CN205960032U - Extranal packing body and power storage device for power storage device - Google Patents

Extranal packing body and power storage device for power storage device Download PDF

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Publication number
CN205960032U
CN205960032U CN201620348899.0U CN201620348899U CN205960032U CN 205960032 U CN205960032 U CN 205960032U CN 201620348899 U CN201620348899 U CN 201620348899U CN 205960032 U CN205960032 U CN 205960032U
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layer
metal
face
mentioned
storage device
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南谷广治
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Lishennoco Packaging Co ltd
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Showa Denko Packaging Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings; Jackets or wrappings
    • H01M50/116Primary casings; Jackets or wrappings characterised by the material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings; Jackets or wrappings
    • H01M50/116Primary casings; Jackets or wrappings characterised by the material
    • H01M50/124Primary casings; Jackets or wrappings characterised by the material having a layered structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/04Construction or manufacture in general
    • H01M10/0413Large-sized flat cells or batteries for motive or stationary systems with plate-like electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/04Construction or manufacture in general
    • H01M10/0436Small-sized flat cells or batteries for portable equipment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/05Accumulators with non-aqueous electrolyte
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • H01M4/64Carriers or collectors
    • H01M4/66Selection of materials
    • H01M4/661Metal or alloys, e.g. alloy coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings; Jackets or wrappings
    • H01M50/116Primary casings; Jackets or wrappings characterised by the material
    • H01M50/117Inorganic material
    • H01M50/119Metals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings; Jackets or wrappings
    • H01M50/116Primary casings; Jackets or wrappings characterised by the material
    • H01M50/121Organic material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings; Jackets or wrappings
    • H01M50/131Primary casings; Jackets or wrappings characterised by physical properties, e.g. gas permeability, size or heat resistance
    • H01M50/133Thickness
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings; Jackets or wrappings
    • H01M50/14Primary casings; Jackets or wrappings for protecting against damage caused by external factors
    • H01M50/145Primary casings; Jackets or wrappings for protecting against damage caused by external factors for protecting against corrosion
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/409Separators, membranes or diaphragms characterised by the material
    • H01M50/449Separators, membranes or diaphragms characterised by the material having a layered structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50Current conducting connections for cells or batteries
    • H01M50/543Terminals
    • H01M50/545Terminals formed by the casing of the cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Sealing Battery Cases Or Jackets (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Secondary Cells (AREA)

Abstract

The utility model relates to a do not need utmost point ear just can switch on to make simultaneously the extranal packing body and power storage device for power storage device who exposes partial corrosion resistance (anti electrolyte performance etc. ) improvement on the metal level of the constitution extranal packing body that becomes problem point. The utility model discloses a structure of the extranal packing body is to have: thermoplastic resin layer (4) of metal level (2) and a range upon range of face at this metal level (2), conductive part (56) that by thermoplastic resin layer are covered are provided with not in the part of a face of metal level (2), as above -mentioned metal level (2), use (A) to implement the metal forming that the plating was handled at the single face at least, (B, ) by covering NULL's metal forming, (C, ) at least in the range upon range of metal forming that has the conductive metal oxide of single face, perhaps (D) is at least in the range upon range of metal forming that has the electric conductivity overburden that contains electrically conductive auxiliary agent and binder of single face.

Description

Electrical storage device external packing body and electrical storage device
Technical field
This utility model is related to one kind and stores as mobile device accumulator, storage battery loaded onto vehicle, regeneration energy regenerating Electrical storage device and the external packing body for such electrical storage device that battery, capacitor (electric capacity) etc. are used.
Background technology
In recent years, along with the slimming of the portable sets such as smart mobile phone, tablet terminal, lightweight, as being equipped on The lithium rechargeable battery of these portable sets, the housing material of lighium polymer secondary battery, using double in metal forming The cascade type housing material of resin film is pasted with face to replace conventional canister.Equally also research has and will employ The capacitor of cascade type housing material, electric capacity etc. are installed on the technology of IC-card, electronic equipment as stand-by power supply.
As resin film is pasted onto metal forming two-sided on cascade type housing material in be accommodated with battery The battery of main part, is known to following battery, and this battery is, for example, to receive in the airtight housing material being made up of flexible membrane Receiving positive pole stacked together, shim, negative pole and the battery being made up of electrolyte constitutes the card type battery of material, on State housing material using the stacked film (reference that thermoplastic resin, metal forming and thermoplastic resin are stacked gradually and constituted Patent documentation 1).
Patent documentation 1:Japanese Unexamined Patent Publication 2005-56854 publication
But, in the battery described in patent documentation 1, since it is desired that the lug line (lead) that setting is derived from electrode, So there is a problem of increasing corresponding parts count.Additionally, since it is desired that making this lug line be fixed on cascade type outer package material The heat seal lands of the periphery of material, so there is also increase corresponding manufacturing man-hours and spending more the problem taken time and energy.
Utility model content
This utility model in view of background of related and make, its object is to provide a kind of electrical storage device and electrical storage device With external packing body, this electrical storage device and electrical storage device external packing body do not need lug just can be energized, and become simultaneously The corrosion resistance (anti-electrolyte capability etc.) of the expose portion on the metal level of composition external packing body of problem points improves.
In order to reach above-mentioned purpose, this utility model provides technical scheme below.
[1] a kind of electrical storage device external packing body is it is characterised in that have:
Metal level and be laminated in this metal level a face thermoplastic resin layer,
In the conductive part being partially provided with not covered by described thermoplastic resin layer in a face of described metal level,
As described metal level, (A) can be used at least to implement the metal forming of plating process, (B) by covering in one side The metal forming that material is constituted, (C) are at least laminated with the metal forming of conductive metal oxide or (D) at least in list in one side Surface layer is laminated with comprising the metal forming of the conductive cover layer of conductive auxiliary agent and binding agent.
[2] a kind of electrical storage device external packing body is it is characterised in that have:
Metal level and be laminated in this metal level a face thermoplastic resin layer,
In the conductive part being partially provided with not covered by described thermoplastic resin layer in a face of described metal level,
As described metal level, (A) can be used at least to implement plating on the face by described thermoplastic resin layer side Process metal forming, (B) be made up of clad material, at least on the face by described thermoplastic resin layer side, be configured with anti-electrolysis The metal forming of the good metal material of matter performance, (C) are at least laminated with conductive gold on the face by described thermoplastic resin layer side Belong to the metal forming of oxide or (D) be at least laminated with the face by described thermoplastic resin layer side comprise conductive auxiliary agent and The metal forming of the conductive cover layer of binding agent.
[3] the electrical storage device external packing body according to the above-mentioned first or second technical scheme, in described metal level Another face on be laminated insulating resin film, and another face of described metal level local setting by described insulation tree The portion of terminal that adipose membrane covers.
[4] a kind of electrical storage device is it is characterised in that have:
The electrical storage device external packing body described in any one of above-mentioned 1st~3 technical scheme of two panels;
Apparatus main body portion,
To make the space described in two panels between external packing body configuring in the way of thermoplastic resin layer each other is facing Middle storage described device main part, the conductive part of the electrode of described device main part and described external packing body connects, and by two The thermoplastic resin layer of the circumference of external packing body described in piece is bonded with each other and is packaged.
Can also be a kind of electrical storage device it is characterised in that having:
Electrical storage device external packing body described in two panels technique scheme 1 or 2;
Apparatus main body portion,
To make the space described in two panels between external packing body configuring in the way of thermoplastic resin layer each other is facing Middle storage described device main part, the negative pole of described device main part is connected with the conductive part of the external packing body of described side, institute The positive pole stating apparatus main body portion is connected with the conductive part of the external packing body of described opposite side, described in being connected with described negative pole The metal level of the external packing body of side, can use and be provided with Ni plating on the face at least leaning on described device main part side of Cu paper tinsel The metal level of coating, and the thermoplastic resin layer of the circumference of the external packing body described in two panels is bonded with each other is sealed Dress.
Furthermore, it is possible to be that the thickness of described Cu paper tinsel is 15 μm~155 μm, the thickness of described Ni plating layer is 0.5 μm~5 μ m.
[5] a kind of electrical storage device is it is characterised in that have:
Positive pole portion, its positive pole work comprising the first metal layer and being laminated in the regional area in a face of this first metal layer Property material layer;
Negative pole portion, its negative pole work comprising second metal layer and being laminated in the regional area in a face of this second metal layer Property material layer;
Shim, it configures between described positive pole portion and described negative pole portion,
It is configured with described positive electrode active material layer between described the first metal layer and described shim, in described second gold medal Belong to and be configured with described negative electrode active material layer between layer and described shim,
As described the first metal layer and described second metal layer, use (A) at least on the face by described shim side Implement plating process metal forming, (B) be made up of clad material, at least on the face by described shim side, be configured with anti-electricity The good metal forming of metal material of solution matter performance, (C) are at least laminated with conductive metal oxygen on the face by described shim side The metal forming of compound or (D) are at least laminated with the face by described shim side and comprise leading of conductive auxiliary agent and binding agent The electrically metal forming of cover layer,
By the periphery encapsulated layer containing thermoplastic resin by one face of the first metal layer in described positive pole portion It is formed without the circumference region of positive electrode active material layer and the non-shape in one face of second metal layer in described negative pole portion The circumference region having negative electrode active material layer is become to be joined together.
[6] electrical storage device according to the 5th technical scheme, stacking the on another face of described the first metal layer One insulating resin film, and being partially provided with not by described first insulating resin film in another face of described the first metal layer The positive terminal portion covering,
Second insulating resin film is laminated on another face of described second metal layer, and in described second metal layer The negative electrode terminal portion being partially provided with not covered by described second insulating resin film in another face.
It is also possible that as described second metal layer, arranging using on the face at least leaning on described shim side of Cu paper tinsel There is the metal level of Ni plating layer.
It is also possible that the thickness of described Cu paper tinsel is 15 μm~155 μm, the thickness of described Ni plating layer is 0.5 μm~5 μm.
In the technical scheme of [1], the conductive part (metal level) being connected with apparatus main body portion is formed as the one of external packing body Part, even if do not use lug can be energized yet.Due to eliminating lug, it is possible to contribute to electrical storage device lightweight and Miniaturization.Additionally, at least one side of metal level is by being configured with the good metal of anti-electrolyte capability in plating processing unit, clad material The configuration section of material, conductive metal oxide or conductive cover layer are formed, and these layers (portion) have anti-electrolyte capability And it is outstanding in terms of corrosion resistance, therefore, it is possible to improve corrosion resistance (the anti-electrolysis of the metal level (conductive part) as barrier layer Matter performance etc.).
In the technical scheme of [2], the conductive part (metal level) being connected with apparatus main body portion is formed as the one of external packing body Part, even if do not use lug can be energized yet.Due to eliminating lug, it is possible to contribute to electrical storage device lightweight and Miniaturization.Additionally, the thermoplastic resin layer side of metal level is good by being configured with anti-electrolyte capability in plating processing unit, clad material The configuration section of metal material, conductive metal oxide or conductive cover layer formed, these layers (portion) have anti-electrolysis Matter performance and outstanding in terms of corrosion resistance, therefore, it is possible to improve the special of the metal level (conductive part) being used simultaneously as barrier layer It is the corrosion resistance (anti-electrolyte capability etc.) at exposed portion.Thus, for example, the electrical storage device meeting being constituted using this external packing body It is not likely to produce electrolyte leakage etc..
In the technical scheme of [3], another face of metal level is laminated insulating resin film, (in addition to portion of terminal Part) insulating properties can be substantially ensured that it is also possible to guarantee physical strength, and being partially provided with another face of metal level The exposed portion (portion of terminal) not covered by insulating resin film, therefore, it is possible to be energized by this exposed portion (portion of terminal).
In the technical scheme (electrical storage device) of [4], employ any one external packing body in above-mentioned [1]~[3] and constitute storage Electric installation, therefore, even if not using lug also can be energized, is capable of lightweight and miniaturization, and can suppress outsourcing Fill the corrosion of metal level (conductive part) of body and be not likely to produce electrolyte leakage etc..
In the technical scheme of [5], the first metal layer constituting positive pole portion and the second metal layer constituting negative pole portion are also The metal level of the function of housing material as electrical storage device can be played, i.e. first and second metal level can play electrode (conductive part) and housing material both functions, therefore, even if do not use lug can be energized yet.Due to removing lug, energy Enough realize lightweight and the miniaturization of electrical storage device.Additionally, the first metal layer and second metal layer (are leaned on electrolyte interface On the face of shim side) it is configured with plating processing unit, be configured with joining of the good metal material of anti-electrolyte capability in clad material Put portion, conductive metal oxide or conductive cover layer, these layers (portion) have anti-electrolyte capability and in corrosion resistance Aspect is outstanding, therefore, it is possible to improve the corrosion resistance at the particularly exposed portion of the metal level being used simultaneously as barrier layer.Therefore, This electrical storage device is not likely to produce electrolyte leakage etc..
In the technical scheme of [6], another face of first and second metal level is laminated insulating resin film respectively, (except end Part beyond sub-portion) insulating properties can be substantially ensured that it is also possible to guarantee physical strength, and another in first and second metal level The exposed portion (portion of terminal) being partially provided with not covered by insulating resin film in one face, therefore, it is possible to by this exposed portion (end Sub-portion) it is energized.
Brief description
Fig. 1 is the sectional view of an embodiment of the electrical storage device representing the 1st technical scheme.
Fig. 2 is the top view of the electrical storage device of Fig. 1.
Fig. 3 is the axonometric chart of an embodiment of the electrical storage device representing the 2nd technical scheme.
Fig. 4 is the sectional view of the line B-B of Fig. 3.
Fig. 5 is the sectional view of another embodiment of the electrical storage device representing the 2nd technical scheme.
Description of reference numerals
1st, electrical storage device;2nd, the first metal layer;2A, the first metal forming;2B, plating processing unit, anti-electrolyte capability are good Metal material configuration section, conductive metal oxide layer, conductive cover layer;3rd, positive electrode active material layer;4th, the first thermoplasticity Resin bed;5th, electrolyte;8th, the first insulating resin film layer;9th, the first exposed portion (positive terminal portion);12nd, second metal layer; 12A, the second metal forming;The good metal material configuration section of 12B, plating processing unit, anti-electrolyte capability, conductive metal oxide Layer, conductive cover layer;13rd, negative electrode active material layer;14th, the second thermoplastic resin layer;15th, electrolyte;18th, the second insulation tree Adipose membrane layer;19th, the second exposed portion (negative electrode terminal portion);21st, shim;22nd, positive pole portion;23rd, negative pole portion;31st, periphery encapsulated layer; 50th, external packing body;54th, negative conductive portion;56th, positive conductive portion;60th, apparatus main body portion.
