CN206236649U - The fluid collection device of single-wafer spin etch cleaning machine - Google Patents
The fluid collection device of single-wafer spin etch cleaning machine Download PDFInfo
- Publication number
- CN206236649U CN206236649U CN201621181947.8U CN201621181947U CN206236649U CN 206236649 U CN206236649 U CN 206236649U CN 201621181947 U CN201621181947 U CN 201621181947U CN 206236649 U CN206236649 U CN 206236649U
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- China
- Prior art keywords
- recovering tray
- fluid
- collection device
- wafer
- shrouding disc
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of fluid collection device of single-wafer spin etch cleaning machine, the fluid for collecting etching single-wafer, comprising：Rotating disk, fixed and rotation single-wafer；At least one recovering tray, is fixedly arranged on the outer rim of the rotating disk, is used to collect the fluid thrown away when the single-wafer rotates；At least one shrouding disc, correspondence is simultaneously covered on the recovering tray, is used to guide the fluid and is flow in the recovering tray；At least one liter is come down to a lower group, and the liter is come down to a lower group including two symmetrical lifting units, and the liter is come down to a lower group and is connected with the shrouding disc, to upper and lower start shrouding disc relative to the rotating disk and the recovering tray.
Description
Technical field
The utility model is related to a kind of fluid collection device of single-wafer spin etch cleaning machine, more particularly to a kind of profit
Different fluid can be collected in the fluid collection device of corresponding recovering tray respectively with the shrouding disc of upper and lower start guiding fluid.
Background technology
Wet-type etching is one of program indispensable in the middle of current manufacture of semiconductor, in general, semiconductor monocrystal circle
Understand by the program of multiple tracks etch cleaning during Wet-type etching, for example, first time etching is first carried out with A acid, then with B
Acid carries out second etching, is finally cleaned with deionized water rinsing again, and is based on cost consideration, and the used etching solution is needed
Recycling is carried out, therefore, existing rotating etching device is provided with multiple etching solution collecting tanks, by will each etching solution
Collecting tank is overall relative to the upper and lower start of rotating disk for placing single-wafer, or will place the rotating disk of single-wafer relative to etching solution receipts
Collect the mode of the upper and lower start of groove, to collect different etching solutions respectively, polluted with avoiding blending between etching solution or
There is chemical change and cause dangerous situation.
If rotating etching device is operationally with overall relative to the rotating disk for placing single-wafer by the respectively etching solution collecting tank
The mode (i.e. single-wafer is motionless and etching solution accumulator tank is moved up and down) of upper and lower start collects different etching solutions, then with respectively
The discharging tube of etching solution collecting tank connection can only use soft pipe, and the etching solution that need to add pump that will be collected into is delivered to recovery
Bucket, while have the problem inside not easy cleaning etching solution collecting tank, so as to cause to remain etching solution and because cleaning not in soft pipe
Totally there is the doubt for polluting.
If rotating etching device is operationally that will place, and the rotating disk and single-wafer of single-wafer are overall to be received relative to etching solution
Collect the mode (i.e. single-wafer is moved up and down and etching solution collecting tank is motionless) of the upper and lower start of groove to collect different etching solutions, then
The risk for having the vibrations that easily cause single-wafer and rupturing it, also there is the problem inside not easy cleaning etching solution collecting tank.
A kind of missing of the etching solution collecting tank based on above-mentioned existing rotating etching device, there is provided single-wafer spin etch
The fluid collection device of cleaning machine so that the fluid collection device have discharging tube have multiple choices and be not required to increase pump with
The etching solution that will be collected into is delivered to recycling bin and the advantage easily cleaned inside the fluid collection device is the utility model
It is intended to actively disclose part.
The content of the invention
Main purpose of the present utility model is to improve existing rotating etching device to have the form of etching solution recovery tube can
The selectivity less and not problem inside easy cleaning etching solution accumulator tank.
It is up to above-mentioned purpose and other purposes, the utility model proposes a kind of fluid of single-wafer spin etch cleaning machine
Collection device, the fluid for collecting etching single-wafer, comprising：Rotating disk, fixed and rotation single-wafer；At least one recovering tray,
The outer rim of the rotating disk is fixedly arranged on, is used to collect the fluid thrown away when the single-wafer rotates；At least one shrouding disc, correspondence is simultaneously covered and set
It is flow in the recovering tray on the recovering tray, being used to guide the fluid；At least one liter is come down to a lower group, and the liter is come down to a lower group including symmetrical two
Individual lifting unit, the liter is come down to a lower group and is connected with the shrouding disc, to upper and lower start shrouding disc relative to the rotating disk and the recovering tray.
