CN206260156U - Built-in substrate - Google Patents
Built-in substrate Download PDFInfo
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- CN206260156U CN206260156U CN201590000675.4U CN201590000675U CN206260156U CN 206260156 U CN206260156 U CN 206260156U CN 201590000675 U CN201590000675 U CN 201590000675U CN 206260156 U CN206260156 U CN 206260156U
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Abstract
The layered product (900) of built-in substrate (10) is made up of insulating properties base material (901 906).The non-formation face of the conductor of insulating properties base material (903) abuts with the installation terminal (211,212) of electronic unit (21).With terminal (211) be connected with conductive pattern (931) for installation by the interlayer connection conductor (331) of insulating properties base material (903).The non-formation face of the conductor of insulating properties base material (904) abuts with the installation terminal (221,222) of electronic unit (22).With terminal (221) be connected with conductive pattern (941) for installation by the interlayer connection conductor (341) of insulating properties base material (904).Conductive pattern (941) is abutted with conductive pattern (931).Insulating properties base material (903) and insulating properties base material (904) are configured as：In the stacking direction, conductive pattern (931) is insulating properties base material (904) side relative to insulating properties base material (903), and conductive pattern (941) is insulating properties base material (903) side relative to insulating properties base material (904).
Description
Technical field
The utility model is related to be built-in with substrate the built-in substrate of multiple electronic units.
Background technology
In the past, it is contemplated that the layered product that various circuit patterns internally possess.For example, in patent document 1, by will be many
Individual thermoplastic insulation's property base material is laminated and heats crimping, forms the multilager base plate that circuit pattern internally possesses.
In the multilager base plate described in patent document 1, thermoplastic insulation's property base material stacking of conductor will be formed in one side, with
So that the face for forming conductor is identical relative to the direction of base material.Also, the multilager base plate described in patent document 1 is matched somebody with somebody by insertion
The interlayer connection conductor of the base material being placed between this 2 conductive patterns is arranged at the base of the layer for constituting different to connect respectively
2 conductive patterns of material.Interlayer connection conductor be by base material formed through hole, to the through hole fill conductive paste,
Conductive paste solidification is realized during heating crimping.
Citation
Patent document
Patent document 1：No. 3407727 specifications of Japanese Patent No.
Utility model content
- the utility model problem to be solved-
In such multilager base plate, by multiple electronic component-embedded different layers in multilager base plate, to multiple electricity
Shared conductive pattern is connected with each electronic unit, it is necessary to be respectively provided with the case of the shared conductive pattern of subassembly connection
Wiring pattern.
Fig. 6 is the side sectional view of the wiring pattern for representing the built-in substrate considered according to existing composition.Such as
Shown in Fig. 6, the built-in substrate 10P considered according to existing composition possesses layered product 900P.Layered product 900P is that to have
What the insulating properties base material 901,902,903,904,905,906 for having thermoplasticity and insulating properties was laminated.Now, insulating properties base material
The formation face that 903-906 tegillums are stacked as conductor is configured in identical direction relative to base material.
On the surface of insulating properties base material 903, shared conductive pattern 931 and conductive pattern 932 is formed.In insulating properties base
The surface of material 904 forms conductive pattern 941P, and conductive pattern 951P is formed on the surface of resin substrate 905.In insulating properties base material
906 surface forms conductive pattern 961P, 962P.
In the layer of the insulating properties base material 902 of layered product 900P, built-in electronic part 21.The installation terminal of electronic unit 21
211st, 212 towards the side of insulating properties base material 903.Installation terminal 211 passes through to be arranged on the conductor figure with insulating properties base material 903
The interlayer connection conductor 331 of the position that case 931 is overlapped, to be connected with conductive pattern 931.Installation terminal 212 is by being set
In the interlayer connection conductor 332 of the position Chong Die with the conductive pattern 932 of insulating properties base material 903, to connect with conductive pattern 932
Connect.
In the layer of the insulating properties base material 905 of layered product 900P, built-in electronic part 22.The installation terminal of electronic unit 22
221st, 222 towards the side of insulating properties base material 906.Installation terminal 221 passes through to be arranged on the conductor figure with insulating properties base material 906
The interlayer connection conductor 361P of the position that case 961P is overlapped, is connected with conductive pattern 961P.
In such composition, electronic unit 21 only connects via interlayer connection conductor 331 relative to conductive pattern 931
Connect.On the other hand, electronic unit 22 is via interlayer connection conductor 361P, conductive pattern 961P, interlayer connection conductor 363P, conductor
Pattern 951P, interlayer connection conductor 351P, conductive pattern 941P and interlayer connection conductor 341P and relative to conductive pattern 931
Connection.So, the wiring for electronic unit 22 is elongated, and loss increases.
The purpose of this utility model is to be built-in with the built-in substrate of multiple electronic units, reduces and is directed to each electricity
The loss of subassembly.