Specific embodiment
Fig. 1, an embodiment of the electrical storage device 1 of 2 expression the 1st technical schemes.This electrical storage device 1 is cascade type exterior electricity Pond, has the plain battery 60 as apparatus main body portion and the external package casing 45 receiving this plain battery 60.
As shown in Figure 1, 2, external package casing 45 is the gabarit chi of the flange 53 by main body 51 and size and aforementioned body 51 The combination of very little identical lid (bottom) 55 is made, and this main body 51 has the recess 52 that top view is square and recessed from this The flange 53 that the opening edge in portion 52 extends in outward direction.Above-mentioned recess 52 is formed as the storage space of plain battery 60.
As the constituent material of aforementioned body 51, use with second metal layer 12, be laminated in this second metal layer 12 second thermoplastic resin layer 14 in a face (the first face) and another face (being laminated in above-mentioned second metal layer 12 Two faces) the second insulating resin film 18 external packing body 50.In this external packing body 50, at one of above-mentioned second metal layer 12 The negative conductive portion 54 being partially provided with not covered by above-mentioned second thermoplastic resin layer in face.In the present embodiment, upper The central part stating a face of second metal layer 12 forms above-mentioned negative conductive portion 54.Additionally, in above-mentioned second metal layer 12 The negative electrode terminal portion 19 being partially provided with not covered by above-mentioned second insulating resin film in another face.In the present embodiment, Central part in another face of above-mentioned second metal layer 12 forms above-mentioned negative electrode terminal portion 19.
As the constituent material of above-mentioned lid 55, use with the first metal layer 2, be laminated in this first metal layer 2 First thermoplastic resin layer 4 in a face (the first face) and another face (second being laminated in above-mentioned the first metal layer 2 Face) the first insulating resin film 8 external packing body 50.In this external packing body 50, in a face of above-mentioned the first metal layer 2 It is partially provided with the positive conductive portion 56 not covered by above-mentioned first thermoplastic resin layer.In the present embodiment, above-mentioned The central part in one face of one metal level 2 forms above-mentioned positive conductive portion 56.Office in another face of above-mentioned the first metal layer 2 Portion is provided with the positive terminal portion 9 not covered by above-mentioned first insulating resin film.In the present embodiment, in above-mentioned first metal The central part in another face of layer 2 forms above-mentioned positive terminal portion 9.
Additionally, as above-mentioned the first metal layer 2, adopting in the first metal forming 2A at least by electrolyte contact side (by dress Put main part 60 side, lean on the first thermoplastic resin layer 4 side) it is configured with the structure (reference picture of any one of several structures as follows 1):
I) plating processing unit 2B;
Ii) configuration section 2B being configured with the good metal of anti-electrolyte capability of the metal forming being made up of clad material;
Iii) conductive metal oxide 2B;
Iv) electric conductivity covering part 2B containing conductive auxiliary agent and binding agent.
Additionally, in the present embodiment, use above-mentioned first metal forming 2A two-sided on be configured with above-mentioned plating Processing unit 2B, configuration section 2B, conductive metal oxide 2B and electric conductivity covering part 2B any one of structure (reference Fig. 1).Additionally, in the 1st technical scheme, above-mentioned the first metal layer 2 can also be using only exhausted by first in the first metal forming 2A Edge resin film 8 side is configured with above-mentioned plating processing unit 2B, configuration section 2B, conductive metal oxide 2B and electric conductivity covering part 2B any one of structure.
Additionally, as above-mentioned second metal layer 12, adopting at least (leaning in the second metal forming 12A by electrolyte contact side Apparatus main body portion 60 side, lean on the second thermoplastic resin layer 14 side) be configured with any one of several structures as follows structure (ginseng According to Fig. 1):
I) plating processing unit 12B;
Ii) configuration section 12B being configured with the good metal of anti-electrolyte capability of the metal forming being made up of clad material;
Iii) conductive metal oxide 12B;
Iv) electric conductivity covering part 12B containing conductive auxiliary agent and binding agent.
Additionally, in the present embodiment, processed using being configured with above-mentioned plating on two-sided in above-mentioned second metal forming 12A Portion 12B, configuration section 12B, conductive metal oxide 12B and electric conductivity covering part 12B any one of structure (reference Fig. 1).Additionally, in the 1st technical scheme, above-mentioned second metal layer 12 can also be exhausted using only in the second metal forming 12A second Edge resin film 18 side is configured with above-mentioned plating processing unit 12B, configuration section 12B, conductive metal oxide 12B and electric conductivity and covers Cap 12B any one of structure.
These the first metal layers 2, detailed construction of second metal layer 12 etc. are described below.
Aforementioned body 51 is that the above-mentioned external packing body to flat board sheet material is implemented the shaping such as bulging, drawing and forming and formed recess 52, and the not deformed part of recess 52 surrounding is trimmed to the part after the contour dimension of flange 53.On the other hand, on Stating lid 55 is the part that the above-mentioned external packing body of flat board sheet material is cut into required size.Recess in aforementioned body 51 The inner surface setting of 52 bottom has negative conductive portion 54, has positive conductive portion 56 (reference picture in the inner surface setting of lid 55 1).Above-mentioned positive conductive portion 56 and negative conductive portion 54 make the 12B such as the plating processing unit of metal level sudden and violent using external packing body 50 The exposed portion exposed is formed.Additionally, above-mentioned positive terminal portion 9 and negative electrode terminal portion 19 make metal level using external packing body 50 The exposed portion coming out is formed.
Above-mentioned plain battery 60 be by the negative pole 62 of the positive pole 61 of sheet and sheet across shim 63 stacking get up and Become, this plain battery 60 is accommodated in the space between the above-mentioned external packing body of two panels 50, the end of positive pole 61 and external packing body 50 Positive conductive portion 56 connects, and the end of negative pole 62 is connected (with reference to Fig. 1) with the negative conductive portion 54 of external packing body 50.
Above-mentioned electrical storage device 1 is constituted as follows:In the positive pole 61 by plain battery 60 and positive conductive portion 56, negative pole 62 After engaging respectively with negative conductive portion 54, plain battery 60 is accommodated in the recess 52 of main body 51 and covers lid 55, reserve Electrolyte injection opening ground seals to the thermoplastic resin layer 4,14 of the flange 53 of main body 51 and the contact site of lid 55, in note Complete to encapsulate by above-mentioned electrolyte injection opening is carried out with heat-sealing after having entered electrolyte.
In above-mentioned electrical storage device 1, positive terminal portion 9 and negative electrode terminal portion 19 are provided with external packing body 50, therefore, Energising can be formed with other equipment by these portion of terminal to be connected.
Joint as above-mentioned positive pole 61 and the juncture, above-mentioned negative pole 62 and negative conductive portion 54 in positive conductive portion 56 Mode, and be not particularly limited, for example ultrasonic bonding, welding can be exemplified and carry out bonding using conductive adhesive Deng.
