CN106197824A - Pressure transducer and the automobile being suitable for - Google Patents
Pressure transducer and the automobile being suitable for Download PDFInfo
- Publication number
- CN106197824A CN106197824A CN201610739706.9A CN201610739706A CN106197824A CN 106197824 A CN106197824 A CN 106197824A CN 201610739706 A CN201610739706 A CN 201610739706A CN 106197824 A CN106197824 A CN 106197824A
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- CN
- China
- Prior art keywords
- support plate
- pressure
- chip
- pin
- signal processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/06—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices
Abstract
The invention discloses a kind of pressure transducer and the automobile being suitable for.Wherein, described pressure transducer includes: with the shell of opening；For sensing the pressure sensitive chip of air pressure, comprise chip pin；By described pressure sensitive chip package support plate wherein together with described shell, including: support plate body and the support plate pin that runs through described support plate plate body；The chip pin of described pressure sensitive chip is corresponding with the support plate pin being positioned at described support plate body side to be connected；Pressure signal processing means, electrically connects with the support plate pin of described support plate body opposite side, carries out signal processing for the pressure signal being provided described pressure sensitive chip.The present invention solves the induced signal processing means problem that the life-span is shorter under environment under high pressure, and solves the problem that standardized shell sizes cannot accommodate multiple chip being packaged together.
Description
Technical field
The present embodiments relate to encapsulation technology, particularly relate to a kind of pressure transducer and the automobile being suitable for.
Background technology
Along with sensor is in the extensive application in each field, different field is the most different to the requirement of sensor.Such as exist
In the air compressor of automobile, pressure transducer is set, needs pressure transducer to have antidetonation, ruggedness strong.To this end, technology people
Member uses the mode of integrated circuit by encapsulation such as pressure sensitive circuit, pressure signal processing circuit in pressure sensor.
But, the pressure transducer that aforesaid way obtains is under the high-low pressure change situation of many frequencys, and service life is obvious
Not enough.
Meanwhile, along with the maturation day by day of chip encapsulation technology, TO encapsulation technology wider application is led at each chip
Territory.More general TO encapsulates chip carrier standardization so that the space that standardized shell is provided and the pressure of high integration
Between the size of force transducer, it is impossible to Perfect Matchings.Accordingly, it would be desirable to improve for drawbacks described above.
Summary of the invention
The present invention provides a kind of pressure transducer and the automobile being suitable for, and cannot stablize solving existing pressure transducer
And be easier to batch production the air pressure being applied in automobile detection.
First aspect, embodiments provides a kind of pressure transducer, including: with the shell of opening；For feeling
Answer the pressure sensitive chip of air pressure, comprise chip pin；Together with described shell, described pressure sensitive chip package is existed
Support plate therein, described support plate includes: support plate body and the support plate pin running through described support plate plate body；Described pressure sensitive chip
Chip pin corresponding with the support plate pin being positioned at described support plate body side connect；Pressure signal processing means, with described load
The support plate pin electrical connection of plate body opposite side, is carried out at signal for the pressure signal being provided described pressure sensitive chip
Reason.
Second aspect, the embodiment of the present invention additionally provides a kind of automobile, including: automobile air compressor；And, it is arranged on
The pressure transducer as above of described automobile air compressor；Wherein, described pressure transducer is sealed by support plate and shell
The pressure sensitive chip of dress is arranged in the high-pressure chamber of described automobile air compressor, and described pressure signal processing means is arranged at
Outside described high-pressure chamber.
Pressure sensitive chip is individually encapsulated by the present invention, and the life-span is relatively under environment under high pressure to solve induced signal processing means
Short problem, and solve the problem that standardized shell sizes cannot accommodate multiple chip being packaged together.
Accompanying drawing explanation
Fig. 1 is the structural representation of the pressure transducer in the embodiment of the present invention one；
Fig. 2 is support plate pin and the connection of chip pin in A-A direction in the pressure transducer in the embodiment of the present invention one
Schematic diagram；
Fig. 3 be B-B direction in the pressure transducer in the embodiment of the present invention one pressure signal processing means in printing electricity
Road plate and pressure signal process the connection diagram of chip.
Detailed description of the invention
The present invention is described in further detail with embodiment below in conjunction with the accompanying drawings.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention, rather than limitation of the invention.It also should be noted that, in order to just
Part related to the present invention is illustrate only rather than entire infrastructure in description, accompanying drawing.
Referring to Fig. 1, one embodiment of the invention provides a kind of pressure transducer.The present embodiment is applicable to detect automobile etc.
Air pressure signal (hereinafter referred to as pressure signal) in equipment based on voltage-controlled driving.Wherein, in described voltage-controlled driving equipment
Comprising air compressor, described pressure transducer is arranged on the air outlet slit side of air compressor.Air compressor can be according to institute
The pressure signal that stating pressure transducer provides adjusts the compression situation of air compressor.Described pressure transducer includes: feeling of stress
Answer chip 12, encapsulate shell 11 and the support plate 13 of described pressure sensitive chip 12, and pressure signal processing means 14.
Described shell 11 is with opening, in order to allow the air of air intlet or air outlet slit enter in shell 11, in order to envelope
The pressure sensitive chip 12 being contained in shell 11 can sense air pressure and produce pressure signal.The quantity of opening can be one
Individual or multiple.Opening may be provided at the positions such as the top of shell 11, sidewall.Described shell 11 is preferably metal material, in order to profit
By TO encapsulation technology, pressure sensitive chip 12 is packaged.Wherein, described shell 11 is according to TO encapsulation technology defined
Industry standard buying.For the ease of pressure sensitive chip 12 is fixed in air inlet duct and air outlet duct, institute
State shell 11 the most stepped, so when automobile making, described shell 11 can be fixed in pipeline.
Described pressure sensitive chip 12 is the semiconductor device manufactured based on MEMS (MEMS).It is including at least electricity
The chip pins 121 such as source pin, pressure signal output pin.Described chip pin 121 can be in needle-like or paster shape.
Described pressure sensitive chip 12 utilizes the corresponding relation of air pressure-resistance, the air pressure change conversion that will be sensed
Become the signal of telecommunication, and the signal of telecommunication is exported by chip pin 121.Such as, described pressure sensitive chip 12 is at monocrystal silicon
Spread Wheatstone bridge, the voltage inhibition effect utilizing bridge wall resistance value to produce with air pressure change on sheet, produce a differential voltage
Signal, this difference voltage signal is pressure signal.
Described support plate 13 for pressure signal transmission that pressure sensitive chip 12 is sensed to outside pressure signal at
Reason device 14.
Described support plate 13 is provided with the support plate pin 131 corresponding with chip pin 121 quantity, each chip pin 121 and load
The corresponding electrical connection of plate pin 131.Wherein, described support plate pin 131 runs through support plate plate body.Described support plate pin 131 is at support plate plate
Body and chip pin 121 fixing side can be that paster shape (such as pad or metal patch) or needle-like are (such as metal wire or pin
Foot).Described support plate pin 131 is needle-like at the opposite side of support plate plate body, in order to and outside pressure signal processing means 14 phase
Even.
Described chip pin 121 and support plate pin 131 can use the mode of welding to fix, as shown in Figure 2.Preferably, institute
State support plate pin 131 to be fixed together by wire bonding mode with chip pin 121.Specifically, described support plate pin 131 with
It is metal wire that chip pin 121 electrically connects side, and utilizes the modes such as heat, pressure or ultrasonic energy, allows this metal wire and pressure
The chip pin 121 of power induction chip 12 occurs electronics to share or the phase counterdiffusion of atom, so that realizing former between two kinds of metals
Bonding in sub-magnitude, so realizes the electric interconnection between chip and support plate 13.
Particular for the strong motion applied environment of automobile, the gap perfusion between described support plate 13 and pressure sensitive chip 12
Flexible glue.Wherein, described flexible glue is the insulation colloid meeting and presetting coefficient of elasticity, in order to protect pressure sensitive chip 12 to alleviate outside
Vibrations are to the destruction electrically connected between chip internal and chip with support plate.Described flexible glue is exemplified as silica gel.The pressure surrounded by flexible glue
Power induction chip 12 can reduce the automobile macroseism destruction to it.During fabrication, the preference temperature preset is used to be softened by flexible glue
After, it is poured between support plate 13 and pressure sensitive chip 12, after temperature reduces, flexible glue becomes support plate 13 and pressure sensitive chip
Insulating protector between 12.
