CN206148790U - Laser device - Google Patents
Laser device Download PDFInfo
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- CN206148790U CN206148790U CN201621170319.XU CN201621170319U CN206148790U CN 206148790 U CN206148790 U CN 206148790U CN 201621170319 U CN201621170319 U CN 201621170319U CN 206148790 U CN206148790 U CN 206148790U
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- laser instrument
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Abstract
The utility model provides a laser device, include: be used for exporting the kind component that has the laser pulse of adjustable frequency and pulse width, for the light modulator who makes laser pulse the optical pulse train that becomes to have certain envelope shape under modulating signal's control, a first amplifier for setting a camera the pulse string enlargies with the laser power who improves the optical pulse train, a beam splitter for inciting somebody to action optical pulse train after enlargeing divide into identical first pulse string and second pulse string, a two second amplifiers for being directed at first pulse string and second pulse string enlarge respectively with the laser power who improves first pulse string and second pulse string. The utility model discloses a laser device is through focus, can be applicable to the disposable cutting of favoring the LED wafer with two pulse strings two -layer cutting layer of compriseing a plurality of focus points (demolition point) respectively about forming on treating the scribing thing, improves outward appearance straightness accuracy and outward appearance effect that the sheet was processed, effectively improves laser scribing's quality.
Description
Technical field
This utility model is related to laser instrument processed and applied technical field, specially a kind of laser instrument.
Background technology
Cut is cut relative to the traditional saw blade of industry, and the novel dicing technology for developing, it will typically swash
Light beam focuses on chip surface or inside, marks ditch flute mark in chip surface or inside by laser, then uses sliver technology again
Split along cut.Cut have production capacity height, high yield rate, be easily operated automatically, the low advantage of cost, it is (luminous in LED
Diode) chip, RFID (RF identification), it is widely used in Flash (flash memory) etc. the preparation field of product, especially half
In the substrate scribing process of conductor LED chip, diamond cutter cutting has been instead of completely.
LED wafer scribing is carried out using laser processing technology, the manufacturing standard technologies of LED are had become.Compared to biography
The diamond blade cutting of system, cut speed is fast, quality is good, efficiency high.It is main at present to pass through the single psec arteries and veins of single focus
Punching, focuses on material internal, carries out laser scribing using its high power density.
For relatively thin wafer, tradition typically focuses on to form a focus using single beam laser, using its high power peak
Value density is processed.Such relatively thin wafer is generally required and obtains sheet mechanical reduction, polishing.
For further cost-effective, raising efficiency, will gradually remove thinning process, the thickness of product will be stepped up.It is logical
The multiple multilayer processing of single focus is crossed, it is less efficient, and can cause to cut appearance poor, situations such as cross section quality is not high, cause product
Yield declines.
Another major issue, LED chip processing, be generally processed using a pulse, due to peak power compared with
Height, energy are larger, laser easily penetrable material, injure the electrode at the Sapphire Substrate back side, cause electrical yield to decline.
Utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model are to provide a kind of laser instrument, for solving
Certainly in prior art, laser dicing is low for thicker wafer dicing efficiency, the problem that presentation quality and electrical yield decline.
For achieving the above object and other related purposes, this utility model provides a kind of laser instrument, and the laser instrument includes：
To the seed source for exporting the laser pulse with adjustable frequency and pulsewidth；It is connected with the seed source, in modulated signal
Control under by the Laser pulse modulator into the optical pulse train with certain envelope shape photomodulator；With the light modulation
Device is connected, for being amplified to improve the first amplifier of the laser power of the optical pulse train to the optical pulse train；With
First amplifier is connected, and is divided into identical first train of pulse and the second arteries and veins for the optical pulse train after by amplification
The beam splitter of punching string；It is connected with the beam splitter, for being put to first train of pulse and second train of pulse respectively
Big two the second amplifiers to improve the laser power of first train of pulse and second train of pulse.
In an embodiment of the present utility model, the laser instrument also includes being connected to the beam splitter and two described the
Between two amplifiers, the angle of divergence for changing first train of pulse or second train of pulse makes first arteries and veins of output
Punching string and second train of pulse have the angle of divergence processing meanss of the different angles of divergence.
In an embodiment of the present utility model, the angle of divergence processing meanss are beam expanding lens.
In an embodiment of the present utility model, the angle of divergence processing meanss are lens group.
In an embodiment of the present utility model, the seed source is psec optical fiber seed source or femtosecond fiber seed source.
As described above, a kind of laser instrument of the present utility model, has the advantages that：
1st, laser instrument of the present utility model can export identical two trains of pulse, pass through by arranging beam splitter
Arranging angle of divergence processing meanss can be (quick-fried by some focus points respectively in treating upper and lower two-layer is formed on scribing thing by two trains of pulse
Fried point) incised layer that constitutes, using bifocuses low-energy laser scribing, it is adaptable to thicker LED wafer (>150um) once
Property cutting problem, improve sheet processing outward appearance linearity and appearance, effectively improve the quality of laser scribing.
2nd, laser instrument output pulse string formula laser of the present utility model, is prevented effectively from pulse peak power too high to wafer
The damage that backplate is caused, improves the electrical yield of microsection manufacture LED chip.
3rd, laser instrument of the present utility model directly exports two-way laser, realizes bifocuses compared to conventionally by lens light splitting
Mode, laser output power is relatively low, it is to avoid damage of the high power to laser instrument, and the power per road laser can be directly only
Vertical control, it is without the need for being realized by light-dividing device, simple and sensitive, while reducing the cost of making.
Description of the drawings
Fig. 1 is shown as the theory diagram of laser instrument of the present utility model.
Fig. 2 is shown as a kind of preferred theory diagram of laser instrument of the present utility model.
Fig. 3 is shown as the schematic diagram of the laser pulse that the seed source of laser instrument of the present utility model is produced.
Fig. 4 is shown as the modulated rear light pulse for generating of laser pulse that the seed source of laser instrument of the present utility model is produced
The schematic diagram of string.
Fig. 5 is shown as the schematic diagram of the focus point formed on slice thing of laser instrument of the present utility model.
Component label instructions
100 laser instrument
101 seed sources
102 photomodulators
103 first amplifiers
104 beam splitters
105 second amplifiers
106 angle of divergence processing meanss
200 treat scribing thing
201 ground floor focus points
202 second layer focus points
Specific embodiment
Embodiment of the present utility model is illustrated below by way of specific instantiation, those skilled in the art can be by this theory
Content disclosed by bright book understands other advantages of the present utility model and effect easily.This utility model can also be by addition
Different specific embodiments is carried out or applies, and the every details in this specification can also be based on different viewpoints and answer
With, without departing from it is of the present utility model spirit under carry out various modifications and changes.
The purpose of the present embodiment is to provide a kind of laser instrument, is carried out using the femtosecond or picosecond laser light beam of train of pulse
The substrate scribing such as LED chip substrate.
The laser instrument of the present embodiment is a kind of common source double light path train of pulse psec optical fiber laser, i.e., by same psec seed
Source produces, and two-way, envelope be adjustable, and (more than 2-2 pulse can for the train of pulse being made up of 2 or more than 2 ultrashort laser pulses
Adjust), and do not have road laser independently to amplify, laser power Independent adjustable can be flexibly arranged according to laser processing technology, it is intended to solve
The quality of the thicker wafer scribing of LED field, efficiency and yield issues.
The laser instrument of the present embodiment adopts burst mode, two-way, picosecond laser beam, the train of pulse of laser instrument to focus on LED
Inside Sapphire Substrate, silicon substrate or SIC substrate wafers, upper and lower two-layer focus point (demolition point) is formed, disposable laser is carried out
High-quality scribing.Burst mode laser processing mode will be prevented effectively from that pulse peak power is too high to be caused to wafer rear electrode
Damage, improve LED chip make electrical yield.Thicker LED will mainly be solved using the scribing of bifocuses low-energy laser brilliant
Disk (>Disposable cutting problem 150um), improves the outward appearance linearity and appearance of sheet processing.
The laser instrument of the present embodiment directly exports two-beam, and, without the need for lens light splitting, light path is easier for outer light path.Institute
Can solve with the laser instrument of the present embodiment that laser dicing in prior art is low for thicker wafer dicing efficiency, presentation quality
The problem declined with electrical yield.
A kind of principle and embodiment of laser instrument of the present embodiment described in detail below, makes those skilled in the art not
Creative work is needed to be appreciated that a kind of laser instrument of the present embodiment.
Specifically, as shown in figure 1, the laser instrument 100 that the present embodiment is provided includes：Seed source 101, photomodulator 102, the
One amplifier 103, beam splitter 104 and two the second amplifiers 105.Preferably, as shown in Fig. 2 the laser instrument 100 is also wrapped
Include angle of divergence processing meanss 106.
Specifically, in the present embodiment, the seed source 101 is to export the laser arteries and veins with adjustable frequency and pulsewidth
Punching.Wherein, the seed source 101 can be direct for psec optical fiber seed source or femtosecond fiber seed source, i.e., described seed source 101
Produce the homologous and relevant psec of two beams or femtosecond laser.
In the present embodiment, the seed source 101 be psec optical fiber seed source, psec optical fiber seed source produce Gao Zhongying skin
Second laser, as shown in Figure 3.T0The width of pulse is exported for seed source, is also the arteries and veins of individual pulse in pulse envelope or train of pulse
Rush width, f0The repetition rate of pulse is exported for seed source, is also the repetition rate of individual pulse in pulse envelope or train of pulse.
In the present embodiment, the wave-length coverage of the laser pulse is 355nm～1550nm, pulse duration range be 100fs～
200ps, repetition rate 50K-1MKZ are adjustable, and power 0-20W is adjustable, horizontal polarization.
Specifically, in the present embodiment, the photomodulator 102 is connected with the seed source 101, in modulated signal
Control under by the Laser pulse modulator into the optical pulse train with certain envelope shape, wherein, as shown in figure 4, the light
Each envelope of train of pulse includes at least 2 subpulses, wherein, t is time coordinate, and T is train of pulse goods or pulse envelope
Time width, F are the repetition frequencies of train of pulse.
Specifically, in the present embodiment, first amplifier 103 is connected with the photomodulator 102, for described
Optical pulse train is amplified to improve the laser power of the optical pulse train.
In the present embodiment, the optical pulse train for modulating generation is divided into identical two-beam by the beam splitter 104, is had
Body ground, in the present embodiment, the beam splitter 104 is connected with first amplifier 103, for the described smooth arteries and veins after by amplification
Rush string and be divided into identical first train of pulse and the second train of pulse.
Wherein, the pulse envelope number for being included in first train of pulse and second train of pulse respectively be 2～2 with
On.I.e. described first train of pulse and second train of pulse are respectively by certain repetition rate, 2 or more than 2 identical energies, phases
The burst blocks constituted with the psec or femtosecond pulse of pulsewidth are into and arbitrarily adjustable in scope.
Specifically, in the present embodiment, the angle of divergence processing meanss 106 are connected with the beam splitter 104, for changing
The angle of divergence of first train of pulse or second train of pulse makes first train of pulse and second train of pulse of output
With the different angles of divergence.
In the present embodiment, the angle of divergence processing meanss 106 can be beam expanding lens or lens group.
In the present embodiment, the angle of divergence processing meanss 106 are preferably beam expanding lens, i.e., laser pulse train passes through to expand all the way
Shu Jing, makes angle of divergence size variation, due to first train of pulse it is different with the angle of divergence of second train of pulse, described first
Train of pulse or second train of pulse in the focus after focusing not on same height, as shown in figure 5, thus equivalent to
Treat on scribing thing 200 while forming two scribing cutting lines.
In this embodiment, two second amplifiers 105 are connected with the angle of divergence processing meanss 106 respectively,
It is amplified respectively to improve first arteries and veins for first train of pulse different to the angle of divergence and second train of pulse
The laser power of punching string and second train of pulse.So, the laser power of first train of pulse and second train of pulse
Independently can adjust.
Therefore, the laser instrument 100 in the present embodiment can export two trains of pulse, and the diverging of two trains of pulse
Angle is different, and the train of pulse of the direct output of such laser instrument 100 can be in treating to be formed on scribing thing 200 upper and lower two-layer respectively by some
The incised layer that focus point (demolition point) is constituted, i.e. ground floor focus point 201 and second layer focus point 202, it is concrete as shown in Figure 5.
Two train of pulse ECDC beams of the output of laser instrument 100 in the present embodiment, form after focusing on scribing thing 200 is treated
Two-layer is respectively by some focus points, i.e. ground floor focus point 201 and second layer focus point 202 up and down.
In detailed description below the present embodiment, laser instrument 100 generates the process of the train of pulse that output is directly used：
The repetition rate of the laser pulse train of psec optical fiber laser seed source output is 37MHz, and pulsewidth is 10ps, light work(
Rate is about 200mw, the laser pulse train that seed source 101 is exported is adjusted through photomodulator 102, the output letter after adjustment
Number it is the adjustable trains of pulse of 50KHz-1M for repetition rate, burst width is the adjustable ns of 20ps-200ps, and train of pulse has 2-
20 picopulses, 104 points of Jing beam splitters are A, and B two-way, difference through amplifying, export two-way power for 0.1-10W psecs again
Train of pulse.
In sum, laser instrument of the present utility model can export identical two pulses by arranging beam splitter
String, can be by two trains of pulse in treating upper and lower two-layer is formed on scribing thing respectively by some poly- by arranging angle of divergence processing meanss
The incised layer that focus (demolition point) is constituted, using bifocuses low-energy laser scribing, it is adaptable to thicker LED wafer (>150um)
Disposable cutting problem, improve sheet processing outward appearance linearity and appearance, effectively improve the quality of laser scribing；This
The laser instrument output pulse string formula laser of utility model, is prevented effectively from that pulse peak power is too high to be caused to wafer rear electrode
Damage, improve microsection manufacture LED chip electrical yield；Laser instrument of the present utility model directly exports two-way laser, compares
In bifocal mode is realized conventionally by lens light splitting, laser output power is relatively low, it is to avoid high power is to laser instrument
Damage, and the power per road laser can direct independent control, need not be simple and sensitive by light-dividing device realization, while reduction
The cost for making.So, this utility model effectively overcomes various shortcoming of the prior art and has high industrial exploitation value
Value.
Above-described embodiment only illustrative principle of the present utility model and its effect are new not for this practicality is limited
Type.Any person skilled in the art all can be carried out to above-described embodiment under without prejudice to spirit and the scope of the present utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the essence disclosed in this utility model
All equivalent modifications completed under god and technological thought or change, should be covered by claim of the present utility model.
Claims (5)
1. a kind of laser instrument, it is characterised in that：The laser instrument includes：
To the seed source for exporting the laser pulse with adjustable frequency and pulsewidth；
Be connected with the seed source, under the control of modulated signal by the Laser pulse modulator into certain envelope shape
The photomodulator of the optical pulse train of shape；
It is connected with the photomodulator, for being amplified to improve the laser power of the optical pulse train to the optical pulse train
The first amplifier；
Be connected with first amplifier, for the optical pulse train after by amplification be divided into identical first train of pulse and
The beam splitter of the second train of pulse；
It is connected with the beam splitter, for being amplified first train of pulse and second train of pulse to improve respectively
State two the second amplifiers of the laser power of the first train of pulse and second train of pulse.
2. laser instrument according to claim 1, it is characterised in that：The laser instrument also include be connected to the beam splitter and
Between two second amplifiers, the angle of divergence for changing first train of pulse or second train of pulse makes output
First train of pulse and second train of pulse have the angle of divergence processing meanss of the different angles of divergence.
3. laser instrument according to claim 2, it is characterised in that：The angle of divergence processing meanss are beam expanding lens.
4. laser instrument according to claim 2, it is characterised in that：The angle of divergence processing meanss are lens group.
5. laser instrument according to claim 1, it is characterised in that：The seed source is psec optical fiber seed source or femtosecond light
Fine seed source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621170319.XU CN206148790U (en) | 2016-11-02 | 2016-11-02 | Laser device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621170319.XU CN206148790U (en) | 2016-11-02 | 2016-11-02 | Laser device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206148790U true CN206148790U (en) | 2017-05-03 |
Family
ID=58622861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621170319.XU Active CN206148790U (en) | 2016-11-02 | 2016-11-02 | Laser device |
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| Country | Link |
|---|---|
| CN (1) | CN206148790U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106410573A (en) * | 2016-11-02 | 2017-02-15 | 国神光电科技（上海）有限公司 | Laser |
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2016
- 2016-11-02 CN CN201621170319.XU patent/CN206148790U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106410573A (en) * | 2016-11-02 | 2017-02-15 | 国神光电科技（上海）有限公司 | Laser |
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