CN205907377U - Diode lead wire electroplating system - Google Patents
Diode lead wire electroplating system Download PDFInfo
- Publication number
- CN205907377U CN205907377U CN201620711329.3U CN201620711329U CN205907377U CN 205907377 U CN205907377 U CN 205907377U CN 201620711329 U CN201620711329 U CN 201620711329U CN 205907377 U CN205907377 U CN 205907377U
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- electro
- plating roller
- sepage
- copper rod
- diode
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Abstract
The utility model relates to a diode lead wire electroplating system, its innovation point lies in: this diode lead wire electroplating system includes: electroplating barrel, driving motor and reduction gear, driving motor links to each other with the reduction gear, and driving motor driving roll is rotatory, the quad slit is transformed into by the circular port in plating solution infiltration hole, and the infiltration capacity of plating solution increases, increases electric conductivity through increasing the plating solution to can part the electroplating with heavy current type diode and undercurrent type diode, owing to need not carry out screening work, thus effectively improved the electroplating efficiency of diode, under the effect of insulating cover for the copper sheathing is located the center as the negative pole of electroplating, its power line, and stamp -mounting -paper diode lead wire cladding material is even. And when needing the clearance negative pole, only need rotatory dismantle down the copper sheathing can, easy dismounting is swift.
Description
Technical field
The utility model is related to diode production field, more particularly, to a kind of diode lead electroplating system.
Background technology
Diode in process of production, needs to use electroplating device to block tin to its lead.Traditional diode plating
Equipment cylinder includes the copper rod that cylinder and level are located in cylinder, and copper rod is energized as electroplating cathode, lead height during plating
Slightly above horizontal copper rod height, because its electric force lines distribution is top, causes the uneven coating of the diode lead of bottom even；Separately
Outward, as being stained with the copper rod of negative electrode by tin, need often to disassemble cleaning, dismounting is inconvenient.
The a diameter of 0.6mm of circular port that the sepage module of general electro-plating roller setting adopts about, electroplate liquid infiltration capacity
Little, but the infiltration capacity of electroplate liquid can not be increased by increasing aperture again, and such diode easily spills from hole, in order to carry
The electric conductivity in plating for the high product, can only be by being mixed the diode of high current type and small current type diode during plating
Plating, small current type diode is substantially filled in the gap of high current type diode, again to high current type two after the completion of plating
Pole pipe and small current type diode are screened, although the electric conductivity of plating improves, follow-up screening operation makes always
Diode plating output efficiency be difficult to improve.
Utility model content
The technical problems to be solved in the utility model is to provide one kind being capable of diode lead electroplating system, it is possible to increase electricity
Plating efficiency, electroplating effect is more preferable.
For solving above-mentioned technical problem, the technical solution of the utility model is: a kind of diode lead electroplating system, its wound
New point is: this diode lead electroplating system includes: electro-plating roller, motor and decelerator；Motor and decelerator
It is connected, motor drives electro-plating roller rotation；
The outline of described electro-plating roller is polygon barrel-like structure, and electro-plating roller is provided with several sepage modules,
Sepage module is rectangular-shaped and electro-plating roller global formation；Sepage module is protruded and is arranged on the outline of electro-plating roller, institute
If state that sepage groove in arterial highway is provided with sepage module, sepage groove for length be 20mm, width be 0.6mm slot, sepage
In module, the sepage groove of setting is equidistantly evenly distributed on the outside of electro-plating roller；Cover plate is provided with electro-plating roller, cover plate with
Electro-plating roller passes through bolt and is connected；One end of electro-plating roller is provided with power transmission shaft and is connected with decelerator, described electro-plating roller interior
Portion is provided with horizontal copper rod along axis direction.
Further, the horizontal copper rod bottom even in described electro-plating roller has several screwed holes, and horizontal copper rod hangs down
Directly it is provided with threaded vertical copper rod, the lower end screw thread of described vertical copper rod is combined with copper sheathing；Described horizontal copper rod
With insulation sleeve is all cased with vertical copper rod.
The utility model has the advantage of: electroplate liquid penetrates into hole and transforms square opening into by circular port, and the infiltration capacity of electroplate liquid increases
Plus, increase electric conductivity by increasing electroplate liquid, such that it is able to carry out point high current type diode and small current type diode
Open plating, due to not needing to carry out screening operation, thus effectively increasing the electroplating efficiency of diode.
So that copper sheathing is as the negative electrode electroplated in the presence of insulation sleeve, its power line is located at center, and stamp-mounting-paper diode draws
Line coating is uniform.And when needing to clear up negative electrode, only need to rotate dismounting lower copper sheathing, convenient to disassembly.
Brief description
With reference to the accompanying drawings and detailed description the utility model is described in further detail.
Fig. 1 is the front view of diode lead electroplating system.
Fig. 2 is the electro-plating roller internal structure schematic diagram of diode lead electroplating system.
Specific embodiment
The following examples can make professional and technical personnel that the utility model is more fully understood, but therefore will not
The utility model is limited among described scope of embodiments.
A kind of diode lead electroplating system as shown in Fig. 1 Fig. 2, this diode lead electroplating system includes: plating rolling
Cylinder 1, motor 2 and decelerator 3；Motor 2 is connected with decelerator 3, and motor 1 drives electro-plating roller 1 to rotate.
The outline of electro-plating roller 1 is polygon barrel-like structure, and electro-plating roller 1 is provided with several sepage modules 11,
Sepage module 11 is rectangular-shaped and electro-plating roller 1 global formation；Sepage module 11 protrudes the outline being arranged on electro-plating roller 1
On, if arterial highway sepage groove 12 is provided with described sepage module 11, sepage groove 12 for length be 20mm, width be 0.6mm length
Square opening, in sepage module 11, the sepage groove 12 of setting is equidistantly evenly distributed on the outside of electro-plating roller 1；On electro-plating roller 1
It is provided with cover plate 13, cover plate 13 is connected by bolt with electro-plating roller 1；One end of electro-plating roller 1 is provided with power transmission shaft 14 and subtracts
Fast device 3 is connected, and the inside of described electro-plating roller 1 is provided with horizontal copper rod 4 along axis direction.
Horizontal copper rod 4 bottom even in electro-plating roller 1 has several screwed holes, horizontal copper rod 4 is vertically installed with logical
Cross threaded vertical copper rod 5, the lower end screw thread of described vertical copper rod 5 is combined with copper sheathing 6；Described horizontal copper rod 4 and vertically
Insulation sleeve 7 is all cased with copper rod 5.
It should be understood by those skilled in the art that, the utility model is not restricted to the described embodiments, above-described embodiment and
Described in specification, principle of the present utility model is simply described, on the premise of without departing from the utility model spirit and scope,
The utility model also has various changes and modifications, and these changes and improvements both fall within claimed the utility model scope
Interior.The utility model claims scope by appending claims and its equivalent thereof.
Claims (2)
1. a kind of diode lead electroplating system it is characterised in that: this diode lead electroplating system includes: electro-plating roller, drive
Dynamic motor and decelerator；Motor is connected with decelerator, and motor drives electro-plating roller rotation；
The outline of described electro-plating roller is polygon barrel-like structure, and electro-plating roller is provided with several sepage modules, sepage
Module is rectangular-shaped and electro-plating roller global formation；Sepage module is protruded and is arranged on the outline of electro-plating roller, described oozes
If sepage groove in arterial highway is provided with liquid module, sepage groove for length be 20mm, width be 0.6mm slot, sepage module
The sepage groove of upper setting is equidistantly evenly distributed on the outside of electro-plating roller；Cover plate, cover plate and plating are provided with electro-plating roller
Cylinder passes through bolt and is connected；One end of electro-plating roller is provided with power transmission shaft and is connected with decelerator, the inside edge of described electro-plating roller
Axis direction and be provided with horizontal copper rod.
2. a kind of diode lead electroplating system according to claim 1 it is characterised in that: the water in described electro-plating roller
Flat copper rod bottom even has several screwed holes, and horizontal copper rod is vertically installed with the vertical copper rod being threaded connection, described
Vertically the lower end screw thread of copper rod is combined with copper sheathing；All it is cased with insulation sleeve on described horizontal copper rod and vertical copper rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620711329.3U CN205907377U (en) | 2016-07-07 | 2016-07-07 | Diode lead wire electroplating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620711329.3U CN205907377U (en) | 2016-07-07 | 2016-07-07 | Diode lead wire electroplating system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205907377U true CN205907377U (en) | 2017-01-25 |
Family
ID=57805070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620711329.3U Active CN205907377U (en) | 2016-07-07 | 2016-07-07 | Diode lead wire electroplating system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205907377U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106048700A (en) * | 2016-07-07 | 2016-10-26 | 如皋市大昌电子有限公司 | Diode lead electroplating system |
| CN108677244A (en) * | 2018-06-05 | 2018-10-19 | 陈涛 | A kind of semiconductor diode production technology |
| CN108796592A (en) * | 2018-06-05 | 2018-11-13 | 陈涛 | A kind of semiconductor diode electroplating processes system |
-
2016
- 2016-07-07 CN CN201620711329.3U patent/CN205907377U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106048700A (en) * | 2016-07-07 | 2016-10-26 | 如皋市大昌电子有限公司 | Diode lead electroplating system |
| CN108677244A (en) * | 2018-06-05 | 2018-10-19 | 陈涛 | A kind of semiconductor diode production technology |
| CN108796592A (en) * | 2018-06-05 | 2018-11-13 | 陈涛 | A kind of semiconductor diode electroplating processes system |
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|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |