CN206020343U - Ultrasonic probe gong type chip and the probe using ultrasonic probe gong type chip - Google Patents
Ultrasonic probe gong type chip and the probe using ultrasonic probe gong type chip Download PDFInfo
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- CN206020343U CN206020343U CN201621053541.1U CN201621053541U CN206020343U CN 206020343 U CN206020343 U CN 206020343U CN 201621053541 U CN201621053541 U CN 201621053541U CN 206020343 U CN206020343 U CN 206020343U
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Abstract
The utility model discloses a kind of ultrasonic probe gong type chip and using the probe of ultrasonic probe gong type chip, the ultrasonic probe gong type chip includes the dish-type chip of Integral design and the annular chip on one side end face of dish-type chip, the external diameter of the annular chip is equal to the diameter of the dish-type chip, and the effective area of the dish-type chip is less than 1000mm2.The utility model can be on the basis of existing probe by the shape for changing chip, so that flaw detection sensitivity is improved, the profile of ultrasonic probe gong type chip is gong type so that vibrations are more concentrated, and the propagation without edge vibrations, the sensitivity of flaw detection will be greatly improved.
Description
Technical field
The utility model is related to ultrasonic probe field, and specifically a kind of ultrasonic probe gong type chip and use are super
The probe of sonic probe gong type chip.
Background technology
Ultrasonic probe is the device for producing with receive ultrasonic wave, is the most important components for constituting ultrasonic testing system
One of.The performance of ultrasonic probe directly affects the characteristic of launched ultrasonic wave, has influence on the ability of ultrasonic testing system.
Can produce in the material at present ultrasonic wave mode have multiple, its principle all refer to by the energy of other forms turn
The vibration energy of ultrasonic wave is changed to, ultrasonic probe the most frequently used and that ultrasound detection instrument is used in combination in ultrasound detection,
Be using material piezo-electric effect realize electroacoustic energy conversion PZT (piezoelectric transducer).Critical component in this kind of probe is piezo crystals
Piece, is also called PZT (piezoelectric transducer), is a monocrystalline or polycrystal thin slice or film with piezoelectric property, and its effect is by electricity
Acoustic energy can be converted to, convert acoustic energy into electric energy.
At present the fundamental type of ultrasonic probe and composition include normal probe as shown in Figure 1 (joint 1`, shell 2`,
Match somebody with somebody coil 3`, damping block 4`, chip 5`, diaphragm 6`) and angle probe (joint 1``, shell 2``, coupling as shown in Figure 2
Coil 3``, damping block 4``, chip 5``, wedge 6``, sound-absorbing material 7``).1st, normal probe
Normal probe is used for launching and receiving compressional wave, therefore is also called longitudinal wave probe, and normal probe is mainly used in detection and test surface
Flaw detection of parallel defect, such as sheet material, foundry goods and forging etc., normal probe is mainly by chip, fast damping, matched coil, sound absorption material
Material and diaphragm and shell etc. are constituted.
(1) chip
Chip is made with piezo-electric crystal, also referred to as piezoelectric chip, and its effect is with inverse piezoelectric effect transmitting ultrasound
Ripple, and receive ultrasonic wave (echo) with its direct piezoelectric effect, piezoelectric chip is most important element in probe, and the performance of chip is determined
Determine the performance that pops one's head in,
(2) damping block and sound-absorbing material
Damping block is to stick to the block object behind chip with damping action, usually by epoxy resin and tungsten powder etc.
It is made into by a certain percentage.First of damping block effect is that the vibrations to piezoelectric chip play damping action, its two be absorb brilliant
Ultrasonic wave of the piece to its back side emitter, which three is that chip is played a supportive role.Chip produces vibrations under high electric field pulse excitation
Afterwards, due to the effect of inertia, shake and be not easy to stop within a period of time, so that pulse broadens, this lasting vibrations
Acceptance of the chip to echo-signal being hindered, the echo-signal in this period being prevented from manifesting, Depth resolution reduces.Damping
Block can increase the shock damping of chip, reduce Qm values, so as to shorten the vibrations time of chip, the chip for shaking is returned as early as possible
Inactive state is arrived again, to be conducive to reception of the chip to echo-signal.The damping action of damping block is bigger, and the width of pulse is got over
Narrow, resolving power is higher, but, sensitivity can decline, and therefore, can not covet excessive damping.Chip transmitting is super
Sound wave be to chip two sides and meanwhile transmitting, ultrasonic wave from chip to its back side emitter return chip after can produce noise signal,
In order to absorb the ultrasonic wave of chip back surface, it is the larger sound-absorbing material of attenuation coefficient that damping block is required.
