CN206353884U - A kind of complex function substrate - Google Patents
A kind of complex function substrate Download PDFInfo
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- CN206353884U CN206353884U CN201720017283.XU CN201720017283U CN206353884U CN 206353884 U CN206353884 U CN 206353884U CN 201720017283 U CN201720017283 U CN 201720017283U CN 206353884 U CN206353884 U CN 206353884U
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- layer
- fixedly connected
- overcoat
- substrate
- thermal insulation
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Abstract
The utility model discloses a kind of complex function substrate, including substrate chip, circuit layer is fixedly connected with the top of the substrate chip, the bottom of the substrate chip is fixedly connected with overcoat, the circuit layer includes coating, the bottom of the coating is fixedly connected with copper foil layer, the overcoat includes thermal insulation layer, the bottom of the thermal insulation layer is fixedly connected with waterproof layer, the thermal insulation layer includes glass layer, the bottom of the glass layer is fixedly connected with vacuum flaggy, the bottom of the vacuum flaggy is fixedly connected with asbestos layer, the waterproof layer includes separation layer, the bottom of the separation layer is fixedly connected with rubber layer, the bottom of the rubber layer is fixedly connected with matcoveredn.The utility model possesses the effect of insulating water-proof function by setting overcoat, waterproof layer, thermal insulation layer, separation layer, rubber layer, protective layer, glass layer, vacuum flaggy and asbestos layer so as to reach.
Description
Technical field
The utility model is related to matrix technique field, specially a kind of complex function substrate.
Background technology
Substrate is the stock for manufacturing PCB, and generally, substrate is exactly copper-clad laminate, single, double surface printed board
It is on baseplate material-copper-clad laminate, selectively to carry out hole machined, electroless copper, electro-coppering, etching etc. in the mill
Processing, obtains required circuitous pattern, the manufacture of another kind of multilayer board is also, using the slim copper coated foil plate of inner core as base, to incite somebody to action
Conductive pattern layer alternately sticks together with prepreg through disposable lamination, forms more than three layers conductive pattern interlayers mutual
Even, it has the function of three aspects of conductive, insulation and support, the performance of printed board, quality, the processability in manufacture, manufacture
Cost, manufacture level etc., depend greatly on baseplate material.
With the development of society, the progress of science and technology, people are also more and more deep for the research of various mechanizing circuits,
It is required for using circuit board in many mechanical control systems being controlled machinery, and the core component of circuit board
It is exactly substrate, with the development in epoch, the manufacturing process of substrate is more and more ripe, and the manufacturing cost of substrate also reduces many,
So as to which the usage amount that result in substrate rises, example composite base plate is more widely applied, but the function of existing composite base plate
It is single, do not possess the effect of insulating water-proof, easily occur when in use it is various damage, it is necessary to the substrate more renewed, to user
Use bring trouble, waste money and the time of user.
Utility model content
The purpose of this utility model is to provide a kind of complex function substrate possess the advantage of insulating water-proof function, solves
The function of composite base plate is single, the problem of not possessing insulating water-proof function.
To achieve the above object, the utility model provides following technical scheme：A kind of complex function substrate, including substrate core
Circuit layer is fixedly connected with the top of piece, the substrate chip, the bottom of the substrate chip is fixedly connected with overcoat, described
Circuit layer includes coating, and the bottom of the coating is fixedly connected with copper foil layer, and the overcoat includes thermal insulation layer, the thermal insulation layer
Bottom be fixedly connected with waterproof layer, the thermal insulation layer includes glass layer, and the bottom of the glass layer is fixedly connected
There is vacuum flaggy, the bottom of the vacuum flaggy is fixedly connected with asbestos layer, and the waterproof layer includes separation layer, the separation layer
Bottom be fixedly connected with rubber layer, the bottom of the rubber layer is fixedly connected with matcoveredn.
It is preferred that, the both sides of the overcoat, which have been fixedly connected with the middle part of fixed edge edge, the fixed edge edge, to be offered
Fixing hole.
It is preferred that, the overcoat is internally provided with reinforcement, and the reinforcement is distributed in the inner homogeneous of overcoat,
And the quantity of reinforcement is no less than three.
It is preferred that, the bottom of the circuit layer by adhesive with being fixedly connected at the top of substrate chip, the overcoat
Top be fixedly connected by adhesive with the bottom of substrate chip.
It is preferred that, the coating uniform is covered in the top of copper foil layer, the top of the waterproof layer and the bottom of thermal insulation layer
It is fixedly connected by high-temperature plastic.
