CN205940853U - Pressure sensor and car that is suitable for - Google Patents
Pressure sensor and car that is suitable for Download PDFInfo
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- CN205940853U CN205940853U CN201620970477.7U CN201620970477U CN205940853U CN 205940853 U CN205940853 U CN 205940853U CN 201620970477 U CN201620970477 U CN 201620970477U CN 205940853 U CN205940853 U CN 205940853U
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- support plate
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Abstract
The utility model discloses a pressure sensor and car that is suitable for. Wherein, pressure sensor includes: have the open -ended shell, be used for responding to air pressure's forced induction chip, contain chip fin, with the shell together will forced induction chip package includes at wherein support plate: the support plate body with run through the support plate pin of support plate plate body, the chip fin of forced induction chip with be located the support plate pin of support plate body one side corresponds to be connected, pressure signal processing apparatus, with the support plate pin electricity of support plate body opposite side is connected, and it is right to be used for the pressure signal that the forced induction chip provided carries out signal processing. The utility model provides a sensing signal processing apparatus in short problem of high voltage ring lower life -span of border to and the problem that the chip that a plurality of encapsulation are in the same place can't be held to normalized shell size has been solved.
Description
Technical field
The utility model embodiment is related to encapsulation technology, more particularly, to a kind of pressure sensor and the automobile being suitable for.
Background technology
With the extensive application in each field for the sensor, the requirement to sensor for the different field is also different.Such as exist
Setting pressure sensor in the air compressor of automobile, needs pressure sensor to have antidetonation, durability strong.For this reason, technology people
Pressure sensitive circuit, pressure signal processing circuit etc. are encapsulated in pressure sensor by the way of integrated circuit by member.
However, the pressure sensor that aforesaid way obtains is under the high-low pressure change situation of many frequencys, service life is obvious
Not enough.
Meanwhile, ripe day by day with chip encapsulation technology, TO encapsulation technology is widely applied in each chip neck
Domain.More general TO encapsulation is by chip carrier standardization so that the pressure of the space that provided of standardized shell and high integration
It is impossible to perfect matching between the size of force snesor.Accordingly, it would be desirable to improve for drawbacks described above.
Utility model content
The utility model provides a kind of pressure sensor and the automobile being suitable for, cannot to solve existing pressure sensor
The air pressure being applied in automobile that is stable and being easier to produce in batches detects.
In a first aspect, the utility model embodiment provides a kind of pressure sensor, including：Shell with opening；With
In the pressure sensitive chip of sensing air pressure, comprise chip pin；Together with described shell, described pressure sensitive chip is sealed
The support plate being mounted in it, described support plate includes：Support plate body and the support plate pin running through described support plate plate body；Described pressure sensitive
The chip pin of chip is corresponding with the support plate pin positioned at described support plate body side to be connected；Pressure signal processing meanss, with institute
State the support plate pin electrical connection of support plate body opposite side, the pressure signal for being provided to described pressure sensitive chip carries out letter
Number process.
Second aspect, the utility model embodiment additionally provides a kind of automobile, including：Automobile air compressor；And, if
Put the pressure sensor as above in described automobile air compressor；Wherein, by support plate and outer in described pressure sensor
The pressure sensitive chip of shell encapsulation is arranged in the high-pressure chamber of described automobile air compressor, and described pressure signal processing meanss set
It is placed in outside described high-pressure chamber.
Pressure sensitive chip is individually encapsulated by the utility model, solves induced signal processing meanss longevity under hyperbaric environment
Order shorter problem, and solve the problems, such as that standardized shell sizes cannot accommodate multiple chips being packaged together.
Brief description
Fig. 1 is the structural representation of the pressure sensor in the utility model embodiment one；
Fig. 2 is the support plate pin in A-A direction and chip pin in pressure sensor in the utility model embodiment one
Connection diagram；
Fig. 3 is to print in the pressure signal processing meanss in B-B direction in pressure sensor in the utility model embodiment one
Printed circuit board and the connection diagram of pressure signal process chip.
