CN205912334U - FPC board - Google Patents

FPC board Download PDF

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Publication number
CN205912334U
CN205912334U CN201620976249.0U CN201620976249U CN205912334U CN 205912334 U CN205912334 U CN 205912334U CN 201620976249 U CN201620976249 U CN 201620976249U CN 205912334 U CN205912334 U CN 205912334U
Authority
CN
China
Prior art keywords
element area
fpc
component
region
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201620976249.0U
Other languages
Chinese (zh)
Inventor
施景辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangxi Yinuo New Material Co., Ltd
Original Assignee
Jiangxi Holitech Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangxi Holitech Technology Co Ltd filed Critical Jiangxi Holitech Technology Co Ltd
Priority to CN201620976249.0U priority Critical patent/CN205912334U/en
Application granted granted Critical
Publication of CN205912334U publication Critical patent/CN205912334U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a FPC board, it includes the FPC body, and the FPC body is regional including the component that is used for setting up electronic component, and the regional one side of component is provided with bonding area, and bonding area rolls over the region with the regional turn the corner of expert of component and is connected, and the opposite side in component region is connected with and is used for the connection zone that is connected with the chip, component regional be provided with at least one location bump on the surface. The utility model discloses make component zone location accurate.

Description

A kind of fpc plate
Technical field
The utility model is related to a kind of fpc plate.
Background technology
Element area, bonding region, bending region and join domain are typically provided with fpc plate, element area is used for setting Put electronic component, bonding region is arranged at the side of element area, bonding region is passed through bending region and is connected with element area, even Connect the opposite side that region is connected to element area, bonding region is used for carrying out bonding with liquid-crystalline glasses, and join domain is used for and hand Mainboard connects.In existing fpc plate, when mounting electronic component on element area, element area often cannot be very Accurately navigate to precalculated position, so, in mounted with electronic components, the mounting position of electronic component often cannot be very smart Really.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of fpc plate, and it makes element area accurate positioning.
For solving above-mentioned technical problem, the fpc plate that the utility model provides, it includes fpc body, and fpc body includes using In the element area of setting electronic component, the side of element area is provided with bonding region, and bonding region and element area pass through Bending region is connected, and the opposite side of element area is connected with the join domain for being connected with chip, described element area A surface on be provided with least one positioning convex point.
Preferably, being provided with two positioning convex points on a surface of described element area, two positioning convex points are respectively Diagonal position positioned at element area.
Preferably, being all covered with the 3rd layers of copper, the 3rd bronze medal on the described non-routing region on two surfaces in bending region Layer is in latticed.
Preferably, the position being used for installing electronic component on described element area is provided with a pi stiffening plate.
Preferably, described join domain is l shape.
After above structure, the utility model compared with prior art, has the advantage that
Fpc plate of the present utility model, due to being provided with positioning convex point on a surface of element area, so, in attachment Before electronic component, first element area is positioned by positioning convex point, so allowing for element area can be very accurate Navigate to precalculated position, then electronic component is mounted on element area so that electronic component is relative with element area Accurately, the mounting position also allowing for electronic component is accurate for position.
Brief description
Fig. 1 is the structural representation of the utility model fpc plate.
Specific embodiment
With reference to the accompanying drawings and detailed description the utility model is described in more detail.
As shown in Figure 1, the utility model fpc plate includes fpc body 1, and fpc body 1 is included for arranging electronic component Element area 101, the side of element area 101 is provided with bonding region 102, and bonding region 102 and element area 101 pass through curved Folding area domain 103 is connected, and the opposite side of element area 101 is connected with the join domain 104 for being connected with chip, described unit At least one positioning convex point 1013 is provided with one surface in part region 101.
Two positioning convex points 1013 are provided with one surface of described element area 101,1013 points of two positioning convex points Not Wei Yu element area 101 diagonal position, it is more accurate that two positioning convex points 1013 make element area 101 position.
Fpc plate placement location is provided with detent, before mounted with electronic components, first element area 101 is led to Cross positioning convex point 1013 positioned that is to say, that by the positioning convex point 1013 on element area 101 be respectively embedded in positioning recessed So that element area 101 accurate positioning of fpc plate in groove.
It is all covered with the 3rd layers of copper 1031, the 3rd layers of copper on the described non-routing region on two surfaces in bending region 103 1031 is in latticed, and so, the 3rd layers of copper 1031 makes the intensity in bending region 103 increase, is difficult to tear, and due to the 3rd Layers of copper 1031 is in latticed so that the pliability in bending region 103 is preferable.
The position being used for installing electronic component on described element area 101 is provided with a pi stiffening plate 1012, so, makes On element area 101 for install the position intensity of electronic component higher so that electronic component fix stably.
Described join domain 104 is l shape, and so, join domain 104 length is longer, easy to connect.
Below only explanation is made that with regard to the utility model application preferably example, but is not to be construed as to claim Limit, structure of the present utility model can have other changes, is not limited to said structure.In a word, all of the present utility model solely The various change made in vertical scope of the claims is all in protection domain of the present utility model.

Claims (5)

1. a kind of fpc plate, it includes fpc body (1), and fpc body (1) includes the element area for arranging electronic component (101), the side of element area (101) is provided with bonding region (102), and bonding region (102) are passed through with element area (101) Bending region (103) is connected, and the opposite side of element area (101) is connected with the join domain (104) for being connected with chip, It is characterized in that: it is provided with least one positioning convex point (1013) on a described surface of element area (101).
2. a kind of fpc plate according to claim 1 it is characterised in that: set on a described surface of element area (101) It is equipped with two positioning convex points (1013), two positioning convex points (1013) are located at the diagonal position of element area (101) respectively.
3. a kind of fpc plate according to claim 2 it is characterised in that: described two surfaces in bending region (103) non- 3rd layers of copper (1031) is all covered with routing region, the 3rd layers of copper (1031) is in latticed.
4. a kind of fpc plate according to claim 3 it is characterised in that: be used for electricity is installed on described element area (101) The position of subcomponent is provided with a pi stiffening plate (1012).
5. a kind of fpc plate according to claim 4 it is characterised in that: described join domain (104) be l shape.
CN201620976249.0U 2016-08-28 2016-08-28 FPC board Active CN205912334U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620976249.0U CN205912334U (en) 2016-08-28 2016-08-28 FPC board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620976249.0U CN205912334U (en) 2016-08-28 2016-08-28 FPC board

Publications (1)

Publication Number Publication Date
CN205912334U true CN205912334U (en) 2017-01-25

Family

ID=57800226

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620976249.0U Active CN205912334U (en) 2016-08-28 2016-08-28 FPC board

Country Status (1)

Country Link
CN (1) CN205912334U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20190403

Address after: No. 6 Helitai Road, Xinfeng County Industrial Park, Ganzhou City, Jiangxi Province, 341600

Patentee after: Jiangxi BYD electronic parts Co., Ltd.

Address before: 343700 No. 1 Industrial Development Park, Taihe County, Ji'an City, Jiangxi Province

Patentee before: JIANGXI HELITAI TECHNOLOGY CO., LTD.

TR01 Transfer of patent right
CP01 Change in the name or title of a patent holder

Address after: No. 6 Helitai Road, Xinfeng County Industrial Park, Ganzhou City, Jiangxi Province, 341600

Patentee after: Jiangxi Yinuo New Material Co., Ltd

Address before: No. 6 Helitai Road, Xinfeng County Industrial Park, Ganzhou City, Jiangxi Province, 341600

Patentee before: JIANGXI BYD ELECTRONIC COMPONENT Co.,Ltd.

CP01 Change in the name or title of a patent holder