CN205946482U - Cooling system and food processor - Google Patents
Cooling system and food processor Download PDFInfo
- Publication number
- CN205946482U CN205946482U CN201620865654.5U CN201620865654U CN205946482U CN 205946482 U CN205946482 U CN 205946482U CN 201620865654 U CN201620865654 U CN 201620865654U CN 205946482 U CN205946482 U CN 205946482U
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- fan
- switch circuit
- circuit board
- relay
- semiconductor
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- 235000013305 food Nutrition 0.000 title claims abstract description 19
- 238000001816 cooling Methods 0.000 title abstract description 19
- 239000004065 semiconductor Substances 0.000 claims abstract description 67
- 238000005057 refrigeration Methods 0.000 claims abstract description 35
- 230000017525 heat dissipation Effects 0.000 claims description 12
- 238000000926 separation method Methods 0.000 claims description 2
- 235000013322 soy milk Nutrition 0.000 claims 1
- 230000005611 electricity Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 238000002955 isolation Methods 0.000 description 3
- 235000010469 Glycine max Nutrition 0.000 description 2
- 244000068988 Glycine max Species 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000008267 milk Substances 0.000 description 2
- 210000004080 milk Anatomy 0.000 description 2
- 235000013336 milk Nutrition 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Control Of Positive-Displacement Air Blowers (AREA)
Abstract
The utility model discloses a cooling system and food processor, wherein, this cooling system includes fan, semiconductor refrigeration piece, a switch circuit, the 2nd switch circuit, reaches the controller, wherein, the fan sets up between semiconductor refrigeration piece and circuit board, and the circuit board is close to near semiconductor refrigeration piece, the air -out side of fan to the air inlet of fan side, a switch circuit cuts off or puts through the power of importing to the semiconductor refrigeration piece, the 2nd switch circuit cuts off or puts through the power of importing to the fan, controller when electricity on the circuit board, open a switch circuit and the 2nd switch circuit respectively, the switch -on is imported to the power of semiconductor refrigeration piece and fan, makes the fan blow cold wind to the circuit board the utility model discloses technical scheme reduces the reliability of the temperature rise of food processor's circuit board, improved circuit board.
Description
Technical Field
The utility model relates to the technical field of household appliances, in particular to cooling system and use this cooling system's food processor.
Background
The circuit board of the household appliance product mainly comprises a switching power supply chip, a voltage stabilizing chip, an IGBT, a rectifier bridge, a silicon controlled rectifier and other semiconductor devices. The performance of a semiconductor can be seriously influenced after the semiconductor is heated, and the current common method in the industry is to add a radiating fin to the semiconductor, but the problem can not be well solved, and the problems of performance reduction and reliability reduction after the temperature is increased exist.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a cooling system aims at reducing the temperature rise of food processor's circuit board, improves the reliability of circuit board.
In order to achieve the above object, the present invention provides a heat dissipation system, which includes a fan, a semiconductor refrigeration sheet, a first switch circuit, a second switch circuit, and a controller; the fan is arranged between the semiconductor refrigeration piece and the circuit board, the air inlet side of the fan is close to the semiconductor refrigeration piece, and the air outlet side of the fan is close to the circuit board;
the first switch circuit cuts off or switches on the power supply input to the semiconductor refrigeration chip;
the second switch circuit cuts off or switches on the power supply input to the fan;
when the circuit board is powered on, the controller respectively starts the first switch circuit and the second switch circuit, and switches on the power supply input to the semiconductor chilling plate and the fan, so that the fan blows cold air to the circuit board.
Preferably, the semiconductor refrigeration piece further comprises a cold end and a hot end, the cold end of the semiconductor refrigeration piece is close to the air inlet side of the fan, and the hot end of the semiconductor refrigeration piece is far away from the air inlet side of the fan.
Preferably, a separation plate is arranged between the cold end and the hot end of the semiconductor refrigeration sheet.
Preferably, the control end of the controller is connected with the controlled end of the first switch circuit; the input end of the first switch circuit is connected with the power supply, the output end of the first switch circuit is connected with the anode of the semiconductor refrigerating sheet, and the cathode of the semiconductor refrigerating sheet is grounded; the input end of the second switch circuit is connected with the power supply, the output end of the second switch circuit is connected with the anode of the fan, and the cathode of the fan is grounded; and the control end of the controller is connected with the controlled end of the second switch circuit.
