CN206163477U - Quick assembly disassembly's semiconductor module - Google Patents

Abstract

The utility model discloses a quick assembly disassembly's semiconductor module, including semiconductor assemble and metal sheet, metal sheet bottom area is greater than the semiconductor assemble area and bonds with semiconductor assemble's heat -delivery surface, and the metal sheet top is identical with the draw -in groove of squirrel cage, semiconductor module through the metal sheet inlay locate the squirrel cage on, the utility model discloses set up the metal sheet of great area on semiconductor assemble, can effectively improve semiconductor assemble the exothermicity can, and the metal sheet passes through the bonding agent with the semiconductor assemble heat -delivery surface and bonds, the thermal stress influence of having avoided the welding to produce has improved semiconductor assemble's reliability.

Description

A kind of semiconductor module of fast assembling-disassembling

Technical field

The utility model is related to a kind of semiconductor module, more particularly to one kind is used for small space and fast demountable Semiconductor module.

Background technology

As communication, electrical equipment, computer industry are developed rapidly, for pollution-free, noiseless thermoelectric cooling module demand It is more and more, but because the space of rack or cabinet limits, the conventional mounting means of current general semiconductor module --- use four The structure of individual screw Corner Strapped, then possibly cannot realize that it installs needs, and this is required in the narrow space of less cabinet, Semiconductor module will not only meet the optimization of its function, while also to ensure that the installation of the energy fast assembling-disassembling under the confined space will Ask.

Utility model content

The utility model mainly solves the mounting structure of existing semiconductor module cannot be quick in less rack or cabinet The technical problem of dismounting, there is provided it is a kind of for small space and fast demountable semiconductor module.

In order to solve above-mentioned technical problem, the utility model mainly adopts following technical proposals：

A kind of semiconductor module of fast assembling-disassembling of the present utility model, the mouse cage that the semiconductor module is placed in cabinet On, semiconductor module includes semiconductor subassembly and metallic plate, the metallic plate bottom area more than semiconductor subassembly area and with The heat delivery surface bonding of semiconductor subassembly, metallic plate top matches with the draw-in groove of the mouse cage, and semiconductor module passes through metallic plate It is embedded on mouse cage, the metallic plate of larger area is set on semiconductor subassembly, the exothermicity of semiconductor subassembly can be effectively improved Can, and metallic plate and semiconductor subassembly heat delivery surface are bonding by bonding agent, it is to avoid the thermal stress impact that welding is produced, and improve The reliability of semiconductor subassembly.

Preferably, the metallic plate is copper coin, copper material has preferable thermal conductivity and ductility.

Preferably, the metallic plate is double-layer integrally structure, including bottom heat dissipating layer and top mounting layer, the radiating Aspect product more than the area of mounting layer, with the heat delivery surface of semiconductor subassembly fit by heat dissipating layer, the draw-in groove of mounting layer and the mouse cage Match and be embedded in draw-in groove, the bottom heat dissipating layer of the larger area in double-decker had both had larger area of dissipation, and Buckle for mouse cage leaves card and takes space, and top mounting layer then corresponds to mouse cage draw-in groove and is embedded in draw-in groove, facilitates semiconductor module The installation of block.

Preferably, the heat dissipating layer side is provided with the bayonet socket for semiconductor module clamping, the mounting layer is in halfpace Shape structure, positioned at heat dissipating layer side, the draw-in groove of the top correspondence mouse cage, the side of mounting layer four is ramp type, module for its bottom Can accurately import in the draw-in groove of mouse cage and quick insertion or dial-out, realize the function of Fast Installation or dismounting.

Preferably, the halfpace bevel angle α of the mounting layer is 30 °～45 °, ramp angles are conducive to the embedded of module.

The beneficial effects of the utility model are：The metallic plate of larger area is set on semiconductor subassembly, can be effectively improved The heat dispersion of semiconductor subassembly heat delivery surface, and it is bonding using bonding agent between metallic plate and semiconductor subassembly heat delivery surface, then keep away Exempt from the thermal stress impact that both welding are produced, improve the reliability of semiconductor subassembly, meanwhile, in metallic plate double-decker Bottom heat dissipating layer had both had larger area of dissipation, and the buckle for mouse cage leaves card and takes space, and top mounting layer is then corresponded to In mouse cage draw-in groove and embedded draw-in groove, facilitate the installation of semiconductor module.

