CN206312929U

CN206312929U - A kind of LED wafer encapsulating shell for reducing loss percentage

Info

Publication number: CN206312929U
Application number: CN201621478186.2U
Authority: CN
Inventors: 袁洪峰; 周德全
Original assignee: FUJIAN DINGTAI PHOTOELECTRIC TECHNOLOGY Co Ltd
Current assignee: FUJIAN DINGKE PHOTOELECTRIC TECHNOLOGY Co.,Ltd.
Priority date: 2016-12-30
Filing date: 2016-12-30
Publication date: 2017-07-07
Anticipated expiration: 2026-12-30

Abstract

A kind of LED wafer encapsulating shell for reducing loss percentage, including a main casing, the article putting groove for housing LED wafer is offered on the upside of the main casing, electrode layer is provided with the article putting groove, the filling block on the inside of the spill electric conductor is also installed in including a spill electric conductor and one, the spill electric conductor is installed in the main casing downside and is electrically connected with the electrode layer, respectively there is one group of elasticity for bending inwards to bind foot for the bottom on the spill electric conductor both sides, two groups of elasticity bind foot it is symmetrical and between there is an opening, the bottom of the filling block is equiped with a ring bodies extended in the opening, elasticity bendable of binding foot is folded to the upside of its end and is abutted with the filling block, and the downside of its end is flush with the bottom of the ring bodies when abutting.It is folded to the upside of its end and is abutted with filling block by setting two pairs of elasticity bendable of binding foot, it is possible to prevente effectively from the end that elasticity is bound foot is collided and damages.

Description

A kind of LED wafer encapsulating shell for reducing loss percentage

Technical field

The utility model is related to the part that LED is assembled, and refers in particular to a kind of LED wafer encapsulation for reducing loss percentage Shell.

Background technology

LED wafer is the main raw material(s) of LED, and LED relies primarily on the chip to light.Enable the LED wafer It is enough luminous, then need to set the encapsulating shell used cooperatively with the LED wafer.

Existing encapsulating shell generally comprises a main casing and the positive and negative electrode on the upside of the main casing, LED wafer It is encapsulated on the main casing and is connected with positive and negative electrode, then is electrically connected with city by the positive and negative electrode pin on the downside of main casing Connect.But in order to keep it to radiate and conductive effect, often exposed setting, this is caused positive and negative electrode pin of the prior art In transport, installation process, positive and negative electrode pin thereon easily damages and then influences to use encapsulating shell due to being collided Effect.

Utility model content

The utility model provides a kind of LED wafer encapsulating shell for reducing loss percentage, and its main purpose is to overcome existing The defect that positive and negative electrode pin on LED wafer encapsulating shell is easily damaged.

In order to solve the above technical problems, the utility model is adopted the following technical scheme that：

A kind of LED wafer encapsulating shell for reducing loss percentage, including a main casing, use is offered on the upside of the main casing In the article putting groove of accommodating LED wafer, electrode layer is provided with the article putting groove, is also installed in this including a spill electric conductor and one Filling block on the inside of spill electric conductor, the spill electric conductor is installed in the main casing downside and is electrically connected with the electrode layer Connect, respectively there is one group of elasticity for bending inwards to bind foot for the bottom on the spill electric conductor both sides, two groups of elasticity bind foot it is symmetrical simultaneously And between there is an opening, the bottom of the filling block is equiped with a ring bodies extended in the opening, the elasticity bag The upside that pin bendable is folded to its end abuts with the filling block, and when abutting downside and the ring bodies of its end bottom End is flush.

Further, the distance between horizontal line where the end downside that the ring bodies bottom is bound foot with the elasticity It is 0~0.2mm.

Further, the electrode layer includes three positive electrodes and a negative electrode.

Further, during the two pairs of elasticity is bound foot, wherein three elasticity bind foot for respectively with three positive electrodes one The positive electrode pin of one connection, it is the negative electrode pin being connected with the negative electrode that another elasticity is bound foot.

Further, between the ring bodies is bound foot positioned at four elasticity.

Further, the ring bodies is integrally formed with filling block.

Compared to the prior art, the beneficial effect of the utility model generation is:

It is the utility model simple structure, practical, it is folded to the upside of its end by setting two pairs of elasticity bendable of binding foot Abutted with filling block, it is possible to prevente effectively from the end that elasticity is bound foot is collided and damages；Ring bodies can play the strong point Effect, it is to avoid four elasticity stress of binding foot is excessive and reduce service life.

Brief description of the drawings

Fig. 1 is top schematic diagram of the present utility model.

Fig. 2 is schematic bottom view of the present utility model.

Fig. 3 is the Section A-A figure of Fig. 2.

Specific embodiment

Specific embodiment of the present utility model is illustrated with reference to the accompanying drawings.

Reference picture 1, Fig. 2 and Fig. 3.A kind of LED wafer encapsulating shell for reducing loss percentage, including a main casing 1, the master The upside of housing 1 offers in the article putting groove 11 for housing LED wafer, the article putting groove 11 and is provided with electrode layer 2, also including one Spill electric conductor 3 and one is installed in the filling block 4 of the inner side of spill electric conductor 3, and the spill electric conductor 3 is installed in the master The downside of housing 1 simultaneously electrically connects with the electrode layer 2, and respectively there is one group to bend inwards for the bottom on the both sides of spill electric conductor 3 Elasticity binds foot 31, two groups of elasticity bind foot 31 it is symmetrical and between there is an opening 32, the bottom of the filling block 4 is equiped with one Extend to the ring bodies 5 in the opening, the elasticity 31 bendables of binding foot are folded to the upside 33 of its end and the filling block 4 is supported Connect, and the downside 34 of its end is flush with the bottom of the ring bodies 5 when abutting.Ring bodies 5 and the one of filling block 4 into Type.The present embodiment be the bottom of ring bodies 5 and the elasticity bind foot 31 end downside where the distance between horizontal line for 0~ 0.2mm.It is folded to the upside of its end and is abutted with filling block by setting the two pairs of elasticity, 31 bendables of binding foot, it is possible to prevente effectively from elastic Bind foot 31 end is collided and damages；Ring bodies 5 can play a part of the strong point, it is to avoid four elasticity are bound foot 31 stress It is excessive and reduce service life.Bind foot 31 size of each elasticity is in the present embodiment：Length 0.48mm, width 0.50mm, This numerical value can reach optimal conductive effect.

Reference picture 1, Fig. 2 and Fig. 3.The bottom opening 111 of the article putting groove 11 is substantially square, and its length of side is 1.34mm, open top 112 is also substantially square, and its length of side is 1.616mm, by setting the open top length of side bottom of more than The portion opening length of side, can effectively strengthen radiating effect when the utility model is used.

Reference picture 1, Fig. 2 and Fig. 3.The electrode layer 2 includes three negative electrodes 22 of positive electrode 21 and, two adjacent electricity Extremely separated by insulating tape 23.The two pairs of elasticity is bound foot in 31, wherein three elasticity bind foot for respectively it is described with three just The positive electrode pin 311 that electrode 21 is connected one by one, another elasticity negative electrode for being to be connected with the negative electrode 22 of binding foot draws Pin 312.In addition, the ring bodies 5 is located at four elasticity bind foot between 31, four elasticity are made to bind foot 31 uniform forces, it is to avoid to go out The unstable situation of existing illumination effect.

Specific embodiment of the present utility model is above are only, but design concept of the present utility model is not limited thereto, All changes for carrying out unsubstantiality to the utility model using this design, all should belong to the row for invading the utility model protection domain For.

Claims

1. a kind of LED wafer encapsulating shell for reducing loss percentage, an including main casing, offered on the upside of the main casing for The article putting groove of accommodating LED wafer, electrode layer is provided with the article putting groove, it is characterised in that：Also include a spill electric conductor and One is installed in the filling block on the inside of the spill electric conductor, the spill electric conductor be installed in the main casing downside and with the electricity Respectively there is one group of elasticity for bending inwards to bind foot for pole layer electrical connection, the bottom on the spill electric conductor both sides, and two groups of elasticity are bound foot It is symmetrical and between have one opening, the bottom of the filling block is equiped with a ring bodies extended in the opening, institute Elasticity bendable of binding foot is stated to be folded to the upside of its end and is abutted with the filling block, and the downside of its end and the ring in abutting The bottom of shape body is flush.

2. as claimed in claim 1 a kind of LED wafer encapsulating shell for reducing loss percentage, it is characterised in that：The ring bodies bottom The distance between horizontal line where the end downside that end is bound foot with the elasticity is 0~0.2mm.

3. as claimed in claim 2 a kind of LED wafer encapsulating shell for reducing loss percentage, it is characterised in that：The electrode layer bag Include three positive electrodes and a negative electrode.

4. as claimed in claim 3 a kind of LED wafer encapsulating shell for reducing loss percentage, it is characterised in that：The two pairs of elasticity In binding foot, wherein it is the positive electrode pin being connected one by one with three positive electrodes respectively, another bullet that three elasticity are bound foot It is the negative electrode pin being connected with the negative electrode that property is bound foot.

5. as claimed in claim 4 a kind of LED wafer encapsulating shell for reducing loss percentage, it is characterised in that：The ring-type position Between four elasticity are bound foot.

6. as claimed in claim 1 a kind of LED wafer encapsulating shell for reducing loss percentage, it is characterised in that：The ring bodies with Filling block is integrally formed.