Preferably, the first switch circuit includes a first resistor, a first triode, and a relay; wherein,
the first end of the first resistor is connected with the control end of the controller, the second end of the first resistor is connected with the base electrode of the first triode, the emitting electrode of the first triode is grounded, and the collecting electrode of the first triode is connected with the output end of the coil side of the relay; the coil side input end of the relay is connected with a power supply; the input end of the contact side of the relay is connected with the power supply, the output end of the contact side of the relay is connected with the anode of the semiconductor refrigerating sheet, and the cathode of the semiconductor refrigerating sheet is grounded.
Preferably, the first switch circuit further includes a second resistor, a first end of the second resistor is connected to the base of the first triode, and a first end of the second resistor is connected to the emitter of the first triode.
Preferably, the first switch circuit further includes a first diode, an anode of the first diode is connected to the coil-side output terminal of the relay, and a cathode of the first diode is connected to the coil-side input terminal of the relay.
Preferably, the controller is realized by adopting a single chip microcomputer.
The utility model also provides a food processor, which comprises a host machine, and the food processor also comprises the heat dissipation system, and the heat dissipation system is arranged in the host machine; the heat dissipation system comprises a fan, a semiconductor refrigeration piece, a first switch circuit, a second switch circuit and a controller; the fan is arranged between the semiconductor refrigeration piece and the circuit board, the air inlet side of the fan is close to the semiconductor refrigeration piece, and the air outlet side of the fan is close to the circuit board; the first switch circuit cuts off or switches on the power supply input to the semiconductor refrigeration chip; the second switch circuit cuts off or switches on the power supply input to the fan; when the circuit board is powered on, the controller respectively starts the first switch circuit and the second switch circuit, and switches on the power supply input to the semiconductor chilling plate and the fan, so that the fan blows cold air to the circuit board.
Preferably, the food processor is a broken food processor, a blender or a soybean milk machine.
The utility model discloses technical scheme has formed a cooling system through setting up fan, semiconductor refrigeration piece, first switch circuit, second switch circuit and controller. After the circuit board is powered on, the fan starts to rotate, the controller controls the semiconductor refrigerating sheet to refrigerate, cold air is blown to the circuit board through the fan to cool the circuit board, the problem of temperature rise of the circuit board is effectively solved, and the reliability of the circuit board is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of the heat dissipation system of the present invention;
fig. 2 is a functional block diagram of an embodiment of a first switch circuit of the present invention;
fig. 3 is a functional block diagram of an embodiment of a second switching circuit of the present invention;
fig. 4 is a schematic structural diagram of an embodiment of the first switch circuit of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | Fan with cooling device | 700 | Partition board |
| 200 | Semiconductor refrigerating plate | R1 | A first resistor |
| 210 | Cold end | R2 | Second resistance |
| 220 | Hot end | K1 | Relay with a movable contact |
| 300 | First switch circuit | D1 | First diode |
| 400 | Second switch circuit | Q1 | A first triode |
| 500 | Controller | VCC | Power supply |
| 600 | Circuit board |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a cooling system.
Referring to fig. 1, 2 and 3, in an embodiment of the present invention, the heat dissipation system includes a fan 100, a semiconductor cooling plate 200, a first switch circuit 300, a second switch circuit 400, and a controller 500; the fan 100 is arranged between the semiconductor refrigeration piece 200 and the circuit board 600, the air inlet side of the fan 100 is close to the semiconductor refrigeration piece 200, and the air outlet side of the fan 100 is close to the circuit board 600.
The first switching circuit 300 cuts off or turns on a power VCC input to the semiconductor chilling plate 200; the second switching circuit 400 that cuts off or turns on the power input to the fan 100; when the circuit board 600 is powered on, the controller 500 respectively turns on the first switch circuit 300 and the second switch circuit 400, and turns on the power input to the semiconductor chilling plate 200 and the fan 100, so that the fan 100 blows cold air to the circuit board 600.
The controller 500 and the power source VCC are disposed on the circuit board, and the semiconductor chilling plate 200 and the fan 100 are electrically connected to the circuit board 600 to receive a control signal from the controller 400 and a voltage and a current from the power source VCC, respectively.
After the circuit board 600 is powered on, the controller 500 controls the fan 100 and the semiconductor cooling fins 200 to start operating, and the fan 100 blows cold air onto the circuit board 600, so that the components on the circuit board 600 that generate heat can be cooled.
The utility model discloses technical scheme has formed a cooling system through setting up fan 100, semiconductor refrigeration piece 200, first switch circuit 300, second switch circuit 400 and controller 500. After the circuit board 600 is powered on, the fan 100 starts to rotate, the controller 500 controls the semiconductor refrigeration sheet 200 to refrigerate, cold air is blown to the circuit board 600 through the fan 100 to cool the circuit board 600, the problem of temperature rise of the circuit board 600 is effectively solved, and the reliability of the circuit board 600 is improved.