(3) diaphragm
Piezoelectric ceramic wafer is generally all very crisp, is directly swept along surface of the work when chip is made by the way of directly contact
When looking into, silver coating can be worn quickly, and chip is easy to damage.Therefore one layer of thin diaphragm can be adhered to before chip, to protect
Shield chip and electrode layer are not worn or break, and on the other hand, can also improve the coupling effect of probe and workpiece.Diaphragm has
Soft, hard two kinds, hard protecting film is made with aluminum oxide, sapphire, boron carbide, tungsten carbide, plastic or other material containing silica sand.It is applied to and visits
The smoother workpiece in surface is surveyed, the detection to rough surface workpiece, frequently with the removable soft guarantor that polyurethane plastics etc. are made
Cuticula, to improve coupling effect.Diaphragm increases can Initial pulse width, and resolving power is deteriorated, sensitivity decrease, in this respect, firmly
Diaphragm is more serious than soft diaphragm.Requirement to diaphragm is：Intensity is high, and wearability is good, and attenuation coefficient is little, and thickness is appropriate,
Sound translative performance is good.
(4) matched coil
In addition to the special probe such as high-frequency narrow-pulse, general probe is provided with matched coil, and matched coil is used for adjusting probe
In electrical impedance coupling so that probe have optimal sensitivity and spectral characteristic under centre frequency.(5) probing shell
Probing shell has metal material to make, and also has plastic or other material to make, and metallic material product will consider can not
Get rusty, plastic material products will consider there is certain intensity.
2nd, angle probe
The angle probe and normal probe main distinction in structure is that have wedge without diaphragm, and the Main Function of wedge is
The chip for making and surface of the work shape in an angle, to ensure that the ultrasonic wave of chip transmitting oblique is mapped to according to the incidence angle for setting
Surface of the work, so that obtain shape transformation required for producing.Simultaneously as wedge is before the chip, chip not with workpiece
Directly contact, therefore do not needing diaphragm.
The selection of wedge material must take into its workability, appropriate attenuation coefficient, and factors such as the acoustical coupling of workpiece,
It is also contemplated that whether its velocity of sound can be adapted to produce required refraction angle and wave mode within the workpiece.Such as to transverse wave double-bevel detector, be
Pure shear wave is obtained in workpiece, it is desirable to which the longitudinal wave velocity in wedge is necessarily less than the longitudinal wave velocity in workpiece, be to obtain within the workpiece
Shear wave at any angle, it is desirable to which the longitudinal wave velocity of wedge is necessarily less than the transverse wave velocity in workpiece.
The external form and size design of wedge is extremely important, first, answers the angle of careful design wedge just to can guarantee that and obtains institute
The refraction wave mode for needing and refraction angle, secondly, should cause the sound wave of multiple reflections of the ultrasonic wave in wedge not return again to chip,
So as to reduce or eliminate noise, it is that this has made anechoic trap, drilling etc. on some wedges, or wedge is made cattle horn shape,
Purpose is exactly that the sound scattering for making multiple reflections in voussoir is fallen, and makes the sound wave of return chip as few as possible, so as to reduce clutter pair
The interference of detection.
3rd, other kinds of ultrasonic probe
On the basis of compressional wave normal probe and transverse wave double-bevel detector, the demand according to flaw detection has been produced ultrasound miscellaneous and has been visited
Head, such as compressional wave class have twin crystal compressional wave normal probe, twin crystal longitudinal wave oblique probe, shear wave class to have twin crystal transverse wave double-bevel detector, other types to have
Surface wave probe, creeping wave probe, phased array probe etc., this angle probe all be unable to do without chip.
Current ultrasonic examination, the chip of probe and version caused pop one's head in sensitivity, sound field symmetrical
Property, the characteristic of resolving power, signal to noise ratio etc., reached the high level of comparison.Normal probe reduces the miscellaneous of probe by damping block
Ripple, angle probe reduce clutter by the shape of damping block and wedge, even if chip has selected new piezoelectric and more preferably
Matched coil, such wafer format also be unable to do without damping block.Requirement to probe performance at present, can only be showing according to probe
Shape requires that, if allowing sensitivity to improve again, the clutter of probe is occurred as soon as to greatest extent.
