CN206029626U - Silicon chip attenuate emery wheel - Google Patents
Silicon chip attenuate emery wheel Download PDFInfo
- Publication number
- CN206029626U CN206029626U CN201620995260.1U CN201620995260U CN206029626U CN 206029626 U CN206029626 U CN 206029626U CN 201620995260 U CN201620995260 U CN 201620995260U CN 206029626 U CN206029626 U CN 206029626U
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- abrasive material
- wheel body
- utility
- model
- emery wheel
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Abstract
The utility model discloses a silicon chip attenuate emery wheel, including the wheel body, one side of wheel body is equipped with at least round abrasive material layer, and the abrasive material layer adopts the ceramic bond material to make, and the abrasive material layer includes multistage abrasive material piece, and two adjacent abrasive material lump formations have the space. The utility model discloses in, owing to adopt grinding excellent performance ceramic bond, so the grinding force is little, the grinding temperature is low, and is longe -lived, durable. And simultaneously, the utility model discloses a many rings of abrasive material layers, and each circle abrasive material layer is become by the abrasive material block group, is formed with the space between the abrasive material piece, through the space can be fine the heat dissipation, can prolong to a certain extent the utility model discloses an operating time to increase work efficiency and the space can also hold a large amount of sweeps, only need utilize the grinding fluid to wash the sweeps in the work engineering, can guarantee chip removal and heat dissipation function.
Description
Technical field
This utility model is related to a kind of wafer thinning emery wheel.
Background technology
Electronic product integrated circuit (silicon chip plate) system to the demand driving of high-performance, multi-functional, miniaturization and low cost
Make developing rapidly for the high speed development of technology, particularly portable type electronic product and propose higher and higher requirement to silicon chip,
On the premise of ensureing that electric performance stablity, cost decline, it is necessary to carry out thinning back side to silicon chip, and require that thinning silicon chip has high face
Type precision, without surface/sub-surface damage.
At present, obtain extensively should in the thinning back side processing of silicon chip using the superfine grinding technology of wafer thinning emery wheel
With, but the reduction of reduction and thickness thinning with die size and original thickness, superfine grinding is faced with huge
Challenge, be mainly reflected in：The abrasive material of traditional wafer thinning emery wheel is a monoblock, is easily generated heat, and work a period of time is just
Emery wheel is radiated, therefore, wafer thinning wheel grinding inefficiency, and it is easily caused processed silicon chip surface damage
Wound, or even the decline for causing plane precision.
Utility model content
The utility model discloses a kind of wafer thinning emery wheel, to solve at least one of above-mentioned technical problem.
According to one side of the present utility model, there is provided a kind of wafer thinning emery wheel, including wheel body, the side of wheel body sets
There is at least one circle abrasive material, abrasive material made using ceramic binder material, abrasive material includes multistage abrasive material block, adjacent two
Abrasive material block is formed with space.
In this utility model, as using grinding performance fine ceramics bonding agent, so grinding force is little, grinding temperature is low,
Life-span length is durable in use.Meanwhile, this utility model adopts multi-turn abrasive material, and each circle abrasive material is made up of abrasive material block, grinds
Space is formed between material block, radiating be can be very good by space, work of the present utility model can be extended to a certain extent
Make the time, so as to increase work efficiency, and space can also accommodate substantial amounts of scrap, it is only necessary to using mill in work process
Cut liquid to discharge scrap, you can ensure chip removal and heat sinking function.
In some embodiments, wheel body is rounded, and the centre of wheel body is provided with through hole.Thus, can be with the inwall of through hole
Female thread is set, so that wheel body can be fixed in the rotating shaft of external motor threadably.
In some embodiments, abrasive material has three circles, and the abrasive material block of two adjacent rings is staggered.Thus, using three circles
Abrasive material block arrangement staggeredly, more durable in use for the mode of individual pen arrangement, abrasive grain friction is less,
Surface polishing performance is more preferable.
In some embodiments, the side of wheel body is provided with step.Thus, step can facilitate peace of the present utility model
Dress, meanwhile, step can be reduced and use material, cost-effective.
In some embodiments, the opposite side of wheel body is provided with a circle groove, and groove is provided with inlet opening.Thus, it is possible to
To facilitate the very first time that grinding fluid is injected in inlet opening, so as to wash away abrasive material, cooling and chip removal.
Further, inlet opening inclines arrangement.
In some embodiments, wheel body is made using high density aluminum.Thus, wheel body made by high density aluminum
Can be in order to machining, while wheel body 1 is inherently more light.
Description of the drawings
Front views of the Fig. 1 for a kind of wafer thinning emery wheel of embodiment of this utility model.
Fig. 2 is cross-sectional view of the wafer thinning emery wheel along A-A directions shown in Fig. 1.
Specific embodiment
This utility model is described in further detail with specific embodiment below in conjunction with the accompanying drawings.
Fig. 1 and Fig. 2 schematically show a kind of structure of the wafer thinning emery wheel of embodiment of this utility model.
As depicted in figs. 1 and 2, a kind of wafer thinning emery wheel, including wheel body 1, in Fig. 1, the leading flank of wheel body 1 (or is referred to as
Front end face) on (left surface in Fig. 2, or the left side of Fig. 2) form at least one circle abrasive material 2, abrasive material 2 using ceramics
Make with reference to agent material, abrasive material 2 includes multistage abrasive material block 21, two adjacent abrasive material blocks 21 are formed with space 211.
As shown in figure 1, molding is fluted on the leading flank of wheel body 1, the abrasive material block 21 in abrasive material 2 is snapped in and fixed
It is in groove above-mentioned：At least one circle abrasive material 2 is formed on the leading flank of wheel body 1.
As shown in figure 1, wheel body 1 is preferably rounded, the centre of wheel body 1 is provided with through hole 11, can be with the inwall of through hole 11
Female thread is provided with, so that wheel body 1 can be fixed in the rotating shaft of external motor threadably.
In the present embodiment, abrasive material 2 preferably has three circles, and the abrasive material block 21 of two adjacent rings is staggered, staggered to be
Refer to, as shown in figure 1, one end of the abrasive material block 21 of the abrasive material block 21 and inner ring of outer ring is located at the interposition of the abrasive material block 21 of mesosphere
Place is put, is arranged using three circles abrasive material block 21 staggeredly, more durable in use, the abrasive grain for the mode of individual pen arrangement
Friction is less, and surface polishing performance is more preferable.In other embodiments, abrasive material 2 can also be four circles, six circles etc., can
Change the quantity of abrasive material 2 with according to different use demands.
As shown in Fig. 2 in the present embodiment, step 12 is formed on the leading flank of wheel body 1, step 12 is rounded.Step
12 can facilitate installation of the present utility model, meanwhile, step 12 can be reduced and use material, cost-effective.
As shown in Fig. 2 the right side (on the trailing flank of Fig. 1, being hidden) of wheel body 1 forms a circle groove 13, on groove 13
It is provided with inlet opening 131.Can will facilitate the very first time that grinding fluid is injected in inlet opening 131, so as to wash away abrasive material 2, drop
Gentle chip removal.Will grinding fluid when rushing in fluid apertures 131 and injecting, the side that grinding fluid enters into abrasive material 2 from inlet opening 131 is simultaneously
It is rinsed the scrap for having produced.
Further, inlet opening 131 inclines arrangement.Incline arrangement to refer to, the axis direction of inlet opening 131 and the axle of wheel body 1
In certain angle, the benefit of so arrangement is in line direction：As wheel body 1 can be rotated in grinding process, if feed liquor
The axis direction in hole 131 is identical with the axis direction of wheel body 1, then grinding fluid is due to subject to centrifugal forces, it is easy to from
Throw away in inlet opening 131, cause cleaning performance not good.
In the present embodiment, wheel body 1 is made using high density aluminum.Wheel body 1 made by high density aluminum can be so as to
In machining, while wheel body 1 is inherently more light.In other embodiments, wheel body 1 can also adopt high-molecular organic material
Make, made by high-molecular organic material, wheel body 1 can save cost of manufacture.
In this utility model, as abrasive material 2 can be using the excellent vitrified bond of grinding performance, so grinding force
Little, grinding temperature is low, and life-span length is durable in use.Meanwhile, this utility model adopts multi-turn abrasive material 2 (preferably three circles), and every
One circle abrasive material 2 is made up of abrasive material block 21 again, is formed with space 211, can be very good to dissipate by space 211 between abrasive material block 21
Heat, can extend the working time of the present utility model to a certain extent, and so as to increase work efficiency, and space 211 may be used also
To accommodate substantial amounts of scrap, it is only necessary in work process inject grinding fluid from inlet opening 131, then just scrap can be entered
Row is rinsed, so as to ensure chip removal and heat sinking function.
Above-described is only some embodiments of the present utility model.For the person of ordinary skill of the art,
On the premise of design being created without departing from this utility model, can also make some deformations and improvement, these belong to practical
New protection domain.
Claims (7)
1. a kind of wafer thinning emery wheel, it is characterised in that including wheel body (1), the side of wheel body (1) is provided with least one circle mill
The bed of material (2), abrasive material (2) are made using ceramic binder material, and described abrasive material (2) include multistage abrasive material block (21),
Two adjacent abrasive material blocks (21) are formed with space (211), and described space (211) are used for chip removal or row's grinding fluid.
2. wafer thinning emery wheel according to claim 1, it is characterised in that wheel body (1) is rounded, the wheel body
(1) centre is provided with through hole (11).
3. wafer thinning emery wheel according to claim 2, it is characterised in that abrasive material (2) have three circles, two adjacent rings
Abrasive material block (21) it is staggered.
4. wafer thinning emery wheel according to claim 3, it is characterised in that the side of wheel body (1) is provided with step
(12), step (12) are rounded.
5. the wafer thinning emery wheel according to any one of Claims 1 to 4, it is characterised in that wheel body (1) it is another
Side is provided with a circle groove (13), and groove (13) are provided with inlet opening (131).
6. wafer thinning emery wheel according to claim 5, it is characterised in that described inlet opening (131) incline arrangement.
7. wafer thinning emery wheel according to claim 6, it is characterised in that described wheel body (1) adopts high density aluminum
Make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620995260.1U CN206029626U (en) | 2016-08-30 | 2016-08-30 | Silicon chip attenuate emery wheel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620995260.1U CN206029626U (en) | 2016-08-30 | 2016-08-30 | Silicon chip attenuate emery wheel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206029626U true CN206029626U (en) | 2017-03-22 |
Family
ID=58302019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620995260.1U Expired - Fee Related CN206029626U (en) | 2016-08-30 | 2016-08-30 | Silicon chip attenuate emery wheel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206029626U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108453619A (en) * | 2017-12-30 | 2018-08-28 | 苏州赛尔科技有限公司 | The thinned grinding wheel of Sapphire Substrate |
| CN110722465A (en) * | 2019-11-06 | 2020-01-24 | 西安奕斯伟硅片技术有限公司 | Silicon chip thinning grinding wheel |
| CN110815070A (en) * | 2019-11-06 | 2020-02-21 | 西安奕斯伟硅片技术有限公司 | Grinding wheel |
| CN114274062A (en) * | 2021-12-27 | 2022-04-05 | 锦州神工半导体股份有限公司 | Grinding head for processing surface of silicon wafer and grinding method thereof |
-
2016
- 2016-08-30 CN CN201620995260.1U patent/CN206029626U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108453619A (en) * | 2017-12-30 | 2018-08-28 | 苏州赛尔科技有限公司 | The thinned grinding wheel of Sapphire Substrate |
| CN108453619B (en) * | 2017-12-30 | 2020-02-21 | 苏州赛尔科技有限公司 | Thinning grinding wheel for sapphire substrate |
| CN110871402A (en) * | 2017-12-30 | 2020-03-10 | 苏州赛尔科技有限公司 | Thinning grinding wheel for sapphire substrate |
| CN110871402B (en) * | 2017-12-30 | 2020-11-27 | 苏州赛尔科技有限公司 | Thinning grinding wheel for sapphire substrate |
| CN110722465A (en) * | 2019-11-06 | 2020-01-24 | 西安奕斯伟硅片技术有限公司 | Silicon chip thinning grinding wheel |
| CN110815070A (en) * | 2019-11-06 | 2020-02-21 | 西安奕斯伟硅片技术有限公司 | Grinding wheel |
| CN110815070B (en) * | 2019-11-06 | 2022-04-01 | 西安奕斯伟材料科技有限公司 | Grinding wheel |
| CN114274062A (en) * | 2021-12-27 | 2022-04-05 | 锦州神工半导体股份有限公司 | Grinding head for processing surface of silicon wafer and grinding method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170322 Termination date: 20170830 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |