CN205852020U - Solder reflow device - Google Patents
Solder reflow device Download PDFInfo
- Publication number
- CN205852020U CN205852020U CN201620676692.6U CN201620676692U CN205852020U CN 205852020 U CN205852020 U CN 205852020U CN 201620676692 U CN201620676692 U CN 201620676692U CN 205852020 U CN205852020 U CN 205852020U
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- CN
- China
- Prior art keywords
- solder reflow
- housing
- reflow device
- transparent window
- equipment compartment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
This utility model provides a kind of solder reflow device, and this solder reflow device includes that equipment compartment, equipment compartment include housing and the soldered elements being arranged in housing.So that solder reflow device is operationally, staff can from external observation to equipment compartment in working condition, equipment compartment also includes transparent window, and transparent window is arranged on housing.When solder reflow device works, staff just can observe the working condition in housing by transparent window.If there occurs abnormal conditions in equipment compartment during work, staff just can pass through transparent window and find in time, and then takes measures on customs clearance and remedy, it is to avoid the generation of peril.
Description
Technical field
This utility model relates to solder reflow techniques field, in particular to a kind of solder reflow device.
Background technology
The needs being increasingly miniaturized due to electronic product pcb board, occur in that chip component, traditional welding method can not
Meet the needs of.At first, only have employed reflow soldering process in hybrid circuit board assembles, the element majority of assembly welding is sheet
Shape electric capacity, pellet inductor, pasting type transistor and diode etc..Along with technology development is gradually improved, multiple surface mount elements and patch
Filling the appearance of device, reflow soldering process technology and equipment as a mounting technology part are developed the most accordingly, its application
Increasingly extensive, almost the most it is applied at all electronics field.
Reflow soldering process generally comprises hot plate and is conducted back to fluid welding, infrared reflow brazier, gas phase reflow soldering, hot air reflux
Weldering, infrared ray and hot air reflux weldering, heated filament Reflow Soldering, hot gas re-flow weldering, laser reflow weldering, light beam Reflow Soldering, sense Reflow Soldering,
The solder reflow device of several techniques such as poly-infrared reflow weldering.
Fig. 1 shows existing solder reflow device, and this solder reflow device includes equipment compartment 1 and is arranged on equipment compartment 1 liang
The import 2 of side and outlet 3, workpiece to be welded is processed from import 2 access arrangement cabin 1, then from outlet 3 out.At equipment
During being processed in cabin 1, outside is the situation in invisible equipment compartment 1.Therefore, if processed in equipment compartment 1
Workpiece to be welded occur in that fortuitous event, staff also can't find.
Utility model content
Main purpose of the present utility model is to provide a kind of solder reflow device, to solve to set in Reflow Soldering in prior art
The problem of duty in processing workpiece to be welded does not knows that equipment compartment in standby equipment compartment.
To achieve these goals, this utility model provides a kind of solder reflow device, and including equipment compartment, equipment compartment includes
Housing and the soldered elements being arranged in housing, equipment compartment also includes transparent window, and transparent window is arranged on housing, transparent regards
Window is for observing the working condition in housing.
Further, transparent window is multiple.
Further, multiple transparent windows on housing along housing length direction be distributed.
Further, multiple transparent windows are arranged on housing at intervals.
Further, multiple transparent windows are equally spaced on housing.
Further, transparent window is rectangle.
Further, transparent window is strip, and the length direction along housing is arranged on housing.
Further, the length of transparent window is more than the half of the length of housing.
Further, transparent window is made up of heat resistant transparent material.
Further, heat resistant transparent material is glass or crystalline ceramics.
Application the technical solution of the utility model, when solder reflow device works, staff just can pass through transparent window
Observe the working condition in housing.If there occurs abnormal conditions in equipment compartment during work, staff just can be regarded by transparent
Window finds in time, and then takes measures on customs clearance and remedy, it is to avoid the generation of peril.
In addition to objects, features and advantages described above, this utility model also has other purpose, feature and excellent
Point.Below with reference to figure, this utility model is described in further detail.
Accompanying drawing explanation
The Figure of description constituting a part of the present utility model is further appreciated by of the present utility model for providing, this
The schematic description and description of utility model is used for explaining this utility model, is not intended that improper limit of the present utility model
Fixed.In the accompanying drawings:
Fig. 1 shows the structural representation of solder reflow device of the prior art；
Fig. 2 shows the structural representation of the embodiment one according to solder reflow device of the present utility model；
Fig. 3 shows the structural representation of the embodiment two according to solder reflow device of the present utility model.
Wherein, above-mentioned accompanying drawing includes the following drawings labelling:
10, equipment compartment；11, housing；12, transparent window.
Detailed description of the invention
It should be noted that in the case of not conflicting, the embodiment in this utility model and the feature in embodiment can
To be mutually combined.Describe this utility model below with reference to the accompanying drawings and in conjunction with the embodiments in detail.
In order to make those skilled in the art be more fully understood that this utility model scheme, real below in conjunction with this utility model
Execute the accompanying drawing in example, the technical scheme in this utility model embodiment is clearly and completely described, it is clear that described
Embodiment is only the embodiment of this utility model part rather than whole embodiments.Based on the reality in this utility model
Execute example, the every other embodiment that those of ordinary skill in the art are obtained under not making creative work premise, all answer
When the scope belonging to this utility model protection.