Compared with prior art, the beneficial effects of the utility model are as follows：
1st, the utility model is by setting overcoat, waterproof layer, thermal insulation layer, separation layer, rubber layer, protective layer, glass fibers
Layer, vacuum flaggy and asbestos layer are tieed up, by setting overcoat to be played a protective role to substrate chip, base is effectively avoided
Board chip is damaged in use, is influenceed situation about using, by setting thermal insulation layer, can be completely cut off heat, effectively
Substrate chip is avoided because external temperature is too high, is damaged, situation about using is influenceed, by setting waterproof layer, Neng Goubao
The drying of substrate chip is held, substrate chip is effectively avoided and makes moist, situation about using is influenceed, by setting separation layer,
Waterproof layer can be separated with thermal insulation layer, effectively avoiding waterproof layer influences the effect of heat insulation of thermal insulation layer, by setting rubber
Layer, can effectively obstruct moisture and penetrate into inside substrate, by setting protective layer, rubber layer can be played a protective role, had
The rubber layer that avoids of effect is worn and torn, and is influenceed the situation of waterproof effect, by setting glass layer and asbestos layer, can be hindered
The transmission of amount of insulation, increase effect of heat insulation, by setting vacuum flaggy, effectively heat can be distributed, add every
Thermal effect, possesses the effect of insulating water-proof function so as to reach.
2nd, the utility model can play a protective role to copper foil layer by setting coating, effectively avoid copper foil layer
It is worn, influences situation about using, by setting fixed edge edge and fixing hole, substrate can be made more to facilitate when in use solid
It is fixed, effectively avoid substrate and fix inconvenient, situation about using is influenceed, by setting reinforcement, it is possible to increase overcoat
Intensity, effectively avoids substrate because external force collision is deformed, influences situation about using.
Brief description of the drawings
Fig. 1 is the utility model structural representation；
Fig. 2 is the structural representation of the utility model circuit layer；
Fig. 3 is the structural representation of the utility model overcoat；
Fig. 4 is the structural representation of the utility model waterproof layer；
Fig. 5 is the structural representation of the utility model thermal insulation layer.
In figure：1 substrate chip, 2 circuit layers, 3 overcoats, 4 fixed edges edge, 5 fixing holes, 6 coatings, 7 copper foil layers, 8 waterproofs
Layer, 9 thermal insulation layers, 10 glass layers, 11 vacuum flaggies, 12 asbestos layers, 13 separation layers, 14 rubber layers, 15 protective layers, 16 are strengthened
Muscle.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belongs to the scope of the utility model protection.
Fig. 1-5, a kind of complex function substrate, including substrate chip 1 are referred to, the top of substrate chip 1 is fixedly connected with
Circuit layer 2, the bottom of circuit layer 2 is fixedly connected by adhesive with the top of substrate chip 1, and the bottom of substrate chip 1 is fixed
Overcoat 3 is connected with, by setting overcoat 3 to be played a protective role to substrate chip 1, substrate chip is effectively avoided
1 damages in use, influences situation about using, and the top of overcoat 3 passes through adhesive and the bottom of substrate chip 1
It is fixedly connected, the both sides of overcoat 3 have been fixedly connected with fixed edge along 4, and fixed edge offers fixing hole 5 along 4 middle part, passes through
Fixed edge is set along 4 and fixing hole 5, substrate can be made more to facilitate when in use and fixed, substrate is effectively avoided and fixes not
It is convenient, influence situation about using, overcoat 3 is internally provided with reinforcement 16, inner homogeneous point of the reinforcement 16 in overcoat 3
Cloth, and the quantity of reinforcement 16 is no less than three, by setting reinforcement 16, it is possible to increase the intensity of overcoat 3, effectively keeps away
Exempt from substrate because external force collision is deformed, influence situation about using, circuit layer 2 includes coating 6, and the bottom of coating 6 is fixed
Be connected with copper foil layer 7, by setting coating 6, copper foil layer 7 can be played a protective role, effectively avoid copper foil layer 7 by
Abrasion, influences situation about using, the uniform fold of coating 6 includes thermal insulation layer 9 in the top of copper foil layer 7, overcoat 3, by setting
Thermal insulation layer 9, can completely cut off heat, effectively avoid substrate chip 1 because external temperature is too high, damage, influence is used
Situation, the bottom of thermal insulation layer 9 is fixedly connected with waterproof layer 8, by setting waterproof layer 8, can keep the dry of substrate chip 1
It is dry, effectively avoid substrate chip 1 and make moist, influence situation about using, the top of waterproof layer 8 and the bottom of thermal insulation layer 9
It is fixedly connected by high-temperature plastic, thermal insulation layer 9 includes glass layer 10, and the bottom of glass layer 10 is fixedly connected with vacuum
Flaggy 11, heat, by setting vacuum flaggy 11, can be distributed effectively, add effect of heat insulation, vacuum flaggy 11
Bottom be fixedly connected with asbestos layer 12, by setting glass layer 10 and asbestos layer 12, be capable of the transmission of trap heat, increase
Plus effect of heat insulation, waterproof layer 8 include separation layer 13, by setting separation layer 13, waterproof layer 8 can be separated with thermal insulation layer 9, had
The waterproof layer 8 that avoids of effect influences the effect of heat insulation of thermal insulation layer 9, and the bottom of separation layer 13 is fixedly connected with rubber layer 14, passed through
Rubber layer 14 is set, moisture can be effectively obstructed and penetrate into inside substrate, the bottom of rubber layer 14 is fixedly connected with matcoveredn 15,
By setting protective layer 15, rubber layer 14 can be played a protective role, effectively avoid rubber layer 14 and wear and tear, influenceed
The situation of waterproof effect.