In the electrical storage device of above-mentioned 1st technical scheme, the conductive part (metal that is connected with plain battery (apparatus main body portion) Layer) be formed as the part of external packing body, therefore, even if not using lug also can be energized.By removing lug, it is capable of The lightweight of electrical storage device and miniaturization.Additionally, metal level by the face with electrolyte contact side, there is anti-electrolyte capability and Outstanding in terms of corrosion resistance, even if the thermoplastic resin film with anti-electrolyte capability is being removed in order to arrange conductive part Metal level exposed portion (conductive part) place it is also possible to maintain and improve corrosion resistance (anti-electrolyte capability etc.).Therefore, this storage Electric installation is not likely to produce electrolyte leakage etc..
Next, an embodiment of Fig. 3, the electrical storage device of 4 expression the 2nd technical schemes.This electrical storage device 1 has positive pole Portion 22, negative pole portion 23 and shim 21 (with reference to Fig. 4).It is configured with separation between above-mentioned positive pole portion 22 and above-mentioned negative pole portion 23 Piece 21 (with reference to Fig. 4).
Above-mentioned positive pole portion 22 comprises the first metal layer 2 and the face (shim face) being laminated in this first metal layer 2 Regional area positive electrode active material layer 3.In the present embodiment, positive electrode active material layer 3 is laminated in above-mentioned first metal The central part (region in addition to circumference) in one face (shim face) of layer 2.Additionally, in the present embodiment it is illustrated that Going out above-mentioned the first metal layer 2 is to implement the metal forming of plating process or this situation of metal forming being made up of clad material, Adhesive layer 7 is layered in the entire surface in a face (shim face) of above-mentioned the first metal layer 2.I.e., in the present embodiment, By above-mentioned adhesive layer 7, above-mentioned positive electrode active material layer 3 is laminated in a face of above-mentioned the first metal layer 2 (by shim side Face) (with reference to Fig. 4).Additionally, in the first metal layer 2 using being laminated the conductive cover layer comprising conductive auxiliary agent and binding agent Metal forming in the case of it is also possible to be not provided with above-mentioned adhesive layer 7.
Above-mentioned negative pole portion 23 comprises second metal layer 12 and is laminated in a face of this second metal layer 12 (by shim side Face) regional area negative electrode active material layer 13.In the present embodiment, negative electrode active material layer 13 is laminated in above-mentioned The central part (region in addition to circumference) in one face (by the face of shim side) of two metal levels 1.Additionally, in this embodiment party It is illustrated that above-mentioned second metal layer 12 is to implement the metal forming of plating process or the metal forming being made up of clad material in formula This situation, adhesive layer 17 is layered in the entire surface in a face (by the face of shim side) of above-mentioned second metal layer 12.That is, In the present embodiment, by above-mentioned adhesive layer 17, above-mentioned negative electrode active material layer 13 is laminated in above-mentioned second metal layer 12 One face (by the face of shim side) (with reference to Fig. 4).Additionally, comprising conductive auxiliary agent and viscous in second metal layer 12 using being laminated It is also possible to be not provided with above-mentioned adhesive layer 17 in the case of the metal forming of conductive cover layer of knot agent.
Above-mentioned positive electrode active material layer 3 configures between above-mentioned the first metal layer 2 and above-mentioned shim 21, and above-mentioned negative pole is lived Property material layer 13 configure between above-mentioned second metal layer 12 and above-mentioned shim 21 (with reference to Fig. 4).
In the 2nd technical scheme, as above-mentioned the first metal layer 2, using at least leaning on electrolyte in the first metal forming 2A Contact side (apparatus main body portion side 60) is configured with the structure (with reference to Fig. 4) of any one of several structures as follows:
I) plating processing unit 2B;
Ii) configuration section 2B being configured with the good metal of anti-electrolyte capability of the metal forming being made up of clad material;
Iii) conductive metal oxide 2B;
Iv) electric conductivity covering part 2B containing conductive auxiliary agent and binding agent.
Additionally, as above-mentioned second metal layer 12, (being filled using the electrolyte contact side that at least leans in the second metal forming 12A Put main part side 60) it is configured with the structure (with reference to Fig. 4) of any one of several structures as follows:
I) plating processing unit 12B;
Ii) configuration section 12B being configured with the good metal of anti-electrolyte capability of the metal forming being made up of clad material;
Iii) conductive metal oxide 12B;
Iv) electric conductivity covering part 12B containing conductive auxiliary agent and binding agent.
These the first metal layers 2, detailed construction of second metal layer 12 etc. are described below.
Additionally, as shown in Figure 5 it is also possible to adopt following structure:As above-mentioned the first metal layer 2, use first Metal forming 2A two-sided on be formed with above-mentioned plating processing unit 12B, configuration section 12B, conductive metal oxide 12B or conduction Property covering part 12B metal level, as above-mentioned second metal layer 12, use the second metal forming 12A two-sided on formed There are above-mentioned plating processing unit 12B, the metal level of configuration section 12B, conductive metal oxide 12B or electric conductivity covering part 12B.
Circumference in the said one face (by the face of shim 21 side) of the first metal layer 2 in above-mentioned positive pole portion 22 exists It is formed without the region of positive electrode active material layer, and (lean in the said one face of the second metal layer 12 in above-mentioned negative pole portion 23 The face of shim 21 side) circumference exist and be formed without the region of negative electrode active material layer.Then, by containing thermoplastic resin The periphery encapsulated layer 31 of fat is formed without positive active material by the said one face of the first metal layer 2 in above-mentioned positive pole portion 22 Layer circumference region and above-mentioned negative pole portion 23 the said one face of second metal layer 12 be formed without negative electrode active material The circumference region of layer is joined together to be packaged (with reference to Fig. 4).The circumference of above-mentioned shim 21 becomes entrance, is engaged to The state (with reference to Fig. 4) of the pars intermedia of short transverse (thickness direction) of the inner peripheral surface of above-mentioned periphery encapsulated layer 31.
In the present embodiment, using following structure:In the first metal layer 2 being laminated in above-mentioned positive pole portion 22 above-mentioned one The circumference region being formed without positive electrode active material layer of the adhesive layer 7 in individual face is laminated the first periphery bond layer 6, in stacking In the said one face of the second metal layer 12 in above-mentioned negative pole portion 23 adhesive layer 17 be formed without negative electrode active material layer Circumference region is laminated second week edge bond layer 16, and this two bond layer 6,16 engages by above-mentioned periphery encapsulated layer 31 Come to be packaged together (Fig. 4 reference).
Electrolyte 5 is enclosed between above-mentioned shim 21 and above-mentioned positive electrode active material layer 3.Additionally, by electrolyte 15 envelope Enter (Fig. 4 reference) between above-mentioned shim 21 and above-mentioned negative electrode active material layer 13.Just being formed without of above-mentioned the first metal layer 2 The circumference region being formed without negative electrode active material layer of the circumference region of pole active material layer and second metal layer 12 is borrowed Help above-mentioned periphery encapsulated layer 31 to be joined together to be packaged together, be prevented from the leakage of electrolyte 5,15.That is, by above-mentioned first The adhesive layer 7 of the inner surface side of metal level 2 and by above-mentioned second metal layer 12 the adhesive layer 17 of inner surface side between, by upper State in the closing space that periphery encapsulated layer 31, the first periphery bond layer 6 and the second periphery bond layer 16 surround, from first Metal level 2 side is risen and is configured and enclose positive electrode active material layer 3, electrolyte 5, shim 21, electrolyte 15, negative electrode active material successively Matter layer 13 (Fig. 4 reference).
