example, 504 (Fig. 5), 604 (Fig. 6), 704 (Fig. 7), 804 (Fig. 8) Deng) it can only include the conductive porous material of such as metal foam, it is not set in any thermal interfacial material etc..As showing Example, conductive porous material only can be made up of metal foam, and the metal foam is configured as playing for providing the EMI BLS of shielding In lid effect or can be used as it is described lid operation.Metal foam may also function as example from thermal source (for example, integrated circuit (IC), electronic installation, other thermals source etc.) to except heat/radiator structure or part are (for example, soaking device, other remove heat/radiator structure Or part etc.) etc. the TIM of transmission heat effect or can be operated as the TIM.One or more TIM may be disposed at gold Belong to the top of foam, bottom, above and/or below.One or more TIM can set up heat with metal foam cooperation Bang path and allow from the thermal source below BLS to BLS above except the heat transfer of heat/radiator structure.Dielectric is non-conductive TIM can contact thermal source, and metal foam can allow to shield validity at dielectric TIM and BLS top.

Although in polymer thermal interface materials use the certain increased thermal conductivity of conductive porous material, necessarily deflect with The thermal source shielded is set to alleviate path contacts with radiator or other heat.Advantageously, it is used as BLS using metal foam or net Lid, cover or top one or more (but maying not any or all) in following advantages can be presented, for example using compression with And the lacking for material of interface zone is pushed out during compressing and thermal conductivity is improved.The hot property of metal foam should be with gold Category foam is improved or increased by compression.Therefore, during assembly, interfacial gap reduction is more, and not only thermal resistance is due to thickness Reduce and reduce, and this advantage is enlarged, because the thermal conductivity increase (the more metals of per unit volume) of metal foam or net. As compression extrudes air from metal foam or net, metal foam or net will not be considerably expanded to outside when compressed. By contrast, polymer or the net filled with polymer are not real compressible, because material necessarily deflects out the area at interface To allow thickness to reduce outside domain, therefore reduce thermal resistance.Cover or cover as BLS by using metal foam or net TIM, can be saturating Cross metal foam or net checks, watches or observed the part below BLS, because compared with solid or perforation metallic shield, can See clearly at least partially through metal foam or net., can be by controlling the hole size of net come control flow using metal foam or net Performance is covered to work at various frequencies.

Fig. 5 shows to implement the exemplary reality of the board-level shield (BLS) 500 of one or more various aspects of the disclosure Apply mode.As shown in figure 5, BLS 500 includes lid 504 and framework or fence 508.Framework 508 includes one or more side walls 512, the side wall 512 is arranged to install (for example, welding etc.) to (in a broad aspect, the base of printed circuit board (PCB) (PCB) 516 Plate) one or more parts (for example, device 520 etc.) generally on the PCB 516.In this example, framework 508 is wrapped Include the periphery flange 524 extended internally from the top of side wall 512.Periphery flange 524 limits opening 528.Alternatively, framework can not have There is flange (flange not extended internally).Therefore, BLS lids disclosed herein should be not limited to and any specific BLS Framework, fence or side wall are used together.

BLS lids 504 include the conductive porous material or structure 548 of metal foam or net etc..For example, BLS lids 504 It can only be made up of, and be not provided with the hole in metal foam or net 548, gap, opening, hole etc. metal foam or net 548 Any polymer thermal interface materials.

BLS lids 504 and opening 528 are configured (for example, be sized with shape etc.) with so that opening 528 will be covered by BLS 504 coverings.BLS lids 504 can prevent or at least prevent EMI via opening 528 by (for example, into, leave, leak, escape Deng).BLS lids 504 and BLS frameworks 508 it is operable for for internal device 520 provide electromagnetic interference (EMI) shielding or Shield the shell limited by BLS lids 504 and the cooperation of BLS frameworks 508.

In this exemplary embodiment, metal foam or net 548 extend through BLS openings 528 to contact device 520 (in a broad aspect, thermals source).Thermal interfacial material (TIM2) 536 is on BLS lids 504 or top.Thermal interfacial material 536 to On extend to BLS lids 504 above in order to the soaking device above BLS 500 or it is other remove heat/radiator structure or component contact And allow to its heat transfer.

Metal foam or net 548, thermal interfacial material (TIM2) 536, BLS frameworks 508 and 528 size of being open can be according to tools Body is applied and changed.For example, metal foam or net 548 and/or TIM2 536 size may depend on performance requirements and/or its The relative size of its part.The thickness of metal foam or net 548 may depend on the relative altitude of BLS frameworks 508 and thermal source 520. For example, the thickness of metal foam or net 548 is preferably more than the difference of the height of element height and BLS frameworks 508, to allow Metal foam or net 548 are located against device 520 and compressed in final products.In addition, for example, the occupancy face of metal foam or net 548 Product or outer perimeter are smaller than, equal to or more than the area occupied of device 520.Metal foam or net 548 are preferably sufficiently large with covering Whole opening 528.

Area occupied phase of the area occupied or outer perimeter of thermal interfacial material (TIM2) 536 preferably about with BLS frameworks 508 With size or less than the area occupied of BLS frameworks 508 so that thermal interfacial material (TIM2) 536 will not extend outwardly beyond BLS Framework 508.For example, the area occupied or outer perimeter of thermal interfacial material (TIM2) 536 are smaller than the area occupied of BLS frameworks 508, But it is greater than the area occupied of BLS lids 504.

