CN210431275U - Drive control integrated device and air conditioner - Google Patents
Drive control integrated device and air conditioner Download PDFInfo
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- CN210431275U CN210431275U CN201921544820.1U CN201921544820U CN210431275U CN 210431275 U CN210431275 U CN 210431275U CN 201921544820 U CN201921544820 U CN 201921544820U CN 210431275 U CN210431275 U CN 210431275U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
- Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes
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Abstract
The utility model provides an integrated device of drive control and air conditioner, wherein, the integrated device of drive control includes: the base plate is sequentially integrated with a rectifier, a power factor corrector, a motor driving component of a compressor and a motor driving component of a fan along the direction of the first edge of the base plate; and the temperature detector is arranged in an area between the rectifier and the power factor corrector and is connected to the processor through a pin at the second edge of the substrate so as to send the temperature information of the motor driving component to the processor. Through the utility model provides a drive control integrated device has improved integrated level, electromagnetic interference and interference killing feature, power density and the heat dispersion of drive control integrated device, has synthesized the reliability that has promoted drive control integrated device.
Description
Technical Field
The utility model relates to a drive control technical field, more specifically say, relate to a drive control integrated device and an air conditioner.
Background
The household variable frequency air conditioner generally comprises an outdoor unit and an indoor unit, wherein a drive controller of the outdoor unit and a drive controller of the indoor unit are respectively arranged outdoors and indoors, and a separate combination scheme of a rectifier power device, a power factor corrector, a compressor inverter, a fan inverter and the like is basically adopted.
In the related art, driving devices of household variable frequency air conditioners are continuously developed towards integration, but the main technical problems of the integrated driving control devices include large electromagnetic interference, large packaging difficulty, complex wiring and the like.
Moreover, any discussion of the prior art throughout the specification is not an admission that the prior art is necessarily known to a person of ordinary skill in the art, and any discussion of the prior art throughout the specification is not an admission that the prior art is necessarily widely known or forms part of common general knowledge in the field.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least.
To this end, an object of a first aspect of the present invention is to provide a drive control integrated device.
Another aspect of the present invention is to provide an air conditioner.
In order to achieve the above object, the present invention provides a driving control integrated device, wherein the driving control integrated device is externally connected with a processor, and the driving control integrated device comprises: the base plate is sequentially integrated with a rectifier, a power factor corrector, a motor driving component of a compressor and a motor driving component of a fan along the direction of the first edge of the base plate; and the temperature detector is arranged in the area between the rectifier and the power factor corrector and is connected to the processor through pins at the second edge of the substrate so as to send the temperature information of the power factor corrector to the processor.
The utility model provides an above-mentioned technical scheme provides a drive control integrated device, the direction at the first edge of edge along the base plate, the integration has set up the rectifier on the base plate in proper order, the power factor corrector, the motor drive assembly of the motor drive subassembly of compressor and fan, because the heat dissipation capacity of rectifier is less than the heat dissipation capacity of power factor corrector, and the heat dissipation capacity of power factor corrector is less than the heat dissipation capacity of motor drive assembly, especially the motor drive assembly is close to the base plate edge and sets up, above-mentioned drive control integrated device is favorable to improving the radiating effect of base plate, the high integration of drive control integrated device has not only been realized, and power density and reliability have been improved, in addition, be favorable to improving the miniaturization and the manufacturing cost of drive control integrated device.
In addition, a temperature detector is arranged in the area between the rectifier and the power factor corrector, and because the power factor corrector belongs to a high heat dissipation component, the power factor corrector has great significance for driving the motor, the electric power efficiency of the motor is effectively regulated and controlled by adjusting the phase difference between current and voltage, therefore, the temperature detector is arranged to mainly detect the temperature of the distribution area of the power factor corrector, and the detected temperature information is sent to a processor, and the power factor corrector, the motor driving component of the compressor and the motor driving component of the fan are all connected and controlled by the processor, therefore, when the temperature is detected to be abnormal, the processor can output a cut-off instruction to the power factor corrector to control the power factor corrector to stop working, so that the possibility of burning the power factor corrector can be effectively reduced, and the reliability of a drive control device is further improved.
The temperature signal transmitted by the temperature detector is a weak current signal, and the signal transmitted between the motor driving component and the motor is a strong current signal, so that the temperature detector is close to the second edge, the transmission distance between the temperature detector and the processor can be shortened, the temperature detector is connected to the processor through the pin at the second edge of the substrate, the interference of the strong current signal to the temperature signal is favorably reduced, and the reliability of over-temperature protection of the power factor corrector can be improved.
Additionally, the utility model discloses the integrated device of drive control that above-mentioned technical scheme provided still has following additional technical characteristics:
in one embodiment, the motor drive assembly comprises: the driver is configured to receive the driving control signal sent by the processor and generate a pulse modulation signal according to the driving control signal; and the input end of the inverter is connected to the output end of the driver, and the inverter is configured to drive the motor to operate according to the pulse modulation signal, wherein the inverter is bridged between the high-voltage bus and the low-voltage bus, the input end of the motor is connected to the output end of the inverter through a pin at the first edge, and the processor is connected to the driver through a pin at the second edge of the substrate.
In one embodiment, the temperature detector comprises: the temperature detection resistor is arranged on the substrate, the first end of the temperature detection resistor is connected to the driver, the second end of the temperature detection resistor is connected to the processor through the pin at the second edge, and the resistance value of the temperature detection resistor is in positive correlation or negative correlation with the temperature of the substrate.