Description of the drawings

Fig. 1 is a kind of structural representation of the present utility model.

Fig. 2 is the schematic top plan view of Fig. 1 structures.

Fig. 3 is the metal plate structure schematic diagram in Fig. 1.

Fig. 4 is the schematic top plan view of Fig. 3 structures.

1. semiconductor subassembly in figure, 2. metallic plate, 21. heat dissipating layers, 22. mounting layers, 23. bayonet sockets.

Specific embodiment

Below by embodiment, and accompanying drawing is combined, the technical solution of the utility model is described in further detail.

Embodiment：A kind of semiconductor module of the fast assembling-disassembling of the present embodiment, on the mouse cage being placed in cabinet, such as Fig. 1 and Shown in Fig. 2, semiconductor module includes semiconductor subassembly 1 and copper coin 2, and copper coin bottom area is more than semiconductor subassembly area and with half The heat delivery surface bonding of conductor assembly, as shown in Figure 3 and Figure 4, copper coin is double-layer integrally structure, including bottom heat dissipating layer 21 and top Mounting layer 22, the area of heat dissipating layer is more than the area of mounting layer, and heat dissipating layer is fitted with the heat delivery surface of semiconductor subassembly, heat dissipating layer one Side is designed with the bayonet socket 23 for semiconductor module clamping, and mounting layer is in halfpace shape structure, and halfpace bevel angle α is 45 °, and its is larger Bottom surface be located at heat dissipating layer side, the draw-in groove of top surface correspondence mouse cage, mounting layer matches with the draw-in groove of mouse cage and is embedded at draw-in groove It is interior.

During assembling, first the semiconductor subassembly for having completed is flat in special fixture, covers printing mesh sheet, then in print One layer of bonding agent of even print, then puts by drawing copper coin and covers the lid of special fixture in brush mesh sheet, uses clip Clamp, be eventually put into heating in baking oven, take out after bonding agent solidification, natural cooling, dismounting, so far, semiconductor module Make assembling to complete.

When using, the copper coin mounting layer of semiconductor module is aligned in the draw-in groove of mouse cage and embedded draw-in groove, finally again by mouse Cage buckle blocks copper coin, completes installation of the semiconductor module in cabinet.

In description of the present utility model, technical term " on ", D score, "front", "rear", "left", "right", " vertical ", " horizontal stroke ", " interior ", " outward " etc. represent that direction or position relationship are, based on direction shown in the drawings or position relationship, to be for only for ease of description With understand the technical solution of the utility model, described above that not the utility model has been made to limit, the utility model is also not only It is limited to the citing of described above, the change that those skilled in the art are made in essential scope of the present utility model Change, retrofit, increase or replace, be regarded as protection domain of the present utility model.

Claims (5)

1. a kind of semiconductor module of fast assembling-disassembling, it is characterised in that：On the mouse cage that the semiconductor module is placed in cabinet, half Conductor module includes semiconductor subassembly (1) and metallic plate (2), the metallic plate bottom area be more than semiconductor subassembly area and with The heat delivery surface bonding of semiconductor subassembly, metallic plate top matches with the draw-in groove of the mouse cage, and semiconductor module passes through metallic plate It is embedded on mouse cage.

2. the semiconductor module of a kind of fast assembling-disassembling according to claim 1, it is characterised in that：The metallic plate (2) is Copper coin.

3. the semiconductor module of a kind of fast assembling-disassembling according to claim 1 and 2, it is characterised in that：The metallic plate (2) For double-layer integrally structure, including bottom heat dissipating layer (21) and top mounting layer (22), the heat dissipating layer area is more than mounting layer Area, heat dissipating layer is fitted with the heat delivery surface of semiconductor subassembly, and mounting layer matches with the draw-in groove of the mouse cage and is embedded at draw-in groove It is interior.

4. the semiconductor module of a kind of fast assembling-disassembling according to claim 3, it is characterised in that：The heat dissipating layer (21) one Side is provided with the bayonet socket (23) for semiconductor module clamping, and the mounting layer is in halfpace shape structure, and its bottom is located at heat dissipating layer one Side, the draw-in groove of the top correspondence mouse cage.

5. the semiconductor module of a kind of fast assembling-disassembling according to claim 4, it is characterised in that：The mounting layer (22) Halfpace bevel angle α is 30 °～45 °.