BLS lids 504 can be configured as being connected to BLS frameworks 508.For example, metal foam or net 548 can for example by using Conductive or dielectric contact adhesive (PSA) etc. is attached to the periphery flange 524 of BLS frameworks 508.

As shown in figure 5, BLS frameworks 508 can be coupled (for example, welding etc.) to PCB 516 so that BLS frameworks 508 are total Set on body around device 520.BLS lids 504 can be positioned relative to the opening 528 limited by BLS frameworks 508, so as to cover Or closing opening 528.In this example, metal foam or net 548 are located in opening 528 and extend through opening 528, So that metal foam or the contact device 520 of net 548 (for example, directly contacting, do not have between metal foam or net 548 and the grade of device 520 There are any intermediate member or gap).Thermal interfacial material 536 can contact soaking device (not shown) or other except heat/radiator structure (example Such as, directly contact, there is no any intermediate member or gap between thermal interfacial material 536 and soaking device etc.).Therefore, metal foam Or net 548 and thermal interfacial material (TIM2) 536 can be cooperated to limit from device 520 (in a broad aspect, thermal source) to soaking device (broad sense Ground is said, except heat/radiator structure) can be transmitted from device 520 to soaking device or conduct heat thermally conductive heat road, hot joint, interface Or path.In addition, BLS lids 504 and BLS frameworks 508 it is operable for for device 520 provide electromagnetic interference (EMI) shielding.

Fig. 6 shows to implement another example of the board-level shield (BLS) 600 of one or more various aspects of the disclosure Property embodiment.As shown in fig. 6, BLS 600 includes lid 604 and framework or fence 608.Framework 608 includes one or more (in a broad aspect, side wall 612, the side wall 612 is arranged to install (for example, welding etc.) to printed circuit board (PCB) (PCB) 616 Substrate) one or more parts (for example, device 620 etc.) generally on the PCB 616.In this example, framework 608 Including the periphery flange 624 extended internally from the top of side wall 612.Periphery flange 624 limits opening 628.Alternatively, framework can There is no flange (flange not extended internally).Therefore, BLS disclosed herein lid should be not limited to it is any specific BLS frameworks, fence or side wall are used together.

BLS lids 604 include the conductive porous material or structure 648 of metal foam or net etc..For example, BLS lids 604 It can only be made up of, and be not provided with the hole in metal foam or net 648, gap, opening, hole etc. metal foam or net 648 Any polymer thermal interface materials.

BLS lids 604 and opening 628 are configured (for example, be sized with shape etc.) with so that opening 628 will be covered by BLS 604 coverings.BLS lids 604 can prevent or at least prevent EMI via opening 628 by (for example, into, leave, leak, escape Deng).BLS lids 604 and BLS frameworks 608 it is operable for for internal device 620 provide electromagnetic interference (EMI) shielding or Shield the shell limited by BLS lids 604 and the cooperation of BLS frameworks 608.

In this exemplary embodiment, wire netting or foam 648 are in BLS openings 628 and extend also through BLS Opening 628.Wire netting or foam 648 are configured (for example, fully extension, sufficiently thick etc. above and below) to contact and permit Perhaps from device 620 (in a broad aspect, thermal source) to the heat of soaking device (not shown) (in a broad aspect, except heat/radiator structure or part) Transmission.Therefore, this illustrative embodiments does not include the hot interface material for being positioned at or being layered in the top of metal foam or net 648 Expect (TIM2).

The size of metal foam or net 648, BLS frameworks 608 and opening 628 can change according to concrete application.For example, golden The size of category foam or net 648 may depend on the relative size of performance requirements and/or other parts.Metal foam or net 648 Thickness may depend on the relative altitude of BLS frameworks 608 and thermal source 620.For example, the thickness of metal foam or net 648 is preferable The distance between top and soaking device more than the difference and BLS frameworks 608 of element height and the height of BLS frameworks 608 it With.Metal foam or net 648 are located against device 620 in the final product and soaking device compresses for this permission.In addition, for example, metal The area occupied or outer perimeter of foam or net 648 are smaller than, equal to or more than the area occupied of device 620.Metal foam or net 648 is preferably sufficiently large with the whole opening 628 of covering.

BLS lids 604 can be configured as being connected to BLS frameworks 608.For example, wire netting or foam 648 can for example by using Conductive or dielectric contact adhesive (PSA) etc. is attached to the periphery flange 624 of BLS frameworks 608.

As shown in fig. 6, BLS frameworks 608 can be coupled (for example, welding etc.) to PCB 616 so that BLS frameworks 508 are total Set on body around device 620.BLS lids 604 can be positioned relative to the opening 628 limited by BLS frameworks 608, so as to cover Or closing opening 628.In this example, metal foam or net 648 are located in opening 628 and extend through opening 628, So that metal foam or the contact device 620 of net 648 (for example, directly contacting, do not have between metal foam or net 648 and the grade of device 620 There are any intermediate member or gap).Metal foam or net 648 also can contact soaking device (not shown) or other except heat/radiating knot Structure (for example, directly contacting, does not have any intermediate member or gap) between metal foam or net 648 and soaking device etc..Therefore, it is golden Category foam or net 648 can be limited from device 620 (in a broad aspect, thermal source) to soaking device (in a broad aspect, except heat/radiator structure) Can be transmitted from device 620 to soaking device or conduct heat thermally conductive heat road, hot joint, interface or path.In addition, BLS is covered 604 and BLS frameworks 608 are operable to be shielded for providing electromagnetic interference (EMI) for device 620.

Fig. 7 shows to implement another example of the board-level shield (BLS) 700 of one or more various aspects of the disclosure Property embodiment.As shown in fig. 7, BLS 700 includes lid 704 and framework or fence 708.Framework 708 includes one or more (in a broad aspect, side wall 712, the side wall 712 is arranged to install (for example, welding etc.) to printed circuit board (PCB) (PCB) 716 Substrate) one or more parts (for example, device 720 etc.) generally on the PCB 716.In this example, framework 708 Including the periphery flange 724 extended internally from the top of side wall 712.Periphery flange 724 limits opening 728.Alternatively, framework can There is no flange (flange not extended internally).Therefore, BLS disclosed herein lid should be not limited to it is any specific BLS frameworks, fence or side wall are used together.

BLS lids 704 include the conductive porous material or structure 748 of metal foam or net etc..For example, BLS lids 704 It can only be made up of, and be not provided with the hole in metal foam or net 748, gap, opening, hole etc. metal foam or net 748 Any polymer thermal interface materials.

BLS lids 704 and opening 728 are configured (for example, be sized with shape etc.) with so that opening 728 will be covered by BLS 704 coverings.BLS lids 704 can prevent or at least prevent EMI via opening 728 by (for example, into, leave, leak, escape Deng).BLS lids 704 and BLS frameworks 708 it is operable for for internal device 720 provide electromagnetic interference (EMI) shielding or Shield the shell limited by BLS lids 704 and the cooperation of BLS frameworks 708.

In this exemplary embodiment, metal foam or net 748 are located in the top of BLS openings 728 and BLS frameworks 708 top.Metal foam or net 748 can extend upwardly to BLS frameworks 708 above in order to the soaking above BLS 700 Device other except heat/radiator structure or component contact and allows to its heat transfer.

Thermal interfacial material 732 can be set along the bottom of metal foam or net 748.Thermal interfacial material 732 can contact device 720 (in a broad aspect, thermals source).

The size of first thermal interfacial material (TIM1) 732, metal foam or net 748, BLS frameworks 708 and opening 728 can root Change according to concrete application.For example, the size of TIM1 732 and/or metal foam or net 748 may depend on performance requirements and/ Or the relative size of other parts.TIM1 thickness may depend on the relative altitude of BLS frameworks 708 and thermal source 720.For example, hot boundary The thickness of facestock material 732 is preferably more than the difference of the height of element height and BLS frameworks 708, with permission in the final product the One thermal interfacial material 732 is located against device 720 and compressed.In addition, for example, area occupied or the periphery of the first thermal interfacial material 732 Length is smaller than, equal to or more than the area occupied of device 720.

Metal foam or net 748 are preferably sufficiently large with the whole opening 728 of covering.In this shown example, BLS lids 704 Area occupied or periphery be about area occupied formed objects with BLS frameworks 708.The thickness of metal foam or net 748 can be big In the distance between the top of BLS frameworks 708 and soaking device, to allow, metal foam or net 748 are located against in the final product Soaking device compresses.

BLS lids 704 can be configured as being connected to BLS frameworks 708.For example, metal foam or net 748 can for example by using Conductive or dielectric contact adhesive (PSA) etc. is attached to the periphery flange 724 of BLS frameworks 708.

As shown in fig. 7, BLS frameworks 708 can be coupled (for example, welding etc.) to PCB 716 so that BLS frameworks 708 are total Set on body around device 720.BLS lids 704 can be positioned relative to the opening 728 limited by BLS frameworks 708, so as to cover Or closing opening 728.In this example, thermal interfacial material 732 is located in opening 728 and extends through opening 728.Heat The contact device 720 of boundary material 732 (for example, directly contacting, does not have any centre between thermal interfacial material 732 and the grade of device 720 Part or gap).Metal foam or net 748 can contact soaking device (not shown) or other except heat/radiator structure is (for example, directly Contact, does not have any intermediate member or gap between metal foam or net 748 and soaking device etc.).Therefore, thermal interfacial material (TIM1) 732 and metal foam or net 748 can cooperate to limit from device 720 (in a broad aspect, thermal source) to soaking device (broadly Say, except heat/radiator structure) can be transmitted from device 720 to soaking device or conduct heat thermally conductive heat road, hot joint, interface or Path.In addition, BLS lids 704 and BLS frameworks 708 it is operable for for device 720 provide electromagnetic interference (EMI) shielding.

Fig. 8 shows to implement another example of the board-level shield (BLS) 800 of one or more various aspects of the disclosure Property embodiment.As shown in figure 8, BLS 800 includes lid 804 and framework or fence 808.BLS frameworks 808 include side wall 812 with And the periphery flange 824 extended internally from the top of side wall 812.Periphery flange 824 limits opening 828.Alternatively, framework can not have There is flange (flange not extended internally).Therefore, BLS lids disclosed herein should be not limited to and any specific BLS Framework, fence or side wall are used together.