In embodiment of the present utility model, wherein the shrouding disc is for ring-type and central portion has radial opening.
In embodiment of the present utility model, wherein radial opening and the periphery distance of the rotating disk is 1~10mm.
In embodiment of the present utility model, the wherein periphery distance preferably 3~5mm of the radial opening and the rotating disk.
In embodiment of the present utility model, wherein the recovering tray is ring-type.
In embodiment of the present utility model, wherein the shrouding disc also has guiding roof and guide side walls, the guiding roof
It is inclined annular top surface outward, the guide side walls system is the side of the shrouding disc, a part for the guide side walls and the recovery
A part for the side wall of disk mutually overlaps.
In embodiment of the present utility model, wherein the recovering tray is equal with the number of the shrouding disc.
In embodiment of the present utility model, wherein the recovering tray connects recovery tube, is used to discharge the fluid.
Whereby, fluid collection device of the present utility model is by fixed recovering tray and rotating disk and relative to recovering tray
And rotating disk and can the shrouding disc of start up and down flow to corresponding recovering tray completing the different fluids of guiding, and due to recovering tray
Maintain static, therefore connect the recovery tube of the recovering tray and may be selected to use rigid pipe or soft pipe, and due to recovering tray and lid
Disk can be separated, therefore can easily clean the inside of the recovering tray.
Brief description of the drawings
Fig. 1 is the schematic diagram of uncapping of the fluid collection device in the utility model embodiment；
Fig. 2 is the lower view of the fluid collection device in the utility model embodiment；
Fig. 3 is the schematic cross-section of the fluid collection device in the utility model embodiment；
Fig. 4 is the first use state schematic cross-section of the fluid collection device in the utility model embodiment；
Fig. 5 is the second use state schematic cross-section of the fluid collection device in the utility model embodiment；
Fig. 6 is the 3rd use state schematic cross-section of the fluid collection device in the utility model embodiment；
Fig. 7 is the 4th use state schematic cross-section of the fluid collection device in the utility model embodiment.
【Symbol description】
1 fluid collection device
10 rotating disks
101 rotating shafts
11 recovering tray
111 first recovering tray
112 second recovering tray
113 the 3rd recovering tray
114 first recovering tray side walls
115 second recovering tray side walls
116 the 3rd recovering tray side walls
12 recovery tubes
121 first recovery tubes
122 second recovery tubes
123 the 3rd recovery tubes
13 through holes
131 first through hole
131 ' first through hole
132 second through holes
132 ' second through holes
133 third through-holes
133 ' third through-holes
14 shrouding discs
141 first shrouding discs
141a first guides roof
The guide side walls of 141b first
142 second shrouding discs
142a second guides roof
The guide side walls of 142b second
143 the 3rd shrouding discs
143a the 3rd guides roof
The guide side walls of 143b the 3rd
15 liters are come down to a lower group
151 first lifting units
151 ' first lifting units
152 second lifting units
152 ' second lifting units
153 the 3rd lifting units
153 ' the 3rd lifting units
20 nozzles
D distances
W single-wafers
Specific embodiment
To be fully understood by the purpose of this utility model, feature and effect, now by following specific embodiments, and coordinate attached
Figure, is described in further details to the utility model, is described as follows：
Fig. 1 to Fig. 4 is refer to, fluid collection device of the present utility model 1 is got rid of during for collecting single-wafer W spin etch
The fluid for going out, the fluid collection device 1 includes rotating disk 10, at least one recovering tray 11, at least one shrouding disc 14 and at least one
Rise and come down to a lower group 15.
The rotating disk 10 is connected with rotating shaft 101, with fixed and rotation single-wafer W.
The recovering tray 11 is ring-type and is fixedly arranged on the outer rim of the rotating disk, be used to collect thrown away when single-wafer W rotates should
Fluid, the recovering tray 11 connects recovery tube 12 to discharge the fluid, and the recovery tube 12 reconnects recycling bin (not shown) to accept
The fluid discharged by the recovery tube 12.
The recovering tray 11 includes the first recovering tray 111, the second recovering tray 112 and the 3rd recovering tray 113, wherein this first time
Closing quotation 111 is fixedly arranged near the rotating disk 10, and the 3rd recovering tray 113 is fixedly arranged on farthest away from the rotating disk 10, second recovering tray
112 are fixedly arranged between the recovering tray 113 of the first recovering tray 111 and the 3rd.First recovering tray 111 has the first recovering tray side
Wall 114, second recovering tray 112 has the second recovering tray side wall 115, and the 3rd recovering tray 113 has the 3rd recovering tray side wall
116.First recovering tray 111, the bottom of the recovering tray 113 of the second recovering tray 112 and the 3rd are in groove-like.First recovery
Disk 111, second recovering tray 112 and the 3rd recovering tray 113 connect the first recovery tube 121, the second recovery tube 122 and respectively
Three recovery tubes 123, to discharge different fluids respectively.
The shrouding disc 14 is ring-type and with radial opening, to be covered on the recovering tray 11, is used to guide the fluid and flow to
In the recovering tray 11.The shrouding disc 14 includes the first shrouding disc 141, the second shrouding disc 142 and the 3rd shrouding disc 143, wherein first shrouding disc
141 correspondence lids set first recovering tray 111, and second shrouding disc 142 correspondence lid sets second recovering tray 112, the 3rd shrouding disc 143
Correspondence lid sets the 3rd recovering tray 113.The radial opening of first shrouding disc 141, the shrouding disc 143 of the second shrouding disc 142 and the 3rd
With the periphery of the rotating disk 10 apart from d can be 1~10mm, preferably apart from d be 3~5mm, during avoiding using because rotation should
The centrifugal force of single-wafer W and the fluid that disperses outwardly can splash to non-corresponding collect the recovering tray of the fluid.
First shrouding disc 141 has the first guiding roof 141a and the first guide side walls 141b, and second shrouding disc 142 has
There is second guiding roof 142a and the second guide side walls 142b, the 3rd shrouding disc 143 the 3rd guiding roof 143a and the 3rd to lead
Draw side wall 143b.First guiding roof 141a, the second guiding roof 142a and the 3rd guiding roof 143a are for outward
Inclined annular top surface, is used to provide the shock of the fluid that single-wafer W throws away, then fluid is directed to first recovering tray respectively
111st, the recovering tray 113 of the second recovering tray 112 and the 3rd.First guide side walls 141b, the second guide side walls 142b and
A part of 3rd guide side walls 143b respectively with the first recovering tray side wall 114, the second recovering tray side wall 115 and this
A part for three recovering tray side walls 116 mutually overlaps, to ensure that the fluid that single-wafer W throws away will not ooze out first recovering tray
111st, the recovering tray 113 of the second recovering tray 112 and the 3rd and cause the pollution between fluid.
The liter come down to a lower group 15 come down to a lower group including first liter, second liter come down to a lower group and the 3rd liter is come down to a lower group, wherein this first liter come down to a lower group including
The first symmetrical lifting unit 151,151 ', this second liter is come down to a lower group including the second symmetrical lifting unit 152, the 152 ', the 3rd
Rise and come down to a lower group including the 3rd symmetrical lifting unit 153,153 '.
The first recovering tray side wall 114, the second recovering tray side wall 115 and the 3rd recovering tray side wall 116 are respectively at same
One is radially provided with a pair of first through hole 131,131 ', the second through hole 132,132 ' and third through-holes 133,133 ', to wear respectively
If the first lifting unit 151,151 ', the second lifting unit 152,152 ' and the 3rd lifting unit 153,153 '.
First lifting unit 151,151 ', the second lifting unit 152,152 ' and the 3rd lifting unit 153,153 ' are worn respectively
Cross first through hole 131,131 ', the second through hole 132,132 ' and third through-hole 133,133 ', and with first guide side walls 141b,
The second guide side walls 142b and the 3rd guide side walls 143b are connected, by first shrouding disc 141, second shrouding disc 142
And the 3rd shrouding disc 143 relative to first recovering tray 111, second recovering tray 112, the 3rd recovering tray 113 and the rotating disk
10 and up and down start.
Will be detailed below fluid collection device of the present utility model 1 and make flowing mode when different operating states.With
Under, it will be assumed that the first recovering tray 111 collects the first fluid that injection makes an addition to single-wafer W；Second recovering tray 112 is collected injection and is added
It is added on the second fluid of single-wafer W；3rd recovering tray 113 collects injection and makes an addition to the 3rd fluid of single-wafer W, wherein this first
Fluid is mixed acid, and the second fluid is diluted hydrofluoric acid, and the 3rd fluid is deionized water.And assume that whole etch process system is
Circulated with being sequentially one to single-wafer W injections mixed acid, diluted hydrofluoric acid and deionized water.
However, herein it should be noted that, the order of the fluid that injection makes an addition to single-wafer W be not limited to it is above-mentioned, but can
Each recovering tray correspondence is set with the demand according to user and collects different fluids；Also, fluid collection of the present utility model
The quantity of the recovering tray of device 1 is not also limited with three, and can be one, or more；The first fluid and this second
Fluid, the 3rd fluid are also not necessarily limited to use mixed acid, diluted hydrofluoric acid and deionized water, and can be according to the processing procedure need of user
Ask to use different fluids.
Refer to Fig. 4, its be fluid collection device 1 in the schematic cross-section of the first use state, its display single-wafer W is carried
State when putting or during removal.First shrouding disc 141, the top surface of the shrouding disc 143 of the second shrouding disc 142 and the 3rd are located at than this turn
The lower slightly position of disk 10, in order to place or removal single-wafer W.
Fig. 5 is refer to, it is fluid collection device 1 in the schematic cross-section of the second use state.First, single-wafer W puts
In on the rotating disk 10；Then, the first lifting unit 151,151 ', the second lifting unit 152,152 ' and the 3rd lifting unit 153,
The top surface of first shrouding disc 141, the shrouding disc 143 of the second shrouding disc 142 and the 3rd is increased beyond the rotating disk 10 by 153 '；Then,
The rotating disk 20 drives single-wafer W rotations；Then, nozzle 20 is etched towards injection mixed acid on single-wafer W with making first time, in
Now, the mixed acid because rotate single-wafer W centrifugal force and disperse outwardly, and clash into this first guiding roof 141a or
Then the first guide side walls 141b flow to first recovering tray 111 to discharge again.
Next referring to Fig. 6, it is fluid collection device 1 in the schematic cross-section of the 3rd use state.Use the mixing
After acid is made to etch for the first time to single-wafer W, reuse diluted hydrofluoric acid and single-wafer W works are etched for second.First, first liter
The top surface of first shrouding disc 141 is decreased below drop unit 151,151 ' position of the rotating disk 10, i.e., foregoing first uses shape
The position of state；Then, the rotating disk 20 drives single-wafer W rotations；Then, nozzle 20 is towards injecting diluted hydrofluoric acid on single-wafer W
Etched with making second, in now, the diluted hydrofluoric acid disperses outwardly because of the centrifugal force of the single-wafer W of rotation, and clashes into extremely
Then second guiding roof 142a or the second guide side walls 142b flow to second recovering tray 112 to discharge again.
Next referring to Fig. 7, it is fluid collection device 1 in the schematic cross-section of the 4th use state.Use dilute hydrogen
After fluoric acid makees second etching to single-wafer W, clean action finally is made to single-wafer W using deionized water.First,
The top surface of second shrouding disc 142 is decreased below two lifting units 152,152 ' position of the rotating disk 10, i.e., foregoing first makes
With the position of state；Then, the rotating disk 20 drives single-wafer W rotations；Then, nozzle 20 towards injection on single-wafer W go from
Sub- water to clean, in now, the centrifugal force of single-wafer W of the deionized water because rotating and disperse outwardly, and clash into this
Then three guiding roof 143a or the 3rd guide side walls 143b flow to the 3rd recovering tray 113 to discharge again.Now, that is, complete
Whole etch process.Then the top surface of the 3rd shrouding disc 143 is decreased below the rotating disk 10 by the 3rd lifting unit 153,153 '
Position, i.e., the position of foregoing first use state, then by single-wafer W on the rotating disk 10 take out.
