CN202107788U - Rotary drum of electroplating device for chip diode - Google Patents
Rotary drum of electroplating device for chip diode Download PDFInfo
- Publication number
- CN202107788U CN202107788U CN2011202050539U CN201120205053U CN202107788U CN 202107788 U CN202107788 U CN 202107788U CN 2011202050539 U CN2011202050539 U CN 2011202050539U CN 201120205053 U CN201120205053 U CN 201120205053U CN 202107788 U CN202107788 U CN 202107788U
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- CN
- China
- Prior art keywords
- copper
- rotary drum
- copper rod
- horizontal
- electroplating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to a rotary drum of an electroplating device for a chip diode, which comprises a rotary drum and a horizontal copper bar horizontally arranged in the rotary drum. The rotary drum of the electroplating device for the chip diode is characterized in that the bottom of the horizontal copper bar is evenly provided with a plurality of threaded holes, each threaded hole is in external thread connection with a vertical copper bar, and the lower end of the vertical copper bar is in threaded match with a copper bush. Insulation sleeves are sleeved on both the horizontal copper bar and the vertical copper bars. Under the action of the insulation sleeves, the copper bushes serve as electroplating cathode, and the power lines of the copper bushes are located in the center. Therefore, leads of the chip diode have uniform coatings. When the cathode needs cleaning, only the copper bushes needs detaching rotatably, thereby being convenient and fast to assemble and disassemble.
Description
Technical field
The utility model relates to a kind of stamp-mounting-paper diode electroplating device cylinder, the stamp-mounting-paper diode electroplating device cylinder that particularly a kind of electroplating effect is good and easy to maintenance.
Background technology
Stamp-mounting-paper diode need use electroplating device to the stifled tin of going up of its lead-in wire in process of production.Traditional stamp-mounting-paper diode electroplating device cylinder comprises that cylinder and level are located at the copper rod in the cylinder, and copper rod is switched on as electroplating cathode, and the lead-in wire height is a little more than horizontal copper rod height during plating.The shortcoming of this kind structure is: because its electric force lines distribution by last, causes the uneven coating of the diode lead of bottom to spare; In addition, be stained with by tin on the copper rod as negative electrode, need often disassemble cleaning, dismounting is inconvenient.
Summary of the invention
The technical problem that the utility model will solve provides a kind of electroplating effect stamp-mounting-paper diode electroplating device cylinder good and easy to maintenance.
For solving the problems of the technologies described above; The technical scheme of the utility model is: a kind of stamp-mounting-paper diode electroplating device cylinder; Comprise that cylinder and level are located at the horizontal copper rod in the cylinder; Its innovative point is: the bottom of said horizontal copper rod evenly has several threaded holes, and each threaded hole IT is connected with vertical copper rod, and the lower end screw thread of said vertical copper rod is combined with copper sheathing; All be with insulation covering on said horizontal copper rod and the vertical copper rod.
The advantage of the utility model is: under the effect of insulation covering, make copper sheathing as galvanized negative electrode, its power line is positioned at the center, and stamp-mounting-paper diode lead-in wire coating is even.And when needing the cleaning negative electrode, only need the rotation dismounting down copper sheathing get final product, convenient to disassembly.
Description of drawings
Fig. 1 is the utility model stamp-mounting-paper diode electroplating device roller frame synoptic diagram.
Embodiment
As shown in Figure 1; Comprise cylinder 5, horizontal copper rod 1, vertical copper rod 2, copper sheathing 3; Level is provided with horizontal copper rod 1 in the cylinder 5, evenly has several threaded holes in the bottom of horizontal copper rod 1, and each threaded hole IT is connected with vertical copper rod 2; The lower end screw thread of vertical copper rod 2 is combined with copper sheathing 3, on horizontal copper rod 1 and vertical copper rod 2, all is with insulation covering 4.
During making, on horizontal copper rod 1, overlap insulation covering 4 earlier, the vertical copper rod 2 with the tape insulation cover is threaded in the threaded hole of horizontal copper rod 1 bottom again; Under the effect of insulation covering; Make copper sheathing as galvanized negative electrode, its power line is positioned at the center, and stamp-mounting-paper diode lead-in wire coating is even.And when needing the cleaning negative electrode, only need the rotation dismounting down copper sheathing 3 get final product, convenient to disassembly.
Claims (1)
1. stamp-mounting-paper diode electroplating device cylinder; Comprise that cylinder and level are located at the horizontal copper rod in the cylinder; It is characterized in that: the bottom of said horizontal copper rod evenly has several threaded holes, and each threaded hole IT is connected with vertical copper rod, and the lower end screw thread of said vertical copper rod is combined with copper sheathing; All be with insulation covering on said horizontal copper rod and the vertical copper rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202050539U CN202107788U (en) | 2011-06-17 | 2011-06-17 | Rotary drum of electroplating device for chip diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202050539U CN202107788U (en) | 2011-06-17 | 2011-06-17 | Rotary drum of electroplating device for chip diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202107788U true CN202107788U (en) | 2012-01-11 |
Family
ID=45433230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202050539U Expired - Lifetime CN202107788U (en) | 2011-06-17 | 2011-06-17 | Rotary drum of electroplating device for chip diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202107788U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102226292A (en) * | 2011-06-17 | 2011-10-26 | 如皋市易达电子有限责任公司 | Surface mounting diode electroplating device cylinder |
| CN106048700A (en) * | 2016-07-07 | 2016-10-26 | 如皋市大昌电子有限公司 | Diode lead electroplating system |
-
2011
- 2011-06-17 CN CN2011202050539U patent/CN202107788U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102226292A (en) * | 2011-06-17 | 2011-10-26 | 如皋市易达电子有限责任公司 | Surface mounting diode electroplating device cylinder |
| CN106048700A (en) * | 2016-07-07 | 2016-10-26 | 如皋市大昌电子有限公司 | Diode lead electroplating system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20120111 Effective date of abandoning: 20121003 |