As long as shown in figure 3, the 1``` vibrations of probe chip, he will produce surface wave, compressional wave and shear wave on surface, these
Ripple travels to the edge of probe chip and will pass through edge to surrounding propagation, if echo is got on chip, just quite gets to scarce
Fall into equally, according to Huygen's principle as shown in figure 4, the edge of chip is exactly a new wave source, the wave direction surrounding of generation is propagated,
The vibrations that the echo being reflected in chip is produced equally also are being propagated to Waffer edge, and (a and b refer to the side of chip to such as Fig. 5
Edge) shown in, a part of damped piece of the shock wave of these impact flaw detection sensitivities is sponged, if be predominantly absorbed entirely, flaw detection
Sensitivity will be very low, if do not sponged, when sensitivity is improved, clutter occurs again.So current sensor sensitivity is not
Can be too high.Because the various ripples of the marginal existence of probe chip, and ripple is passed to surrounding by edge, and then bring to flaw detection
Very big impact.
Utility model content
According to technical problem set forth above, and a kind of ultrasonic probe gong type chip is provided and uses ultrasonic probe gong
The probe of type chip.The technological means that the utility model is adopted is as follows：
A kind of ultrasonic probe gong type chip, it is characterised in that：Dish-type chip including Integral design and it is located at the disk
Annular chip on one side end face of type chip, i.e., described dish-type chip and the annular chip are integrated design, the annular
The external diameter of chip is equal to the diameter of the dish-type chip.
The effective area of the dish-type chip is less than 1000mm2.
The invention discloses a kind of normal probe using above-mentioned ultrasonic probe gong type chip, it is characterised in that：Including
Shell, the joint being located on the shell, the damping block for being located at the inside the shell and for avoiding the ultrasonic probe gong type
Chip and the diaphragm of workpiece directly contact, the joint are connected with the ultrasonic probe gong type chip by matched coil,
The dish-type chip is located between the annular chip and the diaphragm.
The invention discloses a kind of angle probe using above-mentioned ultrasonic probe gong type chip, it is characterised in that：Including
Shell, the joint being located on the shell, the sound-absorbing material and wedge for being located at the inside the shell, the joint pass through matched coil
Be connected with the ultrasonic probe gong type chip, the dish-type chip be located at the annular chip and the wedge tapered plane it
Between.
The invention discloses a kind of twin crystal compressional wave normal probe using above-mentioned ultrasonic probe gong type chip.
The invention discloses a kind of twin crystal longitudinal wave oblique probe using above-mentioned ultrasonic probe gong type chip.
The invention discloses a kind of twin crystal transverse wave double-bevel detector using above-mentioned ultrasonic probe gong type chip.
The invention discloses a kind of surface wave probe using above-mentioned ultrasonic probe gong type chip.
The invention discloses a kind of creeping wave probe using above-mentioned ultrasonic probe gong type chip.
The invention discloses a kind of phased array probe using above-mentioned ultrasonic probe gong type chip.
Compared with prior art, the utility model can be made on the basis of existing probe by the shape for changing chip
Obtain flaw detection sensitivity to be improved, the profile of ultrasonic probe gong type chip is gong type so that vibrations are more concentrated, and without
The propagation of edge vibrations, the sensitivity of flaw detection will be greatly improved.
The utility model can be widely popularized in fields such as ultrasonic probes for the foregoing reasons.
Description of the drawings
With reference to the accompanying drawings and detailed description the utility model is described in further detail.
Fig. 1 is the structural representation of existing normal probe.
Fig. 2 is the structural representation of existing angle probe.
Fig. 3 is the mode of propagation for producing compressional wave, shear wave and surface wave when existing chip vibrates.
Fig. 4 is the mode of propagation that the wave direction surrounding that existing Waffer edge is produced is propagated.
Fig. 5 is the clutter schematic diagram that existing angle probe is produced.
Fig. 6 is the sectional view of ultrasonic probe gong type chip in embodiment of the present utility model 1 and embodiment 2.
Fig. 7 is the structural representation of normal probe in embodiment of the present utility model 1.
Fig. 8 is the structural representation of angle probe in embodiment of the present utility model 2.
Specific embodiment
Embodiment 1
As shown in fig. 7, a kind of normal probe, including shell 1, the joint 2 being located on the shell 1, is located in the shell 1
Damping block 3 and the diaphragm 5 for avoiding ultrasonic probe gong type chip 4 and workpiece directly contact, the joint 2 by
It is connected with the ultrasonic probe gong type chip 4 with coil 6.
As shown in fig. 6, the ultrasonic probe gong type chip 4, dish-type chip 4-1 including Integral design and it is located at described
The external diameter of the annular chip 4-2 on mono- side end faces of dish-type chip 4-1, the annular chip 4-2 is equal to the dish-type chip 4-1's
Diameter, the effective area of the dish-type chip 4-1 are less than 1000mm2.The dish-type chip 4-1 is located at the annular chip 4-2
And the diaphragm 5 between.
Embodiment 2
As shown in figure 8, a kind of angle probe, including shell 7, the joint 8 being located on the shell 7, is located in the shell 7
Sound-absorbing material 9 and wedge 10, the joint 8 is connected with ultrasonic probe gong type chip 4 by matched coil 11.
As shown in fig. 6, the ultrasonic probe gong type chip 4, dish-type chip 4-1 including Integral design and it is located at described
The external diameter of the annular chip 4-2 on mono- side end faces of dish-type chip 4-1, the annular chip 4-2 is equal to the dish-type chip 4-1's
Diameter, the effective area of the dish-type chip 4-1 are less than 1000mm2.The dish-type chip 4-1 is located at the annular chip 4-2
And the tapered plane of the wedge 10 between.
The above, only the utility model preferably specific embodiment, but protection domain of the present utility model is not
Be confined to this, any those familiar with the art in the technical scope that the utility model is disclosed, according to this practicality
New technical scheme and its utility model design in addition equivalent or change, should all cover in protection model of the present utility model
Within enclosing.
Claims (10)
1. a kind of ultrasonic probe gong type chip, it is characterised in that：Dish-type chip including Integral design and it is located at the dish-type
Annular chip on one side end face of chip, the external diameter of the annular chip are equal to the diameter of the dish-type chip.
2. a kind of ultrasonic probe gong type chip according to claim 1, it is characterised in that：The dish-type chip effective
Area is less than 1000mm2.
3. a kind of usage right requires the normal probe of the ultrasonic probe gong type chip described in 1 or 2, it is characterised in that：Including outer
Shell, the joint being located on the shell, the damping block for being located at the inside the shell and for avoiding the ultrasonic probe gong type brilliant
Piece and the diaphragm of workpiece directly contact, the joint are connected with the ultrasonic probe gong type chip by matched coil, institute
State dish-type chip to be located between the annular chip and the diaphragm.
4. a kind of usage right requires the angle probe of the ultrasonic probe gong type chip described in 1 or 2, it is characterised in that：Including outer
Shell, be located at the shell on joint, be located at the inside the shell sound-absorbing material and wedge, the joint by matched coil with
Ultrasonic probe gong type chip connection, the dish-type chip be located at the annular chip and the wedge tapered plane it
Between.
5. a kind of usage right requires the twin crystal compressional wave normal probe of the ultrasonic probe gong type chip described in 1 or 2.
6. a kind of usage right requires the twin crystal longitudinal wave oblique probe of the ultrasonic probe gong type chip described in 1 or 2.
7. a kind of usage right requires the twin crystal transverse wave double-bevel detector of the ultrasonic probe gong type chip described in 1 or 2.
8. a kind of usage right requires the surface wave probe of the ultrasonic probe gong type chip described in 1 or 2.
9. a kind of usage right requires the creeping wave probe of the ultrasonic probe gong type chip described in 1 or 2.
10. a kind of usage right requires the phased array probe of the ultrasonic probe gong type chip described in 1 or 2.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621053541.1U CN206020343U (en) | 2016-09-13 | 2016-09-13 | Ultrasonic probe gong type chip and the probe using ultrasonic probe gong type chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621053541.1U CN206020343U (en) | 2016-09-13 | 2016-09-13 | Ultrasonic probe gong type chip and the probe using ultrasonic probe gong type chip |
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| CN206020343U true CN206020343U (en) | 2017-03-15 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107192601A (en) * | 2017-05-23 | 2017-09-22 | 中国科学院重庆绿色智能技术研究院 | The synchronous detecting system of a kind of rock micro-mechanical model and sound mechanics |
| CN108088912A (en) * | 2018-01-04 | 2018-05-29 | 常州市常超电子研究所有限公司 | Diffraction reflection combination method is popped one's head in |
| CN111141824A (en) * | 2020-04-07 | 2020-05-12 | 西南交通大学 | Intelligent bridge steel structure crack detection system and method based on ultrasonic guided waves |
-
2016
- 2016-09-13 CN CN201621053541.1U patent/CN206020343U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107192601A (en) * | 2017-05-23 | 2017-09-22 | 中国科学院重庆绿色智能技术研究院 | The synchronous detecting system of a kind of rock micro-mechanical model and sound mechanics |
| CN108088912A (en) * | 2018-01-04 | 2018-05-29 | 常州市常超电子研究所有限公司 | Diffraction reflection combination method is popped one's head in |
| CN111141824A (en) * | 2020-04-07 | 2020-05-12 | 西南交通大学 | Intelligent bridge steel structure crack detection system and method based on ultrasonic guided waves |
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