CN206388688U - Chip transhipping device structure - Google Patents

Chip transhipping device structure Download PDF

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Publication number
CN206388688U
CN206388688U CN201621464325.6U CN201621464325U CN206388688U CN 206388688 U CN206388688 U CN 206388688U CN 201621464325 U CN201621464325 U CN 201621464325U CN 206388688 U CN206388688 U CN 206388688U
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CN
China
Prior art keywords
chip
clip slot
machined
packing box
box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201621464325.6U
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Chinese (zh)
Inventor
吴康
张艳红
邓洪俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yunnan langene Technology Co. Ltd.
Original Assignee
Aquamarine Technology (yiwu) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aquamarine Technology (yiwu) Co Ltd filed Critical Aquamarine Technology (yiwu) Co Ltd
Priority to CN201621464325.6U priority Critical patent/CN206388688U/en
Application granted granted Critical
Publication of CN206388688U publication Critical patent/CN206388688U/en
Active legal-status Critical Current
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Abstract

Chip transhipping device structure, two parts are shelved by chip packing box and shifting to constitute, the vertical edge of two parallel protrusions is machined with the preceding connecting plate of chip packing box, a horizontal edge is machined between two vertical edges, vertical edge clip slot and horizontal edge clip slot are machined with the longeron upper surface of movable stand, push jack plate is installed in movable stand bottom.When chip is moved and filled, vertical edge and horizontal edge can insert fixed in the vertical edge clip slot and horizontal edge clip slot for moving and shelving on longeron, when moving dress chip, the packing box that workshop is sent shelves one end mounted in shifting, by the box-packed other end shelved in shifting of clean packaging cleaned in workshop, push jack plate is promoted by hand, chip in whole box is once moved and is attached in another clean packing box, placed into cleaning fluid and cleaned after box-packed chip with clean packing, it is possible to reduce the consumption of cleaning fluid.

Description

Chip transhipping device structure
Technical field
This technology belongs to sapphire wafer cleaning equipment technical field, is related to a kind of chip transhipping device structure.
Background technology
Chip dicing from crystal bar, by surface grinding and buffing, after the processing of edge edging, will be put into packing box It is interior, it is sent to pack after the cleaning of cleaning workshop, cleaning, drying and dispatches from the factory.In the prior art, chip is in workshop after mounted box, box Cleaning workshop is sent to together with chip, is put into the cleaning fluid of cleaning machine and cleans, chip is dried in packing box through over cleaning Afterwards, move into pack in finished product packing box and dispatch from the factory.Because chip is in workshop during mounted box, the packaging used in workshop Box, the spot of contamination is more, packing box be sent to cleaning workshop after is directly placed into cleaning fluid clean, the cleaning fluid consumed compared with It is many, add production cost.
The content of the invention
For in the prior art, chip loads and cleaning workshop is sent in packing box, be directly placed into after production and processing is completed Cleaned in cleaning fluid, the problem of cleaning fluid of the spot consumption on packing box is more, the utility model provides a kind of chip and moves dress Mechanism, when chip enters cleaning workshop, chip is moved and is attached in packing shop in the relatively packing box of cleaning, then is cleaned, Reduce consumption of the spot on packing box to cleaning fluid.
The technical solution of the utility model is:A kind of chip transhipping device structure, two parts group is shelved by chip packing box and shifting Into chip packing box is made up of preceding connecting plate, rear connecting plate and side joint face, its upper and lower surface opening, in two relative sides The arc clip slot of a plurality of chip is machined with joint face, crossbeam is installed in the support feet of movable stand, is provided with crossbeam Two longerons, are machined with the vertical edge of two parallel protrusions, between two vertical edges on the preceding connecting plate of chip packing box A horizontal edge is machined with, vertical edge clip slot and horizontal edge clip slot are machined with the longeron upper surface of movable stand, under movable stand Portion is machined with fixed block, fixed block be provided with above and below two slide bars, be provided with and crank arm in one end of slide bar, one end for cranking arm peace Equipped with push jack plate, the vertical edge and horizontal edge of chip packing box are corresponded to respectively to be inserted into vertical edge clip slot and horizontal edge clip slot.
Using the technical solution of the utility model, the vertical edge and horizontal stroke of projection are processed on the preceding connecting plate of chip packing box Edge, vertical edge and horizontal edge can be inserted to be fixed in the vertical edge clip slot and horizontal edge clip slot for moving and shelving on longeron, When moving dress chip, the packing box that workshop is sent shelves one end mounted in shifting, and the clean packaging cleaned in workshop is box-packed The other end shelved in shifting, promotes push jack plate, the chip in whole box is once moved and is attached to another clean bag by hand In mounted box, placed into cleaning fluid and cleaned after box-packed chip with clean packing, it is possible to reduce the consumption of cleaning fluid.In addition, When chip shifting after cleaning, drying is attached to finished product packing box, equally shifting dress can be carried out using the utility model, it is to avoid operator The gloves contact chip of member, is polluted to chip.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation of chip packing box in the utility model.
Embodiment
Embodiment, as depicted in figs. 1 and 2:A kind of chip transhipping device structure, two parts group is shelved by chip packing box and shifting Into chip packing box is made up of preceding connecting plate 6, rear connecting plate 7 and side joint face 8, its upper and lower surface opening, at relative two The arc clip slot 9 of a plurality of chip is machined with side joint face 8, crossbeam 2 is installed in the support feet 1 of movable stand, on crossbeam 2 Two longerons 3 are installed, the vertical edge 4 of two parallel protrusions is machined with the preceding connecting plate 6 of chip packing box, it is vertical at two A horizontal edge 5 is machined between edge 4, vertical edge clip slot 14 and horizontal edge folder are machined with the upper surface of longeron 3 of movable stand Groove 15, is machined with fixed block 13, fixed block 13 two slide bars 12 above and below being provided with, in one end of slide bar 12 in movable stand bottom It is provided with and cranks arm 11,11 one end of cranking arm is provided with push jack plate 10, and the vertical edge 4 and horizontal edge 5 of chip packing box are corresponded to respectively It is inserted into vertical edge clip slot 14 and horizontal edge clip slot 15.

Claims (1)

1. chip transhipping device structure, shelves two parts by chip packing box and shifting and constitutes, chip packing box is by preceding connecting plate(6), after Connecting plate(7)With side joint face(8)Composition, its upper and lower surface opening, in two relative side joint faces(8)On be machined with it is a plurality of The arc clip slot of chip(9), in the support feet of movable stand(1)On crossbeam is installed(2), in crossbeam(2)On be provided with two indulge Beam(3), it is characterised in that:In the preceding connecting plate of chip packing box(6)On be machined with the vertical edges of two parallel protrusions(4), Two vertical edges(4)Between be machined with a horizontal edge(5), in the longeron of movable stand(3)Upper surface is machined with vertical edge clip slot (14)With horizontal edge clip slot(15), fixed block is machined with movable stand bottom(13), fixed block(13)On be provided with above and below two Slide bar(12), in slide bar(12)One end be provided with and crank arm(11), crank arm(11)One end push jack plate is installed(10), chip bag The vertical edge of mounted box(4)With horizontal edge(5)Correspond to respectively and be inserted into vertical edge clip slot(14)With horizontal edge clip slot(15)It is interior.
CN201621464325.6U 2016-12-29 2016-12-29 Chip transhipping device structure Active CN206388688U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621464325.6U CN206388688U (en) 2016-12-29 2016-12-29 Chip transhipping device structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621464325.6U CN206388688U (en) 2016-12-29 2016-12-29 Chip transhipping device structure

Publications (1)

Publication Number Publication Date
CN206388688U true CN206388688U (en) 2017-08-08

Family

ID=59490537

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201621464325.6U Active CN206388688U (en) 2016-12-29 2016-12-29 Chip transhipping device structure

Country Status (1)

Country Link
CN (1) CN206388688U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112736002A (en) * 2020-12-31 2021-04-30 至微半导体(上海)有限公司 Wafer high-speed loading method for wafer cleaning equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112736002A (en) * 2020-12-31 2021-04-30 至微半导体(上海)有限公司 Wafer high-speed loading method for wafer cleaning equipment

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Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20180517

Address after: 653101 North Hongta Town, Hongta District, Yuxi, China

Patentee after: Yunnan langene Technology Co. Ltd.

Address before: 322000 No. 126 Sufu Road, Suxi Town, Yiwu City, Jinhua, Zhejiang

Patentee before: Aquamarine Technology (Yiwu) Co. Ltd.