Specific embodiment
The utility model is described in further detail with reference to the accompanying drawings and examples.It is understood that herein
Described specific embodiment is used only for explaining the utility model, rather than to restriction of the present utility model.Further need exist for
Bright, for the ease of description, in accompanying drawing, illustrate only the part related to the utility model rather than entire infrastructure.
Refer to Fig. 1, the utility model one embodiment provides a kind of pressure sensor.The present embodiment is applicable to detect vapour
Air pressure signal (hereinafter referred to as pressure signal) in the equipment based on voltage-controlled driving such as car.Wherein, described voltage-controlled driving sets
Air compressor is comprised, described pressure sensor is arranged on the air outlet slit side of air compressor in standby.Air compressor can root
Adjust the compression situation of air compressor according to the pressure signal that described pressure sensor provides.Described pressure sensor includes：Pressure
Power induction chip 12, encapsulates shell 11 and the support plate 13 of described pressure sensitive chip 12, and pressure signal processing meanss 14.
Described shell 11 carries opening, in order to allow the air of air intlet or air outlet slit enter in shell 11, to seal
The pressure sensitive chip 12 being contained in shell 11 can sense air pressure and produce pressure signal.The quantity of opening can be one
Individual or multiple.Opening may be provided at the top of shell 11, side Bi Deng position.Described shell 11 is preferably metal material, with facility
With TO encapsulation technology, pressure sensitive chip 12 is packaged.Wherein, described shell 11 is according to TO encapsulation technology defined
Professional standard buying.For the ease of pressure sensitive chip 12 is fixed in air inlet duct and air outlet duct, institute
State shell 11 preferably stepped, so in automobile making, described shell 11 can be fixed in pipeline.
Described pressure sensitive chip 12 is the semiconductor devices being manufactured based on MEMS (MEMS).It includes at least electricity
The chip pins 121 such as source pin, pressure signal output pin.Described chip pin 121 can be in needle-like or paster shape.
Described pressure sensitive chip 12 utilizes the corresponding relation of air pressure-resistance, and the air pressure change being sensed is changed
Become electric signal, and electric signal is exported by chip pin 121.For example, described pressure sensitive chip 12 is in monocrystalline silicon
Wheatstone bridge, the voltage inhibition effect being produced with air pressure change using bridge wall resistance value are spread on piece, produces a differential voltage
Signal, this difference voltage signal is pressure signal.
Described support plate 13 be used for pressure signal transmission that pressure sensitive chip 12 is sensed to outside pressure signal at
Reason device 14.
Described support plate 13 is provided with support plate pin 131 corresponding with chip pin 121 quantity, each chip pin 121 and load
The corresponding electrical connection of plate pin 131.Wherein, described support plate pin 131 runs through support plate plate body.Described support plate pin 131 is in support plate plate
The fixing side of body and chip pin 121 can be paster shape (as pad or metal patch) or needle-like (as metal wire or pin
Pin).Described support plate pin 131 is needle-like in the opposite side of support plate plate body, so that and outside pressure signal processing meanss 14 phase
Even.
Described chip pin 121 and support plate pin 131 can be fixed, as shown in Figure 2 by the way of welding.Preferably, institute
State support plate pin 131 to be fixed together by wire bonding mode with chip pin 121.Specifically, described support plate pin 131 with
Chip pin 121 electrical connection side is metal wire, and using the mode such as heat, pressure or ultrasonic energy, allows this metal wire and pressure
The chip pin 121 of power induction chip 12 occur electronics to share or atom phase counterdiffusion so that realizing former between two kinds of metals
Bonding in sub- magnitude, so realizes the electric interconnection between chip and support plate 13.
Particular for the strong motion applied environment of automobile, the gap perfusion between described support plate 13 and pressure sensitive chip 12
Flexible glue.Wherein, described flexible glue is the insulation colloid meeting default coefficient of elasticity, in order to protect pressure sensitive chip 12 to mitigate outside
Vibrations are to the destruction electrically connecting between chip internal and chip and support plate.Described flexible glue is exemplified as silica gel.The pressure surrounded by flexible glue
Power induction chip 12 can reduce the destruction to it for the automobile macroseism.During fabrication, using default preference temperature, flexible glue is softened
Afterwards, it is poured between support plate 13 and pressure sensitive chip 12, after temperature reduces, flexible glue becomes support plate 13 and pressure sensitive chip
Insulating protector between 12.
Described pressure signal processing meanss 14 are electrically connected with described support plate pin 131, for described pressure sensitive chip
12 pressure signals being provided carry out signal transacting.
Specifically, described pressure signal processing meanss 14 are the signal processing circuit of pressure sensitive chip 12, for institute
The pressure signal receiving is amplified, filters, calibrating etc. processing, to be that air compressor or other testing equipments provide accurately
Air pressure value.Described pressure signal processing meanss 14 can be single-chip microcomputer or integrated circuit.
As shown in figure 1, in order to help packaged pressure sensitive chip 12 is fixed in pipeline, avoid pressure to believe simultaneously
Number processing meanss 14 are destroyed by pressure-air, and described pressure signal processing meanss 14 are arranged on outside pipeline, so pressure letter
There is space at interval number between processing meanss 14 and support plate 13 body.Between described pressure signal processing meanss 14 and support plate 13 body
The space at interval can be matched with pipeline wall thickness it is also possible to be more than pipeline wall thickness.
In a kind of preferred version, described pressure signal processing meanss 14 include：Electrically connect with described support plate pin 131
Printed circuit board (PCB)；And arrangement at least one pressure signal process chip on the printed circuit board, for by described
The pressure signal that support plate pin 131 is provided to described pressure sensitive chip 12 carries out signal transacting.
Wherein, described printed circuit board (PCB) is pressure sensitive chip 12 and each pressure signal process chip provides and connects circuit.
Described printed circuit board (PCB) can comprise a metal figure layer, can also be multiple metal figure layers.Described metal figure layer is patterning
Conductive Butut, for being that pressure sensitive chip 12 and each pressure signal process chip provide electrical connection, bias voltage etc..Work as institute
When stating printed circuit board (PCB) for multilayer, described printed circuit board (PCB) also includes the conductive hole for running through each layer.For the ease of multiple pressures
The arrangement of force signal process chip, described support plate pin 131 is fixed on the layer of metal figure layer of printed circuit board (PCB), at least one pressure
Force signal process chip 142 is arranged on the another layer of metal figure layer of described printed circuit board (PCB).For example, as shown in figure 3, described printing
Circuit board 141 comprises double layer of metal figure layer and connects the conductive hole 143 of two metal figure layers, and the metal figure layer of this two-layer is located at respectively
The obverse and reverse of printed circuit board (PCB) 141, described support plate pin 131 is fixed on the front of printed circuit board (PCB) 141, at pressure signal
Reason chip 142 is arranged at the reverse side of printed circuit board (PCB) 141.Pressure signal process chip 142 is provided with and is connected with support plate pin 131
Pad 144.
Described pressure signal process chip can be the circuit integrated using semiconductor technology, and it includes following at least one
Kind：Filtering process chip, calibration process chip and readout circuit chip.
Wherein, described filtering process chip comprises signal amplification circuit, digital to analog converter and filter circuit etc., for inciting somebody to action
The slight pressure signal of the simulation that described pressure sensitive chip 12 is provided is converted into the pressure signal of digitized low noise.
Described calibration process chip is used for according to the systematic error of pressure sensitive chip 12 and its peripheral circuit, random error
Corrected Deng caused pressure signal deviations.
Described readout circuit chip is used for the sense order according to the external detection system being connected, will be according to pressure signal
Obtained pressure value is exported.In order to protect readout circuit chip, described readout circuit chip is fixed on print by ebonite
On printed circuit board.Described ebonite meets the colloid of default hardness number, such as epoxy resin for hardness.
As shown in Fig. 1,2 and 3, the structure example of described pressure sensor is as follows：
Pressure sensitive chip 12 is encapsulated by the modular housing 11 with opening and standard support plate 13, wherein, support plate 13
Including：Support plate 13 body of bearing pressure induction chip 12 and the support plate pin 131 running through support plate 13 body.Described feeling of stress
Answer chip pin 121 and the corresponding electrical connection of support plate pin 131 of chip 12.Between pressure sensitive chip 12 and support plate 13 body
It is perfused with flexible glue.Described support plate pin 131 also extends through the conductive hole of printed circuit board (PCB) and is welded on the pad around conductive hole, pressure
Pad in force signal process chip 142 passes through the wire electrical connection corresponding with each support plate pin 131 on printed circuit board (PCB) 141.
Space is left between described printed circuit board (PCB) 141 and support plate 13.
In the present embodiment, pressure sensitive chip is individually encapsulated, solve induced signal processing meanss longevity under hyperbaric environment
Order shorter problem, and solve the problems, such as that standardized shell sizes cannot accommodate multiple chips being packaged together.Separately
Outward, select stepped shell and be conducive to clearance space between pressure signal processing meanss and support plate body by pressure sensitive core
Piece is individually embedded in hyperbaric environment.In addition, fixing support plate pin is effectively prevented with chip pin by the way of wire bonding
Under adverse circumstances, pressure induction chip is unstable with the connection of external signal processing meanss.In addition, in support plate and pressure sensitive core
Flexible glue is irrigated, it is possible to increase the shock resistance of pressure sensitive chip in gap between piece.
Embodiment two
On the basis of the various embodiments described above, the present embodiment also provide a kind of with the pressure described in the various embodiments described above
The automobile of sensor.Described automobile is by power drive, has the vehicle that the non-track of four or more wheel carries.Vapour
Car includes central control system and power-driven system.Wherein, central control system is the control system controlling air conditioning for automobiles, door lock etc..Institute
State power-driven system and include automobile air compressor, engine, rotation shaft of wheel etc., for controlling vehicle to travel.Wherein, described
Automobile air compressor, is air pump again, and its operation principle is to suck gas receiver or the storage that natural air is pumped into automobile chassis
Gas tank, making the air under normality have pressure becomes compressed air.The air of compression can promote wheel cylinder, clutch slave cylinder,
Thus controlling the braking of automobile, hand braking (being commonly called as air-cut-off break).Part oversize vehicle also needs to pneumatically and realizes high low speed
Gearshift.In addition, can realize, using the air of compression, the spraying function stopped that drips, thus realizing the cooling of brake rim, thus having
Effect ground reduce automobile in daily traveling because promptly acutely brake leads to brake block to burn out, thus avoiding brake failure
The generation of accident.
Described pressure sensor is arranged on described automobile air compressor.Specifically, carried in described pressure sensor
The pressure sensitive chip of plate and shell encapsulation is arranged in the high-pressure chamber of described automobile air compressor, and described pressure signal is processed
Device is arranged at outside described high-pressure chamber.Wherein, described high-pressure chamber is the storage silo of automobile air compressor compressed air.
Here, support plate is fixed in high-pressure chamber, the support plate pin on support plate passes outside high-pressure chamber, and pressure signal is processed
Each pad of device is corresponding to be welded together with support plate pin.So, on the one hand, the size of described pressure signal processing meanss
Do not limited by standardized shell accommodation space, on the other hand, described pressure signal processing meanss are broken from hyperbaric environment
Bad.
Note, above are only preferred embodiment of the present utility model and institute's application technology principle.Those skilled in the art's meeting
Understand, the utility model is not limited to specific embodiment described here, can carry out various bright for a person skilled in the art
Aobvious change, readjust and substitute without departing from protection domain of the present utility model.Therefore although passing through above example
The utility model is described in further detail, but the utility model is not limited only to above example, without departing from
In the case of the utility model design, other Equivalent embodiments more can also be included, and scope of the present utility model is by appended
Right determine.