In the present embodiment, also there is structure as following.That is, above-mentioned the first metal layer 2 another face (with Face by the face opposition side of shim side) on, to leave the first exposed portion (positive terminal portion) making this first metal layer 2 expose 9 state, be laminated the first insulating resin film 8, and above-mentioned second metal layer 12 another face (by with by shim side The face of face opposition side) on, to leave the state of the second exposed portion (negative electrode terminal portion) 19 making this second metal layer expose, stacking Second insulating resin film 18.In the present embodiment, in another face of above-mentioned the first metal layer 2 (with the face by shim side The face of opposition side) on, to leave the state of the first exposed portion 9 making this first metal layer expose, by the 3rd bond layer 41 It is laminated the first insulating resin film 8, in another face (face with the face opposition side by shim side) of above-mentioned second metal layer 12, To leave the state of the second exposed portion 19 making this second metal layer expose, by the 4th bond layer 42 stacking the second insulation tree Adipose membrane 18.Additionally, in the present embodiment, above-mentioned first exposed portion (positive terminal portion) 9 is arranged at the another of the first metal layer 2 The middle section in individual face, above-mentioned second exposed portion (negative electrode terminal portion) 19 is arranged at the central authorities in another face of second metal layer 12 Region (with reference to Fig. 3,4).
In above-mentioned electrical storage device 1, first and second metal level plays electrode (conductive part) and this work(of external packing body material Can, therefore, even if not using lug can be energized yet.Due to removing lug, it is possible to realize electrical storage device lightweight and Miniaturization.
Additionally, there are the positive terminal portion 9 conducting with positive pole and the negative electrode terminal portion 19 conducting with negative pole, therefore, Can be energized by this two portion of terminal 9,19.
Additionally, as the first metal layer and second metal layer at least one of metal level, using in metal forming extremely It is configured with least structure of any one that thing is constructed as below by electrolyte contact side (apparatus main body portion side 60) less:
I) plating processing unit;
Ii) the configuration section being configured with the good metal of anti-electrolyte capability of the metal forming being made up of clad material;
Iii) conductive metal oxide;
Iv) the electric conductivity covering part containing conductive auxiliary agent and binding agent;
The structures such as these processing units have an anti-electrolyte capability and outstanding in terms of corrosion resistance, on making The corrosion resistance stating the particularly exposed portion of metal level improves.Therefore, this electrical storage device is not likely to produce electrolyte leakage etc..
Additionally, by the both sides that insulating resin film 8,18 is layered in device, (part in addition to portion of terminal) can fill Dividing guarantees insulating properties, and also can substantially ensure that physical strength.Thus, it is also possible to abundant tackle electric power storage of the present utility model Device 1 is installed on and requires the position with insulating properties, has these situations of irregular position.
And, because not needing conventional lead, also would not occur electrical storage device discharge and recharge when heating to lead Around the phenomenon concentrated, by the first metal layer 2 constituting positive pole portion and the second metal layer 12 in negative pole portion can be constituted make to send out Thermal expansion is scattered in the two-sided entire surface of electrical storage device 1 such that it is able to the life-span extending electrical storage device 1 (that is, is obtained in that longevity The electrical storage device of life).Additionally, because not needing lead, it is possible to reduce corresponding manufacturing cost.
In this utility model, as above-mentioned the first metal layer 2 and above-mentioned second metal layer 12, using in metal forming extremely It is configured with, on few one side, the structure that thing any one of is constructed as below:
I) plating processing unit;
Ii) the configuration section being configured with the good metal of anti-electrolyte capability of the metal forming being made up of clad material;
Iii) conductive metal oxide;
Iv) the electric conductivity covering part containing conductive auxiliary agent and binding agent.
These i)~iv) material be respectively provided with anti-electrolyte capability and outstanding in terms of corrosion resistance.
Describe above-mentioned metal level 2,12 in detail.First, as the metal (plating material) constituting plating layer, especially do not limit Fixed, for example can enumerate Ni, Al etc..If represented with specific composition, for example, as metal forming (2A, 12A)/plating layer (2B, 12B), can enumerate SUS (rustless steel)/Ni, Cu/Ni, SUS (rustless steel)/Al etc..The thickness of above-mentioned metal forming preferably 15 μm~155 μm.Additionally, preferably 0.5 μm~5 μm of the thickness of plating layer.Additionally, as the above-mentioned plating layer enumerated, preferably Al is used in negative side (12B) used in side of the positive electrode (2B), by Cu, SUS.
As above-mentioned metal level 2,12, in the case of using " metal forming being made up of clad material ", as such Clad material (the 1st layer (2A, 12A)/2nd layer (2B, 12B)), can enumerate Cu/Ni, Cu/Al, Al/Ni, SUS (rustless steel)/ Ni, SUS (rustless steel)/Al etc..In addition it is also possible to be the three-deckers such as Ni/Cu/Ni.In which case it is preferable that, by wrapping The thickness of the metal forming that layer material is constituted is 15 μm~155 μm.In which case it is preferable that, the 2nd layer segment of clad material Become electrolyte interface.That is, in foregoing illustrative metal forming, the 2nd layer of the metal metal than the 1st layer is in potential resistance to electrolyte contamination Energy aspect is outstanding (anti-electrolyte capability is more preferable).As above-mentioned 2nd layer (layer by electrolyte contact side of clad material), preferably , the configuration metal material lower than the ionization tendency of the 1st layer of metal material is it is more preferable that configuration is led to as Al etc. Often relatively thin oxide-film can be covered on surface under state and form the metal material of passive state.The relatively low metal material of ionization tendency The corrosion resistance (anti-electrolyte capability) of material is higher.But, even " the higher metal of ionization tendency ", as long as " being formed Have the metal of passive state ", then just than the corrosion resistance (potential resistance to electrolyte contamination of " ionization tendency relatively low but the metal that do not form passive state " Can) high.
As above-mentioned metal level 2,12, in the case of using " being laminated the metal forming of conductive metal oxide ", and It is not particularly limited, as metal forming 2A, 12A, for example, can use Al, Cu, Ni, SUS, Ti etc., as conductive metal oxidation Thing 2B, 12B, for example, can enumerate SnO2、TiO2, ZnO etc..Preferably, by the above-mentioned conductive metal of 0.1 μm~1 μm of thickness Oxide skin(coating) is coated on metal forming 2A, 12A.Moreover it is preferred that the thickness of metal forming is 15 μm~155 μm.
As above-mentioned metal level 2,12, in the situation using " conductive cover layer containing conductive auxiliary agent and binding agent " Under, as metal forming 2A, 12A, and it is not particularly limited, for example, can use Al, Cu, Ni, SUS, Ti etc., as conductive auxiliary agent, And be not particularly limited, for example can enumerate CB (white carbon black), CNT (CNT) etc..Additionally, as binding agent (bonding agent), and Be not particularly limited, for example can enumerate PVDF (Kynoar), SBR (butadiene-styrene rubber), CMC (sanlose), PAN (polyacrylonitrile), straight chain formula polysaccharide etc..Generally, above-mentioned conductive auxiliary agent and binding agent are mixed respectively, using organic solvent After carrying out pulp, after being coated in metal forming using rotogravure application method etc., conductive cover layer can be formed by drying.Excellent Choosing, the thickness of above-mentioned conductive cover layer is set as 0.1 μm~20 μm.Additionally, using conductive auxiliary agent and binding agent In the case of, because can fully improve and active substance, interelectrode fluid-tight engagement, above-mentioned bonding can also be not provided with Layer 7,17.
