CN206132814U

CN206132814U - IC test seat connecting device

Info

Publication number: CN206132814U
Application number: CN201621174492.7U
Authority: CN
Inventors: 欧阳睿; 肖金磊; 王国兵; 陈凝; 解辰; 许秋林; 陆小勇
Original assignee: Beijing Tongfang Microelectronics Co Ltd
Current assignee: Beijing Tongfang Microelectronics Co Ltd
Priority date: 2016-11-03
Filing date: 2016-11-03
Publication date: 2017-04-26
Anticipated expiration: 2026-11-03

Abstract

The utility model discloses a IC test seat connecting device, including base plate and cylindrical through -hole post, the base plate is thickness at " ten " font phenolic plastics of 3~10mm board, cylindrical through -hole post is fixed on the base plate, and its one end is the horizontal plane with the base plate, and the other end exceeds 2~4mm of base plate for welding external circuit surveys test panel, the inside shell fragment device that is " ten " shape hollow structure that sets up of cylindrical through -hole post for connect external test seat socket contact pin, the position of cylindrical through -hole post can also be fixed according to the contact dimension parameter of test seat to the base plate. The utility model discloses can make enough that test seat is quick harmless to be changed, only need outer pull out the socket can, avoided the impaired circuit testing of the causing blackboard newspaper of change in -process tradition through -hole useless, saved test cost greatly, can realize again providing a bridging transfer scheme, the dear survey test panel of avoidance of repetition manufacturing and designing for the one -tenth survey that same product surveyed compatible self the multiple encapsulation form of test panel.

Description

A kind of IC test benches attachment means

Technical field

This utility model is related to IC technical field of measurement and test, more particularly to a kind of IC test benches attachment means.

Background technology

IC chip has numerous packing forms such as SOP, DIP, TQFP, QFN, BGA, and a usual product also has various encapsulation Form is meeting different application scene.Therefore numerous custom circuit plates, test bench is needed to set up survey in the production test of IC Test ring border.

Existing general purpose I C（Integrated Chip）Chip has fixed and general dimensions, production test, assessment During, lossless replacing IC chip is mainly realized by test bench, specially corresponded to model test bench and directly welded In PCB（Printed Circuit Board）On circuit test plate, the contact of IC chip passes through by compacting after contacting with test bench Existing good contact, is that PCB is electric in prior art referring to Fig. 1 so as to realize the electrical connection of IC chip and PCB circuit test plates The front plan view that drive test test plate (panel) 100 is connected with Socket test benches 200；Fig. 2, is PCB circuit tests plate 100 in prior art The back side top view being connected with Socket test benches 200, wherein 201 is the through hole of welding Socket test benches.

In prior art, the connection of PCB circuit tests plate 100 and Socket test benches 200, Socket test benches 200 lead to The contact pin contact point of extension is crossed, the through hole 201 on PCB circuit test plates is welded on completely one with PCB circuit tests plate 100 Rise.Its operation principle is：Test bench with realize complete electrical after PCB circuit test plate welds and be connected, chip is placed on test Seat the inside, by pressing and test bench contact good contact is realized, and then realizes the connection of chip and PCB circuit test plates.

There are two drawbacks in the IC chip test device structure of currently available technology itself：On the one hand it is that test bench has admittedly In some limited mechanical life-spans, after long-term use, contact shell fragment can deform, and elasticity can be reduced, so as to cause IC chip to contact not It is good, therefore need to change it when the test bench life-span exhausts or damages, and the through hole of traditional PCB circuit test plates It is that plating is formed, than relatively thin, there is a problem of that dismounting is difficult, unloading process needs butt welding point local to carry out high-temperature heating, outside Separate with PCB pressures in the presence of power, the damage of through hole or interconnector can be caused in period so as to lose electrical connection special Property, cause whole PCB circuit tests plate to be scrapped；Another aspect is that the PCB circuit test plates of connecting test seat are not general, with money core Piece other packing forms, a kind of a set of test board of packaging body or system, it is incompatible, increased maintenance and use cost.

Utility model content

For above-mentioned the deficiencies in the prior art, the purpose of this utility model is to devise a kind of IC test benches to connect Connection device, by bakelite sheet fabrication so as to possess high rigidity, high temperature resistance, wear-resistant, anticorrosive, insulation, electrical connection The characteristic such as good, the lossless plug for realizing test bench is used.

