CN206323643U

CN206323643U - High-flatness Rigid Flex

Info

Publication number: CN206323643U
Application number: CN201621466695.3U
Authority: CN
Inventors: 郭胜纳
Original assignee: Kunshan Q Technology Co Ltd
Current assignee: Kunshan Q Technology Co Ltd
Priority date: 2016-12-29
Filing date: 2016-12-29
Publication date: 2017-07-11
Anticipated expiration: 2026-12-29

Abstract

The utility model discloses a kind of high-flatness Rigid Flex, including soft board part and the two hardboard parts for being incorporated into the soft board part two ends, there is the pasting area for being used for mounting imaging sensor in the middle part of a wherein hardboard part, the pasting area includes substrate, the circuit coating and printing that are formed on substrate surface are attached to the PSR ink layers on the circuit coating and substrate surface, local windowing is carried out to the PSR ink layers of the pasting area, form some windowing grooves for exposing circuit coating and substrate surface, some windowing grooves are uniform in pasting area, and covered some windowing grooves by drawing glue filling.The utility model significantly improves the rugged phenomenon in hardboard region, thus improve finished product obscure it is bad.

Description

High-flatness Rigid Flex

Technical field

The utility model is related to a kind of Rigid Flex, is specifically related to a kind of high-flatness Rigid Flex.

Background technology

At present, with the continuous progress of science and technology, requirement more and more higher of the people to quality life, digital product is constantly to just Victory and lightweight development, the carrying of the camera of high pixel turn into the trend of market development.The convenience of digital product and Lightweight make it that the camera module of requirement to the circuit board also digital product such as more and more higher, particularly mobile phone, computer is often adopted With Rigid Flex, thin Rigid Flex, thinner module and thinner digital product can be made by representing.

But traditional Rigid Flex, is typically to be directly printed onto PSR ink on the circuit of hardboard part, but due to hard Circuit design in plate surface, causes its surface to be uneven even if having printed PSR ink and also have, that is to say, that hardboard part The region of attachment imaging sensor (such as COMS sensitive chips), which has, to be uneven, so that COMS sensitive chips are tilted, most Cause have angle of inclination with imaging camera head eventually, it is impossible to photo-equilibrium is passed well, camera module is obscured It is unclear serious bad.

The content of the invention

In order to solve the above-mentioned technical problem, the utility model proposes a kind of high-flatness Rigid Flex, significantly improve The rugged phenomenon in hardboard region, thus improve finished product obscure it is bad.

What the technical solution of the utility model was realized in：

A kind of high-flatness Rigid Flex, including soft board part and the two hardboard portions for being incorporated into the soft board part two ends Point, wherein having the pasting area for being used for mounting imaging sensor in the middle part of a hardboard part, the pasting area includes substrate, formed The PSR ink layers on the circuit coating and substrate surface are attached in the circuit coating on substrate surface and printing, to the attachment The PSR ink layers in region carry out local windowing, form some windowing grooves for exposing circuit coating and substrate surface, some to be somebody's turn to do The groove that opens a window is uniform in pasting area, and is covered some windowing grooves by drawing glue filling.

It is preferred that, the local windowing of the PSR ink layers is in matrix pattern.

It is preferred that, the glue of filling is spilled over to the relatively low pasting area of the outer horizontal position of matrix pattern in the windowing groove of matrix pattern.

The beneficial effects of the utility model are：The utility model provides a kind of high-flatness Rigid Flex, the soft or hard knot There is the pasting area for being used for mounting imaging sensor, the pasting area includes substrate, formed in the middle part of one hardboard part of plywood The PSR ink layers on the circuit coating and substrate surface are attached in the circuit coating on substrate surface and printing, circuit coating leads to Cross ink layer to be protected, local windowing is carried out by the PSR ink layers of pasting area, some windowing grooves are formed, opened a window recessed Groove is filled with glue, due to the mobility of glue, can be tiled in windowing groove and the relatively low attachment area of the outer horizontal position of windowing groove Not, so as to become comparison smooth on Rigid Flex pasting area surface.After the windowing blend compounds filling of PSR ink layers Surface is very smooth, is placing sensitive chip, sensitive chip can be made preferably to be contacted with hardboard, it is to avoid sensitive chip is tilted, from And improve finished product obscure it is bad.Preferably, windowing is in matrix pattern, it is easy to picture glue, improves production yield.

Brief description of the drawings

Fig. 1 is the front view of the utility model high-flatness Rigid Flex；

Fig. 2 is the profile of the utility model high-flatness Rigid Flex；

Fig. 3 is enlarged diagram at A in the utility model Fig. 2；

Embodiment

To enable the utility model more obvious understandable, the embodiment to the present invention is done in detail below in conjunction with the accompanying drawings Thin explanation.

As shown in Figure 1, Figure 2 and Figure 3, a kind of high-flatness Rigid Flex, including soft board part 1 and it is incorporated into the soft board The two hardboard parts 2 at part two ends, wherein there is the pasting area 21 for being used for mounting imaging sensor in the middle part of a hardboard part, should Pasting area includes substrate, the circuit coating being formed on substrate surface and printing and is attached on the circuit coating and substrate surface PSR ink layers 22, carry out local windowing, formation exposes circuit coating and substrate table to the PSR ink layers of the pasting area Some windowing grooves 23 in face, some windowing grooves are uniform in pasting area, and fill that some windowings are recessed by drawing glue Groove is covered.So, local windowing is carried out by the PSR ink layers to pasting area, forms some windowing grooves, windowing groove is used Glue 3 is filled, due to the mobility of glue, can tile in windowing groove and the relatively low attachment of the outer horizontal position of windowing groove is distinguished, So that to become comparison smooth on the pasting area surface of Rigid Flex.After the windowing blend compounds filling of PSR ink layers Surface is very smooth, when placing sensitive chip, sensitive chip can be made preferably to be contacted with hardboard, it is to avoid sensitive chip is tilted, So as to improve finished product obscure it is bad.

It is preferred that, the local windowing of the PSR ink layers is in matrix pattern, is easy to picture glue, improves production yield.

It is preferred that, the glue of filling is spilled over to the relatively low pasting area of the outer horizontal position of matrix pattern in matrix pattern windowing groove.This Sample, can make chip attachment region more smooth, it is to avoid chip attachment is tilted.

The utility model is opened a window by forming matrix pattern on PSR ink layers, and in windowing groove inside-paint glue covering, is obtained The pasting area of the higher Rigid Flex of flatness, when carrying out attachment sensitive chip, can avoid it from tilting, so as to improve Production yield.

Above example is that referring to the drawings, preferred embodiment of the present utility model is described in detail.The skill of this area Art personnel are by carrying out modification or change on various forms to above-described embodiment, but without departing substantially from substantive feelings of the present utility model Under condition, all fall within protection domain of the present utility model.

Claims

1. a kind of high-flatness Rigid Flex, including soft board part and the two hardboard parts for being incorporated into the soft board part two ends, There is the pasting area for being used for mounting imaging sensor, the pasting area includes substrate, is formed in the middle part of a wherein hardboard part Circuit coating and printing on substrate surface are attached to the PSR ink layers on the circuit coating and substrate surface, it is characterised in that：It is right The PSR ink layers of the pasting area carry out local windowing, and formation exposes circuit coating and some windowings of substrate surface are recessed Groove, some windowing grooves are uniform in pasting area, and covered some windowing grooves by drawing glue filling.

2. high-flatness Rigid Flex according to claim 1, it is characterised in that：The part of the PSR ink layers is opened Window is in matrix pattern.

3. high-flatness Rigid Flex according to claim 2, it is characterised in that：Filled in the windowing groove of matrix pattern Glue be spilled over to the relatively low pasting area of the outer horizontal position of matrix pattern.