Further, the semiconductor refrigeration sheet 200 further includes a cold end 210 and a hot end 220, the cold end 210 of the semiconductor refrigeration sheet 200 is close to the air inlet side of the fan 100, and the hot end 220 of the semiconductor refrigeration sheet 200 is far away from the air inlet side of the fan 100.
It should be noted that the semiconductor refrigeration sheet 200 is a galvanic couple formed by connecting two different semiconductor materials in series, and both ends of the galvanic couple can absorb heat and emit heat respectively, thereby achieving the purpose of refrigeration. It is easy to understand that the cold end 210 of the semiconductor cooling plate 200 is disposed at a position close to the air inlet side of the fan 100, so as to reduce the loss of cold air and facilitate the cooling of the circuit board 600.
Further, an isolation plate 700 is arranged between the cold end 210 and the hot end 220 of the semiconductor chilling plate 200. The isolation plate 700 may be a plastic plate disposed between the cold end 210 and the hot end 220, and the isolation plate 700 is perpendicular to the plane of the semiconductor chilling plate 200. Through setting up division board 700, reduce the convection current between the cold air that semiconductor refrigeration piece 200's cold junction 210 produced and the steam that hot junction 220 produced to reduce the loss of cold air, fully blow cold air to circuit board 600, do benefit to and cool down circuit board 600.
Specifically, the control terminal of the controller 500 is connected to the controlled terminal of the first switch circuit 300; the input end of the first switch circuit 300 is connected with the power supply VCC, the output end of the first switch circuit 300 is connected with the anode of the semiconductor chilling plate 200, and the cathode of the semiconductor chilling plate 200 is grounded; the input terminal of the second switch circuit 400 is connected to the power VCC, the output terminal of the second switch circuit 400 is connected to the positive terminal of the fan 100, the negative terminal of the fan 100 is grounded, and the control terminal of the controller 500 is connected to the controlled terminal of the second switch circuit 400.
In the embodiment of the present invention, the first switch circuit 300 and the second switch circuit 400 have the same structure, and the first switch circuit is taken as an example for description below:
referring to fig. 4, in particular, the first switching circuit 300 includes a first resistor R1, a first transistor Q1, and a relay K1; a first end of the first resistor R1 is connected to a control end of the controller 500, a second end of the first resistor R1 is connected to a base of the first transistor Q1, an emitter of the first transistor Q1 is grounded, and an emitter of the first transistor Q1 is connected to a coil-side output end of the relay K1; the coil side input end of the relay K1 is connected with a power supply VCC; the input of relay K1's contact side with the power VCC connects, the output of relay K1's contact side with semiconductor refrigeration piece 200's positive pole is connected, semiconductor refrigeration piece 200's negative pole ground connection.
The relay K1 includes a movable contact and a fixed contact, and after the coil side of the relay K1 is energized, the movable contact and the fixed contact are attracted, and the relay K1 is conducted; when the coil side of the relay K1 is powered off, the movable contact is disconnected with the fixed contact, and the relay K1 is turned off.
When the controller 500 controls the motor to rotate, the controller 500 controls the first switch circuit 300 to be switched on to switch on the power source VCC input to the water pump, namely, the control end of the controller 500 outputs a high level, at the moment, the first triode Q1 is switched on, so that the loop at the coil side of the relay K1 is grounded and switched on, the electromagnetic suction force at the coil side of the relay K1 is increased, the movable contact and the fixed contact at the contact side are attracted, and the power source VCC input to the semiconductor chilling plate 200 is switched on.
Further, the first switch circuit 300 further includes a second resistor R2, a first end of the second resistor R2 is connected to the base of the first transistor Q1, and an emitter of the second resistor R2 is connected to the emitter of the first transistor Q1. The second resistor R2 is used to ensure that the first transistor Q1 is turned off quickly and reliably when the controller 500 outputs a low level.
Further, the first switch circuit 300 further includes a first diode D1, an anode of the first diode D1 is connected to the coil-side output terminal of the relay K1, and a cathode of the first diode D1 is connected to the coil-side input terminal of the relay K1. The first diode D1 is a freewheeling diode. When relay K1 is turned off, because relay K1 has a large amount of power stored in the coil, a large voltage is induced across the coil, and a freewheeling diode is added to release the power stored in the coil to prevent the coil from burning out.
In this embodiment, the controller 500 is implemented by an 8-bit single chip microcomputer. In addition, the controller 500 can be implemented by a control chip such as a DSP or an FPGA.
