CN206134666U - Separating apparatus - Google Patents

Abstract

The utility model provides a separating apparatus, includes: have pointed end portion the base, locate in this pointed end portion and holding carrier and locating this clamp plate that holds the carrier top for carrying object to through this clamp plate and this pointed end portion this article of cramping, and make this article separate into a plurality of objects. The utility model discloses a separating apparatus compares and knows prior art in knowing, and the user only needs one the utility model discloses a separating apparatus not unidimensional clamp plate of arranging in pairs or groups can accord with the demand of splitting size, and need not if know that many splitting equipment of use of knowing as the prior art can effectively promote easy -to -use nature and the cost of simplex skill is cut in the reduction. In addition, in carrying out the splitting operation, compare in current cutter, this clamp plate can not damage because of the collision.

Description

Separation equipment

Technical field

This utility model is related to a kind of separation equipment, more particularly to a kind of separation equipment for cleaving process.

Background technology

In existing semiconductor technology, wafer can carry out thinning technique, singulation process, packaging technology etc. after the completion of manufacture, Wherein, the mode of singulation process is various, for example, cut, machine cuts, splitting separate etc..

As illustrated in figures ia and ib, existing split point separation equipment 1 includes：One platform body (figure is omited), one are located at the machine Patch of splitting device 12 and of the pedestal 10, on the downside of playscript with stage directions body on the upside of the platform body on the pedestal 10 Film 13.

When cleavage operations are carried out, first by one there is the wafer 8 in multiple precut roads 80 to stick on the pad pasting 13, then will The chopper 120 of the splitting device 12 is pointed on a wherein precut road 80, and the vibrations part 121 using the splitting device 12 hits Hit the chopper 120, make the chopper 120 touch the wafer 8 pairs should precut road 80 back position A, to make the wafer 8 along this Split (such as slight crack S) in precut road 80.Repeat the cleaving step of the above-mentioned splitting device 12 afterwards, with the back side of wafer 8 It is straight to transversely cleave the respectively precut road 80, make the wafer 8 be separated into multiple crystal grain 8a.

However, in existing separation equipment 1, the splitting device 12 is provided only with a kind of chopper 120 of width dimensions, therefore the splitting Device 12 be only capable of cleave specific dimensions wafer 8, such as 6 cun wafers, if being intended to cleave larger sized wafer (such as 8 cun of wafers), Then need to change the separation equipment 1 or buy new separation equipment, thus result in user inconvenience and improve singulation process into This.

Additionally, the splitting device 12 is provided only with a kind of chopper 120 of width dimensions, therefore when the splitting device 12 is by the wafer When 8 middle cleaves the edge to the wafer 8, because the edge of the pad pasting 13 is typically provided with iron hoop (figure is omited), cause The point of a knife face of the chopper 120 can be damaged because colliding the iron hoop.

Therefore, the variety of problems of prior art how is overcome, actually an important topic.

Utility model content

To solve above-mentioned problem of the prior art, this utility model discloses a kind of separation equipment, can effectively be lifted and be used then The cost of convenience and reduction singulation process.

Separation equipment of the present utility model includes：Pedestal, it has point；Bearing part, it is located at the point of pedestal Above and to loaded object；And an at least pressing plate, it is located at bearing part top, to clamp object with point.

In aforesaid separation equipment, bearing part is stickiness lamellar body.

In aforesaid separation equipment, pedestal is chopper, and point is in knife-like.

In aforesaid separation equipment, pressing plate has location division, and with para-position object detached position is intended to.

In aforesaid separation equipment, also include the fixture with opening, it fixes bearing part, opened with making bearing part cover Mouthful.For example, fixture is ring bodies.

From the foregoing, it will be observed that in separation equipment of the present utility model, mainly object lower section is supported in by point, then with pressing plate Pressure break object, to change various sizes of pressing plate according to the object of various sizes, and cleaves on demand the wafer of various sizes, therefore Compared to prior art, user only needs a separation equipment of the present utility model to arrange in pairs or groups various sizes of pressing plate, you can meet The demand of splitting size, and without the need for use multiple stage cleaving device such as prior art, so as to effectively lifting ease of use and Reduce the cost of singulation process.

Additionally, in carrying out in cleavage operations, when the pressing plate of large-size cleaves the edge to object, because pressing plate is with plate Face contact-impact fixture, thus compared to the point of a knife face of existing cutter, pressing plate will not be damaged because of collision.

Description of the drawings

Figure 1A is the generalized section of existing separation equipment；

Figure 1B is the close-up schematic view of Figure 1A；

Fig. 2A is the upper view plane schematic diagram of separation equipment of the present utility model；

Fig. 2 B are the front-view schematic diagram of Fig. 2A；

Fig. 2 C are the local left view schematic diagram of Fig. 2A；

Fig. 3 A are the upper view plane schematic diagram of another embodiment of Fig. 2A；

Fig. 3 B are the front-view schematic diagram of Fig. 3 A；

Fig. 3 C are the local left view schematic diagram of Fig. 3 A；

Fig. 4 A are the upper view plane schematic diagram of another embodiment of Fig. 2A；

Fig. 4 B are the front-view schematic diagram of Fig. 4 A；

Fig. 4 C are the local left view schematic diagram of Fig. 4 A；

Fig. 5 A are the upper view plane schematic diagram of another embodiment of Fig. 2A；

Fig. 5 B are the front-view schematic diagram of Fig. 5 A；And

Fig. 5 C are the local left view schematic diagram of Fig. 5 A；

Wherein, description of reference numerals is as follows：

1st, 2 separation equipments 10,20 pedestals

The chopper of 12 splitting device 120

The 121 vibrations pad pastings of part 13

The fixture of 200 point 21

210 22 bearing parts of opening

23rd, the location division of 33,43,53 pressing plate 230,330,430,530

8 wafer 8a crystal grain

The object of 80 precut road 9

90 slight crack A back positions

S slight cracks.

Specific embodiment

Embodiment of the present utility model is illustrated below by way of particular specific embodiment, those skilled in the art can be by this Description disclosure of that understands easily other advantages of the present utility model and effect.

It should be clear that structure, ratio, size depicted in this specification institute accompanying drawings etc., only to coordinate description institute public The content opened, for understanding and the reading of those skilled in the art, is not limited to the enforceable restriction bar of this utility model Part, therefore do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size are not affecting Under effect that this utility model can be generated and the purpose to be reached, all should still fall in technology disclosed in the utility model In the range of Rong get Neng is covered.Meanwhile, in this specification it is cited such as " on ", the term of D score and " ", only for ease of Narration understands, and be not used to limit this utility model enforceable scope, and its relativeness is altered or modified, without essence Under change technology contents, when being considered as the enforceable category of this utility model.

Fig. 2A to Fig. 2 C is the schematic diagram of separation equipment of the present utility model 2.As shown in Fig. 2A to Fig. 2 C, separation equipment 2 Including：One platform body (figure omit), a pedestal 20, on the downside of the platform body have the fixture 21 of opening 210, solid Covering the bearing part 22 and at least one pressing plate on the upside of the platform body of the opening 210 on the fixture 21 23。

Described pedestal 20 has a point 200, and the bearing part 22 makes the point on the point 200 200 against the bearing part 22.In the present embodiment, the point 200 is in knife-like, and for example, the splitting wafer of pedestal 20 is used Cutter, the chopper 120 that it can be as shown in Figure 1B.

Described fixture 21 is in the platform body and is located between the pedestal 20 and the pressing plate 23.In the present embodiment In, the fixture 21 is conductor loop (for example, becket, such as iron hoop) or dead ring.

Described bearing part 22 on the pedestal 20 with carry an object 9 (tool precut road 80 as shown in Figure 1B Wafer 8).In the present embodiment, the bearing part 22 is stickiness lamellar body, for example, from shape film (release tape), UV glue Band (UV tape) or thermal separation gel band (thermal tape) etc..

Described pressing plate 23 is located at the top of bearing part 22, to clamp the object 9 with the point 200, makes 9 points of the object From into multiple objects (crystal grain 8a as shown in Figure 1B).In the present embodiment, the material of the pressing plate 23 is formed for can be such as Figure 1B institutes The material of the material of the pedestal 10 for showing or other suitable pressure break wafers.It is preferred that the pressing plate 23 has the location division such as groove 230, with para-position, the object 9 is intended to detached position (precut road 80 as shown in Figure 1B).

When detached job is carried out, as shown in Fig. 2 B and Fig. 2 C, first by the point 200 align the object 9 be intended to it is detached The surface of bearing part 22 at the position is simultaneously withstood in position (precut road 80 as shown in Figure 1B), then by the pressing plate 23 towards the carrying Part 22 pushes the object 9, to make the pressing plate 23 clamp the object 9 with the point 200, makes the object 9 upper and lower pressurized and separates Into multiple objects (crystal grain 8a as shown in Figure 1B).Specifically, as shown in Fig. 3 C, Fig. 4 C and Fig. 5 C, during cramping, this is determined The alignment precut road 80 as shown in Figure 1B of position portion 330,430,530 is simultaneously made under surrounding's plate face of the location division 330,430,530 The object 9 is pressed, makes the stress concentration of the point 200 in location division 330,430,530 (or the precut road 80) part, caused Make the object 9 pairs should the place of location division 330,430,530 split, the slight crack 90 as shown in Fig. 3 C, Fig. 4 C and Fig. 5 C.

Therefore, separation equipment of the present utility model 2 inverts existing chopper and pedestal, to be supported by the point 200 In the lower section of the object 9, then with the pressure break of pressing plate 23 object 9, therefore various sizes of pressure can be changed according to the object 9 of various sizes Plate 23,33,43,53 (as shown in Fig. 2A, Fig. 3 A, Fig. 4 A and Fig. 5 A), its actuator state such as Fig. 2 B, Fig. 3 B, Fig. 4 B and Fig. 5 B with Shown in Fig. 2 C, Fig. 3 C, Fig. 4 C and Fig. 5 C, thus separation equipment of the present utility model 2 can on demand cleave the wafer of various sizes (such as 6 cun, 8 cun or 12 cun wafer etc.).Whereby, user only needs a separation equipment 2 to arrange in pairs or groups various sizes of pressing plate 23, 33,43,53 may conform to cleave the demand of size, and without the need for the use multiple stage cleaving device such as prior art, so as to effective Lift ease of use and reduce the cost of singulation process.

Additionally, in carrying out in cleavage operations, when large-size pressing plate 33,43,53 by the middle of the object 9 cleave to During the edge of the object 9, the direction of arrow as shown in Fig. 3 A, Fig. 4 A and Fig. 5 A, because the pressing plate 33,43,53 is with plate face contact The fixture 21 is collided, thus compared to the point of a knife face of existing cutter, the pressing plate 33,43,53 plate face will not be damaged because of collision It is bad.

In addition, various sizes of pressing plate 23,33,43,53 can be integrated in into same platform body, using as pressing plate group, and The wherein pressing plate 23,33,43,53 for being intended to start is selected to carry out detached job with controlling organization (figure is omited).

Above-described embodiment only to illustrative principle of the present utility model and its effect, not for limiting this practicality It is new.Any those skilled in the art can be carried out under without prejudice to spirit and the scope of the present utility model to above-described embodiment Modification.Therefore rights protection scope of the present utility model, should be as listed by claims.

Claims (7)

1. a kind of separation equipment, it is characterized by, the separation equipment includes：

Pedestal, it has point；

Bearing part, it is located on the point of the pedestal and to loaded object；And

An at least pressing plate, it is located at the bearing part top, to clamp the object with the point.

2. separation equipment as claimed in claim 1, it is characterized by, the bearing part is stickiness lamellar body.

3. separation equipment as claimed in claim 1, it is characterized by, the pedestal is chopper.

4. separation equipment as claimed in claim 1, it is characterized by, the point is in knife-like.

5. separation equipment as claimed in claim 1, it is characterized by, the pressing plate has location division, and with para-position, the object is intended to separate Position.

6. separation equipment as claimed in claim 1, it is characterized by, the separation equipment also includes the fixture with opening, its The bearing part is fixed, to make the bearing part cover the opening.

7. separation equipment as claimed in claim 6, it is characterized by, the fixture is ring bodies.