CN206230868U - A kind of temperature and atmosphere control system suitable for forming process - Google Patents
A kind of temperature and atmosphere control system suitable for forming process Download PDFInfo
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- CN206230868U CN206230868U CN201621127483.2U CN201621127483U CN206230868U CN 206230868 U CN206230868 U CN 206230868U CN 201621127483 U CN201621127483 U CN 201621127483U CN 206230868 U CN206230868 U CN 206230868U
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- lower mold
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Abstract
The utility model discloses a kind of temperature and atmosphere control system suitable for forming process; the system includes positioning fixed cell, Ohmic contact heating unit, gas cooling protection location and temperature and image monitoring unit; positioning fixed cell includes structure identical upper die component and lower mold assemblies; Ohmic contact heating unit includes Top electrode, bottom electrode and power supply; lower mold core group directly contact in upper mold core group directly contact in Top electrode and upper die component, bottom electrode and lower mold assemblies；Gas cooling protection location includes the gas bomb, inlet channel, spiral air flow road and the outlet passageway that are sequentially connected；Temperature and image monitoring unit include infrared temperature sensor and ccd image sensor in lower mold core group.The utility model can realize the quick precise control of temperature and atmosphere during microsecond delay, have the advantages that simple structure, easy to operate, control are accurate.
Description
Technical field
The utility model belongs to micro forming apparatuses technical field, more particularly, to a kind of temperature suitable for forming process
Degree and atmosphere control system.
Background technology
When minute yardstick thermoplasticity is carried out, the forming temperature for rapidly and accurately controlling workpiece is the weight for influenceing forming effect
Want factor.Simultaneously as micro parts overall dimensions are small, specific surface area is big, required precision is high, it is necessary to be strict controlled in thermoplasticity
During oxidation, it is therefore necessary to shaping when workpiece around atmosphere be controlled.And carrying out material thermoplastic forming
During performance test, if it is possible to by quick cooling, to retain the high temperature microstructure of workpiece as far as possible, for clear and definite workpiece material
High temperature deformation mechanism be very helpful.Accordingly, it would be desirable to develop one kind, can quickly and accurately to adjust forming temperature gentle
The control system of atmosphere.
Patent CN103838274B provides a kind of multichannel water-cooled temperature control system and control method, for precise control
The temperature of multiple controlled devices.Circulation fluid is divided into multiple branch roads by the program according to the traffic demand of multiple objects, by regulation
The circulation fluid temperature of correspondence branch road, realizes the accurate output to heating power.But the program can only realize lower temperature range
Interior temperature control, it is impossible to meet demand of the microsecond delay process to high temperature.
Patent CN105605933A provides a kind of curing oven temperature control system, for the temperature in effectively control curing oven
Degree, improve product quality.The program detects in-furnace temperature using temperature sensor, and the air quantity in intake stack is adjusted accordingly to control
Temperature in curing oven processed.The program is difficult to the quick adjustment of temperature and precise control.
Utility model content
For the disadvantages described above or Improvement requirement of prior art, the utility model provides a kind of temperature and control climate
System, wherein combine the forming technology feature of shaping especially microsecond delay, respective design suitable for forming process temperature and
Atmosphere control system, and its key component is such as positioned fixed cell, Ohmic contact heating unit, gas cooling protection location and
The structure and its specific set-up mode of temperature and image monitoring unit are studied and designed, and can effectively be solved accordingly existing micro-
Temperature and atmosphere are difficult to the problem of quick precise control in forming process, accurate etc. excellent with simple structure, easy to operate, control
Point.
To achieve the above object, the utility model proposes a kind of temperature suitable for forming process and control climate system
System, the system includes positioning fixed cell, Ohmic contact heating unit, gas cooling protection location and temperature and image monitoring list
Unit, wherein：
The positioning fixed cell includes upper die component and lower mold assemblies, and the upper die component includes the upper water for setting gradually
Cold shut hot plate, Top electrode fixed plate and upper mold core group, the lower mold assemblies include that the lower mold core group for setting gradually, bottom electrode are fixed
Plate and lower water-cooled thermal insulation board；
The Ohmic contact heating unit includes Top electrode, bottom electrode and power supply, wherein, the Top electrode is arranged on described
In Top electrode fixed plate, and with upper mold core group directly contact, it is connected by upper wire with the positive pole of the power supply；The lower electricity
Pole be arranged on the bottom electrode fixed plate in, and with lower mold core group directly contact, its negative pole for passing through lower wire and the power supply
It is connected；
The gas cooling protection location includes that the gas bomb, inlet channel, spiral air flow road and the outlet that are sequentially connected lead to
Road, the inlet channel, spiral air flow road and outlet passageway are arranged in lower mold core group；
The temperature and image monitoring unit include infrared temperature sensor and ccd image sensor, the infrared temperature
Sensor is arranged in lower mold core group, and is connected with control cabinet by cable, and the ccd image sensor is similarly installed at lower mould
In core group, it passes through cable and is connected with computer, and the control cabinet is connected with the computer and power supply respectively.