In sum, the fluid collection device of single-wafer spin etch cleaning machine of the present utility model is used to collect respectively
The different fluid of single-wafer is etched, can be made up and down with rotating disk and relative to recovering tray and rotating disk by fixed recovering tray
Dynamic shrouding disc flow to corresponding recovering tray completing the different fluids of guiding, and because recovering tray is maintained static, therefore connection
The recovery tube of the recovering tray may be selected using rigid pipe or soft pipe and be not required to increase the fluid that will be collected into of pump and pass through recovery tube
Recycling bin is delivered to, and because recovering tray and shrouding disc can be separated, therefore can easily clean the inside of the recovering tray.
The utility model hereinbefore with preferred embodiment disclose, but be familiar with it will be understood by those skilled in the art that
It is that the embodiment is only used for describing the utility model, and is not construed as limiting scope of the present utility model.It should be noted that
The every and equivalent change of the embodiment and displacement, all should be set to be covered by category of the present utility model.Therefore, this practicality is new
The scope that the protection domain of type should be defined by claims is defined.
Claims (8)
1. a kind of fluid collection device of single-wafer spin etch cleaning machine, the fluid of single-wafer is etched for collecting, and it is special
Levy and be, comprising：
Rotating disk, fixed and rotation single-wafer；
At least one recovering tray, is fixedly arranged on the outer rim of the rotating disk, is used to collect the fluid thrown away when the single-wafer rotates；
At least one shrouding disc, correspondence is simultaneously covered on the recovering tray, is used to guide the fluid and is flow in the recovering tray；
At least one liter is come down to a lower group, and the liter is come down to a lower group including two symmetrical lifting units, and the liter is come down to a lower group and is connected with the shrouding disc, to phase
Upper and lower start shrouding disc for the rotating disk and the recovering tray.
2. fluid collection device as claimed in claim 1, it is characterised in that the shrouding disc is ring-type and central portion has and radially opens
Mouthful.
3. fluid collection device as claimed in claim 2, it is characterised in that the radial opening is with the periphery distance of the rotating disk
1~10mm.
4. fluid collection device as claimed in claim 3, it is characterised in that the radial opening is with the periphery distance of the rotating disk
3~5mm.
5. fluid collection device as claimed in claim 1, it is characterised in that the recovering tray is ring-type.
6. fluid collection device as claimed in claim 1, it is characterised in that the shrouding disc also has guiding roof and guiding side
Wall, the guiding roof is inclined annular top surface outward, and the guide side walls are the side of the shrouding disc, one of the guide side walls
Divide and mutually overlapped with a part for the side wall of the recovering tray.
7. fluid collection device as claimed in claim 1, it is characterised in that the recovering tray is equal with the number of the shrouding disc.
8. fluid collection device as claimed in claim 1, it is characterised in that the recovering tray connects recovery tube, is used to discharge this
Fluid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621181947.8U CN206236649U (en) | 2016-11-03 | 2016-11-03 | The fluid collection device of single-wafer spin etch cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621181947.8U CN206236649U (en) | 2016-11-03 | 2016-11-03 | The fluid collection device of single-wafer spin etch cleaning machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206236649U true CN206236649U (en) | 2017-06-09 |
Family
ID=58989871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621181947.8U Expired - Fee Related CN206236649U (en) | 2016-11-03 | 2016-11-03 | The fluid collection device of single-wafer spin etch cleaning machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206236649U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108022854A (en) * | 2016-11-03 | 2018-05-11 | 锡宬国际有限公司 | The fluid collection device of single-wafer spin etch cleaning machine |
| CN114868896A (en) * | 2022-05-30 | 2022-08-09 | 安徽东方果园生物科技有限公司 | Processing equipment and preparation process for zero-calorie sugar-coated nuts |
-
2016
- 2016-11-03 CN CN201621181947.8U patent/CN206236649U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108022854A (en) * | 2016-11-03 | 2018-05-11 | 锡宬国际有限公司 | The fluid collection device of single-wafer spin etch cleaning machine |
| CN114868896A (en) * | 2022-05-30 | 2022-08-09 | 安徽东方果园生物科技有限公司 | Processing equipment and preparation process for zero-calorie sugar-coated nuts |
| CN114868896B (en) * | 2022-05-30 | 2024-04-09 | 安徽东方果园生物科技有限公司 | Processing equipment for zero-calorie sugar coated nuts and preparation technology |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170609 Termination date: 20211103 |