CN206073022U - A kind of new and effective LED heat dissipation structure - Google Patents
A kind of new and effective LED heat dissipation structure Download PDFInfo
- Publication number
- CN206073022U CN206073022U CN201620980842.2U CN201620980842U CN206073022U CN 206073022 U CN206073022 U CN 206073022U CN 201620980842 U CN201620980842 U CN 201620980842U CN 206073022 U CN206073022 U CN 206073022U
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- CN
- China
- Prior art keywords
- alkene layer
- diamond alkene
- solder mask
- heat dissipation
- fixed plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
This utility model belongs to technical field of lamps, specifically discloses a kind of new and effective LED heat dissipation structure, including luminescence chip, and luminescence chip is provided with solder mask and diamond alkene layer in turn below, and diamond alkene layer is arranged below aluminum fixed plate；Diamond alkene layer is connected with solder mask by upper adhesive linkage, and diamond alkene layer is connected with aluminum fixed plate by lower adhesive linkage；Align with solder mask at diamond alkene layer edge；Aluminum fixed plate outer rim exceeds diamond alkene layer.This utility model simple structure, good heat dissipation effect and low cost.
Description
Technical field
This utility model belongs to technical field of lamps, and in particular to a kind of new and effective LED heat dissipation structure.
Background technology
At present, LED is described as forth generation light source or green light source, and LED is due to environmental protection, energy-conservation, service life
Length, small volume, response be fast, it is not mercurous the advantages of and be subject to people's attention, therefore its application is also increasingly wider, has answered at present
Used in instruction, display, decoration, backlight, illuminating lamp field.LED light source in the course of the work, can be also produced in addition to luminous simultaneously
Substantial amounts of heat, the electric energy of the input power about 15% of usual LED light source change into luminous energy, and remaining 85% electric energy is all changed into
Heat, in constantly lighting process, if the heat for producing can not be exhaled in time, can cause LED light source
Damage, while can also affect the luminous efficiency of LED, stability etc..At present, heat dissipation metal material is mainly leaned in LED radiatings, for example
Aluminum, heat is derived from LED luminescence chips, the insulating barrier of the substrate between heat dissipation metal material and luminescence chip and bonding
Agent heat conductivity is little, and radiating efficiency is low, has had a strong impact on the radiating of LED.
Utility model content
The purpose of this utility model is to provide the new and effective LED of a kind of simple structure, good heat dissipation effect and low cost
Radiator structure.
For achieving the above object, this utility model is employed the following technical solutions：A kind of new and effective LED heat dissipation structure,
Including luminescence chip, luminescence chip is provided with solder mask and diamond alkene layer in turn below, and diamond alkene layer is arranged below aluminum fixed plate；
Diamond alkene layer is connected with solder mask by upper adhesive linkage, and diamond alkene layer is connected with aluminum fixed plate by lower adhesive linkage；Diamond alkene
Align with solder mask at layer edge；Aluminum fixed plate outer rim exceeds diamond alkene layer.
Further, aluminum fixed plate is provided with fixed structure beyond the part of diamond alkene layer；Fixed structure be screw or
Fixture.
Further, luminescence chip is provided with lampshade, and lampshade is engaged the receiving space to form closing with solder mask.
Further, lampshade is to be detachably connected with solder mask.
Further, luminescence chip is to be detachably connected with solder mask.