BLS lids 804 include the conductive porous material or structure 848 of metal foam or net etc..For example, BLS lids 804 It can only be made up of, and be not provided with the hole in metal foam or net 848, gap, opening, hole etc. metal foam or net 848 Any polymer thermal interface materials.

In this exemplary embodiment, BLS lids 804 include Part I or bottom 832 and Part II or top 836.Part I 832 can be arranged to contact PCB 816 on device 820 (for example, integrated circuit (IC), electronic installation, Other thermals source etc.).Part II 836 can be configured (for example, be sized with shape etc.) to cover opening 828, and prevent Or at least prevent EMI from passing through (for example, into, leave, leak, escape) via opening 828.Part II 836 can also quilt It is configured to contact and allows to the soaking device above BLS 800 or the heat transfer except heat/radiator structure or part.

In this exemplary embodiment, BLS lids 804 integrally comprise both Part I 832 and Part II 836. BLS lids 804 and BLS frameworks 808 are operable for providing electromagnetic interference (EMI) shielding for internal device 820 or shield The shell limited by BLS lids 804 and the cooperation of BLS frameworks 808.

The Part I 832 and Part II 836 of metal foam or net 848, BLS frameworks 808 and 828 size of being open can Changed according to concrete application.For example, the Part I 832 of metal foam or net 848 and/or the size of Part II 836 can Depending on the relative size of performance requirements and/or other parts.The thickness of the Part I 832 of metal foam or net 848 can Depending on the relative altitude of BLS frameworks 808 and thermal source 820.For example, the thickness of the Part I 832 of metal foam or net 848 can The preferably greater than difference of the height of element height and BLS frameworks 808, with allow in the final product Part I 832 be located against device Part 820 compresses.In addition, for example, the area occupied or outer perimeter of the Part I 832 of metal foam or net 848 are smaller than, are equal to Or more than the area occupied of device 820.

The Part II 836 of metal foam or net 848 is preferably sufficiently large with the whole opening 828 of covering.Show in shown this In example, the area occupied of the Part II 836 of metal foam or net 848 or periphery are about the area occupied with BLS frameworks 808 Formed objects.The thickness of the Part II 836 of metal foam or net 848 can be more than BLS frameworks 808 top and soaking device it Between distance, with allow in the final product Part II 836 be located against soaking device compress.

BLS lids 804 can be configured as being connected to BLS frameworks 808.For example, the Part II 836 of metal foam or net 848 The periphery flange 824 of BLS frameworks 808 can be attached to such as by using conductive or dielectric contact adhesive (PSA).

As shown in figure 8, BLS frameworks 808 can be coupled (for example, welding etc.) to PCB 816 so that BLS frameworks 808 are total Set on body around device 820.BLS lids 804 can be positioned relative to the opening 828 limited by BLS frameworks 808, so as to cover Or closing opening 828.In this example, the Part I 832 of metal foam or net 848 is located in opening 828 and prolonged Extend through opening 828 so that the contact of Part I 832 device 820 is (for example, directly contact, device 720 and metal foam or net There is no any intermediate member or gap etc. between 848 Part I 832).The Part II 836 of metal foam or net 848 can Contact soaking device (not shown) or it is other except heat/radiator structure (for example, directly contact, soaking device and metal foam or net 848 There is no any intermediate member or gap etc. between Part II 836).Therefore, the He of Part I 832 of metal foam or net 848 Part II 836 can be cooperated to limit from device 820 (in a broad aspect, thermal source) to soaking device (in a broad aspect, except heat/radiating knot Structure) can be transmitted from device 820 to soaking device or conduct heat thermally conductive heat road, hot joint, interface or path.In addition, BLS is covered 804 and BLS frameworks 808 are operable to be shielded for providing electromagnetic interference (EMI) for device 820.

BLS disclosed herein lid (for example, 104 (Fig. 1), 204 (Fig. 2), 304 (Fig. 3), 404 (Fig. 4), 504 (Fig. 5), 604 (Fig. 6), 704 (Fig. 7), 804 (Fig. 8) etc.) example embodiment can be with the thermal source of wide scope, electronic installation and/or removing Heat/radiator structure or part (for example, soaking device, radiator, heat pipe, crust of the device or housing etc.) are used together.For example, thermal source It may include one or more heat generating components or device (for example, chip, semiconductor devices, upside-down mounting core in CPU, underfill Piece device, graphics processing unit (GPU), digital signal processor (DSP), multicomputer system, integrated circuit, polycaryon processor Deng).Generally, thermal source may include that temperature provides or transmitted in other words any part of heat higher than thermal interfacial material to thermal interfacial material Or device, generated or transmitted only by or via thermal source by thermal source but regardless of heat.Therefore, each side of the disclosure is not It should be limited to the thermal source with any single type, electronic installation, except any together with heat/radiator structure etc. specific uses.