Above-mentioned positive electrode active material layer 3 is simultaneously not particularly limited, such as by by salt (for example, cobalt acid lithium, lithium nickelate, iron phosphate Lithium, LiMn2O4 etc.) it is added to PVDF (Kynoar), SBR (butadiene-styrene rubber), CMC (sanlose etc.), PAN Blend compositions of binding agents such as (polyacrylonitrile) etc. are formed.Preferably, the thickness of above-mentioned positive electrode active material layer 3 sets It is set to 2 μm~300 μm.
The conductive auxiliary agents such as white carbon black, CNT (CNT) can also also be contained in above-mentioned positive electrode active material layer 3.
As above-mentioned adhesive layer 7, and it is not particularly limited, for example, can enumerate and to be formed by PVDF, SBR, CMC, PAN etc. Layer, for example, formed by being coated in the said one face (by face of shim 21 side) of the first metal layer 2.
In order that the electric conductivity between the first metal layer 2 and positive electrode active material layer 3 improves, can also be by white carbon black, CNT Conductive auxiliary agents such as (CNTs) is added in above-mentioned adhesive layer 7.
Preferably, the thickness of above-mentioned adhesive layer 7 is set as 0.2 μm~10 μm.By the thickness of above-mentioned adhesive layer 7 is set It is scheduled on less than 10 μm, can greatly suppress bonding agent itself so that the situation that the internal driving of electrical storage device 1 increases is occurred.
Although above-mentioned adhesive layer 7 can also be not provided with, in order that the first metal layer 2 and positive electrode active material layer 3 Cohesive improves it is preferred that being arranged on above-mentioned adhesive layer 7 between the first metal layer 2 and positive electrode active material layer 3.
As above-mentioned first periphery bond layer 6, and it is not particularly limited it is preferred that being to be glued by two-solution curing type alkene Connect the layer of dosage form one-tenth.In the case of using two-solution curing type alkene bonding agent, can be substantially prevented from drawing because of the swelling of electrolyte The zygosity rising reduces.Preferably, the thickness of above-mentioned first periphery bond layer 6 is set as 0.5 μm~5 μm.
As above-mentioned negative electrode active material layer 13, and it is not particularly limited, such as by by additive (for example, graphite, metatitanic acid Lithium, Si system alloy, stannum system alloy etc.) it is added to the shapes such as blend compositions in the bonding agents such as PVDF, SBR, CMC, PAN Become.Preferably, the thickness of above-mentioned negative electrode active material layer 13 is set as 1 μm~300 μm.
The conductive auxiliary agents such as white carbon black, CNT (CNT) can also also be contained in above-mentioned negative electrode active material layer 13.
As above-mentioned adhesive layer 17, and it is not particularly limited, for example, can enumerate by PVDF (Kynoar), SBR (butylbenzene Rubber), the layer of the formation such as CMC (sanlose etc.), PAN (polyacrylonitrile), such as by being coated in the second metal Layer 12 said one face (by the face of shim side) and formed.
In order that the electric conductivity between second metal layer 12 and negative electrode active material layer 13 improves, can also be by white carbon black, CNT Conductive auxiliary agents such as (CNTs) is added in above-mentioned adhesive layer 17.
Preferably, the thickness of above-mentioned adhesive layer 17 is set as 0.2 μm~10 μm.By by the thickness of above-mentioned adhesive layer 17 It is set in less than 10 μm, can greatly suppress bonding agent itself so that the situation that the internal driving of electrical storage device 1 increases is occurred.
Although above-mentioned adhesive layer 17 can also be not provided with, in order that second metal layer 12 and negative electrode active material layer 13 Cohesive improve it is preferred that above-mentioned adhesive layer 17 is arranged between second metal layer 12 and negative electrode active material layer 13.
As above-mentioned second periphery bond layer 16, and it is not particularly limited it is preferred that being to be glued by two-solution curing type alkene Connect the layer of dosage form one-tenth.In the case of using two-solution curing type alkene bonding agent, can be substantially prevented from drawing because of the swelling of electrolyte The zygosity rising reduces.Preferably, the thickness of above-mentioned second periphery bond layer 16 is set as 0.5 μm~5 μm.
In the above-described embodiment, above-mentioned periphery encapsulated layer (the periphery encapsulated layer containing thermoplastic resin) 31 is to be laminated The first thermoplastic resin layer 4 and a face being laminated in second metal layer 12 in the circumference in a face of the first metal layer 2 The second thermoplastic resin layer 14 of circumference be piled up, recycle heat to be welded together and formed.As above-mentioned One thermoplastic resin layer 4 is it is preferred that formed by thermoplastic resin unstretching film.Additionally, as above-mentioned second thermoplastic resin Layer 14 is it is preferred that formed by thermoplastic resin unstretching film.
Above-mentioned thermoplastic resin unstretching film 4,14 and be not particularly limited it is preferred that using from by polyethylene, poly- third At least one thermoplastic resin institute selected in alkene, the group of olefinic copolymer, their acid modifier and ionomer composition The unstretching film being formed is constituted.
Preferably, the thickness of above-mentioned thermoplastic resin unstretching film 4,14 is respectively set as 20 μm~150 μm.
As above-mentioned shim 21,63, and it is not particularly limited, for example, can enumerate:
Polyethylene shim,
Polypropylene shim,
The shim being formed by the multilayer film that polyethylene film and polypropylene screen form,
By the wet type or the dry type porous that are coated in the heat resistant inorganic thing such as pottery on any of the above-described shim Shim that plasma membrane is constituted etc..
Preferably, the thickness of above-mentioned shim 21,63 is set as 5 μm~50 μm.
As above-mentioned electrolyte 5,15, and it is not particularly limited it is preferred that use comprises electrolyte and the mixing of lithium salts is non- Water system electrolyte, this electrolyte is from by ethylene carbonate, propylene carbonate, dimethyl carbonate, ethyl methyl carbonate, carbon At least two electrolyte selected in the group of diethyl phthalate and dimethoxy-ethane composition.As above-mentioned lithium salts, not special Do not limit, for example, can enumerate lithium hexafluoro phosphate, LiBF4 etc..As above-mentioned electrolyte 5,15, it is possible to use will be upper State the material mixing non-water system electrolyte and PVDF, PEO (poly(ethylene oxide)) isogel.
In the space between above-mentioned the first metal layer 2 and above-mentioned second metal layer 12, surrounding is by periphery encapsulated layer 31 etc. Surround and centre is in air-tight state, in this state, above-mentioned shim 21 and above-mentioned electrolyte 5,15 are enclosed (ginseng in this space According to Fig. 4,5), it is possible to preventing the leakage of electrolyte.
As above-mentioned first insulating resin film 8 and the second insulating resin film 18, and it is not particularly limited it is preferred that using Stretched polyamide film (tensile nylon film etc.) or oriented polyester film.Wherein it is therefore particularly preferred that using Biaxially oriented polyamide Film (biaxial stretch-formed nylon membrane etc.), biaxial stretch-formed polybutylene terephthalate (PBT) (PBT) film, biaxial stretch-formed poly terephthalic acid Glycol ester (PET) film or biaxial stretch-formed PEN (PEN) film.In addition it is also possible to be above-mentioned first exhausted Edge resin film 8 and the second insulating resin film 18 are all formed as monolayer, or can also be above-mentioned first insulating resin films 8 and second Insulating resin film 18 is all by the multilamellar that for example oriented polyester film/stretched polyamide film is constituted (by stretching PET film/tensile nylon film Multilamellar constituting etc.) formed.
On above-mentioned first insulating resin film 8, it is provided for ensuring that the peristome 8X of the first metal exposed portion 9 in local (with reference to Fig. 4,5).In the above-described embodiment, peristome 8X is arranged on the central part of the first insulating resin film 8, but not special Do not limit such position.The plan view shape of above-mentioned peristome 8X is not defined to rectangular shape yet.
Equally, on above-mentioned second insulating resin film 18, it is provided for ensuring that opening of the second metal exposed portion 19 in local Oral area 18X (with reference to Fig. 4,5).In the above-described embodiment, peristome 18X is arranged on the central part of the second insulating resin film 18, But and it is not particularly limited such position.The plan view shape of above-mentioned peristome 18X is not defined to rectangular shape yet.
Preferably, the thickness of the thickness of above-mentioned first insulating resin film 8 and above-mentioned second insulating resin film 18 all sets For 0.02mm~0.1mm.
Being provided with above-mentioned 3rd bond layer 41, in the case of above-mentioned 4th bond layer 42, as these bonding agents 41st, 42, and be not particularly limited it is preferred that using from by PAUR system bonding agent and EU system bonding The group selected at least one bonding agent that agent is constituted.Preferably, the thickness of above-mentioned 3rd bond layer 41, the above-mentioned 4th glue The thickness connecing oxidant layer 42 is all set as 0.5 μm~5 μm.In another face to above-mentioned first metal foil layer 2 (with shim side phase The face tossed about) above coat and will paste the first insulating resin film 8 and by integral for both bondings be after above-mentioned 3rd bonding agent 41 Can.Additionally, gluing coating the above-mentioned 4th to another face (face with shim side opposition side) of above-mentioned second metal foil layer 12 After connecing agent 42, paste the second insulating resin film 18 and incite somebody to action both bondings integral.
In this utility model, as metal level 2,12, using implementing the metal forming of plating process, by clad material Constitute metal forming in the case of it is preferred that in above-mentioned first metal forming at least by being configured with the face of above-mentioned shim side Upper formation is melted into envelope.In addition, again it is preferred to, in above-mentioned second metal forming at least by being configured with above-mentioned shim side Face on formed chemical conversion envelope.Above-mentioned chemical conversion envelope is by implementing, to the surface of metal forming, the envelope that chemical conversion treatment is formed, By implementing such chemical conversion treatment, the corrosion of metal foil surface being caused by content (electrolyte etc.) can be substantially prevented from. For example, by implementing following process to execute chemical conversion treatment to metal forming.That is, on the surface of the metal forming implementing ungrease treatment On be coated with lower note 1)~3) in any one aqueous solution after, by being dried implementing chemical conversion treatment.These aqueous solutions include:
1) comprise:Phosphoric acid,
Chromic acid,
And at least oneization selected in the group that the non-metal salt of the slaine by fluoride and fluoride is constituted The aqueous solution of the mixture of compound
2) comprise:Phosphoric acid,
Selected in the group being made up of acrylic resin, chitosan derivative resin and phenolic aldehyde system resin at least A kind of resin,
And the mixture of at least one compound selected in the group being made up of chromic acid and chromium (III) salt is water-soluble Liquid
3) comprise:Phosphoric acid,
Selected in the group being made up of acrylic resin, chitosan derivative resin and phenolic aldehyde system resin at least A kind of resin,
At least one compound selected in the group being made up of chromic acid and chromium (III) salt,
And at least oneization selected in the group that the non-metal salt of the slaine by fluoride and fluoride is constituted The aqueous solution of the mixture of compound.
Preferably, the chromium adhesion amount (each face) of above-mentioned chemical conversion envelope is 0.1mg/m2~50mg/m2, particularly preferably , the chromium adhesion amount (each face) of above-mentioned chemical conversion envelope is 2mg/m2~20mg/m2.
Embodiment
Then, specific embodiment of the present utility model is described, this utility model is not particularly limited to these embodiments.
(embodiment 1)
Comprise polyacrylic acid, phosphorus in 40 μm of thickness, aluminium foil implementing nickel plating (1 μm of plating thickness) two-sided upper coating The chemical synthesis treatment liquid of the compound of acid and chromium and fluorine, by being dried at 150 DEG C, makes chromium adhesion amount reach 3mg/m2, Thus obtaining the first metal layer 2.
Then, PAUR system bonding agent is coated on a face of above-mentioned the first metal layer 2.Carrying out this painting When covering, by the use of sheltering process (process adhesive tape is sheltered in stickup), the central part in a face of the first metal layer 2 is glued as uncoated Connect agent region.Afterwards, the biaxial stretching polyamide film of 25 μm of thickness is pasted on this PAUR system bonding agent coated side (the first insulating resin film) 8.Next, on another face of above-mentioned the first metal layer 2 coated acid modified polypropene bonding agent. When carrying out this coating, using sheltering process (stickup shelter process adhesive tape) by the central part in another face of the first metal layer 2 As uncoated adhesive region.Afterwards, by 40 μm of thickness is pasted on this sour modified polypropene system bonding agent coated side Un-stretched polypropylene film (the first thermoplastic resin layer) 4, thus obtain duplexer.
Then, along the periphery irradiating laser of the uncoated adhesive region of the first insulating resin film in above-mentioned duplexer To cut off the first insulating resin film, remove the first insulating resin film layer of uncoated adhesive region, thus forming positive terminal Portion 9.Additionally, along the first thermoplastic resin layer of above-mentioned sandwich uncoated adhesive region periphery irradiating laser to cut Disconnected first thermoplastic resin layer, removes the first thermoplastic resin layer of uncoated adhesive region, forms positive conductive portion 56, and And obtain the external packing body 50 (lid 55 of Fig. 1) of flat board sheet material.
(embodiment 2)
As above-mentioned the first metal layer 2, except using same as Example 1 in the upper enforcement of clad material (aluminum-nickel foil) Beyond metal level obtained from chemical conversion treatment, obtain the external packing body 50 (lid of Fig. 1 of flat board sheet material similarly to Example 1 55).
(embodiment 3)
As above-mentioned the first metal layer 2, except using by coating operation by the SnO of 0.5 μm of thickness2Layer (conductive gold Belonging to oxide) 2B is layered in the two-sided of aluminium foil (the first metal forming) 2A implementing chemical conversion treatment same as Example 1 respectively Beyond metal level obtained from upper, obtain the external packing body 50 (lid 55 of Fig. 1) of flat board sheet material similarly to Example 1.
(embodiment 4)
As above-mentioned the first metal layer 2, except being layered in enforcement respectively using by the conductive cover layer 2B of 20 μm of thickness The aluminium foil of chemical conversion treatment same as Example 1 (the first metal forming) 2A two-sided upper obtained from beyond metal level, with reality Apply the external packing body 50 (lid 55 of Fig. 1) that example 1 similarly obtains flat board sheet material.Above-mentioned conductive cover layer 2B is to utilize intaglio plate After cladding process is coated with, on above-mentioned aluminium foil, the slurry being dissolved in shitosan and white carbon black in ethyl acetate, at 150 DEG C Under so that slurry drying is formed.
(comparative example 1)
As above-mentioned the first metal layer, except direct using the aluminium foil (the implementing chemical conversion treatment same as Example 1 One metal forming) beyond (that is, non-laminated conductive cover layer), obtain the external packing body of flat board sheet material similarly to Example 1.
Evaluation methodology according to lower note is to the potential resistance to electrolyte contamination as above remembering each electrical storage device external packing body obtaining like that Can be evaluated.
(anti-electrolyte capability evaluation methodology)
For each embodiment, comparative example, all produce the external packing body of two panels rectangular shape respectively, exposed with metal forming Come conductive part as inner side (using thermoplastic resin layer as inner side) mode, after two panels external packing body is piled up, Position at one is stayed to be joined together three side heat-sealings of periphery.Then, 5mL electrolyte never package position is injected it In, and above-mentioned unencapsulated position carried out with heat sealing merge completing to encapsulate in the state of having air to enter, put with this state After putting, the positive conductive portion and the negative conductive portion that observe by the naked eye external packing body are corrosion-free to have investigated.
As electrolyte, using by lithium hexafluoro phosphate (LiPF6) be dissolved in concentration 1mol/L make ethylene carbonate (EC), In the mixed solvent that dimethyl carbonate (DMC) and ethyl methyl carbonate (EMC) are mixed with equal-volume ratio Electrolyte.
As a result, due to the corrosion not seeing the metal level (comprising metal forming) being caused by electrolyte, so this practicality The electrical storage device external packing body of new embodiment 1~4 is outstanding in terms of anti-electrolyte capability.
On the other hand, on the external packing body of comparative example 1, somewhat observe the corrosion of the metal level being caused by electrolyte.
As the concrete example of electrical storage device of the present utility model, for example, can enumerate:
The electrochemical appliances such as lithium secondary battery (lithium ion battery, lithium polymer battery etc.)
Lithium-ion capacitance
Double-layer capacitor etc..
No. 2015-89495 opinion of Japan's patent application Patent that the application was filed an application based on April 24th, 2015 is excellent First weigh, disclosure of which directly constitutes the part for the application.
The term being used here and explanation illustrate that embodiment of the present utility model uses, this practicality New it is not limited to this.In this utility model, as long as without deviating from its purport in the range of its claims, then no Change by which kind of design aspect is all allowed.

Claims (10)

1. a kind of electrical storage device external packing body is it is characterised in that have:
Metal level and be laminated in this metal level a face thermoplastic resin layer,
In the conductive part being partially provided with not covered by described thermoplastic resin layer in a face of described metal level,
As described metal level, can be using at least implementing metal forming A of plating process, be made up of clad material in one side Metal forming B, at least one side be laminated with conductive metal oxide metal forming C or at least one side be laminated conductive Metal forming D of cover layer.
2. a kind of electrical storage device external packing body is it is characterised in that have:
Metal level and be laminated in this metal level a face thermoplastic resin layer,
In the conductive part being partially provided with not covered by described thermoplastic resin layer in a face of described metal level,
As described metal level, can be using the gold that plating process is at least implemented on the face by described thermoplastic resin layer side Belong to paper tinsel A, be made up of clad material, to be at least configured with anti-electrolyte capability on the face by described thermoplastic resin layer side good Metal forming B of metal material, the gold of conductive metal oxide is at least laminated with the face by described thermoplastic resin layer side Belong to paper tinsel C or metal forming D that conductive cover layer is at least laminated with the face by described thermoplastic resin layer side.
3. electrical storage device external packing body according to claim 1 and 2 it is characterised in that
Another face of described metal level is laminated insulating resin film, and sets in the local in another face of described metal level Put the portion of terminal not covered by described insulating resin film.
4. a kind of electrical storage device is it is characterised in that have:
Electrical storage device external packing body described in two panels claim 1 or 2;
Apparatus main body portion,
To make to receive in the space described in two panels between external packing body configuring in the way of thermoplastic resin layer each other is facing Receive described device main part, the conductive part of the electrode of described device main part and described external packing body connects, and by two panels institute The thermoplastic resin layer stating the circumference of external packing body is bonded with each other and is packaged.
5. a kind of electrical storage device is it is characterised in that have:
Electrical storage device external packing body described in two panels claim 1 or 2;
Apparatus main body portion,
To make to receive in the space described in two panels between external packing body configuring in the way of thermoplastic resin layer each other is facing Receive described device main part, the negative pole of described device main part is connected with the conductive part of the external packing body of described side, described dress The positive pole putting main part is connected with the conductive part of the external packing body of described opposite side, as the described side being connected with described negative pole External packing body metal level, can use Cu paper tinsel at least lean on described device main part side face on be provided with Ni plating layer Metal level, and the thermoplastic resin layer of the circumference of the external packing body described in two panels be bonded with each other be packaged.
6. electrical storage device according to claim 5 it is characterised in that
The thickness of described Cu paper tinsel is 15 μm~155 μm, and the thickness of described Ni plating layer is 0.5 μm~5 μm.
7. a kind of electrical storage device is it is characterised in that have:
Positive pole portion, it comprises the first metal layer and is laminated in the positive electrode active material of the regional area in a face of this first metal layer Matter layer;
Negative pole portion, it comprises second metal layer and is laminated in the negative electrode active material of the regional area in a face of this second metal layer Matter layer;
Shim, it configures between described positive pole portion and described negative pole portion,
It is configured with described positive electrode active material layer between described the first metal layer and described shim, in described second metal layer It is configured with described negative electrode active material layer and described shim between,
As described the first metal layer and described second metal layer, using enforcement plating at least on the face by described shim side Metal forming A that processes, be made up of clad material, to be at least configured with anti-electrolyte capability on the face by described shim side good Metal forming B of metal material, the metal forming of conductive metal oxide is at least laminated with the face by described shim side C or metal forming D that conductive cover layer is at least laminated with the face by described shim side,
By the periphery encapsulated layer containing thermoplastic resin by the non-shape in one face of the first metal layer in described positive pole portion Become to have being formed without of one face of second metal layer in the circumference region of positive electrode active material layer and described negative pole portion The circumference region of negative electrode active material layer is joined together.
8. electrical storage device according to claim 7 it is characterised in that
First insulating resin film is laminated on another face of described the first metal layer, and another in described the first metal layer The positive terminal portion being partially provided with not covered by described first insulating resin film in individual face,
Second insulating resin film is laminated on another face of described second metal layer, and another in described second metal layer The negative electrode terminal portion being partially provided with not covered by described second insulating resin film in individual face.
9. the electrical storage device according to claim 7 or 8 it is characterised in that
As described second metal layer, using the gold that Ni plating layer is provided with the face at least leaning on described shim side of Cu paper tinsel Belong to layer.
10. electrical storage device according to claim 9 it is characterised in that
The thickness of described Cu paper tinsel is 15 μm~155 μm, and the thickness of described Ni plating layer is 0.5 μm~5 μm.
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