As it is further preferred that the upper mold core group include upper mold core fixed plate, upper mold core ceramic insulation sleeve and on
Core rod, the upper mold core is inlaid in upper mold core ceramic insulation sleeve, the lower surface directly contact of its upper surface and Top electrode, institute
Upper mold core ceramic insulation sleeve is stated to be inlaid in upper mold core fixed plate；Cooling current are offered in the upper water-cooled thermal insulation board
Road, the upper mold core fixed plate, Top electrode fixed plate and upper water-cooled thermal insulation board are bolted on forcing press top shoe.
As it is further preferred that the lower mold core group include lower mold core fixed plate, lower mold core ceramic insulation sleeve and under
Core rod, the lower mold core is inlaid in lower mold core ceramic insulation sleeve, the upper surface directly contact of its lower surface and bottom electrode, institute
Lower mold core ceramic insulation sleeve is stated to be inlaid in lower mold core fixed plate；Lower cooling current are offered in the lower water-cooled thermal insulation board
Road, the lower mold core fixed plate, bottom electrode fixed plate and lower water-cooled thermal insulation board are bolted on forcing press lower bottom base.
It is described as it is further preferred that the spiral air flow road is arranged on the inwall of lower mold core ceramic insulation sleeve
The mounting hole for installing infrared temperature sensor and ccd image sensor is offered in lower mold core fixed plate.
As it is further preferred that the gas bomb is connected by conduit with inlet channel, electricity is connected in the middle part of the conduit
Magnet valve, the magnetic valve is connected by cable with the control cabinet.
Used as it is further preferred that the lower mold core ceramic insulation sleeve is made of crystalline ceramics, the power supply is low
Pressure high-current dc power supply, is full of high pressure nitrogen in the gas bomb.
In general, by the contemplated above technical scheme of the utility model possess compared with prior art, mainly with
Under technological merit：
1. the utility model is by positioning fixed cell, Ohmic contact heating unit, gas cooling protection location and temperature
The research and design of degree and image monitoring unit, obtain and are capable of achieving temperature and atmosphere quick regulation and control during microsecond delay
System, is controlled by using Ohmic contact mode of heating and corresponding closed feedback, realizes the workpiece during microsecond delay
Quick accurate heating.
2. on the one hand the utility model is passed through low speed nitrogen by using gas cooling protection scheme in forming process,
Protective atmosphere is formed around workpiece, effectively suppresses the oxidation of workpiece；On the other hand high speed nitrogen is passed through after shaping terminates, soon
The temperature of the low workpiece of prompt drop, helps to preserve the high temperature microstructure of workpiece as needed, or carries out more fine heat treatment
To obtain corresponding microstructure.
Brief description of the drawings
Fig. 1 is the overall structure diagram of the utility model control system；
Fig. 2 is the structural representation of the Ohmic contact heating unit in the utility model control system；
Fig. 3 (a)-(c) is the structural representation of the gas cooling protection location in the utility model control system；
Fig. 4 is the fundamental diagram of the gas cooling protection location in the utility model control system.
Specific embodiment
In order that the purpose of this utility model, technical scheme and advantage become more apparent, below in conjunction with accompanying drawing and implementation
Example, is further elaborated to the utility model.It should be appreciated that specific embodiment described herein is only used to explain
The utility model, is not used to limit the utility model.Additionally, institute in the utility model disclosed below each implementation method
As long as the technical characteristic being related to does not constitute conflict and can just be mutually combined each other.
As shown in figure 1, a kind of temperature and control climate system suitable for forming process that the utility model embodiment is provided
System, its forming temperature being used for during quick accurate adjustment microsecond delay and atmosphere, the control system include positioning fixed cell,
Ohmic contact heating unit, gas cooling protection location and temperature and image monitoring unit, wherein, positioning fixed cell is used for will
Other units are fixedly attached on forcing press, and Ohmic contact heating unit is used for rapidly heating moulds and workpiece, and gas cooling is protected
Shield unit is used for quick cooling mould and workpiece, and provides protective atmosphere, and temperature and image monitoring unit are used for real-time detection
The temperature of workpiece, the deformation state of observation workpiece, and the signal for showing each state in real time, there is provided human-computer interaction interface, concurrently
Go out control instruction.By the mutual cooperation of above-mentioned unit, the quick accurate of temperature and atmosphere during microsecond delay is capable of achieving
Control, has the advantages that simple structure, easy to operate, control are accurate.