Fig. 2 shows the embodiment one of solder reflow device of the present utility model, and this solder reflow device includes equipment compartment 10, if
Standby cabin 10 includes housing 11 and the soldered elements being arranged in housing 11.So that solder reflow device is operationally, work people
Member can from external observation to equipment compartment the working condition in 10, equipment compartment 10 also includes that transparent window 12, transparent window 12 are arranged
On housing 11.When solder reflow device works, staff just can observe the work feelings in housing 11 by transparent window 12
Condition.If there occurs abnormal conditions in equipment compartment 10 during work, staff just can be found by transparent window 12 in time, and then
Take measures on customs clearance and remedy, it is to avoid the generation of peril.
As in figure 2 it is shown, be provided with multiple transparent window 12 on equipment compartment 10, to provide that more can observe to regard
Angle, facilitates staff to observe the situation in equipment compartment 10.Optionally, in embodiment one, multiple transparent windows 12
On housing 11, the length direction along housing 11 is distributed, thus it is observed that workpiece to be welded all adds in equipment compartment 10
Work flow process.As in figure 2 it is shown, in embodiment one, multiple transparent windows 12 are arranged on housing 11 at intervals.Optionally, many
Individual transparent window 12 is equally spaced on housing 11.
As in figure 2 it is shown, in embodiment one, transparent window 12 is rectangle.Optionally, transparent window 12 is circular or it
His shape is also feasible.
Operationally can produce higher temperature due to solder reflow device, transparent window 12 is made up of heat resistant transparent material,
To meet the solder reflow device requirement for transparent window 12.Optionally, heat resistant transparent material is glass or crystalline ceramics.
Fig. 3 shows the embodiment two of solder reflow device of the present utility model, and this solder reflow device includes equipment compartment 10, if
Standby cabin 10 includes housing 11 and the soldered elements being arranged in housing 11.So that solder reflow device is operationally, work people
Member can from external observation to equipment compartment the working condition in 10, equipment compartment 10 also includes that transparent window 12, transparent window 12 are arranged
On housing 11.When solder reflow device works, staff just can observe the work feelings in housing 11 by transparent window 12
Condition.If there occurs abnormal conditions in equipment compartment 10 during work, staff just can be found by transparent window 12 in time, and then
Take measures on customs clearance and remedy, it is to avoid the generation of peril.Optionally, in embodiment three, transparent window 12 is strip
Shape, the length direction along housing 11 is arranged on housing 11.The visual angle more can observed with offer, facilitates staff couple
Situation in equipment compartment 10 is observed.
Optionally, in embodiment two, the length of transparent window 12, more than the half of the length of housing 11, thus can be seen
Observe workpiece to be welded whole work flows in equipment compartment 10.
The foregoing is only preferred embodiment of the present utility model, be not limited to this utility model, for this
For the technical staff in field, this utility model can have various modifications and variations.All in spirit of the present utility model and principle
Within, any modification, equivalent substitution and improvement etc. made, within should be included in protection domain of the present utility model.
Claims (10)
1. a solder reflow device, including equipment compartment (10), described equipment compartment (10) includes housing (11) and is arranged on described shell
Soldered elements in body (11), it is characterised in that described equipment compartment (10) also includes transparent window (12), described transparent window
(12) being arranged on described housing (11), described transparent window (12) is used for observing the working condition in described housing (11).
Solder reflow device the most according to claim 1, it is characterised in that described transparent window (12) is multiple.
Solder reflow device the most according to claim 2, it is characterised in that multiple described transparent windows (12) are at described housing
(11) on, the length direction along described housing (11) is distributed.
Solder reflow device the most according to claim 3, it is characterised in that multiple described transparent windows (12) set at intervals
Put on described housing (11).
Solder reflow device the most according to claim 4, it is characterised in that multiple described transparent windows (12) equally spaced set
Put on described housing (11).
6. according to the solder reflow device according to any one of claim 2 to 5, it is characterised in that described transparent window (12) is
Rectangle.
Solder reflow device the most according to claim 1, it is characterised in that described transparent window (12) is strip, along institute
The length direction stating housing (11) is arranged on described housing (11).
Solder reflow device the most according to claim 7, it is characterised in that the length of described transparent window (12) is more than described
The half of the length of housing (11).
Solder reflow device the most according to claim 1, it is characterised in that described transparent window (12) is by heat resistant transparent material
Make.
Solder reflow device the most according to claim 9, it is characterised in that described heat resistant transparent material is glass or transparent
Pottery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620676692.6U CN205852020U (en) | 2016-06-30 | 2016-06-30 | Solder reflow device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620676692.6U CN205852020U (en) | 2016-06-30 | 2016-06-30 | Solder reflow device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205852020U true CN205852020U (en) | 2017-01-04 |
Family
ID=57645092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620676692.6U Active CN205852020U (en) | 2016-06-30 | 2016-06-30 | Solder reflow device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205852020U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113878190A (en) * | 2021-11-22 | 2022-01-04 | 襄阳宏天翼机电有限公司 | Programmable desk type reflow soldering machine for circuit board welding |
-
2016
- 2016-06-30 CN CN201620676692.6U patent/CN205852020U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113878190A (en) * | 2021-11-22 | 2022-01-04 | 襄阳宏天翼机电有限公司 | Programmable desk type reflow soldering machine for circuit board welding |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |