CN206134657U - Separating apparatus - Google Patents
Separating apparatus Download PDFInfo
- Publication number
- CN206134657U CN206134657U CN201621126932.1U CN201621126932U CN206134657U CN 206134657 U CN206134657 U CN 206134657U CN 201621126932 U CN201621126932 U CN 201621126932U CN 206134657 U CN206134657 U CN 206134657U
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- Prior art keywords
- separation equipment
- bearing part
- cutter
- utility
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Abstract
The utility model provides a separating apparatus includes: the base, locate on this base and for the holding carrier and locate this effect device that holds the carrier top and have a plurality of cutters of carrying object, it is inequality through the width of this cutter respectively to the regional cutter that uses different width of different width separates the operation on this article. The utility model discloses a separating apparatus can avoid acting on the device and hold the marginal of carrier and damage because of colliding.
Description
Technical field
This utility model is related to a kind of separation equipment, more particularly to a kind of separation equipment for cleaving process.
Background technology
In existing semiconductor technology, wafer can carry out thinning technique, singulation process, packaging technology etc. after the completion of manufacture,
Wherein, the mode of singulation process is various, for example, laser cutting, machine cuts, splitting separate etc..
As illustrated in figures ia and ib, existing split point separation equipment 1 includes:One platform body (figure is omited), one are located at the machine
Patch of splitting device 12 and of the pedestal 10, on the downside of playscript with stage directions body on the upside of the platform body on the pedestal 10
Film 13.
When cleavage operations are carried out, first by one there is the wafer 8 in multiple precut roads 80 to stick on the pad pasting 13, then will
The chopper 120 of the splitting device 12 is pointed on a wherein precut road 80, and the vibrations part 121 using the splitting device 12 hits
Hit the chopper 120, make the chopper 120 touch the wafer 8 pairs should precut road 80 back position A, to make the wafer 8 along this
Split (such as slight crack S) in precut road 80.The above-mentioned splitting device 12 of rear repetition cleaving step, with the back side of wafer 8
It is straight to transversely cleave the respectively precut road 80, make the wafer 8 be separated into multiple crystal grain 8a.
However, in existing separation equipment 1, the splitting device 12 is provided only with a kind of chopper 120 of width dimensions, therefore when this is split
When splitting device 12 edge to the wafer 8 cleaved by the middle of the wafer 8, the edge of the chopper 120 and the pad pasting 13
Can damage because colliding.
Therefore, problem of the prior art how is overcome, actually an important topic.
Utility model content
To solve above-mentioned problem of the prior art, this utility model discloses a kind of separation equipment, is avoided that acting device then
And the edge of bearing part is damaged because colliding.
Separation equipment of the present utility model includes:Pedestal;Bearing part, it is located on pedestal, for loaded object;And make
With device, it is located at bearing part top and the multiple cutters differed with width, to act on the thing being carried on bearing part
Part.
In aforesaid separation equipment, bearing part can be stickiness lamellar body.
In aforesaid separation equipment, acting device is splitting device.
In aforesaid separation equipment, also include the fixture with opening, it fixes bearing part, opened with making bearing part cover
Mouthful.For example, fixture is ring bodies.Or, the path length of the opening of fixture is more than the width of multiple cutters, and multiple cutter positions
In the projected position of opening.
From the foregoing, it will be observed that in separation equipment of the present utility model, mainly there are multiple knives of different in width by acting device
Tool, detached job is carried out with the region of the different in width on object using the cutter of different in width, therefore compared to prior art, this
When the acting device of utility model cleaves the edge to object, object can be cleaved with the cutter of its minimum widith, thus effect dress
Put will not contact-impact bearing part edge, and then be avoided that acting device and the edge of bearing part are damaged because colliding.
Description of the drawings
Figure 1A is the generalized section of existing separation equipment;
Figure 1B is the close-up schematic view of Figure 1A;
Fig. 2A is the schematic side view of separation equipment of the present utility model;
Fig. 2 B are schematic side view of the separation equipment of the present utility model when start;And
Fig. 2 C are the upper view plane schematic diagram of separation equipment of the present utility model.
Wherein, description of reference numerals is as follows:
The pedestal of 1,2 separation equipment 10,20
The chopper of 12 splitting device 120
The 121 vibrations pad pastings of part 13
21 fixtures 210 are open
22 acting device 22a, 22b, 22c, 22d cutter
The bearing part of 220 controller 23
8 wafer 8a crystal grain
The object of 80 precut road 9
A back position S slight cracks
D path length W1, W2, W3, W4 width.
Specific embodiment
Embodiment of the present utility model is illustrated below by way of particular specific embodiment, those skilled in the art can be by this
Description disclosure of that understands easily other advantages of the present utility model and effect.
It should be clear that structure, ratio, size depicted in this specification institute accompanying drawings etc., only to coordinate description institute public
The content opened, for understanding and the reading of those skilled in the art, is not limited to the enforceable restriction bar of this utility model
Part, therefore do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size are not affecting
Under effect that this utility model can be generated and the purpose to be reached, all should still fall in technology disclosed in the utility model
In the range of Rong get Neng is covered.Meanwhile, in this specification it is cited such as " on ", the term of D score and " ", only for ease of
Narration understands, and be not used to limit this utility model enforceable scope, and its relativeness is altered or modified, without essence
Under change technology contents, when being considered as the enforceable category of this utility model.
Fig. 2A to Fig. 2 C is the schematic diagram of separation equipment of the present utility model 2.As shown in Figure 2 A, separation equipment 2 includes:One
Platform body (figure is omited), a pedestal 20, on the downside of platform body have the fixture 21 of opening 210, are fixed on fixation
Acting device 22 on part 21 with the bearing part 23 and of covering opening 210 on the upside of platform body.
Described fixture 21 is in platform body and is located between pedestal 20 and acting device 22.
In the present embodiment, fixture 21 is conductor loop (for example, becket, such as iron hoop) or dead ring.
Described bearing part 23 is on pedestal 20 with the (crystalline substance in tool precut road 80 as shown in Figure 1B of one object of carrying 9
Circle is 8).
In the present embodiment, bearing part 23 is stickiness lamellar body, for example, from shape film (release tape), UV glue
Band (UV tape) or thermal separation gel band (thermal tape) etc..
Described acting device 22 is located at the top of bearing part 23 and with multiple cutter 22a, 22b, 22c, 22d, to act on
On object 9, object 9 is set to be separated into multiple objects (crystal grain 8a as shown in Figure 1B).
In the present embodiment, acting device 22 is splitting device, to produce splitting effect, and each cutter 22a, 22b, 22c,
The width W1 of 22d, W2, W3, W4 are to differ (as shown in Figure 2 C), with the region of the different in width on object 9 (as shown in Figure 2 C
Middle to edge) use different in width W1, the cutter 22a of W2, W3, W4,22b, 22c, 22d carries out detached job.
Additionally, the opening 210 of fixture 21 is circle, its path length D (or width of bearing part 23) is more than each cutter 22a,
Width W1, W2, W3, the W4 of 22b, 22c, 22d, as shown in Figure 2 C, makes each cutter 22a, 22b, 22c, 22d be respectively positioned on opening 210
Projected position in.
Also, each cutter 22a, 22b, 22c, 22d are the chopper that can cleave wafer, and its species is various with structure, are had no especially
Limit.
In addition, acting device 22 is provided with a controller 220, to manipulate a little cutter 22a, the start of 22b, 22c, 22d.
When detached job is carried out, as shown in Fig. 2 B and Fig. 2 C, moving article 9 makes object 9 be intended to detached region correspondence
Positioned at the cutter 22a corresponding to it, 22b, 22c, 22d lower section, i.e., the width in detached region is intended to according to object 9, by region
Corresponding cutter 22a, 22b, 22c, 22d are moved down to provide external force to object 9 by controller 220, for example, are passed through
Object 9 (wafer 8 in tool precut road 80 as shown in Figure 1B) is separated into multiple objects (crystalline substance as shown in Figure 1B by splitting mode
Grain 8a).
Therefore, separation equipment of the present utility model 2 has different in width W1, the cutter of W2, W3, W4 by acting device 22
22a, 22b, 22c, 22d, to cleave the region of different in width on object 9, therefore cleave to the edge of object 9 when acting device 22
When, acting device 22 can cleave object 9 with the cutter 22d of its minimum widith W4, thus acting device 22 (or multiple cutter 22d)
Will not contact-impact bearing part 23 (or fixture 21), and then be avoided that acting device 22 and bearing part 23 (or fixture 21) because
Collide and damage.
It should be appreciated that ground, if acting device 22 cleaves the edge of object 9, cutter 22a with the cutter 22a of its Breadth Maximum W1
Can damage because colliding with fixture 21;If acting device 22 cleaves the centre of object 9 with the cutter 22d of its minimum widith W4
Place, cutter 22d then cannot intactly cleave the middle of object 9.
Above-described embodiment only to illustrative principle of the present utility model and its effect, not for limiting this practicality
It is new.Any those skilled in the art can be carried out under without prejudice to spirit and the scope of the present utility model to above-described embodiment
Modification.Therefore rights protection scope of the present utility model, should be as listed by claims.
Claims (9)
1. a kind of separation equipment, it is characterized by, the separation equipment includes:
Pedestal;
Bearing part, it is located on the pedestal, for loaded object;And
Acting device, it is located at bearing part top and the multiple cutters differed with width, is carried on this and holds to act on
The object in holder.
2. separation equipment as claimed in claim 1, it is characterized by, the bearing part is stickiness lamellar body.
3. separation equipment as claimed in claim 2, it is characterized by, the stickiness lamellar body is from shape film, ultraviolet tape or heat
Separation gel band.
4. separation equipment as claimed in claim 1, it is characterized by, the acting device is splitting device.
5. separation equipment as claimed in claim 1, it is characterized by, the separation equipment also includes the fixture with opening, its
The bearing part is fixed, to make the bearing part cover the opening.
6. separation equipment as claimed in claim 5, it is characterized by, the fixture is ring bodies.
7. separation equipment as claimed in claim 6, it is characterized by, the ring bodies are conductor loop or dead ring.
8. separation equipment as claimed in claim 5, it is characterized by, the path length of the opening of the fixture is more than the plurality of cutter
Width.
9. separation equipment as claimed in claim 5, it is characterized by, the plurality of cutter is located in the projected position of the opening.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621126932.1U CN206134657U (en) | 2016-10-17 | 2016-10-17 | Separating apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621126932.1U CN206134657U (en) | 2016-10-17 | 2016-10-17 | Separating apparatus |
Publications (1)
Publication Number | Publication Date |
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CN206134657U true CN206134657U (en) | 2017-04-26 |
Family
ID=58574240
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201621126932.1U Active CN206134657U (en) | 2016-10-17 | 2016-10-17 | Separating apparatus |
Country Status (1)
Country | Link |
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CN (1) | CN206134657U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110303609A (en) * | 2019-07-12 | 2019-10-08 | 芯盟科技有限公司 | Wafer cuts board and crystal round fringes cutting process |
-
2016
- 2016-10-17 CN CN201621126932.1U patent/CN206134657U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110303609A (en) * | 2019-07-12 | 2019-10-08 | 芯盟科技有限公司 | Wafer cuts board and crystal round fringes cutting process |
CN110303609B (en) * | 2019-07-12 | 2021-08-03 | 芯盟科技有限公司 | Wafer cutting machine and wafer edge cutting method |
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