In use, by setting overcoat 3 to be played a protective role to substrate chip 1, effectively avoiding substrate core
Piece 1 is damaged in use, is influenceed situation about using, by setting thermal insulation layer 9, can be completely cut off heat, effectively keep away
Substrate chip 1 is exempted from because external temperature is too high, has damaged, situation about using has been influenceed, by setting waterproof layer 8, Neng Goubao
The drying of substrate chip 1 is held, substrate chip 1 is effectively avoided and makes moist, situation about using is influenceed, by setting separation layer
13, waterproof layer 8 can be separated with thermal insulation layer 9, effectively avoiding waterproof layer 8 influences the effect of heat insulation of thermal insulation layer 9, by setting
Rubber layer 14 is put, moisture can be effectively obstructed and penetrate into inside substrate, by setting protective layer 15, rubber layer 14 can be played
Protective effect, effectively avoids rubber layer 14 and weares and teares, and the situation of waterproof effect is influenceed, by setting glass layer 10
With asbestos layer 12, it is capable of the transmission of trap heat, increases effect of heat insulation, can be effectively by heat by setting vacuum flaggy 11
Amount is distributed, and adds effect of heat insulation.
In summary：The complex function substrate, passes through overcoat 3, waterproof layer 8, thermal insulation layer 9, separation layer 13, rubber layer
14th, protective layer 15, glass layer 10, vacuum flaggy 11 and asbestos layer 12, the function of solving composite base plate are single, do not possess
The problem of insulating water-proof function.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out in the case where not departing from principle of the present utility model and spirit a variety of changes, repaiies
Change, replace and modification, scope of the present utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. it is fixedly connected with circuit layer at the top of a kind of complex function substrate, including substrate chip (1), the substrate chip (1)
(2), the bottom of the substrate chip (1) is fixedly connected with overcoat (3), and the circuit layer (2) includes coating (6), described to apply
The bottom of layer (6) is fixedly connected with copper foil layer (7), and the overcoat (3) includes thermal insulation layer (9), the bottom of the thermal insulation layer (9)
Waterproof layer (8) is fixedly connected with, the thermal insulation layer (9) includes glass layer (10), the bottom of the glass layer (10)
Vacuum flaggy (11) is fixedly connected with, the bottom of the vacuum flaggy (11) is fixedly connected with asbestos layer (12), the waterproof layer
(8) separation layer (13) is included, the bottom of the separation layer (13) is fixedly connected with rubber layer (14), the bottom of the rubber layer (14)
Portion is fixedly connected with matcoveredn (15).
2. a kind of complex function substrate according to claim 1, it is characterised in that：The both sides of the overcoat (3) are solid
Surely fixed edge is connected with along (4), and the fixed edge offers fixing hole (5) along in the middle part of (4).
3. a kind of complex function substrate according to claim 1, it is characterised in that：The inside of the overcoat (3) is set
There is reinforcement (16), the reinforcement (16) is distributed in the inner homogeneous of overcoat (3), and the quantity of reinforcement (16) is no less than
Three.
4. a kind of complex function substrate according to claim 1, it is characterised in that：The bottom of the circuit layer (2) passes through
Adhesive at the top of substrate chip (1) with being fixedly connected, and the top of the overcoat (3) passes through adhesive and substrate chip (1)
Bottom be fixedly connected.
5. a kind of complex function substrate according to claim 1, it is characterised in that：Coating (6) uniform fold is in copper
The top of layers of foil (7), the top of the waterproof layer (8) is fixedly connected with the bottom of thermal insulation layer (9) by high-temperature plastic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720017283.XU CN206353884U (en) | 2017-01-08 | 2017-01-08 | A kind of complex function substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720017283.XU CN206353884U (en) | 2017-01-08 | 2017-01-08 | A kind of complex function substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206353884U true CN206353884U (en) | 2017-07-25 |
Family
ID=59348818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720017283.XU Active CN206353884U (en) | 2017-01-08 | 2017-01-08 | A kind of complex function substrate |
Country Status (1)
| Country | Link |
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| CN (1) | CN206353884U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107889351A (en) * | 2017-12-24 | 2018-04-06 | 惠州市鑫进新电子有限公司 | A kind of consumer electronics wiring board and manufacture craft |
| CN108391388A (en) * | 2017-12-24 | 2018-08-10 | 惠州市鑫进新电子有限公司 | A kind of fine and closely woven line multilayer circuit board of high level and manufacture craft |
-
2017
- 2017-01-08 CN CN201720017283.XU patent/CN206353884U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107889351A (en) * | 2017-12-24 | 2018-04-06 | 惠州市鑫进新电子有限公司 | A kind of consumer electronics wiring board and manufacture craft |
| CN108391388A (en) * | 2017-12-24 | 2018-08-10 | 惠州市鑫进新电子有限公司 | A kind of fine and closely woven line multilayer circuit board of high level and manufacture craft |
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