CN206037301U - Semiconductor changes in temperature fan - Google Patents

Abstract

The utility model provides a semiconductor changes in temperature fan, includes first wind channel, first wind channel includes the first face of first fan and semiconductor refrigeration piece, flow through under the effect of the first fan first face back discharge of semiconductor refrigeration piece of wind first wind channel in, still include the second wind channel, be provided with second fan and semiconductor refrigeration piece second face on the second wind channel, wind in the second wind channel is flowed through under the effect of second fan and is discharged behind the second face of semiconductor refrigeration piece, and the refrigeration piece includes first face and second face, and the one side is the face of heating, and the one side is the refrigeration face, and its characterized in that, the first transverse plane of semiconductor refrigeration piece fix heat exchanger, at the direct or indirect thermoelectric generation chip that is fixed with of the second transverse plane of semiconductor refrigeration piece. Through the setting of thermoelectric generation chip, can be better with the heat or the cold energy that produce in the semiconductor refrigeration piece working process, turn into the electric energy through the difference in temperature, through being connected with drive power supply, directly feed back the input, not only realize the repeated recycle of energy, help the work efficiency of improvement semiconductor refrigeration piece in addition.

Description

A kind of semiconductor cold-warm fan

Technical field

This utility model belongs to a kind of fan of both cooling and heating, more particularly to one kind is freezed using semiconductor chilling plate Or heat, cold wind or warm braw is produced, while thermo-electric generation is carried out by thermo-electric generation chip, realizes the fan of energy regenerating.

Background technology

Semiconductor chilling plate, is also thermoelectric module, is a kind of heat pump.It is imitated using the peltier of semi-conducting material Should, when the galvanic couple that unidirectional current is connected into by two kinds of different semi-conducting materials, heat can be absorbed respectively at the two ends of galvanic couple With releasing heat, it is possible to achieve the purpose of refrigeration.It has cooling rate very fast, and installing space is little, noiselessness, vibrations, nothing Slide and rotary part, many merits such as environmental protection.Operationally, refrigeration and heating exist semiconductor chilling plate simultaneously, it is adaptable to Need with heating or the application conditions for freezing and occasion.As semiconductor chilling plate is driven by input current, therefore The size and Orientation of control input current/voltage, you can control cooling and warming power and direction.

Semiconductor temperature differential generating piece, then be the reversely operated principle using semiconductor chilling plate, by thermo-electric generation core The temperature difference that piece surface provides, generate electricity generation electric current.

As the effect of semiconductor chilling plate is constantly lifted, its application is also constantly being lifted.In actual applications, go out Having showed carries out producing the fan of cold wind or warm braw using semiconductor chilling plate, in the air cooler that notification number is CN105465931A, The first face for including the first fan and the semiconductor chilling plate on the first air channel is included, the wind in first air channel exists Discharge after flowing through the first face of the semiconductor chilling plate in the presence of first fan；The second wind is provided with second air channel Fan and the second face of the semiconductor chilling plate, the wind in second air channel flow through described half in the presence of second fan Discharge behind second face of conductor cooling piece, first face and the second face of the cooling piece, simultaneously for heating face, be simultaneously refrigeration Face.Although the patent simple structure, act not only as simple fan and use, be also used as cold wind or warm air fan is used, But there is also many deficiencies：First, the heat produced during refrigeration also causes use environment temperature to raise shadow to use environment discharge Ring refrigeration.Second, cold also the discharge to use environment produced when heating causes ambient temperature to decline impact heating effect.The Three, refrigeration intermittent fever is not recycled and is actually wasted.4th, cold when heating also be to waste without recycling.

Utility model content

This utility model is the above-mentioned deficiency of the prior art of solution, there is provided one kind can be freezed using semiconductor chilling plate Or heat, cold wind or warm braw is produced, and the intermittent fever turn electricity reduction hot driving that correspondingly freeze that generated electricity using thermo-electric generation chip The cold turn of electric fan for reducing cold discharge when heating.The utility model can not only improve refrigerating efficiency and effect can also reduce hot row Put, heating efficiency and effect can also be improved while reducing cold discharge.

This utility model is achieved by the following technical solution：

A kind of semiconductor cold-warm, including the first air channel, the first air channel includes the first of the first fan and semiconductor chilling plate Face, the wind in the first air channel are discharged after flowing through the first face of semiconductor chilling plate in the presence of the first fan；Also include second Air channel, is provided with the second face of the second fan and semiconductor chilling plate on the second air channel, the wind in second air channel is in the second wind Flow through in the presence of fan, cooling piece includes the first face and the second face, simultaneously for heating Face, is simultaneously chill surface, it is characterised in that the first transverse plane stationary heat exchangers of semiconductor chilling plate, in semiconductor refrigerating What the second transverse plane of piece was direct or indirect is fixed with thermo-electric generation chip.

Described heat exchanger is hollow prism, and the first transverse plane of semiconductor chilling plate is fixed on the prismatic surface.

Described hollow prism is internally provided with non-cross rib piece.

Described temperature exchanger includes heat pipe, radiating fin, and heat pipe one end is an even curface, and the surface is admittedly Surely there is the first end face of semiconductor chilling plate, another end surfaces of heat pipe are fixed with fin.

The first described fan forms a closed air-out passage, the air-out passage and hollow and annular support with heat exchanger It is internal to be connected.

Described hollow and annular support two ends are provided with air outlet.

Described thermo-electric generation chip is one or more layers overlaying structure.

Described one or more layers overlaying structure includes temperature-uniforming plate, and semiconductor temperature differential generating chip and temperature-uniforming plate are mutually solid It is fixed, one or more layers superposition.

Insulating barrier is provided with the semiconductor temperature differential generating chip and/or temperature-uniforming plate, is provided with insulating barrier and is at least wrapped Solderable position and electrical connection distribution lines layer are included.

The electrode of the semiconductor temperature differential generating chip is connected with each other with driving power supply.

The beneficial effects of the utility model：

By the setting of thermo-electric generation chip, can be hot or cold preferably by what is produced in the semiconductor chilling plate course of work Energy, is converted into electric energy by the temperature difference, by being connected with driving power supply, is directly fed back to input, not only realizes the weight of energy It is multiple to recycle, and help the work efficiency for improving semiconductor chilling plate.

Arranged by one or more layers overlaying structure of semiconductor temperature differential generating chip, carry out more efficient profit to the temperature difference With so as to further improve generating efficiency.Meanwhile, on the one hand the setting of temperature-uniforming plate and change of shape make cold or heat transfer more Uniformly, easier for installation, while the change of shape of temperature-uniforming plate, one or more layers that can make semiconductor temperature differential generating chip is folded Plus structure space distribution is more reasonable.Insulating barrier and circuit layer is provided with semiconductor temperature differential generating chip and/or temperature-uniforming plate, One or more layers overlaying structure of semiconductor temperature differential generating chip can be made more succinct, stablizing for structure not only can be improved Property, reduce parts cost, and production efficiency can greatly improve, and cost will further decrease.

The cold or heat that semiconductor chilling plate surface produces quickly can be conducted by heat exchanger, by increase and air-out Air in pipeline is quickly cooled down or is heated by the contact area of air in pipeline, effectively can be subtracted in closed conduit Ambient temperature effect outside education and correction for juvenile offenders road, prevents dust, small foreign body etc. from entering, keeps the cleaning inside pipeline.

Air-out passage is connected with hollow and annular support, on the one hand can guide the change in air outlet path and direction, another Aspect hollow and annular support can be oriented or rotate air-out with external other air exhausting structures, improve the use range of air-out.

This utility model is not only simple in structure as a kind of both cooling and heating fan, quiet, stable performance, and can be real The recycling of heat energy during existing fan work, so as to reduce power consumption, with good market application foreground.

Description of the drawings

Schematic appearances of the Fig. 1 for one preferred embodiment of utility model；

Perspective exploded views of the Fig. 2 for one preferred embodiment of utility model；

Perspective exploded views of the Fig. 3 for one preferred embodiment free temp exchanger of utility model.

Schematic appearances of the Fig. 4 for another preferred embodiment of utility model；

Perspective exploded views of the Fig. 5 for another preferred embodiment of utility model；

Perspective exploded views of the Fig. 6 for another preferred embodiment free temp exchanger of utility model.

Specific embodiment

This utility model is further illustrated with reference to embodiment.

