CN206179900U - High radiation led filament - Google Patents
High radiation led filament Download PDFInfo
- Publication number
- CN206179900U CN206179900U CN201620788088.2U CN201620788088U CN206179900U CN 206179900 U CN206179900 U CN 206179900U CN 201620788088 U CN201620788088 U CN 201620788088U CN 206179900 U CN206179900 U CN 206179900U
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- Prior art keywords
- heat
- led
- led filament
- oxide
- filament
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Led Device Packages (AREA)
Abstract
The utility model provides a high radiation LED filament, include: a heat conduction base plate, be fixed with the LED lamp of a plurality of series connection on the first surface of heat conduction base plate, with be formed with the high radiation material layer on the relative second surface of first surface, the high radiation material layer with the second surface passes through the chemical bond form and connects. The utility model discloses a high radiation LED filament makes the heat radiation become effective heat dissipation way of LED filament at the superficial layer that has a high fever radiation coefficient that the exposed surface of the heat conduction base plate technology through machining or chemistry, physics form formed and the heat conduction base plate is connected through the chemical bond to improve the heat -sinking capability of filament and be adapted to more powerful practical application.
Description
Technical field
The utility model is related to technical field of LED illumination, more particularly to a kind of radiation LED filament high.
Background technology
The citation form of current filament lamp source is in a heat-conducting substrate for long strip type tens LEDs Series Packages
On 101, the material of heat-conducting substrate 101 is generally crystalline ceramics or opaque metal, when use crystalline ceramics is used as heat-conducting substrate
When 101, it is contemplated that blue leakage problem, it is necessary to which color temperature parameters and chip wave band determine fluorescent material model according to needed for LED, so
Pale yellow fluorescent glue 102 is formed after it is mixed with silica gel or acryl resin afterwards, fluorescent glue 102 is applied to integrated form welding
On good LED blue chips, white light so can be directly converted blue light into.The LED filament that will be prepared is arranged on copper wire support
On, and the transparent or semitransparent sealing cell-shell for being filled with high heat conduction gas 103 (such as mixed gas of hydrogen and helium) is positioned over together
Interior (typically glass), is aided with external constant current control power supply, just constitutes LED filament lamp, as shown in Figure 1.The shape of filament lamp
State and traditional tengsten lamp are very close to manufacture craft has similar with conventional bulb, is very city as a novel energy-conserving light source
Have an optimistic view of in place.
But current filament lamp practical application power is all smaller, generally 2~8W, main bottleneck is just limited with it to be dissipated
Heat energy power is relevant.The desired value of the working junction temperature of LED be below 100 DEG C, actual photoelectric transformation efficiency should 30% with
Under, that is, it is to need to transfer out just make its normal work to have the unnecessary thermal energy more than 70%.So in LED illumination application
Heat sinking function is very crucial technology.
The heat energy of filament surface is taken to glass by the radiating of LED filament mainly by the convection current of high heat conduction gas molecule
The inwall of cell-shell, then cooling is realized by the radiation of cell-shell glass surface.Its main radiating mode is：It is gas radiating, straight
Connect heat loss through conduction and heat loss through radiation.
Increase the content (ratio as increased hydrogen) and concentration of high heat dispersion gas in cell-shell, gas can be increased
Heat dispersion, lifts photoelectric transformation efficiency, but produce little effect, it is impossible to fundamentally solve heat dissipation problem to a certain extent.
The spectrum relative narrower of LED, does not have infra-red radiation part, and heat transfer path is only limitted to contact and conducts substantially, and filament
Direct heat loss through conduction ability be it is very limited, only the metallic conductor at filament two ends and connection copper wire support can realize heat
Conduction, but it is also in itself to rely primarily on the gaseous exchange in shell on a vitreum for insulation that copper wire support is usually
To realize radiating, so its temperature difference very little, the ability of heat transfer is also very small.