In the above embodiment, the temperature detection resistor is arranged on the substrate, and the temperature detection resistor sends the temperature of the substrate to the processor, and particularly, when the temperature on the substrate is detected to be too high, the processor is triggered to control any heating component in the rectifier, the power factor corrector and the inverter to stop working, so as to avoid burning out of the electronic device, and further improve the reliability and the thermal stability of the drive control integrated device.
In one embodiment, the layout area of the PFC on the substrate is designated as a target area, and the temperature detector is disposed in the target area.
In one embodiment, the driver of the fan driving component and the driver of the compressor driving component are integrated on the same driver chip, or the driver of the fan driving component and the driver of the compressor driving component are arranged in two separate driver chips.
In one embodiment, the first edge and the second edge are parallel opposite sides of the substrate, the heat dissipation capacity of the fan driving assembly is smaller than that of the compressor driving assembly, and the heat dissipation capacity of the power factor corrector is larger than that of the rectifier.
In one embodiment, the diameter of the pin of the driver of the fan driving component ranges from 0.3mm to 1.5mm, or the diameter of the pin of the driver of the compressor driving component ranges from 0.5mm to 2 mm.
In one embodiment, the pins of the motor driving component are inserted and/or soldered on the substrate.
In one embodiment, the driving control integrated device further includes: the rectifier comprises four switch bridge arms, each switch bridge arm is provided with a switch tube, and a power supply signal is input into the rectifier through an external pin, wherein the rectifier is configured to convert the power supply signal into a bus signal and load the bus signal to a high-voltage bus and a low-voltage bus.
In the above embodiment, the power supply signal is processed by the rectifier and then converted into a bus signal, the rectifier may be a bridge diode circuit, that is, a diode is disposed in a bridge arm, or the rectifier may be a totem-pole rectifier, that is, a power tube is disposed in a bridge arm, which can further reduce power consumption and electromagnetic interference signals of the totem-pole rectifier, and the rectifier is configured to convert an ac signal into a dc signal.
In one embodiment, the driving control integrated device is connected to the inductive element through an external pin, a first end of the inductive element is connected to the high-voltage bus, and the driving control integrated device further includes: a power factor corrector controlled by the driver, the power factor corrector comprising: the control end of the power tube is connected to an output pin of the driver, the first end of the power tube is connected to the ground wire, the second end of the power tube is connected to the second end of the inductive element through a pin at the first edge, the first end of the inductive element is connected to the high-voltage bus through a pin at the second edge, and the pulse modulation signal is configured to control the power tube to be switched on or switched off; and the first one-way conduction element is connected between the second end of the power tube and the input end of the inverter.
In the above embodiment, by providing that the pfc includes the power tube, the first one-way conducting element and the inductive element, wherein the inductive element is connected to the outside of the substrate, on one hand, the pfc provides the required adjustable dc bus voltage for the inverter, and on the other hand, the pfc adjusts the power factor of the whole machine.
The size of the inductive element is large, and the fluctuation signal generated by the inductive element is large, so that the inductive element is arranged outside the substrate, on one hand, the size, the layout and the integration level of the substrate are optimized, on the other hand, the electromagnetic interference signal on the substrate is reduced, and on the other hand, if the inductive element fails, the inductive element is convenient to overhaul and replace.
In one embodiment, the driving control integrated device further includes: and the second one-way conduction element is connected between the first end of the power tube and the second end of the power tube.
In one embodiment, after the second end of the power tube is connected to the first unidirectional conducting element, the second end of the power tube is connected to the second end of the capacitive element through the pin of the first edge, the first end of the capacitive element is connected to the ground, and the capacitive element is configured to filter ripple signals and/or surge signals flowing through the high-voltage bus.
In the above embodiments, the capacitive element is configured to filter out ripple signals and/or surge signals and load the filtered bus signals to the inverter and the load, and likewise, since the volume of the capacitive element and the ripple signals are large, the driving control integrated device is connected to the capacitive element through the external pin, so as to further reduce the volume of the driving control integrated device and the electromagnetic interference signals.
In one embodiment, an inverter includes: at least two parallelly connected half-bridge circuit of way, half-bridge circuit bridge joint between high-voltage bus and low voltage bus, half-bridge circuit includes: the pulse modulation circuit comprises two switching tubes connected in series, control ends of the switching tubes are connected to an output pin of the driver, and pulse modulation signals are configured to control the two switching tubes connected in series to be conducted alternately.
In the above embodiment, the inverter includes at least two half-bridge circuits connected in parallel, and the control terminal of the switching tube is connected to the output pin of the driver, that is, the switching tube is also controlled by the driver, and the bus signal is converted into the alternating current signal AC and loaded to the load, thereby further improving the reliability and the integration level of the drive control integrated device.
In one embodiment, the switch tube is a metal oxide semiconductor field effect transistor or an insulated gate bipolar transistor, wherein a gate of the metal oxide semiconductor field effect transistor is a control end, a reverse freewheeling diode is connected between a source electrode and a drain electrode of the metal oxide semiconductor field effect transistor, a base electrode of the insulated gate bipolar transistor is a control end, and a reverse freewheeling diode is connected between an emitter electrode and a collector electrode of the insulated gate bipolar transistor.
In one embodiment, the metal oxide semiconductor field effect transistor includes at least one of a silicon type metal oxide semiconductor field effect transistor, a silicon carbide type metal oxide semiconductor field effect transistor and a gallium nitride type metal oxide semiconductor field effect transistor.
In one embodiment, an over-current detection pin of the driver is connected to a second pin of the detection resistor through a pin at a first edge, a first pin of the detection resistor is connected to a ground terminal of the inverter, the driver feeds back an over-current signal generated by the detection resistor to the processor, and the first pin and the second pin are arranged adjacently, wherein the processor outputs a driving control signal to cut off the inverter and/or the power factor corrector in response to the over-current signal.
In the above embodiment, the detection resistor is arranged outside the substrate and connected to the processor through the external pin, on one hand, the detection resistor sends the overcurrent signal to the processor to control the switching tube to be cut off by the processor, so as to improve the reliability of the rectifier, the power factor corrector and the inverter, on the other hand, the detection resistor is a thermistor and has obvious heat value change, and the detection resistor is arranged outside the substrate, so that the heat dissipation capacity on the substrate can be reduced, and the thermal stability, reliability, electromagnetic interference and anti-interference performance of the drive control integrated device are further improved.
In one embodiment, the diameter of the pins of the rectifier ranges from 0.5mm to 2 mm.
In one embodiment, the pin diameter of the pfc is in the range of 0.5mm to 2 mm.
In one embodiment, the long side of the substrate is less than 100mm, the short side of the substrate is less than 50mm, or the thickness of the substrate is less than 10 mm.
The utility model discloses technical scheme of second aspect provides an air conditioner, include: the indoor unit is provided with an indoor unit fan; the outdoor unit is provided with a compressor and/or an outdoor unit fan; according to the drive control integrated device in any one of the above technical solutions, an external pin of the drive control integrated device is connected to the indoor unit and/or the outdoor unit, and the drive control integrated device is configured to control at least one load of the indoor unit fan, the compressor and the outdoor unit fan to operate.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic diagram of a drive control integrated device disclosed in an embodiment of the present invention;
fig. 2 is a schematic diagram of a drive control integrated device according to another embodiment of the present invention;
fig. 3 is a schematic diagram of a drive control integrated device according to another embodiment of the present invention;
fig. 4 is a schematic diagram of a drive control integrated device according to another embodiment of the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention more clearly understood, the present invention will be described in further detail with reference to the accompanying drawings and detailed description. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.
The following describes a drive control integrated device and an air conditioner according to embodiments of the present invention with reference to the drawings.
As shown in fig. 1, 2, 3 and 4, according to some embodiments of the present invention, there is provided a drive control integrated device, including: a substrate, a rectifier, a power factor corrector and a compressor M are sequentially integrated on the substrate along the direction of the first edge of the substrate1Motor drive assembly and fan M2The motor drive assembly of (1); and the temperature detector 110 is arranged in a region between the rectifier and the power factor corrector, and the temperature detector 110 is connected to the processor MCU through a pin at the second edge of the substrate so as to transmit the temperature information of the power factor corrector to the processor MCU.
The utility model discloses above-mentionedThe drive control integrated device provided by the technical scheme is characterized in that a rectifier, a power factor corrector and a compressor M are sequentially integrated on a substrate along the direction of a first edge of the substrate1Motor drive assembly and fan M2The motor driving component is characterized in that the rectifier is arranged on the base plate, the power factor corrector is arranged on the base plate, and the rectifier is arranged on the base plate.
In addition, a temperature detector 110 is disposed in an area between the rectifier and the pfc, and since the pfc belongs to a high heat dissipation component and is significant to the driving of the motor, the power efficiency of the motor is effectively controlled by adjusting a phase difference between current and voltage, and thus the temperature detector 110 is disposed to mainly detect the temperature of a distribution area of the pfc and transmit the detected temperature information to the MCU, the pfc, and the compressor M1Motor drive assembly and fan M2The motor driving components are connected with and controlled by the processor MCU, so that when abnormal temperature is detected, the processor MCU can output a cut-off instruction to the power factor corrector to control the power factor corrector to stop working, the possibility that the power factor corrector is burnt can be effectively reduced, and the reliability of a driving control device is further improved.
The temperature signal transmitted by the temperature detector 110 is a weak current signal, and the signal transmitted between the motor driving component and the motor is a strong current signal, so that the temperature detector 110 is close to the second edge, which can shorten the transmission distance between the temperature detector 110 and the processor MCU, and the temperature detector 110 is connected to the processor MCU through the pin at the second edge of the substrate, which is beneficial to reducing the interference of the strong current signal to the temperature signal, and further can improve the reliability of over-temperature protection of the power factor corrector.
Additionally, the utility model discloses the integrated device of drive control that above-mentioned technical scheme provided still has following additional technical characteristics:
in one embodiment, the motor drive assembly comprises: the driver is configured to receive the driving control signal sent by the processor MCU and generate a pulse modulation signal according to the driving control signal; and the input end of the inverter is connected to the output end of the driver, and the inverter is configured to drive the motor to operate according to the pulse modulation signal, wherein the inverter is bridged between the high-voltage bus and the low-voltage bus, the input end of the motor is connected to the output end of the inverter through a pin at the first edge, and the processor MCU is connected to the driver through a pin at the second edge of the substrate.
In one embodiment, the temperature detector 110 includes: the temperature detection resistor is arranged on the substrate, the first end of the temperature detection resistor is connected to the driver, the second end of the temperature detection resistor is connected to the MCU through the pins at the second edge, and the resistance value of the temperature detection resistor is in positive correlation or negative correlation with the temperature of the substrate.
In the above embodiment, the temperature detection resistor is arranged on the substrate, and the temperature detection resistor sends the temperature of the substrate to the processor MCU, and particularly, when the temperature on the substrate is detected to be too high, the processor MCU is triggered to control any heating component in the rectifier, the power factor corrector and the inverter to stop working, so as to avoid burning out of the electronic device, and further improve the reliability and thermal stability of the drive control integrated device.
In one embodiment, the layout area of the pfc on the substrate is designated as the target area, and the temperature detector 110 is disposed in the target area.
In one embodiment, the fan M2Driver of driving assembly and compressor M1The drivers of the drive units being integrated in the same driver chip, or the fan M2Driver of driving assembly and compressor M1The drivers of the drive assembly are provided in two separate driver chips.
One embodiment, as shown in FIG. 3Indication, blower M2Driver of driving assembly and compressor M1The drivers of the drive units are integrated in the same driver chip, or as shown in FIG. 4, the fan M2Driver of driving assembly and compressor M1The drivers of the drive assembly are provided in two separate driver chips.
In one embodiment, the rectifier is disposed in the region 102 of the substrate, the PFC is disposed in the region 104 of the substrate, and the compressor M1The driving components are disposed in the region 106 of the substrate, as shown in FIG. 1, the temperature detector 110 is also disposed in the region 104 of the substrate, and the fan M2The driving elements are disposed in a region 108 of the substrate.
In one embodiment, the fan M2The diameter of the pin of the driver of the driving assembly ranges from 0.3mm to 1.5mm, or the compressor M1The diameter of the pin of the driver of the driving component ranges from 0.5mm to 2 mm.
In one embodiment, the pins of the motor driving component are inserted and/or soldered on the substrate.
In one embodiment, the driving control integrated device further includes: the rectifier comprises four switch bridge arms, each switch bridge arm is provided with a switch tube, and a power supply signal is input into the rectifier through an external pin, wherein the rectifier is configured to convert the power supply signal into a bus signal and load the bus signal to a high-voltage bus and a low-voltage bus.
In the above embodiment, the power supply signal is processed by the rectifier and then converted into the bus signal, the rectifier may be a bridge diode circuit, that is, a diode is disposed in a bridge arm, or the rectifier may be a totem-pole type rectifier, that is, a power tube is disposed in a bridge arm, which can further reduce power consumption and electromagnetic interference signals of the totem-pole type rectifier, and the rectifier is configured to convert an AC signal AC into a dc signal.
In one embodiment, the driving control integrated device is connected to the inductive element L through an external pin, a first end of the inductive element L is connected to the high-voltage bus, and the driving control integrated device further includes: a power factor corrector controlled by the driver, the power factor corrector comprising: the control end of the power tube is connected to an output pin of the driver, the first end of the power tube is connected to the ground wire, the second end of the power tube is connected to the second end of the inductive element L through a pin at a first edge, the first end of the inductive element L is connected to the high-voltage bus through a pin at a second edge, and the pulse modulation signal is configured to control the power tube to be switched on or switched off; and the first one-way conduction element is connected between the second end of the power tube and the input end of the inverter.
In the above embodiment, the power factor corrector is provided to include the power tube, the first one-way conducting element and the inductive element L, where the inductive element L is connected to the outside of the substrate, on one hand, the power factor corrector provides the required adjustable dc bus voltage for the inverter, and on the other hand, the power factor corrector adjusts the power factor of the whole machine.
The size of the inductive element L is large, and the fluctuation signal generated by the inductive element L is large, so that the inductive element L is arranged outside the substrate, on one hand, the size, the layout and the integration level of the substrate are optimized, on the other hand, the electromagnetic interference signal on the substrate is reduced, and on the other hand, if the inductive element L breaks down, the overhaul and the replacement are also facilitated.
In one embodiment, the driving control integrated device further includes: and the second one-way conduction element is connected between the first end of the power tube and the second end of the power tube.
In one embodiment, the second end of the power transistor is connected to the first one-way conductive element and then connected to the capacitive element C through the pin on the first edge1A second terminal of (C), a capacitive element1Is connected to ground, the capacitive element C1Configured to filter out ripple and/or surge signals flowing through the high voltage bus.
In the above embodiment, the capacitive element C1Is configured to filter out ripple and/or surge signals and to load the inverter and the load with the filtered bus signal, likewise due to the capacitive element C1The volume and the fluctuation signal of the capacitive element are larger, so that the drive control integrated device is connected to the capacitive element through an external pinPart C1To further reduce the volume of the drive control integrated device and electromagnetic interference signals.
In one embodiment, an inverter includes: at least two parallelly connected half-bridge circuit of way, half-bridge circuit bridge joint between high-voltage bus and low voltage bus, half-bridge circuit includes: the pulse modulation circuit comprises two switching tubes connected in series, control ends of the switching tubes are connected to an output pin of the driver, and pulse modulation signals are configured to control the two switching tubes connected in series to be conducted alternately.
In the above embodiment, the inverter includes at least two half-bridge circuits connected in parallel, and the control terminal of the switching tube is connected to the output pin of the driver, that is, the switching tube is also controlled by the driver, and the bus signal is converted into the alternating current signal AC and loaded to the load, thereby further improving the reliability and the integration level of the drive control integrated device.
In one embodiment, the switch tube is a metal oxide semiconductor field effect transistor or an Insulated Gate Bipolar transistor, wherein a Gate of the metal oxide semiconductor field effect transistor is a control terminal, a reverse freewheeling diode is connected between a source electrode and a drain electrode of the metal oxide semiconductor field effect transistor, a base electrode of the Insulated Gate Bipolar transistor is a control terminal, a reverse freewheeling diode is connected between an emitter electrode and a collector electrode of the Insulated Gate Bipolar transistor, and the Insulated Gate Bipolar transistor is an Insulated Gate Bipolar transistor, which is hereinafter referred to as an IGBT.
In one embodiment, the metal oxide semiconductor field effect transistor includes at least one of a silicon type metal oxide semiconductor field effect transistor, a silicon carbide type metal oxide semiconductor field effect transistor and a gallium nitride type metal oxide semiconductor field effect transistor.
In one embodiment, an over-current detection pin of the driver is connected to a second pin of the detection resistor through a pin at a first edge, a first pin of the detection resistor is connected to a ground terminal of the inverter, the driver feeds back an over-current signal generated by the detection resistor to the processor MCU, and the first pin and the second pin are arranged adjacently, wherein the processor MCU outputs a driving control signal to cut off the inverter and/or the power factor corrector in response to the over-current signal.
In the above embodiment, the detection resistor is arranged outside the substrate and connected to the processor MCU through the external pin, on one hand, the detection resistor sends an overcurrent signal to the processor MCU to control the switching tube to be cut off by the processor MCU, so as to improve the reliability of the rectifier, the power factor corrector and the inverter, on the other hand, the detection resistor is a thermistor and has an obvious heat value change, and the detection resistor is arranged outside the substrate, so as to reduce the heat dissipation on the substrate, and further improve the thermal stability, reliability, electromagnetic interference and anti-interference performance of the drive control integrated device.
In one embodiment, the driving control integrated device further includes: the temperature detection resistor is arranged on the substrate, the first end of the temperature detection resistor is connected to the driver, the second end of the temperature detection resistor is connected to the processor MCU through an external pin, and the resistance value of the temperature detection resistor is in positive correlation or negative correlation with the temperature of the substrate.
In the above embodiment, the temperature detection resistor is disposed on the substrate, and the temperature detection resistor sends the temperature of the substrate to the processor MCU, and particularly, when the temperature on the substrate is detected to be higher, the processor MCU is triggered to control any one of the heating components in the rectifier, the power factor corrector and the inverter to stop working, so as to avoid burning out of the electronic device, thereby further improving the reliability and thermal stability of the drive control integrated device, and the temperature detection resistor is usually an NTC (negative temperature Coefficient) resistor or a PTC (Positive temperature Coefficient) resistor.
In one embodiment, the diameter of the pins of the rectifier ranges from 0.5mm to 2 mm.
In one embodiment, the pin diameter of the pfc is in the range of 0.5mm to 2 mm.
In one embodiment, the long side of the substrate is less than 100mm, the short side of the substrate is less than 50mm, or the thickness of the substrate is less than 10 mm.
As can be seen from fig. 1, 2, 3 and table 1, the driving control integrated device of the present invention is mounted on the substrateRectifier, power factor corrector, compressor M1Motor drive assembly and fan M2The motor driving component comprises the following specific embodiments:
the output of the rectifier is connected to a power factor corrector, the output of which is connected to the compressor M1Drive assembly and fan M2Compressor M1Drive assembly and fan M2The drive assemblies of (a) are in a parallel relationship.
The rectifier is a full bridge rectifier formed by four diodes.
The Power Factor corrector comprises a BOOST PFC (Power Factor Correction) circuit consisting of an insulated gate bipolar transistor, a freewheeling diode connected with the insulated gate bipolar transistor in anti-parallel and a fast recovery diode.
Compressor M1The motor driving component comprises an inverter 1 and a driver 1, wherein the inverter 1 comprises six insulated gate bipolar transistors and a fast recovery diode connected with a power tube in parallel.
Fan M2The motor driving component comprises an inverter 2 and a driver 2, wherein the inverter 2 comprises six insulated gate bipolar transistors and a fast recovery diode connected with a power tube in parallel.
As shown in fig. 1, fig. 2, fig. 3 and table 1, the external wiring signal flow defined by the substrate pin arrangement is:
an Alternating Current (AC) power supply is input from the pins 2 and 3, half-wave positive voltage is output from the pin 1 through the positive end of the internal rectifier, the half-wave positive voltage is input from the pin 43 after being connected with an inductor L externally connected with a substrate in series, the half-wave positive voltage is output from the pin 42 after passing through a power factor corrector in the substrate in the first path, and the half-wave positive voltage is connected to an external large electrolytic capacitor C1After charging and smoothing are carried out to obtain the voltage of the direct current bus, one branch of the direct current bus is supplied to the compressor M from a pin 421Is powered by a driving circuit, and branches into two paths to supply power to the fan M from a pin 262The drive circuit of (2) supplies power.
TABLE 1
| Serial number | Definition of | Serial number | Definition of |
| 1 | Rectifier output positive terminal | 24 | Fan drive IC power supply positive terminal |
| 2 | AC input 1 | 25 | Fan drive IC power supply negative terminal |
| 3 | AC input 2 | 26 | Bus voltage P of fan |
| 4 | NTC temperature detection output | 27 | U-phase floating power supply for fan |
| 5 | Compressor drive IC power supply negative terminal | 28 | U-phase output of fan |
| 6 | Compressor drive IC power supplyPositive terminal | 29 | V-phase floating power supply for fan |
| 7 | Compressor fault output port | 30 | V-phase output of fan |
| 8 | IGBT drive signal of PFC | 31 | W-phase floating power supply for fan |
| 9 | Compressor WL drive signal | 32 | W-phase output of fan |
| 10 | Compressor VL drive signal | 33 | Bus voltage N of fan |
| 11 | Compressor UL drive signal | 34 | Drive IC power supply negative terminal 2 |
| 12 | Compressor WH drive signal | 35 | Compressor bus voltage N |
| 13 | VH drive signal of compressor | 36 | Compressor U phase output |
| 14 | Compressor UH drive signal | 37 | Compressor U-phase floating power supply |
| 15 | Compressor overcurrent protection | 38 | Compressor V-phase output |
| 16 | Fan overcurrent protection | 39 | Compressor V-phase floating power supply |
| 17 | Fan fault output port | 40 | W-phase output of compressor |
| 18 | Fan WL drive signal | 41 | W-phase floating power supply for compressor |
| 19 | Fan VL drive signal | 42 | Compressor bus voltage P |
| 20 | UL driving signal of fan | 43 | PFC positive terminal |
| 21 | Fan WH drive signal | 44 | Negative terminal of PFC |
| 22 | Blower VH drive signal | 45 | Output negative terminal of rectifier |
| 23 | Blower UH drive signal |
Compressor M1U, V and W pins of the driving circuit are respectively 36 pins, 38 pins and 40 pins, and correspondingly, the bootstrap voltage charging pin is respectively 37 pins (connected with a bootstrap capacitor C)4) Pin 39 (connected with bypass filter capacitor C)3) And pin 41 (connected with a bypass filter capacitor C)2) Fan M2U, V and W pins of the driving circuit are 27 pins, 29 pins and 31 pins respectively, and correspondingly, the bootstrap voltage charging pin is 28 pins (connected with a bootstrap capacitor C)7) Pin 30 (with bootstrap capacitor C)6) And 32 pins (with bootstrap capacitor C)5)。
Compressor M1After the power P is supplied from the pin 42, the current is outputted from three upper bridge transistors in the substrate → U/V/W → three lower bridge transistors in the substrate → pin 35N under the vector operation control, and then is passed through the compressor M1SamplingResistance R1Back flow large electrolytic capacitor C1The negative electrode of (1).
Fan M2After power P is supplied from the 26 pins, current is output from three upper bridge transistors → U/V/W → three lower bridge transistors → 33 pins N in the substrate under the vector operation control, and passes through the fan M2Sampling resistor R2Back flow large electrolytic capacitor C1The negative electrode of (1).
The second path is output from 44 pins through a power factor corrector in the substrate and is connected with a large electrolytic capacitor C1After being collected by the negative electrode, the current passes through a current sampling resistor R at the direct current side3Then, the voltage enters from the 45 pin and returns to the negative end of the rectifier, and then returns to the alternating current power supply AC.
The pin arrangement definition is beneficial to external component layout and corresponding layout and routing, and is beneficial to improving the electromagnetic interference performance.
In addition, to reduce the internal part of the base plate to the compressor M1Fan M2Current detection path of (2): will be the compressor M1The over-current protection port ITRIP is arranged on the 15 pins of the upper row of pins of the base plate, and the compressor M1Is measured through a sampling resistor R1Then, R passes through the overcurrent detection circuit4Then, the overcurrent protection port of the driver 1, which enters the inside of the substrate from the 15 pins, performs overcurrent protection.
The fan M2The overcurrent protection port FITIRIP is arranged on a base plate and is provided with 16 pins of pins, and a fan M2Is measured through a sampling resistor R2Then, R passes through the overcurrent detection circuit5After that, the overcurrent protection port of the driver 2, which enters the inside of the substrate from the 16 pins, performs overcurrent protection.
The drive control integrated device limited by the application has an overcurrent protection function and is realized by at least adopting the following two modes:
(1) as shown in FIG. 1, 15 pins and 16 pins are arranged on the second edge, and the interior of the substrate faces the compressor M1Fan M2Current detection path of (2): will be the compressor M1The over-current protection port ITRIP is arranged on the 15 pins of the upper row of pins of the base plate, and the compressor M1Is measured through a sampling resistor R1After that, through an overcurrent detection circuitR4Then, the overcurrent protection port of the driver 1, which enters the inside of the substrate from the 15 pins, performs overcurrent protection.
The fan M2The overcurrent protection port FITIRIP is arranged on a base plate and is provided with 16 pins of pins, and a fan M2Is measured through a sampling resistor R2Then, R passes through the overcurrent detection circuit5After that, the overcurrent protection port of the driver 2, which enters the inside of the substrate from the 16 pins, performs overcurrent protection.
(2) As shown in FIG. 2, the first edge is provided with 15 pins and 16 pins, and the interior of the substrate faces the compressor M1Fan M2Current detection path of (2): will be the compressor M1The over-current protection port ITRIP is arranged at 15 pins of the lower row of pins of the base plate, and the compressor M1Is measured through a sampling resistor R1Then, R passes through the overcurrent detection circuit4Then, the overcurrent protection port of the driver 1, which enters the inside of the substrate from the 15 pins, performs overcurrent protection.
The fan M2The overcurrent protection port FITIRIP is arranged on 16 pins of the lower row of pins of the substrate, and the fan M2Is measured through a sampling resistor R2Then, R passes through the overcurrent detection circuit5After that, the overcurrent protection port of the driver 2, which enters the inside of the substrate from the 16 pins, performs overcurrent protection.
(3) As shown in fig. 1 and 2, the 15 pins and the 16 pins are arranged on the edge of the substrate, and if the 15 pins and the 16 pins are arranged on the second edge, the reduction of the compressor M in the substrate is facilitated1Fan M2The pin 15 and the pin 16 are connected with an overcurrent protection section of the processor to directly trigger the processor to perform overcurrent protection, wherein the overcurrent protection end can be a common data port or an interrupt port.
Optionally, the substrate has a rectangular structure with a long side of 50 mm-100 mm, a short side of 10 mm-50 mm, and a thickness of 3 mm-10 mm.
Optionally, the distance between the centers of the strong current pins is 2.5mm to 6.0mm, and the distance between the centers of the weak current pins is 0.3mm to 3.0 mm.
Optionally, the diameter of the strong current pin is 0.3mm to 2mm, specifically, the diameter of the pin of the motor driving component of the rectifier, the power factor corrector, and the compressor M1 is 0.5mm to 2.0mm, and the diameter of the pin of the motor driving component of the fan M2 is 0.3mm to 1.5 mm.
Optionally, the diameter of the weak current pin is 0.1 mm-1 mm.
The 1-25 pins are arranged on the first edge of the substrate, the 26-45 pins are arranged on the second edge of the substrate, and pins are led out from two long edges, and the arrangement mode of single-side single-row, double-side double-row, single-side double-row on both sides or double-side double-row on both sides is adopted.
Optionally, the pins are in a form of a direct package or in a form of a chip package.
In addition, a temperature detection resistor is arranged in the substrate, the internal temperature of the substrate can be detected and output, and protection measures such as voltage limiting and frequency reduction can be timely executed by an external processor MCU.
According to the utility model discloses an air conditioner that embodiment limited includes: the indoor unit is provided with an indoor unit fan; the outdoor unit is provided with a compressor and/or an outdoor unit fan; according to the drive control integrated device in any one of the above technical solutions, an external pin of the drive control integrated device is connected to the indoor unit and/or the outdoor unit, and the drive control integrated device is configured to control at least one load of the indoor unit fan, the compressor and the outdoor unit fan to operate.
Aiming at the technical problems in the prior art, the utility model provides a drive control integrated device and an air conditioner, a temperature detector is arranged in the area between a rectifier and a power factor corrector, because the power factor corrector belongs to a high heat dissipation part, and the power factor corrector has great significance for motor drive, the electric power efficiency of a motor is effectively regulated and controlled by adjusting the phase difference between current and voltage, therefore, the temperature detector is arranged to mainly detect the temperature of the distribution area of the power factor corrector and send the detected temperature information to a processor, the power factor corrector, a motor drive assembly of a compressor and a motor drive assembly of a fan are all connected and controlled by the processor, therefore, when abnormal temperature is detected, the processor can output a cut-off instruction to the power factor corrector to control the power factor corrector to stop working, the possibility of burning the power factor corrector can be effectively reduced, and the reliability of the drive control device is further improved.
It should be noted that in the claims, any reference signs placed between parentheses shall not be construed as limiting the claim.
The word "comprising" does not exclude the presence of elements or steps not listed in a claim.
The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The invention can be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware. The usage of the words first, second and third, etcetera do not indicate any ordering. These words may be interpreted as names.
While the preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the scope of the invention.
In the description of the present invention, the term "plurality" means two or more unless explicitly stated or limited otherwise; the terms "connected," "secured," and the like are to be construed broadly and unless otherwise stated or indicated, and for example, "connected" may be a fixed connection, a removable connection, an integral connection, or an electrical connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the description of the present specification, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Obviously, various modifications and changes may be made by those skilled in the art without departing from the scope of the present invention and its equivalents, and it is intended that the present invention also include such modifications and changes.
Claims (20)
1. A drive control integrated device, wherein a processor is externally connected to the drive control integrated device, the drive control integrated device comprising:
the motor driving assembly comprises a substrate, wherein a rectifier, a power factor corrector, a motor driving assembly of a compressor and a motor driving assembly of a fan are sequentially integrated on the substrate along the direction of a first edge of the substrate;
the temperature detector is arranged in an area between the rectifier and the power factor corrector and is connected to the processor through a pin at the second edge of the substrate so as to send the temperature information of the power factor corrector to the processor.
2. The drive control integrated device according to claim 1, wherein the motor drive assembly comprises:
a driver configured to receive a driving control signal sent by the processor and generate a pulse modulation signal according to the driving control signal;
an inverter having an input connected to an output of the driver, the inverter configured to drive operation of a motor according to the pulse modulated signal,
the inverter is bridged between a high-voltage bus and a low-voltage bus, the input end of the motor is connected to the output end of the inverter through the pin at the first edge, and the processor is connected to the driver through the pin at the second edge of the substrate.
3. The drive control integrated device according to claim 2, wherein the temperature detector comprises:
a temperature detection resistor arranged on the substrate, wherein a first end of the temperature detection resistor is connected to the driver, a second end of the temperature detection resistor is connected to the processor through a pin at the second edge,
the resistance value of the temperature detection resistor is in positive correlation or negative correlation with the temperature of the substrate.
4. The drive control integrated device according to claim 2,
the layout area of the power factor corrector on the substrate is marked as a target area, and the temperature detector is arranged in the target area.
5. The drive control integrated device according to claim 2,
the driver of the fan and the driver of the compressor are integrated in the same driver chip, or the driver of the fan and the driver of the compressor are arranged in two separated driver chips.
6. The drive control integrated device according to claim 2,
the first edge and the second edge are parallel opposite sides of the substrate, the heat dissipation capacity of a motor driving assembly of the fan is smaller than that of a motor driving assembly of the compressor, and the heat dissipation capacity of the power factor corrector is larger than that of the rectifier.
7. The drive control integrated device according to any one of claims 2 to 6,
the diameter range of the pins of the driver of the fan is 0.3-1.5 mm, or the diameter range of the pins of the driver of the compressor is 0.5-2 mm.
8. The drive control integrated device according to any one of claims 1 to 6,
and the pins of the motor driving assembly are inserted and/or welded on the substrate.
9. The drive control integrated device according to any one of claims 2 to 6,
the rectifier comprises four switch bridge arms, each switch bridge arm is provided with a switch tube, a power supply signal is input into the rectifier through a pin at the second edge,
wherein the rectifier is configured to convert the supply signal to a bus signal and load the bus signal to the high voltage bus and the low voltage bus.
10. The integrated device for driving control according to any one of claims 2 to 6, wherein the integrated device for driving control is connected to the inductive element through an external pin, a first end of the inductive element is connected to the high voltage bus, and the power factor corrector comprises:
the control end of the power tube is connected to an output pin of the driver, the first end of the power tube is connected to the ground wire, the second end of the power tube is connected to the second end of the inductive element through a pin at the first edge, the first end of the inductive element is connected to the high-voltage bus through a pin at the second edge, and the pulse modulation signal is configured to control the power tube to be switched on or switched off;
and the first one-way conduction element is connected between the second end of the power tube and the input end of the inverter.
11. The drive control integrated device according to claim 10, further comprising:
and the second one-way conduction element is connected between the first end of the power tube and the second end of the power tube.
12. The drive control integrated device according to claim 11,
and after the second end of the power tube is connected to the first unidirectional conducting element, the second end of the power tube is connected to the second end of a capacitive element through a pin of the first edge, the first end of the capacitive element is connected to the ground wire, and the capacitive element is configured to filter ripple signals and/or surge signals flowing through the high-voltage bus.
13. The drive control integrated device according to any one of claims 2 to 6, wherein the inverter includes:
at least two parallelly connected half-bridge circuit of way, half-bridge circuit bridge connection is in between the high voltage bus with the low pressure bus, half-bridge circuit includes:
the pulse modulation signal is configured to control the two switching tubes connected in series to be conducted alternately.
14. The drive control integrated device according to claim 13,
the switch tube is a metal oxide semiconductor field effect transistor or an insulated gate bipolar transistor,
wherein the grid electrode of the metal oxide semiconductor field effect transistor is the control end, a reverse freewheeling diode is connected between the source electrode and the drain electrode of the metal oxide semiconductor field effect transistor,
the base electrode of the insulated gate bipolar transistor is the control end, and a reverse freewheeling diode is connected between the emitter electrode and the collector electrode of the insulated gate bipolar transistor.
15. The drive control integrated device according to claim 14,
the metal oxide semiconductor field effect transistor comprises at least one of a silicon type metal oxide semiconductor field effect transistor, a silicon carbide type metal oxide semiconductor field effect transistor and a gallium nitride type metal oxide semiconductor field effect transistor.
16. The drive control integrated device according to any one of claims 2 to 6,
an overcurrent detection pin of the driver is connected to a second pin of a detection resistor through a pin at the first edge, a first pin of the detection resistor is connected to the grounding end of the inverter, the driver feeds an overcurrent signal generated by the detection resistor back to the processor, the first pin and the second pin are arranged adjacently,
wherein the processor outputs a drive control signal to turn off the inverter and/or the power factor corrector in response to the over-current signal.
17. The drive control integrated device according to any one of claims 1 to 6,
the diameter range of the pins of the rectifier is 0.5-2 mm.
18. The drive control integrated device according to any one of claims 1 to 6,
the diameter range of the pin of the power factor corrector is 0.5 mm-2 mm.
19. The drive control integrated device according to any one of claims 1 to 6,
the long side of the substrate is less than 100mm, or the short side of the substrate is less than 50mm, or the thickness of the substrate is less than 10 mm.
20. An air conditioner, comprising:
the indoor unit is provided with an indoor unit fan;
the outdoor unit is provided with a compressor and/or an outdoor unit fan;
the drive control integrated device according to any one of claims 1 to 18, wherein an external pin of the drive control integrated device is connected to the indoor unit and/or the outdoor unit, and the drive control integrated device is configured to control at least one load operation of the indoor unit fan, the compressor, and the outdoor unit fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921544820.1U CN210431275U (en) | 2019-09-17 | 2019-09-17 | Drive control integrated device and air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921544820.1U CN210431275U (en) | 2019-09-17 | 2019-09-17 | Drive control integrated device and air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210431275U true CN210431275U (en) | 2020-04-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921544820.1U Active CN210431275U (en) | 2019-09-17 | 2019-09-17 | Drive control integrated device and air conditioner |
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| Country | Link |
|---|---|
| CN (1) | CN210431275U (en) |
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2019
- 2019-09-17 CN CN201921544820.1U patent/CN210431275U/en active Active
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