The thermal interfacial material of wide scope can be used for the first thermal interfacial material (TIM1) (for example, 132 (Fig. 1), 232 (Fig. 2), 332 (Fig. 3), 432 (Fig. 4), 732 (Fig. 7) etc.) and/or the second thermal interfacial material (TIM2) (for example, the second thermal interfacial material 136 (Fig. 1), 336 (Fig. 3), 436 (Fig. 4), 536 (Fig. 5) etc.) illustrative embodiments.Example thermal interfacial material is included between heat Gap filler, hot phase-change material, heat transfer EMI absorbing materials or the heat of mixing/EMI absorbing materials, heat-conducting cream, thermal conducting paste, lead Deep fat is grey, can distribute (dispensable) thermal interfacial material, heat conductive pad etc..Example embodiment may include laird (Laird) one or more of thermal interfacial materials, such as Tputty^TMSeries of heat gap-filler is (for example, Tputty^TM 403、 504th, 506 or 508 can distribute thermal interfacial material etc.), Tflex^TMSeries of heat gap-filler is (for example, Tflex^TMBetween 300 series of heat Gap filler, Tflex^TM600 series of heat gap-fillers, Tflex^TM700 series of heat gap-fillers etc.), Tpcm^TMSeries of heat phase transformation Material is (for example, Tpcm^TM580 serial phase-change materials etc.), Tpli^TMSeries of gaps filler is (for example, Tpli^TM200 series of gaps Filler etc.), IceKap^TMSerial thermal interfacial material and/or CoolZorb^TMSerial heat conduction microwave absorbing material (for example, CoolZorb^TM400 serial heat conduction microwave absorbing materials, CoolZorb^TM500 serial heat conduction microwave absorbing materials, CoolZorb^TM600 serial heat conduction microwave absorbing materials etc.) etc. any of or more plant.

In some illustrative embodiments (for example, Fig. 1 to Fig. 4 etc.), can distribute thermal interfacial material can be more along conduction Porous materials are distributed above conductive porous material so that can be distributed thermal interfacial material infiltration, injection and be waited until conductive porous material In hole, gap, opening, hole of material etc..Conductive porous material can distribute in thermal interfacial material or internal provide or define The continuous conduction structure of opposite fine.As an example, conductive porous material may be disposed at laird distribute hot interface material In material, such as Tflex^TM CR200、Tputty^TM 403、Tputty^TM504 and/or Tputty^TM506, which can distribute temperature gap, fills out One or more in material.For example, the first thermal interfacial material (TIM1) 132 may include that two component original places solidify ceramic filler The temperature gap filler based on silicones, it can solidify at room temperature, with low viscosity (for example, mixing before 260000cps Deng), good thermal conductivity (for example, about 2W/mk etc.), and it is soft and conformal (for example, 3 seconds hardness (Shore 00) be 45 Deng).As another example, the first thermal interfacial material (TIM1) 132 may include temperature gap filler of the one pack system based on silicones, its Soft, conformal and low abrasion, and with good thermal conductivity (for example, about 2.3W/mk etc.).It is used as another example, first Thermal interfacial material (TIM1) 132 may include the temperature gap filler based on silicones of softness, and it distributes silicon for ceramic filler Resin gel, it is soft and conformal, with good thermal conductivity (for example, about 1.8W/mk etc.), can similar lubricating grease equally apply, And easily it can be distributed from the equipment of such as screen process press, syringe and automatic equipment.As another example, the first hot boundary Facestock material (TIM1) 132 may include the single-component silicon resin putty temperature gap filler of softness, wherein need not solidify, with good Thermal conductivity (for example, about 3.5W/mk etc.), and it is soft, conformal, do not wear and tear and can distribute.

In some illustrative embodiments, the first and/or second thermal interfacial material may include suitable with high-termal conductivity Shape gap-filler.Second thermal interfacial material (TIM2) (for example, 136 (Fig. 1), 536 (Fig. 5) etc.) and/or it may also include laird Thermal interfacial material, such as Tflex^TM 200、Tflex^TM HR200、Tflex^TM 300、Tflex^TM 300TG、Tflex^TM HR400、Tflex^TM 500、Tflex^TM 600、Tflex^TM HR600、Tflex^TM SF600、 Tflex^TM 700、Tflex^TM One or more in SF800 temperature gap fillers.For example, the second thermal interfacial material (TIM2) 136 may include the (example of filling Such as, aluminum oxide, ceramics, boron nitride etc.) silicone elastomer gap-filler, its is soft, conformal, support oneself and/or it is natural it is tacky with Be easy to adhere to during assembling and transport, and with good thermal conductivity (for example, about 1.1W/mk, 1.2W/mK, 1.6W/mk, 2.8W/mK, 3W/mK, 5W/mK etc.).As another example, the second thermal interfacial material (TIM2) 136 may include the silicon tree of filling Fat elastomer gel, it has good thermal conductivity (for example, about 1.2W/mK, 1.8W/mk etc.) and may also include silicones lining In or other dielectric barrier layers.As another example, the second thermal interfacial material (TIM2) 136 may include the not siliceous of ceramic filler The gap-filler of resin, its have good thermal conductivity (for example, about 7.8W/mk etc.) and UL94V0 flammability rating and/or It is natural tacky.

The material of wide scope can be used for conductive porous material (for example, conductive porous material 148 (Fig. 1), 248 (Fig. 2), 348 (Fig. 3), 448 (Fig. 4), 548 (Fig. 5), 648 (Fig. 6), 748 (Fig. 7), 848 (Fig. 8) etc.) illustrative embodiments, example Such as conductive foam, net, fabric.As an example, conductive porous material may include with different configurations (for example, material, opening are big Small, open area, line footpath etc.) various woven wires (for example, stainless (steel) wire, copper mesh, silver-plated stainless (steel) wire etc.).

Additionally as example, conductive porous material may include the polyurethane open celled foam with internal interstices, wherein due to At least one conductive layer (for example, metal layer, coat of metal etc.) is provided with the inner surface in gap, so the interior table in gap Face is conductive.The conductive material of wide scope can be used for foam on conductive layer, including copper, nickel, silver, palladium, platinum, plating nickeline, aluminium, tin, Its alloy etc..

As other example, conductive porous material may include to metallize or plate the meshi fabric of metal, such as nickel-clad copper Grid cloth (ripstop) fabric and/or the fabric of nickel-plated metal of Polyester Taffeta (taffeta) fabric, nickel-clad copper.In exemplary reality Apply in mode, conductive porous material can be the Flectron of laird^TMMetallized fabrics, it is included in is plated on fabric in advance Copper basic unit above nickel plating nickel-clad copper fabric.In use, the basic unit of copper can be the copper of highly conductive, and the outer layer of nickel Corrosion resistance is provided.Alternative embodiment may include different porous materials beyond different materials, such as polyurethane foam, Different porous fabrics beyond net are (for example, weaving, non-woven, entanglement or braided fabric, the other materials with loose texture Deng), the different coats of metal and/or different adhesives.

In the exemplary embodiment, BLS frameworks, fence or side wall (for example, BLS frameworks 108 (Fig. 1), 208 (Fig. 2), 308 (Fig. 3), 408 (Fig. 4), 508 (Fig. 5), 608 (Fig. 6), 708 (Fig. 7), 808 (Fig. 8) etc.) can by wide scope material system Into.As an example, can be made into BLS exemplary materials non-exhaustive list include cold-rolled steel, bazar metal, corronil, Stainless steel, tin-plated cold rolled steel, Tinplated copper alloy, carbon steel, brass, copper, aluminium, copper beryllium alloy, phosphor bronze, steel, its alloy, it is coated with The plastic material of conductive material or any other suitable conductive and/or magnetic material.Here provide disclosed herein Material merely to illustrate because can be according to such as concrete application (for example, the space in the part to be shielded, general arrangement Consider, EMI shieldings and radiating need and other factorses) use different materials.

In some illustrative embodiments, either side or both sides that a variety of different thermal interfacial materials can be covered along BLS Set.There can be different thickness to adapt to positioned at BLS along a variety of different thermal interfacial materials of the BLS downsides covered The height change of following device, part etc..Can also have along a variety of different thermal interfacial materials of the BLS upsides covered Different thickness is to adapt to soaking device or other except the thickness change of heat/radiator structure.

Disclosed herein first and/or second thermal interfacial material may include in the base material of rubber, gel or wax etc. Elastomer and/or ceramic particle, metallic particles, ferrite EMI/RFI absorbing particles, metal or glass fiber mesh.First and/or Second thermal interfacial material may include conformal or conformal silicone mat, be not based on the material of silicones (for example, being not based on silicones Gap-filler, thermoplasticity and/or thermosetting polymer, elastomeric material etc.), screen print materials, polyurethane foam or solidifying Glue, heat conduction additive etc..First and/or second thermal interfacial material can be configured with enough conformabilities, conformal performance and/or Pliability (for instance, it is not necessary to undergoing phase transformation or backflow etc.) is bent with passing through under low temperature (for example, 20 DEG C to 25 DEG C room temperature etc.) It is adjusted for tolerance or gap and/or allows the first and/or second thermal interfacial material being arranged to and matching surface (bag Include the matching surface of non-flat forms, bending or injustice) contact (for example, extruding etc.) when closely conform to matching surface (for example, In the way of relatively closely fitting and encapsulating etc.).

First and/or second thermal interfacial material may include by elastomer and at least one heat-transfer metal, boron nitride and/ Or ceramic packing formation soft thermal interfacial material so that the soft thermal interfacial material even if do not suffer from phase transformation or backflow Can be conformal.In some illustrative embodiments, the first and/or second thermal interfacial material may include the silicones bullet of ceramic filler Property body, the silicone elastomer of boron nitride filling, glass fiber-reinforced gap-filler or including the film do not strengthened substantially Hot phase-change material.First and/or second thermal interfacial material can have relatively low Young's modulus and Shore hardnes figure (for example, The hardness of Shore 00 is 25,40,70,75, less than 100, less than 25, more than 75, between 25 and 75Shore 00 etc.).

According to for preparing the specific material of thermal interfacial material and the loading percentage of heat transfer filler (if any) Than, illustrative embodiments may include with high-termal conductivity (for example, 1W/mK (every meter of watt is per Kelvin), 1.1 W/mK, 1.2W/mK、2.8W/mK、3W/mK、3.1W/mK、3.8W/mK、4W/mK、4.7W/mK、 5W/mK、5.4W/mK、6W/mK、 7.8W/mK etc.) one or more of thermal interfacial materials.These thermal conductivity are only examples, because other embodiment may include The thermal interfacial material of thermal conductivity with other values higher than 7.8W/mK, less than 1W/mK or between 1 and 7.8W/mk. Therefore, each side of the disclosure should not necessarily be limited by is used together with any specific thermal interfacial material, because illustrative embodiments can Thermal interfacial material including wide scope.