- means to solve the problem-
Built-in substrate of the present utility model possesses：Layered product；With the 1st electronic unit and the 2nd electronic unit, matched somebody with somebody
Put in the inside of layered product, be configured with installation terminal in one side respectively.Layered product has the heat by conductor is only formed in one side
The insulating properties base material of plasticity is laminated multi-disc and heat the composition of crimping, and insulating properties base material is included only to be led in one side formation the 1st
1st insulating properties base material of body and only one side formed the 2nd conductor the 2nd insulating properties base material.Layered product possess be connected to the 1st electricity
The shared conductive pattern of subassembly and the 2nd electronic unit.
Shared conductive pattern in the stacking direction, is configured between the 1st electronic unit and the 2nd electronic unit.
The 1st conductor for not forming conductor of the side opposite with the interarea for being formed with the 1st conductor of the 1st insulating properties base material is non-
Formation face is connected to the 1st electronic unit, and the 1st insulating properties base material has the installation terminal of the 1st electronic unit and the 1st conductor company
Connect and be formed in the interlayer connection conductor of the position Chong Die with the 1st conductor.2nd insulating properties base material be formed with the 2nd conductor
The 2nd non-formation face of conductor for not forming conductor of the opposite side of interarea is connected to the 2nd electronic unit, the 2nd insulating properties base material tool
Having connect the installation terminal of the 2nd electronic unit with the 2nd conductor and be formed in the interlayer connection of the position Chong Die with the 2nd conductor
Conductor.1st insulating properties base material is configured as：In the stacking direction, the interarea and the 2nd insulating properties base material for being formed with the 1st conductor are supported
Connect.2nd insulating properties base material is configured as：In the stacking direction, the interarea for being formed with the 2nd conductor is abutted with the 1st insulating properties base material.
1st insulating properties base material is heated during crimping with the 2nd insulating properties base material.
In this composition, conductor length, shared conductive pattern between shared conductive pattern and the 1st electronic unit with
Conductor length between 2nd electronic unit all shortens.
Additionally, in built-in substrate of the present utility model, preferably in the stacking direction, in the 1st electronic unit and the 2nd
, there is the part that the 1st conductor and the 2nd conductor are mutually abutted, in the 1st conductor and the 2nd conductor in the region between electronic unit
Between form alloy-layer.
In this composition, it is possible to increase the connection reliability of the mutual bearing surface of conductor.
Additionally, in built-in substrate of the present utility model, preferably the 1st conductor is the 1st electronic unit and the 2nd electronics
The shared wiring pattern that part is connected.
In this composition, conductor length, shared conductive pattern between shared conductive pattern and the 1st electronic unit with
Conductor length between 2nd electronic unit shortens.
Additionally, in the manufacture method of built-in substrate of the present utility model, with following each operation.
The manufacture method of built-in substrate has the operation for preparing multi-disc insulating properties base material, and the insulating properties base material is only to exist
One side formed conductor thermoplastic insulating properties base material, and comprising only one side formed the 1st conductor the 1st insulating properties base material and
The 2nd insulating properties base material of the 2nd conductor is only formed in one side.
The manufacture method of built-in substrate has：Chong Die with the 1st conductor position in the 1st insulating properties base material sets and passes through
Through hole, the operation of conductive paste is filled to the through hole.
The manufacture method of built-in substrate has：Chong Die with the 2nd conductor position in the 2nd insulating properties base material sets and passes through
Through hole, the operation of conductive paste is filled to the through hole.
The manufacture method of built-in substrate has：By the stacking of multi-disc insulating properties base material, to cause and the 1st insulating properties base material
In be formed with the 1st conductor the 1st non-formation face for not forming conductor of the opposite side of interarea be connected to the peace of the 1st electronic unit
The face that dress terminal exposes, the side opposite with the interarea that the 2nd conductor is formed with the 2nd insulating properties base material does not form conductor
2nd non-formation face is connected to the face that the installation terminal of the 2nd electronic unit exposes, and the 1st conductor is formed with the 1st insulating properties base material
Interarea abutted with the 2nd insulating properties base material, and the interarea and the 1st insulating properties base of the 2nd conductor are formed with the 2nd insulating properties base material
The operation that material is abutted.
The manufacture method of built-in substrate has：Pressure is applied to the multi-disc insulating properties base material being laminated along stacked direction
And the operation for being heated.
In this manufacture method, the transmission for each electronic unit for being built-in with multiple electronic units is able to easily form
Less built-in substrate is lost.
- utility model effect-
According to the utility model, can realize reducing the built-in substrate of the loss in substrate.
Brief description of the drawings
Fig. 1 is the side, sectional of the construction for representing the built-in substrate involved by the 1st implementation method of the present utility model
Figure.
Fig. 2 is the amplification view at the junction surface of the built-in substrate involved by the 1st implementation method of the present utility model.