Compared with prior art, the beneficial effects of the utility model are as follows：Luminescence chip be provided with turn below solder mask and
Diamond alkene layer, diamond alkene layer are arranged below aluminum fixed plate, and diamond alkene layer not only has insulating properties, while diamond alkene layer has
The heat that luminescence chip is produced can be distributed rapidly, it is to avoid heat gathers inside LED light source in a large number by good thermal conductivity
Collection, improves the stability of LED light source, extends its service life；Diamond alkene layer is connected with solder mask by upper adhesive linkage, diamond alkene
Layer be connected with aluminum fixed plate by lower adhesive linkage, it is easy for installation, at the same reduction connector use, reduces cost and avoid damage
Bad each part；Align with solder mask at diamond alkene layer edge so that the heat that light source is produced fully can be distributed, it is to avoid heat
Aggregation；Aluminum fixed plate outer rim exceeds diamond alkene layer, is conveniently installed, and reduces installation difficulty；Aluminum fixed plate exceeds diamond
The part of alkene layer is provided with fixed structure, and fixed structure is screw or fixture, conveniently carries out installation exercise；Set on luminescence chip
There is lampshade, lampshade is engaged the receiving space to form closing with solder mask, it is to avoid luminescence chip is damaged, and increases the service life；Lamp
Cover with solder mask to be detachably connected, conveniently safeguarded to be detachably connected with solder mask by luminescence chip.
Description of the drawings
Fig. 1 is structural representation of the present utility model.
Specific embodiment
A kind of new and effective LED heat dissipation structure, as shown in figure 1, including luminescence chip 7, luminescence chip 7 is set in turn below
There are solder mask 6 and diamond alkene layer 4, diamond alkene layer 4 has nanoscale diamond alkene to make, with good radiating effect, diamond alkene
Thermal conductivity is 1000-2000 W/ (m K), and diamond alkene layer 4 is arranged below aluminum fixed plate 2；Solder mask 6, diamond alkene layer 4 and aluminum
Fixed plate processed 2 can be square, circular or other geometries；Diamond alkene layer 4 is connected with solder mask 6 by upper adhesive linkage 5, diamond
Alkene layer 4 is connected with aluminum fixed plate 2 by lower adhesive linkage 3；Align with solder mask 6 at 4 edge of diamond alkene layer；Outside aluminum fixed plate 2
Edge exceeds diamond alkene layer 4.Aluminum fixed plate 2 is provided with fixed structure 1 beyond the part of diamond alkene layer 4；Fixed structure 1 is screw
Or fixture.Luminescence chip 7 is provided with lampshade 8, and lampshade 8 is engaged the receiving space to form closing with solder mask 6.Lampshade 8 with
Solder mask 6 is to be detachably connected.Luminescence chip 7 is to be detachably connected with solder mask 6.
Claims (5)
1. a kind of new and effective LED heat dissipation structure, including luminescence chip, it is characterised in that：Luminescence chip is provided with turn below
Solder mask and diamond alkene layer, diamond alkene layer are arranged below aluminum fixed plate；The diamond alkene layer is by upper adhesive linkage and solder mask
Connection, diamond alkene layer are connected with aluminum fixed plate by lower adhesive linkage；Align with solder mask at the diamond alkene layer edge；The aluminum
Fixed plate outer rim processed exceeds diamond alkene layer.
2. new and effective LED heat dissipation structure as claimed in claim 1, it is characterised in that：The aluminum fixed plate is beyond brill
The part of stone alkene layer is provided with fixed structure；The fixed structure is screw or fixture.
3. new and effective LED heat dissipation structure as claimed in claim 2, it is characterised in that：The luminescence chip is provided with lamp
Cover, lampshade are engaged the receiving space to form closing with solder mask.
4. new and effective LED heat dissipation structure as claimed in claim 3, it is characterised in that：The lampshade with solder mask is can
Dismounting connection.
5. new and effective LED heat dissipation structure as claimed in claim 4, it is characterised in that：The luminescence chip and solder mask
To be detachably connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620980842.2U CN206073022U (en) | 2016-08-30 | 2016-08-30 | A kind of new and effective LED heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620980842.2U CN206073022U (en) | 2016-08-30 | 2016-08-30 | A kind of new and effective LED heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206073022U true CN206073022U (en) | 2017-04-05 |
Family
ID=58434610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620980842.2U Active CN206073022U (en) | 2016-08-30 | 2016-08-30 | A kind of new and effective LED heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206073022U (en) |
-
2016
- 2016-08-30 CN CN201620980842.2U patent/CN206073022U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |