CN206024251U - A kind of pad of the chip components and parts for camera module - Google Patents
A kind of pad of the chip components and parts for camera module Download PDFInfo
- Publication number
- CN206024251U CN206024251U CN201620916977.2U CN201620916977U CN206024251U CN 206024251 U CN206024251 U CN 206024251U CN 201620916977 U CN201620916977 U CN 201620916977U CN 206024251 U CN206024251 U CN 206024251U
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- Prior art keywords
- pad
- parts
- camera module
- chip components
- solder mask
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Abstract
The utility model discloses a kind of pad of the chip components and parts for camera module, including symmetrically arranged left pad and backhand welding disk, the left pad and backhand welding disk are constituted by square copper sheet, Gold plated Layer and solder mask, the upper surface of square copper sheet is coated with one layer of Gold plated Layer, the top of Gold plated Layer is coated with one layer of solder mask, wherein one quadrangle engraved structure of middle setting of solder mask.The utility model is by changing bond pad shapes and size on wiring board with the welding of 0201 chip SMD components, two original oblong pads are designed to fan-shaped pad, four corner tin cream amounts outside reducing, avoid due to exist more tin cream reflow oven be heated interior temperature contrast excessive produce drastically expand after occur blast splash, reduce reduce 0201 chip components and parts periphery produce tin sweat(ing) risk.
Description
Technical field
The utility model is related to a kind of pad, specifically a kind of pad of the chip components and parts for camera module.
Background technology
As application of the camera module in mobile phone is more and more wider, client is to quality requirements more and more higher.Shooting head mould
The volume of group is also less and less, more and more thinner, then chip components and parts are also more and more, more and more thinner, therefore small package
0201 chip paster application is more and more.During actual surface mount, the periphery of 0201 chip components and parts easily occurs
Tin sweat(ing), such tin sweat(ing) possibly cannot be detected in the test production of camera module, but after prolonged vibration
Will produce and release, black group of taking pictures is formed so as to drop to video sensing area, affect image quality of taking pictures, there is larger quality hidden
Suffer from.Due to being a cavity structure inside camera module, easily shelter evil people and countenance evil practices, after on wiring board, tin sweat(ing) occurs in pad peripheral
Cannot find in time, after coming off after extended periods and go on video sensing area surface, will result in the black group of appearance of taking pictures
Quality risk, it is necessary to from the generation that design and technique prevent tin sweat(ing) up.
Utility model content
The purpose of this utility model is to provide that one kind, for camera module, is reduced and reduces 0201 chip components and parts week
Side produces the pad of tin sweat(ing), to solve the problems, such as to propose in above-mentioned background technology.
For achieving the above object, the utility model provides following technical scheme：
A kind of pad of the chip components and parts for camera module, including symmetrically arranged left pad and backhand welding disk, institute
State left pad and backhand welding disk to be constituted by square copper sheet, Gold plated Layer and solder mask, the upper surface of square copper sheet be coated with one layer gold-plated
Layer, the top of Gold plated Layer are coated with one layer of solder mask, wherein one quadrangle engraved structure of middle setting of solder mask.
As further program of the utility model：The interior outside of the quadrangle engraved structure is parallel, and upper and lower both sides are
Arc-shaped side, the round dot of arc-shaped side are close to the long side midpoint in quadrangle engraved structure.
As further program of the utility model：On the left pad and backhand welding disk between quadrangle engraved structure most
Short spacing size is 0.300mm, and most long spacing size is 0.715mm.
As further program of the utility model：The distance between interior outside of the quadrangle engraved structure is
0.210mm.
As further program of the utility model：The maximum spacing of two arc-shaped sides up and down of the quadrangle engraved structure
Size is 0.350mm.
As further program of the utility model：Circle on the left pad on arc-shaped side and backhand welding disk between arc-shaped side
Heart spacing dimension is 0.46mm.
Compared with prior art, the beneficial effects of the utility model are：By change wiring board on 0201 chip paster
Two original oblong pads are designed to fan-shaped pad, four outside minimizing by the bond pad shapes and size of components and parts welding
Individual corner tin cream amount, it is to avoid due to exist more tin cream reflow oven be heated interior temperature contrast excessive produce drastically expand after send out
Raw blast is splashed, and reduces the risk for reducing that 0201 chip components and parts periphery produces tin sweat(ing).
Description of the drawings
Fig. 1 is structural representation of the present utility model.
Specific embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Embodiment in based on the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment for being obtained, belongs to the scope of the utility model protection.
Fig. 1 is referred to, in the utility model embodiment, a kind of pad of the chip components and parts for camera module, bag
Symmetrically arranged left pad 10 and backhand welding disk 20 is included, the left pad 10 is main by square copper sheet 110, Gold plated Layer 130 and welding resistance
Layer 120 is constituted, and the upper surface of square copper sheet 110 is coated with one layer of Gold plated Layer 130, and the top of Gold plated Layer 130 is coated with one layer of solder mask
120, wherein one quadrangle engraved structure of middle setting of solder mask 120.
In the same manner, backhand welding disk 20 is mainly made up of square copper sheet 210, Gold plated Layer 230 and solder mask 220, square copper sheet 210
Upper surface is coated with one layer of Gold plated Layer 230, and the top of Gold plated Layer 230 is coated with one layer of solder mask 220, the wherein centre of solder mask 220
One quadrangle engraved structure is set.
The interior outside of the quadrangle engraved structure is parallel, and upper and lower both sides are arc-shaped side, and the round dot of arc is close in four
While shape engraved structure long while midpoint.
The shortest spacing reference dimension of the solder mask 220 of the solder mask 120 and backhand welding disk 20 of the left pad 10 is
0.300mm, most long spacing reference dimension are 0.715mm, the solder mask 220 of the solder mask 120 and backhand welding disk 20 of left pad 10
Parallel edges distance reference is 0.210mm, between the circular arc maximum of the solder mask 220 of the solder mask 120 and backhand welding disk 20 of left pad 10
It is 0.350mm away from reference dimension, and the center of circle spacing reference dimension of two circular arcs is 0.46mm.
It is obvious to a person skilled in the art that the utility model is not limited to the details of above-mentioned one exemplary embodiment, and
And in the case of without departing substantially from spirit or essential attributes of the present utility model, can realize that this practicality is new in other specific forms
Type.Therefore, no matter from the point of view of which point, embodiment all should be regarded as exemplary, and is nonrestrictive, this practicality is new
The scope of type is by claims rather than described above is limited, it is intended that the equivalency fallen in claim is contained
All changes in justice and scope are included in the utility model.Any reference in claim should not be considered as restriction
Involved claim.
Moreover, it will be appreciated that although this specification is been described by according to embodiment, not each embodiment is only wrapped
Contain an independent technical scheme, this narrating mode of specification is only that those skilled in the art should for clarity
Using specification as an entirety, the technical scheme in each embodiment can also form those skilled in the art through appropriately combined
Understandable other embodiment.
Claims (6)
1. a kind of pad of the chip components and parts for camera module, including symmetrically arranged left pad and backhand welding disk, which is special
Levy and be, the left pad and backhand welding disk are constituted by square copper sheet, Gold plated Layer and solder mask, and the upper surface of square copper sheet is coated with
One layer of Gold plated Layer, the top of Gold plated Layer are coated with one layer of solder mask, wherein one quadrangle engraved structure of middle setting of solder mask.
2. the pad of a kind of chip components and parts for camera module according to claim 1, it is characterised in that described
The interior outside of quadrangle engraved structure is parallel, and upper and lower both sides are arc-shaped side, and the round dot of arc-shaped side is close to tie in quadrangle hollow out
The long side midpoint of structure.
3. the pad of a kind of chip components and parts for camera module according to claim 1, it is characterised in that described
Shortest spacing size on left pad and backhand welding disk between quadrangle engraved structure is 0.300mm, and most long spacing size is
0.715mm.
4. the pad of a kind of chip components and parts for camera module according to claim 2, it is characterised in that described
The distance between interior outside of quadrangle engraved structure is 0.210mm.
5. the pad of a kind of chip components and parts for camera module according to claim 2, it is characterised in that described
The maximum spacing size of two arc-shaped sides up and down of quadrangle engraved structure is 0.350mm.
6. the pad of a kind of chip components and parts for camera module according to claim 3, it is characterised in that described
Center of circle spacing dimension on left pad on arc-shaped side and backhand welding disk between arc-shaped side is 0.46mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620916977.2U CN206024251U (en) | 2016-08-23 | 2016-08-23 | A kind of pad of the chip components and parts for camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620916977.2U CN206024251U (en) | 2016-08-23 | 2016-08-23 | A kind of pad of the chip components and parts for camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206024251U true CN206024251U (en) | 2017-03-15 |
Family
ID=58250364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620916977.2U Active CN206024251U (en) | 2016-08-23 | 2016-08-23 | A kind of pad of the chip components and parts for camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206024251U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110446339A (en) * | 2019-06-11 | 2019-11-12 | 重庆惠科金渝光电科技有限公司 | A kind of circuit board and display device |
| CN110996232A (en) * | 2019-11-22 | 2020-04-10 | 歌尔股份有限公司 | Sound generating device monomer and electronic equipment |
-
2016
- 2016-08-23 CN CN201620916977.2U patent/CN206024251U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110446339A (en) * | 2019-06-11 | 2019-11-12 | 重庆惠科金渝光电科技有限公司 | A kind of circuit board and display device |
| CN110446339B (en) * | 2019-06-11 | 2021-12-24 | 重庆惠科金渝光电科技有限公司 | Circuit board and display device |
| CN110996232A (en) * | 2019-11-22 | 2020-04-10 | 歌尔股份有限公司 | Sound generating device monomer and electronic equipment |
| CN110996232B (en) * | 2019-11-22 | 2021-01-15 | 歌尔股份有限公司 | Sound generating device monomer and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200927 Address after: 336600 east side of East Outer Ring Road (Chengdong Industrial Park), Fenyi County, Xinyu City, Jiangxi Province Patentee after: Jiangxi Shengtai precision optics Co., Ltd Address before: 336600 Jiangxi province Xinyu City Fenyi County Industrial Park Patentee before: JIANGXI SHENGTAI OPTICAL Co.,Ltd. |