Fig. 3 is the side sectional view of the composition for representing the circuit substrate involved by the 1st implementation method of the present utility model.
Fig. 4 is the structure heated before crimping for representing the built-in substrate involved by the 1st implementation method of the present utility model
The side sectional view made.
Fig. 5 is the side, sectional of the construction for representing the built-in substrate involved by the 2nd implementation method of the present utility model
Figure.
Fig. 6 is the side sectional view for representing the wiring pattern according to the existing built-in substrate for constituting and considering.
Specific embodiment
(the 1st implementation method)
Come to illustrate the built-in substrate involved by the 1st implementation method of the present utility model referring to the drawings.Fig. 1 is
Represent the side sectional view of the construction of built-in substrate involved by the 1st implementation method of the present utility model.Fig. 2 is this practicality
The amplification view at the junction surface of the built-in substrate involved by the 1st new implementation method.Fig. 4 is to represent the utility model
The 1st implementation method involved by built-in substrate heating crimping before construction side sectional view.
As shown in figure 1, the built-in substrate 10 involved by the 1st implementation method of the present utility model possesses multiple is insulated
The layered product 900 that property base material 901-906 is laminated.Each insulating properties base material 901-906 is made up of the thermoplastic resin of film-form.
As thermoplastic resin, for example, it is made up of the material with liquid crystal polymer as principal component.Insulating properties base material 901-906 is by only in tool
The structure for having the one side in the face in two faces to be formed with conductor is constituted.For example, insulating properties base material 901-906 attaches copper by one side
Thermoplastic resin is constituted.
Insulating properties base material 901,902,903 is identical area.Insulating properties base material 904,905,906 is identical area,
Area than insulating properties base material 901,902,903 is small.Part that therefore, layered product 900 is laminated in insulating properties base material 901-906,
The part being laminated with insulating properties base material 901,902,903, thickness is different.The part of insulating properties base material 901-906 stackings does not almost have
It is flexible.That is, the part of insulating properties base material 901-906 stackings is the rigid portion of built-in substrate 10.Only insulating properties
The part of the stacking of base material 901,902,903 has flexibility.That is, the part of only insulating properties base material 901-903 stackings is portion
The flexible part of part built-in substrate 10.
, equivalent to " the 3rd insulating properties base material " of the present utility model, insulating properties base material 903 is equivalent to this for insulating properties base material 902
" the 1st insulating properties base material " of utility model.Insulating properties base material 904 is equivalent to " the 2nd insulating properties base material " of the present utility model, insulation
Property base material 905 is equivalent to " the 4th insulating properties base material " of the present utility model.2 interareas in insulating properties base material 903 are (with stacking side
To orthogonal face) among do not form the face of conductor equivalent to " the 1st non-formation face " of the present utility model.In insulating properties base material 904
2 interareas (face orthogonal with stacked direction) among do not form the face of conductor " the 2nd is non-formation equivalent to of the present utility model
Face ".
The formation face of the conductor in insulating properties base material 902 abuts with the non-formation face of the conductor in insulating properties base material 901.Absolutely
The non-formation face of the conductor in edge base material 902 abuts with the non-formation face of the conductor in insulating properties base material 903.Insulating properties base material
The formation face of the conductor in 903 abuts with the formation face of the conductor in insulating properties base material 904.Conductor in insulating properties base material 904
Non-formation face abutted with the non-formation face of the conductor in insulating properties base material 905.The formation face of the conductor in insulating properties base material 905
Abutted with the non-formation face of the conductor in insulating properties base material 906.
So, by the conductor in the non-formation face for possessing the conductor made in insulating properties base material 902 and insulating properties base material 903
Non-formation face abut composition, the stacking of insulating properties base material can be adjusted in the case where the thickness of insulating properties base material is not changed
The distance of conductive pattern 921 and conductive pattern 931 on direction.
Additionally, by so in the midway of stacked direction, making the formation face of the conductor in insulative substrate non-with conductor
Form relation of plane reversion to be laminated insulating properties base material, can be formed and used in the face at the two ends of the stacked direction of layered product 900
Conductive pattern in installing component, the conductive pattern for installing layered product 900.
The formation face of the conductor in insulating properties base material 901, arranges conductive pattern 911,912,913,914.The face is layer
Stack 900 (built-in substrate 10) is installed in the mounting surface of other circuit substrates, and conductive pattern 911,912,913,914 is
External connection terminal in built-in substrate 10.
Insulating properties base material 901 and the boundary face of insulating properties base material 902 in layered product 900, arrange conductive pattern 921.
Conductive pattern 921 is connected by being equipped on the interlayer connection conductor 311 of insulating properties base material 901 with conductive pattern 914.
The boundary face of insulating properties base material 903 and insulating properties base material 904 in layered product 900, arranging conductive pattern 931,
932、933.Conductive pattern 931 equivalent to " shared conductive pattern " of the present utility model, and equivalent to of the present utility model
" the 1st conductor ".Conductive pattern 932 is the terminal pad conductor of electronic unit 21.It is built-in that conductive pattern 933 is mounted to the part
The terminal pad conductor of the external electronic of substrate 10.
A part and conductive pattern 932 for conductive pattern 931 is configured in the rigid portion of layered product 900.Conductive pattern
931 other parts and conductive pattern 933 are configured in the flexible part of layered product 900.
Conductive pattern 933 is by being equipped on the interlayer connection conductor 333 of insulating properties base material 903 and being equipped on insulation
The interlayer connection conductor 321 of property base material 902, is connected with conductive pattern 921.A part and conductive pattern 933 for conductive pattern 931
It is not to be built in the terminal pad that the electronic unit of built-in substrate 10 (electronic unit 23 in reference picture 3) is mounted to lead
Body.
Additionally, insulating properties base material 903 and the boundary face of insulating properties base material 904 in layered product 900, arrange conductive pattern
941、942.Conductive pattern 941,942 is the terminal pad conductor of electronic unit 22.Conductive pattern 941 is equivalent to the utility model
" the 2nd conductor ".
Layered product 900 is overlooked, conductive pattern 941 is overlap with conductive pattern 931, conductive pattern 942 and the weight of conductive pattern 932
It is folded.Conductive pattern 941 is engaged with conductive pattern 931, and conductive pattern 942 is engaged with conductive pattern 932.Now, as shown in Fig. 2
On conductive pattern 942 and the composition surface of conductive pattern 932, alloy-layer 990 is formed.Alloy-layer 990 such as conductive pattern 932,
In 942 modes being made up of copper, it is made up of the alloy (Cu-Ni-Sn alloys) of copper, nickel, tin.By forming such alloy-layer
990, the fusing point on composition surface is uprised, it is possible to increase reliability.
Insulating properties base material 905 and the boundary face of insulating properties base material 906 in layered product 900, arrange conductive pattern 951.
The formation face of the conductor in insulating properties base material 906, arranges conductive pattern 961,962.Conductive pattern 961,962 is
It is not built in the terminal pad conductor that the electronic unit of built-in substrate 10 (electronic unit 24 in reference picture 3) is mounted.
Conductive pattern 961 is connected by being equipped on the interlayer connection conductor 361 of insulating properties base material 906 with conductive pattern 951.
Electronic unit 21 possesses installation terminal 211,212 in one side.The electronic unit 21 is equivalent to of the present utility model
" the 1st electronic unit ".Electronic unit 22 possesses installation terminal 221,222 in one side.The electronic unit 22 is equivalent to this practicality
New " the 2nd electronic unit ".
Electronic unit 21,22 is configured in the inside of the rigid portion in layered product 900.
Electronic unit 21 is configured in the region of the insulating properties base material 902 in layered product 900.The installation of electronic unit 21 is used
Terminal 211,212 is towards the side of insulating properties base material 903.Installation with terminal 211,212 insulating properties base material 902,903 boundary face
Expose.Layered product 900 is overlooked, installation terminal 211 is overlap with conductive pattern 931, installed with terminal 212 and conductive pattern 932
Overlap.Installation terminal 211 is connected by being equipped on the interlayer connection conductor 331 of insulating properties base material 903 with conductive pattern 931
Connect.Installation terminal 212 is connected by being equipped on the interlayer connection conductor 332 of insulating properties base material 903 with conductive pattern 932.
Electronic unit 22 is configured in the region of the insulating properties base material 905 in layered product 900.The installation of electronic unit 22 is used
Terminal 221,222 is towards the side of insulating properties base material 904.Installation with terminal 221,222 insulating properties base material 904,905 boundary face
Expose.Layered product 900 is overlooked, installation terminal 221 is overlap with conductive pattern 941, installed with terminal 222 and conductive pattern 942
Overlap.Installation terminal 221 is connected by being equipped on the interlayer connection conductor 341 of insulating properties base material 904 with conductive pattern 941
Connect.Installation terminal 222 is connected by being equipped on the interlayer connection conductor 342 of insulating properties base material 904 with conductive pattern 942.
So, in the composition of present embodiment, it is equipped with what the installation terminal 211,212 of electronic unit 21 was connected
The formation of the conductor in the insulating properties base material 903 of interlayer connection conductor 331,332 and conductive pattern 931,932 is facing to arranging
Interlayer connection conductor 341,342 and conductive pattern 941,942 that the installation terminal 221,222 for having electronic unit 22 is connected
The side of insulating properties base material 904.Additionally, the formation of conductor in the insulating properties base material 904 is facing to insulating properties base material 903 1
Side.
Insulating properties base material 903 is equipped on as the conductive pattern 931 of shared conductive pattern to be supported with insulating properties base material 904
The boundary face for connecing.
In the stacking direction, the installation terminal 211,212 of electronic unit 21 is configured in the side of conductive pattern 931, electricity
The installation terminal 221,222 of subassembly 22 is configured in the side of conductive pattern 931.
Layered product 900 is overlooked, is installed with the part overlap of terminal 211, installation terminal 221 and conductive pattern 931.
Therefore, conductive pattern 931 is only connected with installation with terminal 211 by interlayer connection conductor 331, conductive pattern
931 are only connected with installation with terminal 221 by conductive pattern 941 and interlayer connection conductor 341.To be led thereby, it is possible to shorten
Conductor length that body pattern 931 is connected with electronic unit 21, the conductor length that conductive pattern 931 is connected with electronic unit 22.
Therefore, it is possible to reduce the loss of the high-frequency signal for two electronic units 21,22 for being built in layered product 900, can
Realize the relatively low built-in substrate 10 of loss.
Further, as shown in Figure 6, it is also possible to not by the wiring pattern of the transmission signal of electronic unit 22 be arranged on just
The different region of the configuring area of the electronic unit 22 in property portion.Therefore, it is possible to reduce the area of rigid portion, being capable of small-sized landform
Into built-in substrate 10.
Additionally, in the composition of present embodiment, due to overlooking layered product 900, electronic unit 21 and the weight of electronic unit 22
It is folded, therefore, it is possible to further reduce the area of rigid portion.
Additionally, in the composition of present embodiment, due to installation terminal 211 and the electronic unit 22 of electronic unit 21
Installation terminal 221 is overlapped respectively, therefore, it is possible to further reduce the high frequency between conductive pattern 931 and electronic unit 21,22
The loss of signal.
Additionally, in the composition of present embodiment, the installation of electronic unit 21 passes through interlayer connection conductor with terminal 211
331 and the conductive pattern of terminal pad that connects by as shared conductive pattern is conductive pattern 931.Therefore, it is possible to enter
One step reduces the loss of high-frequency signal.
Additionally, being conductive pattern 931, electronic unit relative to shared conductive pattern in the composition of present embodiment
21st, 22 only it is individually configured across one layer of insulating properties base material.Transmission therefore, it is possible to further reduce high-frequency signal is damaged
Consumption, and the height (thickness) of rigid portion can be reduced, the low level of built-in substrate 10 can be made.
In addition, in the composition of present embodiment, the two ends configuration illustrated in stacked direction does not form the insulation of conductor
The mode of property base material 901,906.These insulating properties base materials 901,906 be for protecting electronic unit 21,22, conductive pattern,
Can also omit.
The built-in substrate 10 being made up of this structure can for example be used in the circuit substrate shown in Fig. 3.Fig. 3 is table
Show the side sectional view of the composition of circuit substrate involved by the 1st implementation method of the present utility model.Circuit substrate 1 possesses part
The electronic unit 23,24 of built-in substrate 10 and exterior.Built-in substrate 10 possesses above-mentioned composition.Electronic unit 23 is installed in
The conductive pattern 931,933 of built-in substrate 10.Electronic unit 24 is installed in the conductive pattern of built-in substrate 10
961、962。
By being set to such composition, for example, can suppress high-frequency signal between electronic unit 23 and electronic unit 21
The loss of the high-frequency signal between loss, electronic unit 23 and electronic unit 22.
Such built-in substrate 10 is as follows to be manufactured like that.
First, prepare one side to attach the insulating properties base material 902,903,904,905 of copper and do not attach the insulating properties base of copper
Material 901,906.Insulating properties base material 901-906 is made up of thermoplastic resin, such as with liquid crystal polymer as principal component.
Patterned process etc. is carried out by the conductor formation face to insulating properties base material 902 to form conductive pattern 921.It is logical
Cross carries out patterned process to form conductive pattern 931,932,933 to the conductor formation face of insulating properties base material 903.By right
The conductor of insulating properties base material 904 forms face and carries out patterned process to form conductive pattern 941,942.By to insulating properties base
The conductor of material 905 forms face and carries out patterned process to form conductive pattern 951.
For insulating properties base material 902, the hole 82 of insertion insulating properties base material 902 in a thickness direction is set.For insulating properties
Base material 905, sets the hole 85 of insertion insulating properties base material 905 in a thickness direction.
The assigned position of the part of conductive pattern 921 is formed in insulating properties base material 902, is formed from the non-formation face one of conductor
The through hole of side insertion insulating properties base material 902, and fill conductive paste 321DP.
The assigned position of the part of conductive pattern 931 is formed in insulating properties base material 903, is formed from the non-formation face one of conductor
The through hole of side insertion insulating properties base material 903, and fill conductive paste 331DP.Conductive pattern is formed in insulating properties base material 903
932 part, forms the through hole from the non-formation face side insertion insulating properties base material 903 of conductor, and fill conductive paste
332DP.The part of conductive pattern 933 is formed in insulating properties base material 903, is formed from the non-formation face side insertion insulating properties of conductor
The through hole of base material 903, and fill conductive paste 333DP.
The part of conductive pattern 941 is formed in insulating properties base material 904, is formed from the non-formation face side insertion insulation of conductor
The through hole of property base material 904, and fill conductive paste 341DP.The part of conductive pattern 942 is formed in insulating properties base material 904,
The through hole from the non-formation face side insertion insulating properties base material 904 of conductor is formed, and fills conductive paste 342DP.
Here, conductive paste has mobility.But, as described above, in the built-in substrate 10 of present embodiment,
Conductor is configured in the one end for being arranged at the through hole of each insulating properties base material.Therefore, the conductor turns into the ground of through hole, can press down
Conductive paste processed spills from through hole, and the manufacture of built-in substrate 10 becomes easy, and each interlayer connection conductor reliability
Property improve.
Electronic unit 21 is inserted to the hole 82 of insulating properties base material 902.Now, electronic unit 21 is configured as installation terminal
211st, 212 towards the non-formation face side of conductor.Electronic unit 22 is inserted to the hole 85 of insulating properties base material 905.Now, electronic unit
22 are configured as installation terminal 221,222 towards the non-formation face side of conductor.
By insulating properties base material 901-906 stackings, to cause to meet following condition.
The non-formation face of conductor of insulating properties base material 902 abuts with the non-formation face of the conductor of insulating properties base material 903.Insulating properties base
The conductor of material 903 forms face and is abutted with the conductor formation face of insulating properties base material 904.The non-formation face of conductor of insulating properties base material 904
Abutted with the non-formation face of the conductor of insulating properties base material 905.Now, in the bearing surface and conductive pattern of conductive pattern 931,941
932,942 bearing surface coating grafting material.
Insulating properties base material 901-906 to being stacked in the state of at least pressure is applied in stacked direction is heated to be come
Integration.Now, conductive paste 321DP, 331DP, 332DP, 333DP, 341DP, 342DP solidifications, form interlayer connection conductor
321、331、332、333、341、342.Additionally, reacted with conductive pattern by grafting material, in conductive pattern 931,941
Interface and conductive pattern 932,942 interface formed alloy-layer.Additionally, imbedding insulative resin to hole 82,85.Thus,
Realize layered product 900.
By using such manufacture method, the relatively low built-in substrate of above-mentioned loss can be easily manufactured
10。
(the 2nd implementation method)
Come to illustrate the built-in substrate involved by the 2nd implementation method of the present utility model referring to the drawings.Fig. 5 is
Represent the side sectional view of the construction of built-in substrate involved by the 2nd implementation method of the present utility model.
As shown in figure 5, the built-in substrate 10A involved by the 2nd implementation method of the present utility model possess will it is multiple absolutely
The layered product 900A that edge base material 901A-907A is laminated.Each insulating properties base material 901A-907A by film-form thermoplastic resin
Fat is constituted.As thermoplastic resin, for example, it is made up of the material with liquid crystal polymer as principal component.Insulating properties base material 901A-
The thermoplastic resin that 905A is attached copper by one side is constituted.Insulating properties base material 906A, 907A is the thermoplastic resin not form conductor.
Insulating properties base material 901A, 902A, 903A are identical areas.Insulating properties base material 904A, 905A, 906A, 907A are
Identical area, the area than insulating properties base material 901A, 902A, 903A is small.Therefore, layered product 900A is in insulating properties base material
The part of 901A-907A stackings and insulating properties base material 901A, 902A, the part of 903A stackings, thickness are different.Insulating properties base material
The part that 901A-907A is laminated is almost without flexibility.That is, the part that insulating properties base material 901A-907A is laminated is
The rigid portion of built-in substrate 10A.Only insulating properties base material 901A, 902A, the part of 903A stackings have flexibility.Namely
Say, the part of only insulating properties base material 901A-903A stackings is the flexible part of built-in substrate 10A.Built-in substrate 10A with
Built-in substrate 10 involved by 1st implementation method is different, on the direction orthogonal with stacked direction, in the both sides of rigid portion
Flexible part is set.
Insulating properties base material 902A equivalent to " the 3rd insulating properties base material " of the present utility model, insulating properties base material 903A equivalent to
" the 1st insulating properties base material " of the present utility model.Insulating properties base material 905A equivalent to " the 2nd insulating properties base material " of the present utility model,
Insulating properties base material 906A is equivalent to " the 4th insulating properties base material " of the present utility model.
The formation face of the conductor in insulating properties base material 902A abuts with insulating properties base material 901A.In insulating properties base material 902A
The non-formation face of conductor abuts with the non-formation face of the conductor in insulating properties base material 903A.Conductor in insulating properties base material 903A
Formation face abuts with the formation face of the conductor in insulating properties base material 904A.The non-formation face of the conductor in insulating properties base material 904A with
The formation face of the conductor in insulating properties base material 905A abuts.The non-formation face of the conductor in insulating properties base material 905A and insulating properties base
Material 906A is abutted.
The formation face of the conductor in insulating properties base material 901A, arranges conductive pattern 911,912,913,914.The face is layer
Stack 900A (built-in substrate 10A) is installed in the mounting surface of other circuit substrates, conductive pattern 911,912,913,914
It is the external connection terminal in built-in substrate 10A.
The boundary face of the insulating properties base material 901A and insulating properties base material 902A in layered product 900A, arranges conductive pattern
921A、922A。
The boundary face of the insulating properties base material 903A and insulating properties base material 904A in layered product 900A, arranges conductive pattern
931A、932A、933A、934A、935A.Conductive pattern 931A equivalent to " shared conductive pattern " of the present utility model, and
Equivalent to " the 1st conductor " of the present utility model.Conductive pattern 932A is the terminal pad conductor of electronic unit 21.Conductive pattern
933A, 935A are used as terminal pad conductor, the input and output of the external electronic for being installed on built-in substrate 10A
Electrode.Conductive pattern 934A is the conductor of wiring, and possesses the external electrical sub-portion for being installed in the built-in substrate 10
The terminal pad conductor of part.
A part and conductive pattern 932A of conductive pattern 931A, 934A are configured in the rigid portion of layered product 900A.
The other parts and conductive pattern 933A, 935A of conductive pattern 931A, 934A are configured in the flexible part of layered product 900A.
Conductive pattern 933A is by being equipped on the interlayer connection conductor 333 of insulating properties base material 903A and being equipped on absolutely
The interlayer connection conductor 321 of edge base material 902A, is connected with conductive pattern 921A.
Additionally, the boundary face of the insulating properties base material 903A and insulating properties base material 904A in layered product 900A, arranges conductor
Pattern 941A, 942A, 943A.
Layered product 900A is overlooked, conductive pattern 941A is Chong Die with conductive pattern 931A, conductive pattern 942A and conductive pattern
932A is overlapped.Conductive pattern 943A is Chong Die with conductive pattern 934A.Conductive pattern 941A is engaged with conductive pattern 931A, conductor figure
Case 942A is engaged with conductive pattern 932A.Conductive pattern 943A is engaged with conductive pattern 934A.Now, it is same with the 1st implementation method
Sample ground, alloy-layer is formed on each composition surface.
The boundary face of the insulating properties base material 905A and insulating properties base material 906A in layered product 900A, arranges conductive pattern
951A、952A.Conductive pattern 951A is the wiring pattern for electronic unit 22 to be connected with conductive pattern 931A, and is also
The terminal pad conductor of electronic unit 22.Conductive pattern 951A is equivalent to " the 2nd conductor " of the present utility model.Conductive pattern 952A
It is the terminal pad conductor of electronic unit 22.
Conductive pattern 951A by being equipped on the interlayer connection conductor 341 of insulating properties base material 904A, with conductive pattern
931A is connected.Conductive pattern 952A by being equipped on the interlayer connection conductor 342 of insulating properties base material 904A, with conductive pattern
943A is connected.
Electronic unit 21,22 is provided in the inside of the rigid portion in layered product 900A.
Electronic unit 21 is configured in the region of the insulating properties base material 902A in layered product 900A.The installation of electronic unit 21
With terminal 211,212 towards insulating properties base material 903A sides.Installation terminal 211,212 is in insulating properties base material 902A, 903A
Boundary face is exposed.Layered product 900A is overlooked, installs Chong Die with conductive pattern 931A with terminal 211, installed and use terminal 212 and conductor
Pattern 932A is overlapped.Installation terminal 211 by being equipped on the interlayer connection conductor 331 of insulating properties base material 903A, come with lead
Body pattern 931A is connected.Installation terminal 212 by being equipped on the interlayer connection conductor 332 of insulating properties base material 903A, with
Conductive pattern 932A is connected.
Electronic unit 22 is equipped on the region of the insulating properties base material 906A in layered product 900A.The installation of electronic unit 22
With terminal 221,222 towards insulating properties base material 905A sides.Installation terminal 221,222 is in insulating properties base material 905A, 906A
Boundary face is exposed.Layered product 900A is overlooked, installs Chong Die with conductive pattern 951A with terminal 221, installed and use terminal 222 and conductor
Pattern 952A is overlapped.Installation terminal 221 by being equipped on the interlayer connection conductor 351 of insulating properties base material 905A, come with lead
Body pattern 951A is connected.Installation terminal 222 by being equipped on the interlayer connection conductor 352 of insulating properties base material 905A, with
Conductive pattern 952A is connected.