The thermal radiation capability of current filament is also very limited.The fluoresent coating on ceramic substrate filament top layer leads ceramics
Hot substrate radiant heat in itself cannot be passed, and more seriously these radiant heat can be absorbed by fluoresent coating and cause fluorescence
The temperature of superficial layer rises, and brings less preferable application effect.And the filament lamp surface of Metal Substrate is to be directly exposed to outward, can
With the gaseous exchange of environment in backdoor by surface radiating, so what the filament radiating of Metal Substrate will be compared with ceramic base will more excellent one
A bit.In order to consider the requirement that light reflection and technique simplify, Metal Substrate typically uses the silvering of best bright finish, as shown in Fig. 2 adopting
With metal iron layer 104 and the double-layer structure of metal nickel dam 105 as Metal Substrate, a table of metal iron layer 104 and metal nickel dam 105
Face is fitted, and bright and clean silvering on another plated surface, LED 106 is attached to an exposed surface of silvering 1071, another exposed
The surface of silvering 1072 as radiating surface.But the heat emissivity coefficient of bright and clean silvering is very small, surface emissivity
(emissivity) definition up to 1, worst is 0, then the heat emissivity coefficient of bright and clean silvering only has 0.02-0.05, this
The radianting capacity that sample results in heat-conducting substrate is excessively poor.So the heat-radiation heat-dissipating ability of Metal Substrate filament is also excessively poor at present,
Although there is larger swept area at the Metal Substrate filament back side, contribution of its heat loss through radiation to filament lamp system radiating is very little.
Further, it is also possible to pass through to increase the radiation surface area (using big cell-shell) of cell-shell or the surface of increase LED filament
The modes such as the long-pending probability (overstriking filament) to improve gas molecule collision improve the heat dispersion of LED filament, but effect is not
It is preferable.
Therefore, how fundamentally to improve the heat dispersion of LED filament, and then improve the power of LED filament lamp has turned into
One of those skilled in the art's problem demanding prompt solution.
Utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of radiation LED filament high,
Heat dissipation problem for solving LED filament in the prior art.
In order to achieve the above objects and other related objects, the utility model provides a kind of radiation LED filament high, the spoke high
Penetrating LED filament at least includes：
One heat-conducting substrate, is fixed with the LED of multiple series connection, with first table on the first surface of the heat-conducting substrate
Radiative material layer high is formed with the relative second surface in face；The radiative material layer high passes through chemical bond with the second surface
Form is connected.
Preferably, the chemical bond includes metallic bond, ionic bond, covalent bond.
Preferably, the radiative material layer high is by the reaction of gas phase surface, plating, physical sputtering, ion implanting, chemical gas
Mutually the mode of deposition, physical vapour deposition (PVD) or high temperature sintering is formed.
Preferably, the heat emissivity coefficient of the radiative material layer high is not less than 0.5.
Preferably, the radiative material layer high includes：Nichrome, the oxide of nichrome, nichrome
Oxide, the oxide of iron, the oxide of nickel, bronze, cast iron, white pottery porcelain, the oxide of copper, the oxide of lead, steel, the oxygen of steel
The oxide of compound or aluminium.
Preferably, the material of the heat-conducting substrate is metal, ceramics, glass, sapphire, aluminium nitride or quartz.
Preferably, the heat-conducting substrate includes one layer of Heat Conduction Material or the different Heat Conduction Material of multilayer.
Preferably, the LED is packed LED chip；Each packed LED chip is fixed on the heat conduction base by solid
On plate, the welding plate for connecting each packed LED chip surface with bonding wire realizes the series connection of each packed LED chip.
Preferably, the LED is flip LED chips；The heat conduction base is directly welded at by the surface pads of bottom
On plate, realized being connected in series by the printing connecting line on the heat-conducting substrate.
It is highly preferred that the first surface is provided with the reflector layer of an any surface finish.
Preferably, the LED is flip LED chips；The first surface of the heat-conducting substrate is provided with an insulating materials
Layer, is printed with metal connecting line on the insulation material layer, each flip LED chips are connected by the welding plate of bottom with the metal connecting line
Realization is connect to be connected in series.
It is highly preferred that the surface of the insulation material layer is provided with the reflector layer of an any surface finish.
Preferably, the exposed surface of the radiative material layer high is the non-smooth finish surface of out-of-flatness.
As described above, radiation LED filament high of the present utility model, has the advantages that：
Radiation LED filament high of the present utility model passes through machining or chemistry, physics in the exposure of heat-conducting substrate
The superficial layer with high-heating radiation coefficient that the technique of form is formed and heat-conducting substrate is connected by chemical bond, does not cover by outer
The surface applied and increase radiation coefficient material coating and cover formation is put, heat radiation is turned into effective sinking path of LED filament, from
And improve the heat-sinking capability of filament and be adapted to more powerful practical application.
Brief description of the drawings
Fig. 1 is shown as the structural representation of LED filament lamp of the prior art.
Fig. 2 is shown as the structural representation of metal base LED filament of the prior art.
Fig. 3 is shown as the formal dress structural representation of radiation LED filament high of the present utility model.
Fig. 4 is shown as the inverted structure schematic diagram of radiation LED filament high of the present utility model.
Component label instructions
101 heat-conducting substrates
102 fluorescent glues
103 high heat conduction gases
104 metal iron layer
105 metal nickel dams
106 LEDs
1071~1072 silvering
1 LED
2 heat-conducting substrates
3 radiative material layers high
4 reflector layers
5 solids
6 welding plates
7 bonding wires
8 insulation material layers
9 metal connecting lines
Specific embodiment
Implementation method of the present utility model is illustrated below by way of specific instantiation, those skilled in the art can be by this theory
Content disclosed by bright book understands other advantages of the present utility model and effect easily.The utility model can also be by addition
Different specific embodiments are embodied or practiced, and the various details in this specification can also be based on different viewpoints and answer
With, without departing from it is of the present utility model spirit under carry out various modifications or alterations.
Refer to Fig. 3~Fig. 4.It should be noted that the diagram provided in the present embodiment only illustrates this in a schematic way
The basic conception of utility model, when only display is with relevant component in the utility model rather than according to actual implementation in schema then
Component count, shape and size are drawn, and the kenel of each component, quantity and ratio can be a kind of random changing during its actual implementation
Become, and its assembly layout kenel be likely to it is increasingly complex.
As shown in Fig. 3~Fig. 4, the utility model provides a kind of radiation LED filament high, and the radiation LED filament high includes：
LED 1, heat-conducting substrate 2, radiative material high layer 3 and reflector layer 4.
The LED 1 is fixed on the first surface of the heat-conducting substrate 2.
Specifically, as shown in figure 3, used as an implementation method of the present utility model, the LED 1 is packed LED chip,
Further, in order to improve the reflectance luminous efficiency of light, bright and clean reflective of layer of surface is plated in the first surface of the heat-conducting substrate 2
Layer 4 so that form high reflecting rate material layer between the LED 1 and the heat-conducting substrate 2 to improve the reflectance luminous efficiency of light.
In the present embodiment, the material of the reflector layer 4 is preferably silver.Each packed LED chip is fixed on described reflective by solid 5
On layer 4, the surface of each packed LED chip is provided with welding plate 6, and multiple packed LED chips are cascaded by bonding wire 7, with
Form light source.
Specifically, as shown in figure 4, used as another implementation method of the present utility model, the LED 1 is flip LED core
Piece, the first surface of the heat-conducting substrate 2 is provided with an insulation material layer 8, and metal connecting line is printed with the insulation material layer 8
9, each flip LED chips are connected realization and are connected in series by the welding plate 6 of bottom with the metal connecting line 9.Further to improve light
Reflectance luminous efficiency, the surface of the insulation material layer 8 is provided with the reflector layer 4 of any surface finish, and the reflector layer 4 can be by applying
The reflective oil of brush is formed.
As shown in Fig. 3~Fig. 4, the heat-conducting substrate 2 is used to carry the LED 1, and carries out the transmission of heat.
Specifically, as shown in Fig. 3~Fig. 4, the material of the heat-conducting substrate 2 include but is not limited to metal (elemental metals or
Alloy), ceramics, glass, sapphire, aluminium nitride or quartz, in the present embodiment, the heat-conducting substrate 2 is single metal level,
In actually used, the heat-conducting substrate 2 can be the Heat Conduction Material of multilayer unlike material, be not limited with the present embodiment.
As shown in Fig. 3~Fig. 4, the radiative material high layer 3 is formed at the second surface of the heat-conducting substrate 2, and described the
Two surfaces are relative with the first surface.The radiative material layer 3 high the heat-conducting substrate 2 is conducted through the heat for coming and passes through institute
Radiative material high 3 exposed back side radiant of layer are stated in extraneous gas, and then realizes radiating to reduce work of the temperature to LED
The influence of voltage and operating current.
Specifically, the radiative material layer 3 high is connected with the heat-conducting substrate 2 by chemical bond form, the chemical bond
Including but not limited to metallic bond, ionic bond, covalent bond.The utility model does not include institute by way of simple adhesion or coating
State the second surface that radiative material layer 3 high is covered in the heat-conducting substrate 2.
More specifically, the generation type of the radiative material high layer include but is not limited to gas phase surface reaction (as aoxidized),
Plating, physical sputtering, ion implanting, chemical vapor deposition, physical vapour deposition (PVD) or high temperature sintering.
Specifically, the heat emissivity coefficient of the radiative material layer 3 high is not less than 0.5.In the present embodiment, the radiation high
The material of material layer 3 includes but is not limited to nichrome, the oxide of nichrome, the oxide of nichrome, iron
Oxide, the oxide of nickel, bronze, cast iron, white pottery porcelain, the oxide of copper, the oxide of lead, steel, the oxide of steel or aluminium
Oxide.Machining can arbitrarily be passed through or chemistry, the technique of physical form are formed, and passed through with the heat-conducting substrate 2
The material with high-heating radiation coefficient of chemical bond connection is applied to radiative material layer 3 high of the present utility model, differs herein
One enumerates.
Specifically, in order to further improve the radiation coefficient of the radiative material high layer 3, by the radiative material layer 3 high
Exposed surface the non-smooth surface of out-of-flatness is formed by way of Surface Machining, to increase the surface of the radiative material layer 3 high
Product.In the present embodiment, the technique of the Surface Machining includes but is not limited to sandblasting, grinding, impressing.
Embodiment one
Using metallic iron or ferroalloy as the heat-conducting substrate 2, the heat-conducting substrate 2 is placed in oxidation environment, led to
Peroxidating forms the oxide of iron, and then improves radiation coefficient.In the present embodiment, the oxide of the iron of formation is with four oxidations three
As a example by iron, its radiation coefficient is more than 0.74.
Embodiment two
Using metallic iron as the heat-conducting substrate 2, the heat-conducting substrate 2 second surface by ion implanting mode
Nickel ion and chromium ion is implanted sequentially to form the nichrome surface with high radiation coefficient, the spoke of the nichrome
Coefficient is penetrated more than 0.8.
Embodiment three
Use 310 formula bodies stainless steel (its chemical formula is Ni20Cr25Fe55) difficult to understand as the heat-conducting substrate 2, led described
The second surface of hot substrate 2 carries out high temperature oxidation process, and to obtain the oxide of nichrome, its radiation coefficient is reachable
0.97.Under the conditions of same surface area, compared to LED filament of the prior art, its radiance improves 30~50 times.
Example IV
Using any metal as the heat-conducting substrate 2, apply glaze in the second surface of the heat-conducting substrate 2 and carry out high temperature
To form white ceramic surface, its radiation index is more than 0.78 to sintering.
Embodiment five
Accessible superficial layer is formed on the heat-conducting substrate 2, then carries out oxidation processes and form comparatively ideal radiation high
Surface.
Specifically, tens microns of nickel metal is plated at the back side of the common steel substrates of former A3003, rolling by way of
Nickel metal surface forms micron-sized uneven whole face, to improve surface area, then forms coarse oxygen by oxidation technology
Change nickel surface layer.The radiation coefficient of nickel oxide maintains 0.85~0.9, by can further improve lamp after rough surface
The Net long wave radiation ability of silk.
Embodiment warp above is as an example, the principle that can be based on disclosed in the utility model is extended to different materials
Using not repeating one by one herein.
As described above, radiation LED filament high of the present utility model, has the advantages that：
Radiation LED filament high of the present utility model passes through machining or chemistry, physics in the exposure of heat-conducting substrate
The superficial layer with high-heating radiation coefficient that the technique of form is formed and heat-conducting substrate is connected by chemical bond, turns into heat radiation
Effective sinking path of LED filament, so as to improve the heat-sinking capability of filament and be adapted to more powerful practical application.
In sum, the utility model provides a kind of radiation LED filament high, at least includes：One heat-conducting substrate, the heat conduction
The LED of multiple series connection is fixed with the first surface of substrate, height is formed with the second surface relative with the first surface
Radiative material layer；The radiative material layer high is connected with the second surface by chemical bond form.Spoke high of the present utility model
The exposure that LED filament is penetrated in heat-conducting substrate is formed and heat-conducting substrate by machining or chemistry, the technique of physical form
The superficial layer with high-heating radiation coefficient connected by chemical bond, makes heat radiation turn into effective sinking path of LED filament, from
And improve the heat-sinking capability of filament and be adapted to more powerful practical application.So, the utility model effectively overcomes existing
Various shortcoming in technology and have high industrial utilization.
Above-described embodiment only illustrative principle of the present utility model and its effect are new not for this practicality is limited
Type.Any person skilled in the art can all be carried out under without prejudice to spirit and scope of the present utility model to above-described embodiment
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the essence disclosed in the utility model
All equivalent modifications completed under god and technological thought or change, should be covered by claim of the present utility model.
Claims (12)
1. a kind of height radiates LED filament, it is characterised in that the radiation LED filament high at least includes：
One heat-conducting substrate, is fixed with the LED of multiple series connection, with the first surface phase on the first surface of the heat-conducting substrate
To second surface on be formed with radiative material high layer；The radiative material layer high passes through chemical bond form with the second surface
Connection.
2. height according to claim 1 radiates LED filament, it is characterised in that：The chemical bond includes metallic bond, ion
Key, covalent bond.
3. height according to claim 1 radiates LED filament, it is characterised in that：The radiative material layer high passes through gas phase table
The mode of face reaction, plating, physical sputtering, ion implanting, chemical vapor deposition, physical vapour deposition (PVD) or high temperature sintering is formed.
4. height according to claim 1 radiates LED filament, it is characterised in that：The heat radiation system of the radiative material layer high
Number is not less than 0.5.
5. height according to claim 1 radiates LED filament, it is characterised in that：The radiative material layer high includes：Nickel chromium iron
Alloy, the oxide of nichrome, the oxide of nichrome, the oxide of iron, the oxide of nickel, bronze, cast iron, white pottery
The oxide of porcelain, the oxide of copper, the oxide of lead, steel, the oxide of steel or aluminium.
6. height according to claim 1 radiates LED filament, it is characterised in that：The material of the heat-conducting substrate is metal, pottery
Porcelain, glass, sapphire, aluminium nitride or quartz.
7. height according to claim 1 radiates LED filament, it is characterised in that：The heat-conducting substrate includes one layer of heat conduction material
Material or the different Heat Conduction Material of multilayer.
8. height according to claim 1 radiates LED filament, it is characterised in that：The LED is packed LED chip；
Each packed LED chip is fixed on the heat-conducting substrate by solid, and each packed LED chip surface is connected with bonding wire
Welding plate realizes the series connection of each packed LED chip.
9. height according to claim 8 radiates LED filament, it is characterised in that：The first surface is provided with a surface light
Clean reflector layer.
10. height according to claim 1 radiates LED filament, it is characterised in that：The LED is flip LED chips；
The first surface of the heat-conducting substrate is provided with an insulation material layer, and metal connecting line is printed with the insulation material layer,
Each flip LED chips are connected realization and are connected in series by the welding plate of bottom with the metal connecting line.
11. radiation LED filaments high according to claim 10, it is characterised in that：The surface of the insulation material layer is set
There is the reflector layer of an any surface finish.
12. radiation LED filaments high according to claim 1, it is characterised in that：The exposed surface of the radiative material high layer is
The non-smooth finish surface of out-of-flatness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620788088.2U CN206179900U (en) | 2016-07-26 | 2016-07-26 | High radiation led filament |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620788088.2U CN206179900U (en) | 2016-07-26 | 2016-07-26 | High radiation led filament |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206179900U true CN206179900U (en) | 2017-05-17 |
Family
ID=58673904
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| Application Number | Title | Priority Date | Filing Date |
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| CN201620788088.2U Expired - Fee Related CN206179900U (en) | 2016-07-26 | 2016-07-26 | High radiation led filament |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206179900U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107665942A (en) * | 2016-07-26 | 2018-02-06 | 上海莱托思电子科技有限公司 | Height radiation LED filament |
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2016
- 2016-07-26 CN CN201620788088.2U patent/CN206179900U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107665942A (en) * | 2016-07-26 | 2018-02-06 | 上海莱托思电子科技有限公司 | Height radiation LED filament |
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Granted publication date: 20170517 Termination date: 20200726 |