Below more specific detail will be one by one carried out to unit.
As shown in figure 1, positioning fixed cell includes upper die component and lower mold assemblies, wherein, upper die component is included from up to
Under the upper water-cooled thermal insulation board 6, Top electrode fixed plate 7 and the upper mold core group that set gradually；Lower mold assemblies include setting successively from top to bottom
Lower mold core group, bottom electrode fixed plate 11 and the lower water-cooled thermal insulation board 12 put；
Ohmic contact heating unit includes Top electrode 3-2, bottom electrode 3-4 and power supply 3, wherein, Top electrode 3-2 is arranged on
In Top electrode fixed plate 7, and with upper mold core group directly contact, it is connected by upper wire 3-1 with the positive pole of power supply 3；Bottom electrode
3-4 be arranged on bottom electrode fixed plate 11 in, and with lower mold core group directly contact, its negative pole phase for passing through lower wire 3-3 and power supply 3
Even；
Gas cooling protection location includes the gas bomb 4, inlet channel 4-3, spiral air flow road 4-4 and the outlet that are sequentially connected
Passage 4-5, i.e. gas bomb 4 are connected with inlet channel 4-3, and inlet channel 4-3 is communicated with spiral air flow road 4-4, spiral air flow road
4-4 is communicated with outlet passageway 4-5, and inlet channel 4-3, spiral air flow road 4-4 and outlet passageway 4-5 are arranged at lower mold core group
In；
Temperature and image monitoring unit include infrared temperature sensor 2-3 and ccd image sensor 1-3, and infrared temperature is passed
Sensor 2-3 is arranged in lower mold core group, and is connected with control cabinet 2 by cable 2-2, and ccd image sensor 1-3 is similarly installed at
In lower mold core group, it passes through cable 1-1 and is connected with computer 1, and control cabinet 2 is connected by cable 1-2 with computer 1, by electricity
Cable 2-4 is connected with power supply 3.
Specifically, upper mold core group includes upper mold core fixed plate 8, upper mold core ceramic insulation sleeve 8-1 and upper mold core 8-2, on
Core rod 8-2 is inlaid in upper mold core ceramic insulation sleeve 8-1, the lower surface directly contact of its upper surface and Top electrode 3-2, upper mould
Core ceramic insulation sleeve 8-1 is inlaid in upper mold core fixed plate 8；Cooling water flow conduits 6-1 is offered in upper water-cooled thermal insulation board 6,
Upper mold core fixed plate 8, Top electrode fixed plate 7 and upper water-cooled thermal insulation board 6 are bolted on forcing press top shoe 5.
Lower mold core group includes lower mold core fixed plate 9, lower mold core ceramic insulation sleeve 9-1 and lower mold core 9-2, lower mold core 9-2
It is inlaid in lower mold core ceramic insulation sleeve 9-1, the upper surface directly contact of its lower surface and bottom electrode 3-4, lower mold core ceramics
Insulating sleeve 9-1 is inlaid in lower mold core fixed plate 9；Lower cooling water flow conduits 12-1, lower mould are offered in lower water-cooled thermal insulation board 12
Core fixed plate 9, bottom electrode fixed plate 11 and lower water-cooled thermal insulation board 12 are bolted on forcing press lower bottom base 13.
Further, spiral air flow road 4-4 is arranged on the inwall of lower mold core ceramic insulation sleeve 9-1, inlet channel 4-3
It is passed through in lower mold core ceramic insulation sleeve 9-1 by lower mold core fixed plate 9 with outlet passageway 4-5, so that it is with lower mold core ceramics absolutely
Spiral air flow road 4-4 on edge sleeve 9-1 inwalls is connected；Offered in lower mold core fixed plate 9 and passed for installing infrared temperature
The mounting hole of sensor 2-3 and ccd image sensor 1-3, offers and the mounting hole pair on lower mold core ceramic insulation sleeve 9-1
The hole answered, so that the temperature of infrared temperature sensor 2-3 energy real-time monitoring workpiece 10 to be formed, makes ccd image sensor 1-3
The state of real-time monitoring workpiece 10.
More specifically, gas bomb 40 is connected by conduit 4-1 with inlet channel 4-3, and electricity is connected in the middle part of conduit 4-1
Magnet valve 4-2, magnetic valve 4-2 is connected by cable 2-1 with control cabinet 2.Lower mold core ceramic insulation sleeve 9-1 uses crystalline ceramics
It is made, power supply 3 is low-voltage, high-current dc source, high pressure nitrogen is full of in gas bomb 4.
During practical operation, workpiece 10 is placed on lower mold core 9-2 tops, upper mold core 8-2 is descending until being contacted with workpiece 10.
Now, power supply 3, upper wire 3-1, Top electrode 3-2, lower wire 3-3, bottom electrode 3-4, upper mold core 8-2, lower mold core 9-2, Yi Jigong
Part 10 constitutes closed-loop path, as shown in Figure 2.Computer 1 sends control by control cabinet 2 according to the heating-up temperature for setting to power supply 3
Signal processed, the output current of regulation power supply 3 when electric current passes through foregoing closed-loop path, due to the presence of resistance, changes into heat,
So that temperature is raised.
Wherein, the ratio P that the heating power of workpiece 10 accounts for whole closed-loop path heating general power is：
Wherein, WiIt is the heating power of corresponding component, ρiIt is the resistivity of corresponding component material, liIt is the length of corresponding component
Degree, riIt is the radius of corresponding component.By adjusting the material and size of all parts, can cause that P values are as far as possible big, that is, generate heat to the greatest extent
Amount concentrates on workpiece 10.
The temperature of infrared temperature sensor 2-3 monitor in real time workpiece 10, and temperature signal is passed into meter by control cabinet 2
Calculation machine 1；Computer 1 by real time temperature signal compared with setting value relatively after, send corresponding control instruction, and control instruction is passed through
Control cabinet 2 passes to power supply 3；Power supply 3 adjusts output current, so as to realize to the real-time of the temperature of workpiece 10 according to control instruction
Adjustment and precise control.
In forming process, the state of ccd image sensor 1-3 real-time monitorings workpiece 10, and by picture signal transmit to
Computer 1 is shown and is stored.
High pressure nitrogen in gas bomb 4 reaches spiral air flow road 4-4, Ran Houtong by conduit 4-1 and inlet channel 4-3
Outlet passageway 4-5 discharges are crossed, wherein, the flow velocity of nitrogen gas is controlled by magnetic valve 4-2.In forming process, by magnetic valve
4-2 controls in optimum speed gas flow rate, and nitrogen is filled in around workpiece 10, forms protective atmosphere, can effectively suppress work
Oxidation of the part 10 in heating process.
When quick reduction by 10 temperature of workpiece is needed, electromagnetic valve for adjusting 4-2 increases gas flow rate, quickly the gas of flowing,
Substantial amounts of heat can be taken away, so as to quickly reduce the temperature of workpiece 10, cooling power is：
Wherein, as shown in figure 4, Q is heat exchange power, A is heat exchange area, and W is the coefficient of heat transfer, and Δ T is the temperature difference, and a is spiral
The width of flow channel, b is the height in spiral air flow road, and N is the complete spiral numbers of spiral air flow road 4-4, and c is spiral air flow road
The pitch of 4-4, d is the internal diameter of spiral air flow road 4-4, and u is the flow velocity of stream of nitrogen gas, T1It is mould inside temperature (i.e. in runner
Wall temperature), T2It is the stream of nitrogen gas temperature at inlet channel 4-3.
According to actual forming technology to the demand of cooling power, by size (including the air-flow for adjusting spiral air flow road 4-4
Road width, flow channel height, spiral number, pitch, internal diameter), nitrogen gas flow velocity and stream of nitrogen gas temperature, you can needed for obtaining
The cooling effect wanted, so as to realize quick accurate cooling.
As it will be easily appreciated by one skilled in the art that preferred embodiment of the present utility model is the foregoing is only, not
It is used to limit the utility model, all any modifications made within spirit of the present utility model and principle, equivalent and changes
Enter, should be included within protection domain of the present utility model.