Described pressure signal processing means 14 electrically connects with described support plate pin 131, for described pressure sensitive chip
12 pressure signals provided carry out signal processing.
Specifically, described pressure signal processing means 14 is the signal processing circuit of pressure sensitive chip 12, for institute
The pressure signal received is amplified, filters, calibration etc. processes, in order to provide accurately for air compressor or other detection equipment
Air pressure value.Described pressure signal processing means 14 can be single-chip microcomputer or integrated circuit.
As it is shown in figure 1, in order to help to be fixed in pipeline packaged pressure sensitive chip 12, avoid pressure to believe simultaneously
Number processing means 14 is destroyed by pressure-air, and described pressure signal processing means 14 is arranged on outside pipeline, so pressure letter
There is space at interval number between processing means 14 and support plate 13 body.Between described pressure signal processing means 14 and support plate 13 body
The space at interval can match with pipeline wall thickness, it is also possible to more than pipeline wall thickness.
In a kind of preferred version, described pressure signal processing means 14 includes: electrically connect with described support plate pin 131
Printed circuit board (PCB)；And arrange that at least one pressure signal on the printed circuit board processes chip, for by described
The pressure signal that described pressure sensitive chip 12 is provided by support plate pin 131 carries out signal processing.
Wherein, described printed circuit board (PCB) processes chip for pressure sensitive chip 12 and each pressure signal and provides connection circuit.
Described printed circuit board (PCB) can comprise a metal figure layer, can also be multiple metal figure layers.Described metal figure layer is patterning
Conduction Butut, provide electrical connection, bias voltage etc. for processing chip for pressure sensitive chip 12 and each pressure signal.Work as institute
Stating printed circuit board (PCB) when being multilamellar, described printed circuit board (PCB) also includes the conductive hole for running through each layer.For the ease of multiple pressures
Force signal processes the layout of chip, and described support plate pin 131 is fixed on the layer of metal figure layer of printed circuit board (PCB), at least one pressure
Force signal processes chip 142 and is arranged on the another layer of metal figure layer of described printed circuit board (PCB).Such as, as it is shown on figure 3, described printing
Circuit board 141 comprises double layer of metal figure layer and connects the conductive hole 143 of two metal figure layers, and the metal figure layer of this two-layer lays respectively at
The obverse and reverse of printed circuit board (PCB) 141, described support plate pin 131 is fixed on the front of printed circuit board (PCB) 141, at pressure signal
Reason chip 142 is arranged at the reverse side of printed circuit board (PCB) 141.Pressure signal process chip 142 is provided with and is connected with support plate pin 131
Pad 144.
Described pressure signal processes chip can be the circuit utilizing semiconductor technology integrated, and it includes following at least one
Kind: Filtering Processing chip, calibration process chip and readout circuit chip.
Wherein, described Filtering Processing chip comprises signal amplification circuit, digital to analog converter and filter circuit etc., and being used for will
The slight pressure signal of the simulation that described pressure sensitive chip 12 is provided is converted into the pressure signal of digitized low noise.
Described calibration process chip is for according to pressure sensitive chip 12 and the systematic error of peripheral circuit, random error
Pressure signal deviations caused by Deng is corrected.
Described readout circuit chip, will be according to pressure signal for the sense order according to the external detection system connected
Obtained force value is exported.In order to protect readout circuit chip, described readout circuit chip is fixed on print by ebonite
On printed circuit board.Described ebonite is the colloid that hardness meets default hardness number, such as epoxy resin.
Such as Fig. 1, shown in 2 and 3, the structure example of described pressure transducer is as follows:
Pressure sensitive chip 12 is encapsulated by modular housing 11 and standard support plate 13 with opening, wherein, and support plate 13
Including support plate 13 body of: bearing pressure induction chip 12 with run through the support plate pin 131 of support plate 13 body.Described feeling of stress
Answer chip pin 121 and the corresponding electrical connection of support plate pin 131 of chip 12.Between pressure sensitive chip 12 and support plate 13 body
It is perfused with flexible glue.Described support plate pin 131 also extends through the conductive hole of printed circuit board (PCB) and is welded on the pad around conductive hole, pressure
Force signal processes the pad on chip 142 by the electrical connection corresponding with each support plate pin 131 of the wire on printed circuit board (PCB) 141.
Space is left between described printed circuit board (PCB) 141 and support plate 13.
Pressure sensitive chip is individually encapsulated by the present embodiment, solves induced signal processing means longevity under environment under high pressure
Order shorter problem, and solve the problem that standardized shell sizes cannot accommodate multiple chip being packaged together.Separately
Outward, select stepped shell and clearance space between pressure signal processing means and support plate body is conducive to pressure sensitive core
Sheet is individually embedded in environment under high pressure.Effectively prevent it addition, use the mode of wire bonding to fix support plate pin with chip pin
Adverse circumstances downforce induction chip is unstable with the connection of external signal processing means.It addition, at support plate and pressure sensitive core
Flexible glue is irrigated, it is possible to increase the shock resistance of pressure sensitive chip in gap between sheet.
Embodiment two
On the basis of the various embodiments described above, the present embodiment also provides for a kind of with the pressure described in the various embodiments described above
The automobile of sensor.Described automobile is by power drive, has the vehicle of the non-track carrying of four or more wheel.Vapour
Car includes central control system and power-driven system.Wherein, central control system is the control system controlling air conditioning for automobiles, door lock etc..Institute
State power-driven system and include automobile air compressor, electromotor, rotation shaft of wheel etc., be used for controlling vehicle and travel.Wherein, described
Automobile air compressor, is again air pump, and its operation principle is to suck natural air to be pumped into gas receiver or the storage of automobile chassis
Gas tank, making the air under normality have pressure becomes compressed air.The air of compression can promote wheel cylinder, clutch slave cylinder,
Thus control the braking of automobile, hand braking (being commonly called as air-cut-off break).Part oversize vehicle also needs to pneumatically and realizes high low speed
Gearshift.It addition, utilize the air of compression can realize the spraying function stopped that drips, thus realize the cooling of brake rim, thus have
Effect ground reduce automobile in daily traveling because urgent acutely brake causes brake block to burn out, thus avoid brake failure
The generation of accident.
Described pressure transducer is arranged on described automobile air compressor.Specifically, described pressure transducer is carried
The pressure sensitive chip of plate and shell encapsulation is arranged in the high-pressure chamber of described automobile air compressor, and described pressure signal processes
Device is arranged at outside described high-pressure chamber.Wherein, described high-pressure chamber is the storage silo of automobile air compressor compressed air.
Here, support plate is fixed in high-pressure chamber, the support plate pin on support plate passes outside high-pressure chamber, and is processed by pressure signal
Corresponding the welding together with support plate pin of each pad of device.So, on the one hand, the size of described pressure signal processing means
Do not limited by standardized shell accommodation space, on the other hand, described pressure signal processing means breaking from environment under high pressure
Bad.
Note, above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that
The invention is not restricted to specific embodiment described here, can carry out for a person skilled in the art various obvious change,
Readjust and substitute without departing from protection scope of the present invention.Therefore, although by above example, the present invention is carried out
It is described in further detail, but the present invention is not limited only to above example, without departing from the inventive concept, also
Other Equivalent embodiments more can be included, and the scope of the present invention is determined by scope of the appended claims.
Claims (8)
1. a pressure transducer, it is characterised in that including:
Shell with opening；
For sensing the pressure sensitive chip of air pressure, comprise chip pin；
By described pressure sensitive chip package support plate wherein together with described shell, including: support plate body with run through described
The support plate pin of support plate plate body；The chip pin of described pressure sensitive chip and the support plate pin being positioned at described support plate body side
Corresponding connection；
Pressure signal processing means, electrically connects with the support plate pin of described support plate body opposite side, for described pressure sensitive
The pressure signal that chip is provided carries out signal processing.
Pressure transducer the most according to claim 1, it is characterised in that described shell is stepped；And/or, described pressure
Between force signal processing means and described support plate body, there is space at interval.
