CN206098379U - Power semiconductor assembly and elevator - Google Patents

Abstract

The utility model relates to a power semiconductor assembly and have this power semiconductor assembly's elevator. This power semiconductor assembly (100) include: be equipped with power semiconductor semiconductor module (102), with semiconductor module fits together, is used for cooling off semiconductor module's radiator (104), and, fill semiconductor module with heat -conducting cream (108) in the clearance between the radiator. The radiator, be provided with the intercommunication the clearance with outside filling hole (112) of radiator. In view of the above, need not lift semiconductor module off from the radiator, the outside that just can follow the radiator supplyes the heat -conducting cream through this filling hole is direct to the clearance between semiconductor module and the radiator. Dismouting semiconductor module's workload and time both can have been saved, good radiating effect can be guaranteed again.

Description

Power semiconductor assembly and elevator

Technical field

The utility model is related to power semiconductor assembly and the elevator with power semiconductor assembly.

Background technology

Heat-conducting silicone grease etc. is filled in gap of the electronic device (such as CPU, IGBT power model etc.) and radiator between Heat-conducting cream, improves the heat transfer between electronic device and radiator, is the side of well-known raising dissipation from electronic devices effect Method.For example, Japanese patent gazette JP 2003-347783 discloses a kind of power-converting device of drive motor, the electric power Converting means is provided with exothermic material 5 being provided between the power part 1 of power semiconductor and radiator 4.It is public according to the patent Report specification【0009】Section explanation, exothermic material 5 can be heat release piece, or heat-conducting silicone grease.

All power-converting devices described above, can generate heat in drive motor, stop to be cooled down again when driving.If this Kind of power-converting device is the motor of the device for driving the Jing such as elevator often to loiter, will continually in heating and In the circulation of cooling.Certainly, along with this cold cycling, power-converting device can expand with heat and contract with cold.It is this to expand with heat and contract with cold Although the outward appearance overall to power-converting device will not bring significantly change, to originally just very narrow and small power part 1 with Gap between radiator 4 can but bring very big impact.When power part 1 and 4 high-temperature expansion of radiator, the gap can be squeezed Obtain less, and when power part 1 and the cooling of radiator 4 are shunk, the gap can become big again.Gap becomes hour, part heat-conducting cream meeting It is pressed against outside gap, when gap becomes big, being extruded into the heat-conducting cream of outside can be inhaled into gap again, while also frequently there is air to be inhaled Enter gap, bubble is formed in heat-conducting cream.These bubbles will reduce the heat-transfer effect of heat-conducting cream.

In addition, all power-converting devices described above, Jing is often by longitudinal direction (by Fig. 1 of above-mentioned patent gazette or Fig. 2 rotations 90 ° of direction) distribution board or switch board are arranged on, make the gap between power part 1 and radiator 4 be in lengthwise position.At this Under the state of kind, the heat-conducting cream for filling during use in the gap can trickle gradually downward, make air inlet in the gap, lead Radiating effect is caused to decline.

Additionally, in use, as time goes by heat-conducting cream can gradually ageing hardening.The heat-conducting cream of solidification is in warm Crackle occurs during swollen shrinkage, declines radiating effect.

Therefore, all power-converting devices described above etc. include electronic device and the device of radiator, need every one section Time unloads electronic device (power part 1 as escribed above) from radiator (radiator 4 as escribed above), and heat conduction is smeared again It is installed to again on radiator after cream.As shown in Fig. 1 and Fig. 2 of above-mentioned patent gazette, power part 1 is provided with binding post 6, generally It is connected with the power line of motor.So, in order to unload power part 1, not only need to stop whole equipment, and dismount power part 1 operation is pretty troublesome, time-consuming.

Utility model content

Technical problem to be solved in the utility model is to provide a kind of power semiconductor assembly, this power semiconductor group Part need not unload semiconductor module from radiator, and heat-conducting cream just can be supplemented in gap between the two.

To solve the technical problem, power semiconductor assembly of the present utility model includes：It is provided with power semiconductor Semiconductor module；Fit together with the semiconductor module, to the radiator for cooling down the semiconductor module；And, The heat-conducting cream being filled in the gap between the semiconductor module and the radiator.In the radiator, it is provided with connection Hand-hole outside the gap and the radiator.

The utility model also provides a kind of elevator, and it includes car, controls control device, the Yi Jishang of the cage operation The power semiconductor assembly stated.

Because the hand-hole of power semiconductor assembly of the present utility model is by the gap between semiconductor module and radiator It is connected with the outside of radiator, it is possible to from the outside of radiator by the hand-hole directly to semiconductor module and radiating Gap between device supplements heat-conducting cream.Semiconductor module need not be unloaded from radiator, just can be filled with new heat-conducting cream Bubble, the space being formed in use in original heat-conducting cream, it might even be possible to new heat-conducting cream by aging heat-conducting cream From the gap extrusion, new and old displacement is carried out.Therefore, workload and the time of dismounting-mounting semiconductor module can be both saved, again can be with Ensure the good heat transfer between semiconductor module and radiator, so as to ensure good radiating effect.

In addition, the utility model elevator is due to above-mentioned power semiconductor assembly, that is, being provided with power semiconductor device The part of part has the structure of above-mentioned power semiconductor assembly, thus not only can reduce maintenance elevator workload and when Between, can ensure that the power semiconductor assembly has good radiating effect again.

Description of the drawings

Fig. 1 is the schematic diagram of the one embodiment for being schematically indicated the utility model power semiconductor assembly.

Fig. 2 is the schematic diagram of the one embodiment for being schematically indicated the utility model elevator.

Mark ＞ in ＜ accompanying drawings

100- power semiconductor assemblies, 102- semiconductor modules, 104- radiators, 106- bolts, 108- heat-conducting creams, 112- Hand-hole, 114- port lids, 200- elevators, 202- hoistways, 204- cars, 206- counterweights, 208- hoist ropes, 210- traction machines, 220- control devices.

Specific embodiment

Below in conjunction with the accompanying drawings and embodiment, specific embodiment of the present utility model is described in detail.

Fig. 1 is the schematic diagram of the one embodiment for being schematically indicated the utility model power semiconductor assembly.Power is partly led Body component 100 includes semiconductor module 102 and radiator 104.Power semiconductor is provided with semiconductor module 102.Example Such as, power converter loop (frequency conversion loop etc.) of the semiconductor module 102 comprising control motor, leads in these power converter loops Often include igbt (IGBT), SPM (IPM) constant power semiconductor devices.These power semiconductors Device operationally can generate heat.

Radiator 104 is fitted together by bolt 106 with semiconductor module 102, to cool down semiconductor module 102. Heat-conducting cream 108 is filled with gap between semiconductor module 102 and radiator 104.Actual assembling process is typically, first First heat-conducting cream 108 is smeared at the back side (face contacted with radiator 104) of semiconductor module 102, then will partly be led with bolt 106 Module 102 is installed to radiator 104, and heat-conducting cream 108 is clipped in the gap between semiconductor module 102 and radiator 104.

Radiator 104 is provided with hand-hole 112.Hand-hole 112 connects the outside of the gap and radiator 104. The port lid 114 for covering hand-hole 112 is provided with the outside opening of hand-hole 112.In the present embodiment, port lid 114 is by a spiral shell Bolt is constituted.As shown in figure 1, being provided with screw thread at the outside opening of hand-hole 112, and bolt and the screw thread are cooperatively formed into port lid 114, cover the outside opening of hand-hole 112.But, what port lid was not required, it is a preferred version to arrange port lid.

Because hand-hole 112 is by the outside phase of the gap between semiconductor module 102 and radiator 104 and radiator 104 Connection, it is possible to from the outside of radiator 104 by the hand-hole 112 directly to semiconductor module 102 and radiator 104 it Between gap supplement heat-conducting cream 108.Semiconductor module 102 need not be unloaded from radiator 104, just can be by new heat-conducting cream Filling is formed in use bubble, space in original heat-conducting cream, it might even be possible to led aging with new heat-conducting cream Hot cream carries out new and old displacement from the gap extrusion.Therefore, workload and the time of dismounting-mounting semiconductor module 102 can be both saved, The good heat transfer between semiconductor module 102 and radiator 104 is can ensure that again, so as to ensure good radiating effect.