Alternative embodiment, which can be configured such that, has one between TIM1 and IC and/or between TIM2 and soaking device Or more intermediate member (for example, other thermal interfacial materials, other radiating/heat extraction structures etc.).In addition, TIM1 and/or TIM2 Offer shielding is also assisted in, such as in the conductive illustrative embodiments of TIM1 and/or TIM2.TIM1 will contact IC or its In the illustrative embodiments of its thermal source, at least TIM1 bottom can be dielectric and nonconducting, to avoid when TIM1 contacts IC When make IC short circuit or otherwise the performance to PCB brings adverse effect.

There is disclosed herein exemplary method.For example, a kind of method generally may include using conductive porous material covering by plate The opening that one or more side walls of level shields (BLS) are limited.In some illustrative embodiments, conductive porous material It may be disposed in thermal interfacial material.But in other examples embodiment, conductive porous material is not provided at heat In boundary material.In this case, conductive porous material can be only by metal foam, wire netting or other conductive porous material groups Into, and any thermal interfacial material is not provided with (for example, polymer in the hole in metal foam or net, gap, opening, hole etc. Thermal interfacial material etc.).

Conductive porous material may include conductive foam, net or fabric.One or more side wall can be surrounded generally Thermal source on substrate is installed to substrate.Conductive porous material is (with and without thermal interfacial material, depending on exemplary embodiment party Formula) at least a portion from the thermally conductive heat road of thermal source can be limited.One or more side wall and conductive porous material (tool Thermal interfacial material is with or without, depending on illustrative embodiments) it is operable for for thermal source provide EMI shielding.

This method may include to cover opening using the lid of conductive porous material is included, in some illustrative embodiments The conductive porous material can be in thermal interfacial material.The lid can integrally comprise Part I for contacting thermal source and For contacting the Part II except heat/radiator structure.

In some illustrative embodiments of conductive porous material in thermal interfacial material, thermal interfacial material can be prolonged The opening that is limited by one or more side wall is extended through for the first thermal interfacial material of contact thermal source.Second hot boundary Facestock material may be coupled to the first thermal interfacial material and/or open outside for contact remove heat/radiator structure.

In other examples embodiment of the conductive porous material in thermal interfacial material, thermal interfacial material can be by Be configured to contact BLS outside except the second thermal interfacial material of heat/radiator structure.First thermal interfacial material may be coupled to second The opening that thermal interfacial material and/or extend through is limited by one or more side wall is for contacting thermal source.

There is provided example embodiment is intended to make the disclosure will will pass on thoroughly and fully this public affairs to those skilled in the art The scope opened.Many details (for example, particular elements, example of apparatus and method) are illustrated to provide implementation of this disclosure The thorough understanding of mode.It will be apparent to the person skilled in the art that the detail, example need not be used Embodiment can be implemented in many different forms, be not necessarily to be construed as limiting the scope of the present disclosure.It is real in some examples Apply in mode, be not described in known processing, apparatus structure and technology.In addition, passing through the one or more of the disclosure The advantages and improvements that illustrative embodiments can be realized provide only for explanation, are not intended to limit the scope of the present disclosure, because Illustrative embodiments disclosed herein can provide all above-mentioned advantages and improvements or not provide above-mentioned advantages and improvements, and still fall Enter in the scope of the present disclosure.

What specific size disclosed herein, specific material and/or concrete shape were exemplary in nature, it is not intended to limit this public affairs The scope opened.The disclosure of particular value and specific range of values herein for given parameters is not excluded for disclosed herein one or more Useful other values or value scope in individual example.Moreover, it is foreseeable that any two of design parameter as described herein is specifically worth The end points of the value scope that may be adapted to given parameters can be limited, and (that is, the disclosure of the first value and second value for given parameters can Any value between the first value of given parameters and second value can be also used for by being interpreted to disclose).If for example, herein Parameter X is exemplified as having value A, and is also exemplified as having value Z, then it is foreseeable that parameter X can have from about A to about Z Value scope.Similarly, it is foreseeable that the disclosure of two or more value scopes of parameter (no matter whether these scopes nested, hand over It is folded or completely different) include the value scope that can be claimed using the end points of disclosed scope be possible to combine.For example, If parameter X herein is exemplified as the value in the scope with 1-10 or 2-9 or 3-8, it is also foreseen that parameter X can have bag Include other value scopes including 1-9,1-8,1-3,1-2,2-10,2-8,2-3,3-10 and 3-9.

Terms used herein is intended merely to describe specific example embodiment, it is not intended that limited.As herein Used, unless the context clearly, the otherwise description of singulative can be intended to include plural form.Term " comprising ", "comprising" and " having " only refer to containing, therefore show there is described feature, important document, step, operation, element and/or part, but One or more further features, important document, step, operation, element, part and/or its combination are not precluded the presence or addition of.Herein Method and step, processing and the operation of description are not necessarily intended to perform according to particular order that is described herein or showing, except non-specific Indicate execution sequence.It will be further understood that can be using additional or alternative step.

Be referred to as when element or layer " ... on ", " being joined to ", " being connected to " or " being couple to " another element or layer When, it can engage directly on another element or layer or directly, be connected or coupled to another element or layer, or Intermediary element or layer also may be present in person.On the contrary, when element be referred to as " on directly existing ... ", " being directly joined to ", " be directly connected to To " or when " being directly coupled to " another element or layer, intermediary element or layer can be not present.For describing the relation between element Other words should also be construed in that manner (for example, " between " and " between directly existing ... ", " adjacent " and " direct neighbor ") etc..Such as Used herein, term "and/or" includes any one or more relevant entry and its all combinations.

Term " about " represents to calculate or measured some small inexactnesies of permissible value when applied to value, and (value is approached Accurately；It is about approximate or rationally approximate；Almost).If as some reasons, the inexactness provided by " about " is in ability Do not understood in domain with common meaning otherwise, then " about " as used herein represents may be by common survey method Cause or utilize at least variable caused by these parameters.For example, term " substantially ", " about " and " substantially " is available herein To represent in manufacturing tolerance.

Although term first, second, third, etc. may be used herein come describe various elements, part, region, layer and/ Or part, these elements, part, region, layer and/or part should not be limited by these terms.These terms can only be used for distinguishing One element, part, region, layer or part and another region, layer or part.Unless context is clearly indicated, otherwise this paper institutes The term of such as " first ", " second " and other numerical terms that use does not imply that order or order.Therefore, show not departing from In the case of the teaching of example embodiment, the first element, part, region, floor or part are alternatively referred to as the second element, part, area Domain, layer or part.

For ease of description, may use herein space relative terms such as " interior ", " outer ", " following ", " lower section ", " under Portion ", " above ", " top " etc. describe an element or feature shown in figure and another element or the relation of feature.Except Outside orientation described in figure, space relative terms can be intended to the different orientation of device in use or operation.For example, such as Device upset in fruit figure, then being described as be in the element of other elements or feature " lower section " or " following " will be oriented as in institute State other elements or feature " above ".Therefore, exemplary term " lower section " can cover above and below two orientation.Device also can be another Row orientation (being rotated by 90 ° or other orientations), then respective explanations are also wanted in the relative description in space used herein.

It is to illustrate and describe to provide embodiment described above.It is not intended to limit or the limitation disclosure.It is special Each element or feature for determining embodiment are typically not limited to the particular implementation, but under applicable circumstances can be mutual Change, and can be used in selected embodiment (even if being not shown or described in detail).These embodiments can also be according to Many modes change.These changes are not construed as departing from the disclosure, and all such modifications are intended to the model for being included in the disclosure In enclosing.

Claims

1. a kind of board-level shield BLS, the BLS are applied to provide electromagnetic interference EMI shieldings at least one part on substrate, Characterized in that, the BLS includes：

One or more side walls, one or more a side wall, which is limited, to be open and is arranged to generally around described At least one described part on substrate is installed to the substrate；

Lid, the lid is configured as the opening that covering is limited by one or more side wall, and the lid includes conductive many Porous materials；

Thus, when one or more side wall generally around at least one described part be installed to the substrate and During the opening that the lid covering is limited by one or more side wall：

The lid limits at least a portion from the thermally conductive heat road of at least one part；And

The lid and one or more a side wall can operate to be shielded for providing EMI at least one described part.

2. BLS according to claim 1, it is characterised in that：

The conductive porous material includes conductive foam, net or fabric；And/or

The conductive porous material is in thermal interfacial material.

3. BLS according to claim 1 or 2, it is characterised in that the lid is only made up of the conductive porous material.

4. BLS according to claim 3, it is characterised in that the conductive porous material is metal foam or net.

5. BLS according to claim 1 or 2, it is characterised in that the lid is integrally comprised for contacting described at least one The Part I of individual part and for contact except heat/radiator structure Part II, thus the lid can operate for Limit from least one described part to the thermally conductive heat road except heat/radiator structure.

6. BLS according to claim 2, it is characterised in that the thermal interfacial material is the first thermal interfacial material, and this first Thermal interfacial material extend through the opening that is limited by one or more side wall for described in contact at least one Part.

7. BLS according to claim 6, it is characterised in that：

It is described lid also include be used for contact outside the BLS except the second thermal interfacial material of heat/radiator structure；And

First thermal interfacial material and second thermal interfacial material include identical or different thermal interfacial material.

8. BLS according to claim 2, it is characterised in that：

The thermal interfacial material be arranged to contact outside the BLS except the second thermal interfacial material of heat/radiator structure；

The lid also includes the first thermal interfacial material for being used to contact at least one part；And

9. BLS according to claim 2, it is characterised in that the thermal interfacial material is configured as, when one or more Multiple side walls be generally installed to the substrate around at least one described part and lid covering by one or During the opening that more side walls are limited, at least one described part on the substrate is directly contacted.

10. a kind of component, the component include except heat/radiator structure, the printed circuit board (PCB) with least one part and according to BLS described in any one of claim 1 to 9, it is characterised in that：

One or more side wall is installed to the printed circuit board (PCB) so that the opening is at least one described part Top；

The lid is located on one or more side wall so that described in being limited by one or more side wall Opening is covered by the lid；

The lid limits at least one from least one described part to the thermally conductive heat road except heat/radiator structure Point；And

The BLS can operate to provide EMI shieldings at least one described part.

11. component according to claim 10, it is characterised in that：

Described at least one described part of lid contact；And/or

The lid contact is described to remove heat/radiator structure.

12. the component according to claim 10 or 11, it is characterised in that：

Heat/the radiator structure that removes is soaking device；And

At least one described part is the integrated circuit on the printed circuit board (PCB).

13. a kind of electronic installation, it is characterised in that the electronic installation includes the component according to claim 10 or 11.