Pressure transducer the most according to claim 1, it is characterised in that described support plate pin and chip pin are by lead-in wire
Bonding pattern is fixed together.
Pressure transducer the most according to claim 1, it is characterised in that the seam between described support plate and pressure sensitive chip
Gap perfusion flexible glue.
Pressure transducer the most according to claim 1, it is characterised in that described pressure signal processing means includes:
The printed circuit board (PCB) electrically connected with described support plate pin；And arrange at least one pressure on the printed circuit board
Signal processing chip, is carried out at signal for the pressure signal provided described pressure sensitive chip by described support plate pin
Reason.
Pressure transducer the most according to claim 5, it is characterised in that described pressure signal process chip include with down to
Few one: Filtering Processing chip, calibration process chip and readout circuit chip.
Pressure transducer the most according to claim 5, it is characterised in that described printed circuit board (PCB) is at least double layer of metal figure
Layer, described support plate pin is fixed on the layer of metal figure layer of printed circuit board (PCB), and at least one pressure signal processes chip and is arranged on
The another layer of metal figure layer of described printed circuit board (PCB).
8. an automobile, it is characterised in that including:
Automobile air compressor；
And, it is arranged on the pressure transducer as described in arbitrary in claim 1-7 of described automobile air compressor；Wherein,
The pressure sensitive chip encapsulated by support plate and shell in described pressure transducer is arranged at the high pressure of described automobile air compressor
In storehouse, described pressure signal processing means is arranged at outside described high-pressure chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610739706.9A CN106197824A (en) | 2016-08-26 | 2016-08-26 | Pressure transducer and the automobile being suitable for |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610739706.9A CN106197824A (en) | 2016-08-26 | 2016-08-26 | Pressure transducer and the automobile being suitable for |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106197824A true CN106197824A (en) | 2016-12-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610739706.9A Pending CN106197824A (en) | 2016-08-26 | 2016-08-26 | Pressure transducer and the automobile being suitable for |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106197824A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110567632A (en) * | 2019-08-29 | 2019-12-13 | 北京自动化控制设备研究所 | Core body composite silicon piezoresistive pressure sensor |
| CN115077753A (en) * | 2022-08-11 | 2022-09-20 | 江苏航运职业技术学院 | Overload self-starting pressure sensor and use method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4984466A (en) * | 1989-06-02 | 1991-01-15 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor pressure sensor |
| CN201259456Y (en) * | 2008-07-21 | 2009-06-17 | 无锡华润安盛科技有限公司 | Encapsulation construction for automobile tyre pressure sensor |
| CN105280603A (en) * | 2015-04-09 | 2016-01-27 | 上海兆芯集成电路有限公司 | Electronic package assembly |
| CN205373941U (en) * | 2015-12-21 | 2016-07-06 | 上海保隆汽车科技股份有限公司 | Pneumatic brake pressure sensor |
| CN205940853U (en) * | 2016-08-26 | 2017-02-08 | 华景传感科技（无锡）有限公司 | Pressure sensor and car that is suitable for |
-
2016
- 2016-08-26 CN CN201610739706.9A patent/CN106197824A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4984466A (en) * | 1989-06-02 | 1991-01-15 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor pressure sensor |
| CN201259456Y (en) * | 2008-07-21 | 2009-06-17 | 无锡华润安盛科技有限公司 | Encapsulation construction for automobile tyre pressure sensor |
| CN105280603A (en) * | 2015-04-09 | 2016-01-27 | 上海兆芯集成电路有限公司 | Electronic package assembly |
| CN205373941U (en) * | 2015-12-21 | 2016-07-06 | 上海保隆汽车科技股份有限公司 | Pneumatic brake pressure sensor |
| CN205940853U (en) * | 2016-08-26 | 2017-02-08 | 华景传感科技（无锡）有限公司 | Pressure sensor and car that is suitable for |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110567632A (en) * | 2019-08-29 | 2019-12-13 | 北京自动化控制设备研究所 | Core body composite silicon piezoresistive pressure sensor |
| CN115077753A (en) * | 2022-08-11 | 2022-09-20 | 江苏航运职业技术学院 | Overload self-starting pressure sensor and use method thereof |
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Application publication date: 20161207 |
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