CN206332025U - 一种5050内置ic全彩led - Google Patents

一种5050内置ic全彩led Download PDF

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Publication number
CN206332025U
CN206332025U CN201720027848.2U CN201720027848U CN206332025U CN 206332025 U CN206332025 U CN 206332025U CN 201720027848 U CN201720027848 U CN 201720027848U CN 206332025 U CN206332025 U CN 206332025U
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China
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pasters
chip
utility
supports
colour leds
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Expired - Fee Related
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CN201720027848.2U
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陈都
叶书娟
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Dongguan City Beyond Photoelectric Technology Co Ltd
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Dongguan City Beyond Photoelectric Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

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Abstract

本实用新型系提供一种5050内置IC全彩LED，涉及半导体器件。本实用新型包括5050支架，5050支架上设有G贴片、R贴片、B贴片和IC芯片，G贴片、R贴片、B贴片呈一字型排开，R贴片位于G贴片和B贴片之间。本实用新型优化了RGB贴片的排列方式，形成新型的全彩光源，内置IC芯片于5050支架上，省去后期对IC芯片进行加工，降低成本，同时消除因外置IC芯片而造成的损耗，省去大部分后期的维修，还能延长LED的寿命。

Description

一种5050内置IC全彩LED
技术领域
本实用新型涉及半导体器件，具体公开了一种5050内置IC全彩LED。
背景技术
LED封装5050RGB三色光源普遍应用于户外，在广告灯箱、显示屏等地方都有应用，5050RGB三色光源是由红、绿、蓝三种颜色的5050贴片组成，5050贴片是一种LED光源。
传统的5050全彩LED直接封装红绿蓝三种颜色的5050贴片，再通过外置的IC(集成电路)来驱动LED发出不同颜色的灯光，但外置IC会使加工成本提高，而且IC外置容易受到外界的影响，复杂多变的外界环境容易导致全彩LED失效等问题的出现，从而影响全彩LED的使用寿命。
实用新型内容
基于此，有必要针对现有技术问题，提供一种5050内置IC全彩LED，内置IC芯片于5050支架上，抗干扰性能好，组装效率高，成本低。
为解决现有技术问题，本实用新型公开一种5050内置IC全彩LED，包括5050支架，5050支架上设有G贴片、R贴片、B贴片和IC芯片，G贴片、R贴片、B贴片呈一字型排开，R贴片位于G贴片和B贴片之间。
进一步的，G贴片、R贴片、B贴片的排列间隔为0.2mm。
进一步的，5050支架包括数据输出端、数据输入端、电源端、接地端。
进一步的，G贴片、R贴片、B贴片和IC芯片的阳极连接电源端，IC芯片的输入端连接数据输入端，IC芯片的输出端连接数据输出端，IC芯片的阴极连接接地端。
本实用新型的有益效果为：本实用新型公开一种5050内置IC全彩LED，优化了RGB贴片的排列方式，形成新型的全彩光源，内置IC芯片于5050支架上，省去后期对IC芯片进行加工，降低成本，同时消除因外置IC芯片而造成的损耗，省去大部分后期的维修，还能延长LED的寿命。
附图说明
图1为本实用新型的结构示意图。
图2为本实用新型的立体结构示意图。
附图标记为：数据输出端1、数据输入端2、电源端3、接地端4、5050支架10、IC芯片11、G贴片12、R贴片13、B贴片14。
具体实施方式
为能进一步了解本实用新型的特征、技术手段以及所达到的具体目的、功能，下面结合附图与具体实施方式对本实用新型作进一步详细描述。
请参阅图1至图2：
一种5050内置IC全彩LED，包括5050支架10，5050支架10上设有G贴片12、R贴片13、B贴片14和IC芯片11，四个元件都采用点胶连接的方式固定；G贴片12、R贴片13、B贴片14呈一字型排开，R贴片13位于G贴片12和B贴片14之间，能有效利用三种色光元素，G贴片12、R贴片13、B贴片14的排列间隔为0.2mm，这个距离能有机地融合三种色光，带来丰富的颜色组合。将IC芯片11内置到5050支架10上，能有效消除外界对IC芯片11造成的影响，节省了后期安装IC芯片11的步骤，省去大部分后期的维修，节省成本至少10％，还能延长LED的寿命。
为进一步控制LED的发光，5050支架10包括数据输出端1、数据输入端2、电源端3、接地端4，一般采用四只引脚的5050支架10，G贴片12、R贴片13、B贴片14和IC芯片11的阳极连接电源端3，IC芯片11的输入端连接数据输入端2，IC芯片11的输出端连接数据输出端1，IC芯片11的阴极连接接地端4。输入不同的数据，通过IC芯片11调节G贴片12、R贴片13、B贴片14的亮度，不同的组合能形成不同颜色的光效，满足不同场合的需求。
为进一步提高LED的寿命，采用高密封、高导热的胶水把IC芯片11封装保护起来，使其长时间内也不会失效。
本发明内置IC芯片11，减低IC芯片11的损耗，同时降低加工和维修成本，成品寿命可持续50000小时以上，通过不同的RGB贴片排列方式，调节IC芯片11控制LED发出不同的颜色的光。
以上所述实施例仅表达了本实用新型的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本实用新型专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本实用新型构思的前提下，还可以做出若干变形和改进，这些都属于本实用新型的保护范围。因此，本实用新型专利的保护范围应以所附权利要求为准。

Claims (4)

1.一种5050内置IC全彩LED，其特征在于：包括5050支架(10)，所述5050支架(10)上设有G贴片(12)、R贴片(13)、B贴片(14)和IC芯片(11)，所述G贴片(12)、R贴片(13)、B贴片(14)呈一字型排开，所述R贴片(13)位于所述G贴片(12)和B贴片(14)之间。
2.根据权利要求1所述的一种5050内置IC全彩LED，其特征在于：所述G贴片(12)、R贴片(13)、B贴片(14)的排列间隔为0.2mm。
3.根据权利要求1所述的一种5050内置IC全彩LED，其特征在于：所述5050支架(10)包括数据输出端(1)、数据输入端(2)、电源端(3)、接地端(4)。
4.根据权利要求3所述的一种5050内置IC全彩LED，其特征在于：所述G贴片(12)、R贴片(13)、B贴片(14)和IC芯片(11)的阳极连接电源端(3)，所述IC芯片(11)的输入端连接所述数据输入端(2)，所述IC芯片(11)的输出端连接所述数据输出端(1)，所述IC芯片(11)的阴极连接所述接地端(4)。
CN201720027848.2U 2017-01-10 2017-01-10 一种5050内置ic全彩led Expired - Fee Related CN206332025U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110335863A (zh) * 2019-07-04 2019-10-15 深圳光台实业有限公司 一种led支架封装结构及封装工艺

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110335863A (zh) * 2019-07-04 2019-10-15 深圳光台实业有限公司 一种led支架封装结构及封装工艺
CN110335863B (zh) * 2019-07-04 2024-02-23 今台电子(惠州)有限公司 一种led支架封装结构及封装工艺

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Granted publication date: 20170714

Termination date: 20220110