As shown in figure 1, hand-hole 112 can be segmented using different cross dimensions.For example, can be Jie Jin the gap Part adopt less aperture, can so avoid heat-conducting cream 108 from outflowing along hand-hole 112, and hand-hole can be reduced The impact of 112 pairs of radiating effects of radiator 104.And in the part of close outside opening, can adopt larger aperture, so as to Injection device is mutually connected, coordinates.Furthermore it is also possible to inject unnecessary heat-conducting cream be close to the position in the gap in hand-hole 112 108.So, it is unnecessary in hand-hole 112 when the gap becomes big when semiconductor module 102 and the cooling of radiator 104 are shunk Heat-conducting cream 108 can be inhaled into the gap, so as to suppress to suck air formation bubble.Port lid 114 can prevent heat-conducting cream 108 from leading to Cross hand-hole 112 to outflow and aging.

Hand-hole 112 in embodiment shown in Fig. 1 is a straight hole, i.e. the center line of hand-hole 112 is straight line. In Fig. 1, hand-hole 112 is located at the left side of radiator 104, the opening towards outside radiator 104 towards the opening in the gap It is located at the right side of radiator 104.But, this is not the restriction to the shape of hand-hole 112.Hand-hole 112 can also have to turn The hole of turn of bilge.For example, hand-hole 112 can be arranged on radiator 104 towards the opening in the gap with same as shown in Figure 1 Left side, and hand-hole 112 can midway have turning part so as to be arranged on radiating towards the opening outside radiator 104 The top or bottom of device 104.Hand-hole 112 can be arranged on towards the opening outside radiator 104 and is easy to as needed The orientation of filling heat-conductive cream operation.Furthermore it is also possible to as needed, multiple branches are set in hand-hole 112, and towards between described Gap opens up multiple openings.As such, it is possible to more uniformly to the gap filling heat-conductive cream.

Fig. 2 is the schematic diagram of the one embodiment for being schematically indicated the utility model elevator.Elevator 200 includes car 204 With the control device 220 of the control operation of car 204.Control device 220 includes above-mentioned power semiconductor assembly 100.Car 204 It is connected with counterweight 206 by hoist ropes 208, is lifted under the traction of traction machine 210 in hoistway 202.Power semiconductor assembly 100 frequency converters for including control traction machine 210 etc..

Because the utility model elevator 200 has above-mentioned power semiconductor assembly 100, that is, it is being provided with power semiconductor device The part of part has the structure of above-mentioned power semiconductor assembly 100, it is possible to obtain above-mentioned utility model effect.Not only may be used To reduce workload and the time of maintenance elevator, can ensure that the power semiconductor assembly has good radiating effect again Really.

The utility model is not limited to the above embodiments, and it also includes various variations.For example, above-mentioned In order to make it easy to understand, describing in detail to the utility model, but it is not that the utility model is defined in into tool in embodiment In having the embodiment of all above-mentioned parts.Furthermore it is possible to some technical characteristics of certain embodiment are replaced into into other enforcements Technical characteristic in example, the part of certain embodiment composition can also be appended in other embodiments.Additionally, to each enforcement The local of the composition of example, can be added with other technical characteristics, be replaced, or is deleted.

Claims (3)

1. a kind of power semiconductor assembly, it includes：It is provided with the semiconductor module of power semiconductor；With the semiconductor module Block is fitted together, to the radiator for cooling down the semiconductor module；And, be filled in the semiconductor module and it is described dissipate The heat-conducting cream in gap between hot device,

It is characterized in that：

Hand-hole in the radiator, outside being provided with the connection gap and the radiator.

2. power semiconductor assembly according to claim 1,

It is characterized in that：With the port lid for covering the hand-hole.

3. a kind of elevator, it includes the control device of car and the control cage operation,

It is characterized in that：With power semiconductor assembly according to claim 1 and 2.