Claims (6)
1. a kind of temperature and atmosphere control system suitable for forming process, it is characterised in that the system includes that positioning is fixed single
Unit, Ohmic contact heating unit, gas cooling protection location and temperature and image monitoring unit, wherein：
The positioning fixed cell includes upper die component and lower mold assemblies, the upper die component include the upper water-cooled that sets gradually every
Hot plate (6), Top electrode fixed plate (7) and upper mold core group, the lower mold assemblies include that the lower mold core group that sets gradually, bottom electrode are solid
Fixed board (11) and lower water-cooled thermal insulation board (12)；
The Ohmic contact heating unit includes Top electrode (3-2), bottom electrode (3-4) and power supply (3), wherein, the Top electrode
(3-2) be arranged on the Top electrode fixed plate (7) in, and with upper mold core group directly contact, its by upper wire (3-1) with it is described
The positive pole of power supply (3) is connected；The bottom electrode (3-4) is arranged in the bottom electrode fixed plate (11), and straight with lower mold core group
Contact, it passes through lower wire (3-3) and is connected with the negative pole of the power supply (3)；
The gas cooling protection location includes the gas bomb (4), inlet channel (4-3), spiral air flow road (4-4) that are sequentially connected
With outlet passageway (4-5), the inlet channel (4-3), spiral air flow road (4-4) and outlet passageway (4-5) are arranged at lower mould
In core group；
The temperature and image monitoring unit include infrared temperature sensor (2-3) and ccd image sensor (1-3), described red
Outer temperature sensor (2-3) is arranged in lower mold core group, and is connected with control cabinet (2) by cable, the ccd image sensor
(1-3) is similarly installed in lower mold core group, and it passes through cable and is connected with computer (1), the control cabinet (2) respectively with the meter
Calculation machine (1) is connected with power supply (3).
2. as claimed in claim 1 suitable for the temperature and atmosphere control system of forming process, it is characterised in that the upper mould
Core group includes upper mold core fixed plate (8), upper mold core ceramic insulation sleeve (8-1) and upper mold core (8-2), the upper mold core (8-2)
Be inlaid in upper mold core ceramic insulation sleeve (8-1), the lower surface directly contact of its upper surface and Top electrode (3-2), it is described on
Core rod ceramic insulation sleeve (8-1) is inlaid in upper mold core fixed plate (8)；Offered in the upper water-cooled thermal insulation board (6) cold
But water flow passage (6-1), the upper mold core fixed plate (8), Top electrode fixed plate (7) and upper water-cooled thermal insulation board (6) are by bolt
It is fixed on forcing press top shoe (5).
3. as claimed in claim 1 or 2 suitable for the temperature and atmosphere control system of forming process, it is characterised in that described
Lower mold core group includes lower mold core fixed plate (9), lower mold core ceramic insulation sleeve (9-1) and lower mold core (9-2), the lower mold core
(9-2) is inlaid in lower mold core ceramic insulation sleeve (9-1), the upper surface directly contact of its lower surface and bottom electrode (3-4), institute
Lower mold core ceramic insulation sleeve (9-1) is stated to be inlaid in lower mold core fixed plate (9)；Offered in the lower water-cooled thermal insulation board (12)
Lower cooling water flow conduits (12-1), the lower mold core fixed plate (9), bottom electrode fixed plate (11) and lower water-cooled thermal insulation board (12) lead to
Cross and be bolted on forcing press lower bottom base (13).
4. as claimed in claim 3 suitable for the temperature and atmosphere control system of forming process, it is characterised in that the spiral
Flow channel (4-4) is arranged on the inwall of lower mold core ceramic insulation sleeve (9-1), is offered on the lower mold core fixed plate (9)
Mounting hole for installing infrared temperature sensor (2-3) and ccd image sensor (1-3).
5. as claimed in claim 4 suitable for the temperature and atmosphere control system of forming process, it is characterised in that the gas storage
Bottle (40) is connected by conduit (4-1) with inlet channel (4-3), and magnetic valve (4-2), the electricity are connected in the middle part of the conduit (4-1)
Magnet valve (4-2) is connected by cable with the control cabinet (2).
6. as claimed in claim 5 suitable for the temperature and atmosphere control system of forming process, it is characterised in that the lower mould
Core ceramic insulation sleeve (9-1) is made of crystalline ceramics, and the power supply (3) is low-voltage, high-current dc source, the gas storage
High pressure nitrogen is full of in bottle (4).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201621127483.2U CN206230868U (en) | 2016-10-16 | 2016-10-16 | A kind of temperature and atmosphere control system suitable for forming process |
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|---|---|---|---|
| CN201621127483.2U CN206230868U (en) | 2016-10-16 | 2016-10-16 | A kind of temperature and atmosphere control system suitable for forming process |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106466916A (en) * | 2016-10-16 | 2017-03-01 | 华中科技大学 | A kind of temperature being applied to forming process and atmosphere control system |
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- 2016-10-16 CN CN201621127483.2U patent/CN206230868U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106466916A (en) * | 2016-10-16 | 2017-03-01 | 华中科技大学 | A kind of temperature being applied to forming process and atmosphere control system |
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