So, in the composition of present embodiment, it is equipped with what the installation terminal 211,212 of electronic unit 21 was connected
The formation of the conductor in the insulating properties base material 903A of interlayer connection conductor 331,332 and conductive pattern 931A, 932A facing to
It is equipped with interlayer connection conductor 351,352 and conductive pattern that the installation terminal 221,222 of electronic unit 22 is connected
The insulating properties base material 905A sides of 951A, 952A.Additionally, the formation of conductor in insulating properties base material 905A, 904A facing to
Insulating properties base material 903A sides.
Insulating properties base material 903A and insulating properties base material are equipped on as the conductive pattern 931A of shared conductive pattern
The boundary face that 904A is abutted.
In the stacking direction, the installation terminal 211,212 of electronic unit 21 is configured in conductive pattern 931A sides, electricity
The installation terminal 221,222 of subassembly 22 is configured in conductive pattern 931A sides.
Also, layered product 900A is overlooked, electronic unit 21 is Chong Die with the only a part of electronic unit 22.In addition, electronic unit
21 can also be not overlap in the case where layered product 900A is overlooked with electronic unit 22.
Even such composition, also in a same manner as in the first embodiment, can reduce to be directed to being built in layered product 900A
Two electronic units 21,22 high-frequency signal loss, the relatively low built-in substrate of loss can be realized
10A。
- symbol description-
1：Circuit substrate
10、10A、10P：Built-in substrate
21、22、23：Electronic unit
82、85：Hole
211、212、221、222：Installation terminal
321、331、332、333、341、342、351、352、351P、361P、363P：Interlayer connection conductor
321DP、331DP、332DP、333DP、341DP、342DP：Conductive paste
900、900A、900P：Layered product
901、902、903、904、905、906、901A、902A、903A、904A、905A、906A、907A：Insulating properties base material
921、921A、922A、931、932、933、931A、932A、933A、934A、935A、941、942、941A、942A、
943A、941P、951P、961P、962P：Conductive pattern
990：Alloy-layer
Claims (3)
1. a kind of built-in substrate, possesses：
Layered product, forms only forming the thermoplastic insulating properties base material stacking multi-disc of conductor and carrying out heating crimping in one side,
The insulating properties base material in one side comprising only the 1st insulating properties base material of the 1st conductor is formed and only forms the 2nd of the 2nd conductor the in one side
Insulating properties base material；
1st electronic unit and the 2nd electronic unit, are configured in the inside of the layered product, are configured with installation in one side respectively
Use terminal；With
Shared conductive pattern, is connected with the 1st electronic unit and the 2nd electronic unit,
The shared conductive pattern in the stacking direction, be configured in the 1st electronic unit and the 2nd electronic unit it
Between,
The side opposite with the interarea for being formed with the 1st conductor of the 1st insulating properties base material does not form the 1st non-of conductor
Formation face is connected to the 1st electronic unit, and the 1st insulating properties base material has interlayer connection conductor, the interlayer connection conductor
The installation terminal of the 1st electronic unit is connected with the 1st conductor, and is formed in the position Chong Die with the 1st conductor
Put,
The side opposite with the interarea for being formed with the 2nd conductor of the 2nd insulating properties base material does not form the 2nd non-of conductor
Formation face is connected to the 2nd electronic unit, and the 2nd insulating properties base material has interlayer connection conductor, the interlayer connection conductor
The installation terminal of the 2nd electronic unit is connected with the 2nd conductor, and is formed in the position Chong Die with the 2nd conductor
Put,
1st insulating properties base material is configured as：In the stacking direction, the interarea for being formed with the 1st conductor is exhausted with the described 2nd
Edge base material is abutted,
2nd insulating properties base material is configured as：In the stacking direction, the interarea for being formed with the 2nd conductor is exhausted with the described 1st
Edge base material is abutted,
1st insulating properties base material and the 2nd insulating properties base material are heated during crimping.
2. built-in substrate according to claim 1, wherein,
In the stacking direction, there is the 1st conductor in the region between the 1st electronic unit and the 2nd electronic unit
And the part that the 2nd conductor is mutually abutted, between the 1st conductor and the 2nd conductor, it is formed with alloy-layer.
3. built-in substrate according to claim 1, wherein,
1st conductor is the shared conductive pattern.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014128193 | 2014-06-23 | ||
| JP2014-128193 | 2014-06-23 | ||
| PCT/JP2015/066815 WO2015198870A1 (en) | 2014-06-23 | 2015-06-11 | Component-embedded substrate and method for producing component-embedded substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206260156U true CN206260156U (en) | 2017-06-16 |
Family
ID=59022504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201590000675.4U Active CN206260156U (en) | 2014-06-23 | 2015-06-11 | Built-in substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206260156U (en) |
-
2015
- 2015-06-11 CN CN201590000675.4U patent/CN206260156U/en active Active
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