Claims (8)
1. a kind of pressure sensor is it is characterised in that include：
Shell with opening；
For sensing the pressure sensitive chip of air pressure, comprise chip pin；
Together with described shell by described pressure sensitive chip package support plate wherein, including：Support plate body and run through described
The support plate pin of support plate plate body；The chip pin of described pressure sensitive chip and the support plate pin positioned at described support plate body side
Corresponding connection；
Pressure signal processing meanss, are electrically connected with the support plate pin of described support plate body opposite side, for described pressure sensitive
The pressure signal that chip is provided carries out signal transacting.
2. pressure sensor according to claim 1 is it is characterised in that described shell is stepped；And/or, described pressure
Between force signal processing meanss and described support plate body, there is space at interval.
3. pressure sensor according to claim 1 is it is characterised in that described support plate pin passes through lead with chip pin
Bonding pattern is fixed together.
4. pressure sensor according to claim 1 is it is characterised in that seam between described support plate and pressure sensitive chip
Gap irrigates flexible glue.
5. pressure sensor according to claim 1 is it is characterised in that described pressure signal processing meanss include：
The printed circuit board (PCB) electrically connecting with described support plate pin；And arrangement at least one pressure on the printed circuit board
Signal processing chip, the pressure signal for being provided to described pressure sensitive chip by described support plate pin is carried out at signal
Reason.
6. pressure sensor according to claim 5 it is characterised in that described pressure signal process chip include with down to
Few one kind：Filtering process chip, calibration process chip and readout circuit chip.
7. pressure sensor according to claim 5 is it is characterised in that described printed circuit board (PCB) is at least double layer of metal figure
Layer, described support plate pin is fixed on the layer of metal figure layer of printed circuit board (PCB), and at least one pressure signal process chip is arranged on
The another layer of metal figure layer of described printed circuit board (PCB).
8. a kind of automobile is it is characterised in that include：
Automobile air compressor；
And, be arranged on described automobile air compressor as described pressure sensor arbitrary in claim 1-7；Wherein,
It is arranged at the high pressure of described automobile air compressor by the pressure sensitive chip of support plate and shell encapsulation in described pressure sensor
In storehouse, described pressure signal processing meanss are arranged at outside described high-pressure chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620970477.7U CN205940853U (en) | 2016-08-26 | 2016-08-26 | Pressure sensor and car that is suitable for |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620970477.7U CN205940853U (en) | 2016-08-26 | 2016-08-26 | Pressure sensor and car that is suitable for |
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| Publication Number | Publication Date |
|---|---|
| CN205940853U true CN205940853U (en) | 2017-02-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620970477.7U Active CN205940853U (en) | 2016-08-26 | 2016-08-26 | Pressure sensor and car that is suitable for |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106197824A (en) * | 2016-08-26 | 2016-12-07 | 华景传感科技（无锡）有限公司 | Pressure transducer and the automobile being suitable for |
| CN108106775A (en) * | 2017-12-13 | 2018-06-01 | 芜湖致通汽车电子有限公司 | A kind of temperature and pressure transmitter |
| CN110567632A (en) * | 2019-08-29 | 2019-12-13 | 北京自动化控制设备研究所 | Core body composite silicon piezoresistive pressure sensor |
| CN113375840A (en) * | 2020-02-25 | 2021-09-10 | 北京机械设备研究所 | Pressure sensor and packaging method thereof |
-
2016
- 2016-08-26 CN CN201620970477.7U patent/CN205940853U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106197824A (en) * | 2016-08-26 | 2016-12-07 | 华景传感科技（无锡）有限公司 | Pressure transducer and the automobile being suitable for |
| CN108106775A (en) * | 2017-12-13 | 2018-06-01 | 芜湖致通汽车电子有限公司 | A kind of temperature and pressure transmitter |
| CN110567632A (en) * | 2019-08-29 | 2019-12-13 | 北京自动化控制设备研究所 | Core body composite silicon piezoresistive pressure sensor |
| CN113375840A (en) * | 2020-02-25 | 2021-09-10 | 北京机械设备研究所 | Pressure sensor and packaging method thereof |
| CN113375840B (en) * | 2020-02-25 | 2022-12-23 | 北京机械设备研究所 | Pressure sensor and packaging method thereof |
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