Embodiment one

As shown in Figure 1, 2, be one preferred embodiment of this utility model outward appearance and structural decomposition diagram.Embodiment includes There are vane a1, ring support a2, the first fan a3, heat-exchange device a4, shell a5, driving power supply a6, the second fan a7, bottom The parts such as seat a8.Wherein, shell a5 is fixed with base a8, the surface of shell a5 is provided with button, such as switch, nature Wind, cold wind and warm braw etc., are fixed with driving power supply a6, wherein driving power supply a6 and shell a5 face buttons in the inside of shell a5 It is electrically connected, so that button can be controlled to driving power supply a6.The lower end of shell a5 is provided with numerous opening Hole a51, is fixed with heat-exchange device a4 in the inside of shell a5, is fixedly arranged above the first fan a3 in heat-exchange device a4, The both sides of heat-exchange device a4 are fixed with the second fan a7, and the position of wherein the second fan a7 is corresponding with perforate a51, in shell A5's is fixedly arranged above ring support a2, is being fixed with out vane a1, by above-mentioned in ring support a2 on two side through hole a21 Part is fixedly connected to form a complete fan.

First fan a3 and heat-exchange device a4 are internally formed a closed air-out passage in air supplying ring, air-out passage with it is hollow It is connected inside annular support a2, hollow and annular support a2 two ends is provided with through hole a21, with the hollow internal phase for going out vane a1 Even, by the prerotation vane of internal edge side, by wind to assigned direction and scope.

In the present embodiment, the air inlet of fan is mainly (face just relative with the button) perforate from behind shell a5 Air intake at a51, mainly by the second fan a7, from air-out at the lateral opening hole a51 of shell a5, and cold wind is mainly by first for hot blast Fan a3 blows, by ring support a2, finally from air-out at the hollow open for going out vane a1.In actual use, by changing Become the input current direction of heat-exchange device a4, make one end that semiconductor chilling plate was originally heated be freezed, and originally freezed End is heated, and so as to realize cold wind from air-out at the lateral opening hole a51 of shell a5, hot blast is finally from going out vane a1's Middle vacancy air-out.

As shown in figure 3, the perspective exploded view of the present embodiment heat-exchange device a4.Heat-exchange device a4 is mainly by heat friendship Parallel operation a9, semiconductor chilling plate a10, temperature-uniforming plate a11, thermo-electric generation chip a12, radiator a13 etc. are constituted.Wherein, quasiconductor First transverse plane stationary heat exchangers a9 of cooling piece a9, are fixed with temperature indirectly in second transverse plane of semiconductor chilling plate a10 Difference power-generating chip a12, i.e., first the second end face of semiconductor chilling plate a10 fixes temperature-uniforming plate a11 now, then temperature-uniforming plate a11's Thermo-electric generation chip a12 is fixed on surface, in the surface of thermo-electric generation chip a12 fixed heat sink a13 again, thermo-electric generation chip The electrode of a12 is connected with each other with driving power supply a6, and electricity is fed back to input directly, reduces middle energy storage device, so as to The loss for reducing multiple energy storage transmission and causing.

Heat-exchange device a4 Main Functions be by semiconductor chilling plate a9 produce it is cold or hot, make heat exchanger a9 inner chambers In air cooling or heating, the air in air channel is sent by fan a3, so as to realize cold wind or warm braw.In quasiconductor system In the course of work of cold a9, the first end face refrigeration of semiconductor chilling plate a9, fan output cold wind, the heat that second end face is produced Amount is generated electricity by thermo-electric generation chip a12；In the same manner, the first end face of semiconductor chilling plate a9 is heated, fan output warm braw, The cold temperature difference and environment between that second end face is produced generating electricity so that the more energy-conserving and environment-protective of fan work.

Heat exchanger a9 is hollow prism, and specially six prisms, first transverse plane of semiconductor chilling plate a9 are fixed on institute State prismatic surface, it is preferred to use semiconductor chilling plate a9 is fixed simultaneously in six prismatic surfaces, on the one hand can be more efficient Utilization space, on the other hand can improve refrigeration or the overall power for heating.For preferably improving conduction efficiency, increase temperature and hand over Contact of the hollow inside of parallel operation a9 with air, is internally provided with non-cross rib piece in hollow prism, so as to increase conducting surface Product, further improves conduction efficiency.Meanwhile, the inside of hollow prism is also provided with the structures such as groove, projection, improves and sky The liquid medium contact area that intracavity is put.And the non-cross connected circulation speed that can effectively improve internal gas flow of rib piece Rate, it is to avoid air-flow is obstructed due to a certain channel blockage.

Heat exchanger a9 is a kind of heat-conduction component, the cold or hot quick conduction that can be produced semiconductor chilling plate a10 And be uniformly distributed, the general material that makes is metal, composition metal or ceramics etc..Wherein the surface of temperature exchanger a9 be plane, Or polyhedron plane, if desired for the quantity for expanding installation quasiconductor power-generating chip, the general surface using polyhedron plane, shape Shape is hollow prism.

Thermo-electric generation chip a12 can be multiple-layer stacked structure, i.e., first fix temperature-uniforming plate on its surface, then on temperature-uniforming plate Fixed thermo-electric generation chip, makes to interfix between thermo-electric generation chip and temperature-uniforming plate, and one or more layers superposition, so that improve temperature Difference generating efficiency.Above-mentioned one or more layers overlaying structure, is mainly directly superimposed or thermo-electric generation sheet and samming by thermo-electric generation sheet Plate gauge then or it is irregular be overlapped mutually, for example：Thermo-electric generation sheet is staggeredly superimposed with temperature-uniforming plate, or is directly superimposed upon samming Plate surface etc..In the superposition number of plies, can be with root temperature difference size, and the distribution of installing space, with reference to factors such as price, productions, Carry out combined selection and consider one or more layers.

Temperature-uniforming plate a11 refers to that heat conductivity height, thermal resistance are little, can quickly by heat conduction and equally distributed thing after being heated Body or device, it is conventional for copper, heat pipe, aluminium alloy, phase-change material, carbon fiber, Graphene etc. in a kind of metal, it is nonmetallic or Device.In the present embodiment, temperature-uniforming plate a11 is a rectangular slab construction, and its shape can also be cuboid, pyramid Body, "L" shaped, " U " font structure etc., fix thermo-electric generation sheet and temperature-uniforming plate on its surface, so as to change thermo-electric generation chip It is distributed with the locus of other temperature-uniforming plates.The area of temperature-uniforming plate a11 is generally higher than thermo-electric generation chip, with following side Face advantage：On the one hand the conduction of heat of thermo-electric generation chip can be made more uniform efficient；On the other hand consider that production is installed Improved efficiency, be easy to form modular construction.

Surfaces such as temperature-uniforming plate a11, thermo-electric generation chip a12 is provided with insulating barrier, is provided with line layer on insulating barrier, adopts Make of enamel or anodic oxidation mode.Line layer is provided with insulating barrier, using printing, plating, compound or spraying method system Make.In general, can be preferably suitable for by the way of traditional printing, especially in surface strength and durability degree, be suitable for criticizing Quantify production.Line layer at least includes solderable position and electrical connection distribution, and thermo-electric generation chip is separately fixed at solderable Socket part position, the electrical connection between each thermo-electric generation chip are series connection and/or parallel connection, make each thermo-electric generation chip form electricity Gas is connected as entirety, unified output voltage and electric current.

On line layer in addition to solderable position and electrical connection distribution is at least included, electrostatic protection is also provided with One or more in the circuits such as circuit, rectification, pressure limiting, current control, to meet different function needs.

Fixation side between the parts such as semiconductor chilling plate a10, temperature-uniforming plate a11, thermo-electric generation chip a12, radiator a13 Formula is welding and/or adhesive solidification, and solidification bonding can be bondd using high heat conduction cement.Can pay the utmost attention to as needed into Row welding, such as surface are difficult to solder to due to material, can coat a metal level on surface by the mode such as plating, compound, spraying Welded again afterwards.By way of welding, its thermal contact resistance can be greatly reduced, and be favorably improved heat conduction efficiency, The another side production process is simple, is suitable for the large-scale production of mass, is favorably improved production efficiency, reduces production Cost.

Radiator a13 is aluminium alloy heat radiator, its Main Function be the heat of thermo-electric generation chip operation is dissipated or It is hot junction when working as thermo-electric generation, it is ensured that the Effec-tive Function of thermo-electric generation chip, in actual applications, can also adopts One or more combination in heat pipe with radiator fin, fan, water-cooled, fin radiator etc..

As shown in Figure 4,5, be one preferred embodiment of this utility model outward appearance and structural decomposition diagram.Embodiment includes Have vane b1, the first fan b2, the first wind channel tube b3, shell b4, the second fan b5, ventilation side cover b6, heat-exchange device b7, The parts such as the second wind channel tube b8, water storage tray b9, air supplying ring b10, base b11.Wherein, air supplying ring is fixed with base b11 B11, is fixed with water storage tray b9, the second wind channel tube b8 inside air supplying ring b11 successively, in the second wind channel tube b8 is fixed with hot friendship Changing device b7, is fixed with shell b4 on air supplying ring b11, and the both sides of shell b4 are fixed with the second fan b5 and ventilation side cover b6, It is in the central authorities of shell b4, corresponding with heat-exchange device b7 to be fixed with the first wind channel tube b3 and the first fan b2, in the upper of shell b4 End is fixed with vane b1, is fixedly connected to form a complete fan by above-mentioned part.

As shown in fig. 6, the perspective exploded view of the present embodiment heat-exchange device b7.Heat-exchange device b7 is mainly by first Fin b12, the first heat pipe b13, semiconductor chilling plate b14, temperature-uniforming plate b15, thermo-electric generation chip b16, the second heat pipe b17, Two fin b18 etc. are constituted.Wherein one end of the first heat pipe b13 is an even curface, and the surface is fixed with semiconductor refrigerating The first end face of piece b14, another end surfaces of the first heat pipe b13 are fixed with the first fin b12.By the first heat pipe b13 and The setting of one fin b12, quickly by the cold of semiconductor chilling plate b14 first end faces generation or can be thermally conducted to the first fin B12, expands the contact area with surrounding air by the first fin b12, improves refrigeration or the heating efficiency of air channel inner air.

Thermo-electric generation chip b16 is indirectly fixed with second transverse plane of semiconductor chilling plate b14, i.e., is first partly led now The second end face of body cooling piece b14 fixes temperature-uniforming plate b15, then fixes thermo-electric generation chip b16 on the surface of temperature-uniforming plate b15, The flat surface of second heat pipe b17 one end is fixed on the surface of thermo-electric generation chip b16 again, solid in another end surfaces of the second heat pipe Surely there is the second fin b12.

Second fin b12, the second fan b5 and ventilation side cover b6 three are located in same horizontal line, by the second fan b5 The heat of the second fin b12 is derived by the vent divulged information in side cover, or as the hot junction during thermo-electric generation Use.

This utility model more preferably specific embodiment, what those skilled in the art was carried out in the range of technical scheme Generally variations and alternatives are should be construed as being included in protection domain of the present utility model.

Claims (10)

1. a kind of semiconductor cold-warm is fanned, and including the first air channel, the first air channel includes the first of the first fan and semiconductor chilling plate Face, the wind in the first air channel are discharged after flowing through the first face of semiconductor chilling plate in the presence of the first fan；Also include second Air channel, is provided with the second face of the second fan and semiconductor chilling plate on the second air channel, the wind in second air channel is in the second wind Flow through in the presence of fan, cooling piece includes the first face and the second face, simultaneously for heating Face, is simultaneously chill surface, it is characterised in that the first transverse plane stationary heat exchangers of semiconductor chilling plate, in semiconductor refrigerating What the second transverse plane of piece was direct or indirect is fixed with thermo-electric generation chip.

2. a kind of semiconductor cold-warm according to claim 1 is fanned, it is characterised in that described heat exchanger is hollow rib Post, the first transverse plane of semiconductor chilling plate are fixed on the prismatic surface.

3. a kind of semiconductor cold-warm according to claim 2 is fanned, it is characterised in that described hollow prism is internally provided with Non-cross rib piece.

4. a kind of semiconductor cold-warm according to claim 1 is fanned, it is characterised in that also including temperature exchanger, described Temperature exchanger includes heat pipe, radiating fin, and heat pipe one end is an even curface, and the surface is fixed with semiconductor refrigerating The first end face of piece, another end surfaces of heat pipe are fixed with fin.

5. a kind of semiconductor cold-warm fan according to any one claim of claim 1-4, it is characterised in that described the One fan forms a closed air-out passage with heat exchanger, and the air-out passage is connected with hollow and annular internal stent.

6. a kind of semiconductor cold-warm according to claim 5 is fanned, it is characterised in that described hollow and annular support two ends set It is equipped with air outlet.

7. a kind of semiconductor cold-warm according to claim 5 is fanned, it is characterised in that described thermo-electric generation chip is one layer Or multiple-layer stacked structure.

8. a kind of semiconductor cold-warm according to claim 7 is fanned, it is characterised in that described one or more layers overlaying structure bag Temperature-uniforming plate is included, semiconductor temperature differential generating chip and temperature-uniforming plate interfix, one or more layers superposition.

9. a kind of semiconductor cold-warm according to claim 8 is fanned, it is characterised in that the semiconductor temperature differential generating chip And/or insulating barrier on temperature-uniforming plate, is provided with, it is provided with insulating barrier Road floor.

10. according to a kind of semiconductor cold-warm fan described in any one of claim 6-8, it is characterised in that the quasiconductor temperature The electrode of difference power-generating chip is connected with each other with driving power supply.