In order to reach above-mentioned technical purpose, the technical scheme that this utility model is adopted is：

A kind of IC test benches attachment means, including substrate and cylindrical hole post, it is characterised in that substrate be thickness 3 ~ " ten " font bakelite plate of 10mm；Cylindrical hole post is fixed on substrate, and its one end is with substrate in horizontal plane, the other end Beyond 2 ~ 4mm of substrate, for welding external circuit test board；Cylindrical hole post inside arranges the bullet in " ten " shape hollow-core construction Sheet devices, for connecting external testing seat socket contact pin.

Preferably, in the IC test benches attachment means, substrate carrys out fixed cylinder according to the contact size parameter of test bench The position of shape through hole post.

This utility model is due to improving traditional test bench connected mode, the beneficial effect for being obtained, on the one hand, Under ensureing the test bench and circuit test plate good electrical JA(junction ambient) consistent with traditional approach, test bench can quick nondestructive more Change, it is only necessary to outer drawing socket, without the need for the disassembling section of traditional approach, it is to avoid conventional via is impaired in Renewal process causes electricity Drive test test plate (panel) is scrapped, and greatlys save testing cost；On the other hand, additionally it is possible to be embodied as identical product circuit test plate compatible certainly Body multiple packing forms provide a bridge joint transfer scheme into surveying, it is to avoid the expensive test board of design iterations manufacture.

This utility model is described further with reference to the accompanying drawings and detailed description.

Description of the drawings

Fig. 1 is that existing Socket test benches are connected front plan view with PCB circuit test plates.

Fig. 2 is that existing Socket test benches are connected back side top view with PCB circuit test plates.

Fig. 3 is the front plan view of this utility model IC test bench attachment means.

Fig. 4 is test bench socket ferrule front face top view of the present utility model.

Specific embodiment

It is the front plan view of this utility model IC test bench attachment means referring to Fig. 3, wherein, 300 is this utility model IC test bench attachment means, 310 is the substrate of IC test bench attachment means, and 320 is logical for the cylinder of IC test bench attachment means Hole post, 321 is " ten " shape hollow-core construction shrapnel device of cylindrical hole post；Substrate 310 is in " ten " font, using specific phenol Aldehyde plastic plate, the THICKNESS CONTROL of substrate 310 in 3 ~ 10mm, so that it possesses good hardness, flatness, lead to the hole site reference standard Test bench contact size parameter.Cylindrical hole post 320 is fixed on " ten " font substrate 310, keeps one end and substrate 310 In horizontal plane, the other end exceeds substrate（310）2~4mm.There is the shrapnel device 321 of " ten " font inside cylindrical hole post 320, For connecting external testing seat socket contact pin.It is used to weld the electricity of outside beyond the other end cylindrical hole post 320 of substrate 310 Drive test test plate (panel), to realize that good electrical connects.

It is IC test benches ferrule front face top view of the present utility model referring to Fig. 4, wherein 400 is test bench, 401 are survey Examination seat socket contact pin；" ten " font shrapnel device 321 inside cylindrical hole post 320, for connecting external testing seat socket Contact pin 401, realizes the good contact with external testing seat socket contact pin 401, when changing test bench, only outer need to pull out test bench i.e. Can, without the need for welding.Because the good mechanical properties that high intensity cylindrical hole post possesses, effectively prevent Renewal process Test board is caused to scrap because through hole is impaired in middle traditional approach, so as to greatly save testing cost.

The implementation of IC test benches attachment means of the present utility model is not limited to embodiment discussed above.It is based on The obvious conversion of this utility model enlightenment or replacement should also be as being considered within protection domain of the present utility model.More than Specific embodiment be used for disclose optimal implementation of the present utility model so that one of ordinary skill in the art can The purpose of this utility model is reached using numerous embodiments of the present utility model and various alternative.

Claims

1. a kind of IC test benches attachment means, including substrate and cylindrical hole post, it is characterised in that substrate be thickness 3 ~ " ten " font bakelite plate of 10mm；Cylindrical hole post is fixed on substrate, and its one end is in horizontal plane with substrate, another End exceeds 2 ~ 4mm of substrate, for welding external circuit test board；Cylindrical hole post inside is arranged in " ten " shape hollow-core construction Shrapnel device, for connecting external testing seat socket contact pin.

2. IC test benches attachment means as claimed in claim 1, it is characterised in that substrate is joined according to the contact size of test bench Number comes the position of fixed cylinder shape through hole post.