The utility model discloses technical scheme produces air conditioning through semiconductor refrigeration piece 200, blows cold gas to circuit board 600 through fan 100, has realized the air-cooled cooling, has effectively restrained the temperature rise of circuit board 600 during operation, has reduced circuit board 600's loss for circuit board 600 work has improved circuit board 600's reliability at lower temperature range.
The utility model also provides a food processor, this food processor include above-mentioned cooling system and host computer, and this cooling system sets up in the host computer, and this cooling system's concrete structure refers to above-mentioned embodiment, because this food processor has adopted the whole technical scheme of all above-mentioned embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is no longer given here.
The food processor is a broken-wall processor, a stirrer or a soybean milk machine and the like.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (10)
1. A heat dissipation system is characterized by comprising a fan, a semiconductor refrigeration piece, a first switch circuit, a second switch circuit and a controller; the fan is arranged between the semiconductor refrigeration piece and the circuit board, the air inlet side of the fan is close to the semiconductor refrigeration piece, and the air outlet side of the fan is close to the circuit board;
the first switch circuit cuts off or switches on the power supply input to the semiconductor refrigeration chip;
the second switch circuit cuts off or switches on the power supply input to the fan;
when the circuit board is powered on, the controller respectively starts the first switch circuit and the second switch circuit, and switches on the power supply input to the semiconductor chilling plate and the fan, so that the fan blows cold air to the circuit board.
2. The heat dissipation system of claim 1, wherein the semiconductor chilling plate further comprises a cold side and a hot side, the cold side of the semiconductor chilling plate being proximate to the air inlet side of the fan, and the hot side of the semiconductor chilling plate being distal to the air inlet side of the fan.
3. The heat dissipation system of claim 2, wherein a separation plate is disposed between the cold end and the hot end of the semiconductor chilling plate.
4. The heat dissipating system of any of claims 1-3, wherein a control terminal of the controller is connected to a controlled terminal of the first switching circuit; the input end of the first switch circuit is connected with the power supply, the output end of the first switch circuit is connected with the anode of the semiconductor refrigerating sheet, and the cathode of the semiconductor refrigerating sheet is grounded; the input end of the second switch circuit is connected with the power supply, the output end of the second switch circuit is connected with the anode of the fan, and the cathode of the fan is grounded; and the control end of the controller is connected with the controlled end of the second switch circuit.
5. The heat dissipating system of claim 4, wherein the first switching circuit comprises a first resistor, a first transistor, and a relay; wherein,
the first end of the first resistor is connected with the control end of the controller, the second end of the first resistor is connected with the base electrode of the first triode, the emitting electrode of the first triode is grounded, and the collecting electrode of the first triode is connected with the output end of the coil side of the relay; the coil side input end of the relay is connected with a power supply; the contact side input end of the relay is connected with the power supply, the contact side output end of the relay is connected with the anode of the semiconductor refrigerating sheet, and the cathode of the semiconductor refrigerating sheet is grounded.
6. The heat dissipating system of claim 5, wherein the first switching circuit further comprises a second resistor, a first terminal of the second resistor being coupled to the base of the first transistor, and a second terminal of the second resistor being coupled to the emitter of the first transistor.
7. The heat dissipating system of claim 6, wherein the first switch circuit further comprises a first diode, an anode of the first diode being connected to the coil-side output terminal of the relay, and a cathode of the first diode being connected to the coil-side input terminal of the relay.
8. The heat dissipation system of claim 1, wherein the controller is implemented using a single-chip microcomputer.
9. A food processor comprising a main body, wherein the food processor comprises the heat dissipation system of any one of claims 1-8, and the heat dissipation system is disposed in the main body.
10. The food processor of claim 9, wherein the food processor is a broken food processor, a blender, or a soymilk machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620865654.5U CN205946482U (en) | 2016-08-10 | 2016-08-10 | Cooling system and food processor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620865654.5U CN205946482U (en) | 2016-08-10 | 2016-08-10 | Cooling system and food processor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205946482U true CN205946482U (en) | 2017-02-08 |
Family
ID=57923395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620865654.5U Active CN205946482U (en) | 2016-08-10 | 2016-08-10 | Cooling system and food processor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205946482U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109452365A (en) * | 2017-09-06 | 2019-03-12 | 浙江绍兴苏泊尔生活电器有限公司 | Food processor and method for making yoghourt by using same |
-
2016
- 2016-08-10 CN CN201620865654.5U patent/CN205946482U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109452365A (en) * | 2017-09-06 | 2019-03-12 | 浙江绍兴苏泊尔生活电器有限公司 | Food processor and method for making yoghourt by using same |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |