CN205847749U - Four limit high-frequency electromagnetic Heat sealing machines of printed circuit board - Google Patents
Four limit high-frequency electromagnetic Heat sealing machines of printed circuit board Download PDFInfo
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- CN205847749U CN205847749U CN201620675184.6U CN201620675184U CN205847749U CN 205847749 U CN205847749 U CN 205847749U CN 201620675184 U CN201620675184 U CN 201620675184U CN 205847749 U CN205847749 U CN 205847749U
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Abstract
This application discloses four limit high-frequency electromagnetic Heat sealing machines of a kind of printed circuit board, including: the electromagnetic generator of the corresponding setting in Copper Foil region being positioned on four limits with soft/hard multilayer printed circuit board；And, that be connected with electromagnetic generator, for electromagnetic generator output high-frequency resonant electric current is produced the high-frequency power supply circuit of current vortex to trigger Copper Foil region；The drive circuit being connected with high-frequency power supply circuit；And, that be connected with drive circuit, for controlling the governor circuit that drive circuit drives high-frequency power supply circuit to work.So, breaking through tradition bottleneck at one stroke, the four direction at printed circuit board fuses simultaneously, and the fusion head in each direction can adjust distance, and each fusion head can individually control switch, independent temperature control.This mechanism efficiency is high, and compatibility is strong.
Description
Technical field
The application relates to printed circuit board field, particularly relates to four limit high-frequency electromagnetic Heat sealing machines of a kind of printed circuit board.
Background technology
Answer at present the market demand soft/rigid polyviyl circuit board size is increasing, fusion sites gets more and more, and current two sides is high
Frequently electromagnetism fusion positions soft/hard multilayer printed circuit board device and only can merge plate two sides simultaneously, and this method efficiency is low, and such as
Need to fuse other both sides and need to readjust plate position so that aligning accuracy is the highest, product quality can not get ensureing.
Summary of the invention
The application is intended to solve one of above-mentioned technical problem the most to a certain extent.
The application provides four limit high-frequency electromagnetic Heat sealing machines of a kind of printed circuit board, four limit high frequencies of described printed circuit board
Electromagnetism Heat sealing machine is for carrying out electromagnetism hot melt process to soft/hard multilayer printed circuit board so that described soft/hard multilayer printed circuit
The Copper Foil region that plate is positioned on four limits is fused by insulating barrier that is that contact and that heated by electromagnetism hot melt, including:
The electromagnetism of the corresponding setting in described Copper Foil region that/hard multilayer printed circuit board soft with described is positioned on four limits occurs
Device；And,
That be connected with described electromagnetic generator, for described to trigger to described electromagnetic generator output high-frequency resonant electric current
Copper Foil region produces the high-frequency power supply circuit of current vortex；
The drive circuit being connected with described high-frequency power supply circuit；And,
That be connected with described drive circuit, for controlling the master that described drive circuit drives described high-frequency power supply circuit to work
Control circuit.
Further, described electromagnetic generator is arranged at the opposite sides in described Copper Foil region.
Further, four limit high-frequency electromagnetic Heat sealing machines of described printed circuit board also include:
The temperature conditioning unit being connected with described governor circuit；And,
Temperature sensor that nearly described Copper Foil region is arranged, that be connected with described temperature conditioning unit.
Further, four limit high-frequency electromagnetic Heat sealing machines of described printed circuit board also include: with described high-frequency power supply circuit
The mutual inductance circuit of the corresponding setting of output loop, described governor circuit includes:
Single-chip microcomputer；And,
It is arranged at the peripheral circuit outside described single-chip microcomputer,
Described single-chip microcomputer has: the driving interface being connected with described drive circuit；The triggering being connected with described temperature conditioning unit
Interface；And, the transducer signal input interface being connected with described mutual inductance circuit.
Further, four limit high-frequency electromagnetic Heat sealing machines of described printed circuit board also include:
That be connected with described governor circuit, for being controlled to drive by described governor circuit in described electromagnetism hot melt processing procedure
The hold-down mechanism that described soft/hard multilayer printed circuit board is compressed by dynamic described electromagnetic generator.
Further, the frequency range value of described high-frequency resonant electric current: 15000-40000Hz.
The application provides the benefit that:
By providing four limit high-frequency electromagnetic Heat sealing machines of a kind of printed circuit board, including: with soft/hard multilayer printed circuit board
The electromagnetic generator of the corresponding setting in Copper Foil region being positioned on four limits；And, that be connected with electromagnetic generator, for electromagnetism
Generator output high-frequency resonant electric current produces the high-frequency power supply circuit of current vortex to trigger Copper Foil region；With high-frequency power supply circuit phase
Drive circuit even；And, that be connected with drive circuit, for controlling the master control that drive circuit drives high-frequency power supply circuit to work
Circuit.So, breaking through tradition bottleneck at one stroke, the four direction at printed circuit board fuses simultaneously, and the fusion in each direction
Head can adjust distance, and each fusion head can individually control switch, independent temperature control.This mechanism efficiency is high, compatibility
By force.
Accompanying drawing explanation
Fig. 1 is the structural representation of four limit high-frequency electromagnetic Heat sealing machines of the printed circuit board of the embodiment of the present application.
Detailed description of the invention
Embodiments herein is described below in detail, and the example of described embodiment is shown in the drawings, the most from start to finish
Same or similar label represents same or similar element or has the element of same or like function.Below with reference to attached
The embodiment that figure describes is exemplary, it is intended to be used for explaining the application, and it is not intended that restriction to the application.
In the description of the present application, it is to be understood that term " " center ", " longitudinally ", " laterally ", " length ", " width ",
" thickness ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", " end " " interior ", " outward ", " up time
Pin ", the orientation of the instruction such as " counterclockwise " or position relationship be based on orientation shown in the drawings or position relationship, be for only for ease of
Describe the application and simplification description rather than instruction or the device of hint indication or element must have specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore it is not intended that restriction to the application.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or
Implicitly include one or more this feature.In the description of the present application, " multiple " are meant that two or more,
Unless otherwise expressly limited specifically.
In this application, unless otherwise clearly defined and limited, term " install ", " being connected ", " connection ", " fixing " etc.
Term should be interpreted broadly, and connects for example, it may be fixing, it is also possible to be to removably connect, or be integrally connected；It can be machine
Tool connects, it is also possible to be electrical connection；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, can be two units
Connection within part.For the ordinary skill in the art, can understand that above-mentioned term is in this Shen as the case may be
Concrete meaning in please.
In this application, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score
Can include that the first and second features directly contact, it is also possible to include that the first and second features are not directly contact but by it
Other characterisation contact between.And, fisrt feature second feature " on ", " top " and " above " include that first is special
Levy directly over second feature and oblique upper, or be merely representative of fisrt feature level height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " below " include that fisrt feature immediately below second feature and obliquely downward, or is merely representative of
Fisrt feature level height is less than second feature.
Combine accompanying drawing below by detailed description of the invention the application is described in further detail.
Embodiment one:
As it is shown in figure 1, present embodiments provide four limit high-frequency electromagnetic Heat sealing machines of a kind of printed circuit board, printed circuit board
Four limit high-frequency electromagnetic Heat sealing machines for soft/hard multilayer printed circuit board 1 is carried out electromagnetism hot melt process so that soft/hard multilayer
Copper Foil region 11 on printed circuit board 1 is fused by insulating barrier 12 that is that contact and that heated by electromagnetism hot melt, including:
The electromagnetic generator 2 of the corresponding setting in Copper Foil region 11 being positioned on four limits with soft/hard multilayer printed circuit board 1,
Electromagnetic generator 2 is provided with poly-magnetic material；
It is that be connected with electromagnetic generator 2, for electromagnetic generator 2 is exported high-frequency resonant electric current to trigger Copper Foil region 11
Produce the high-frequency power supply circuit of current vortex；
The drive circuit being connected with high-frequency power supply circuit；And,
That be connected with drive circuit, for controlling the governor circuit that drive circuit drives high-frequency power supply circuit to work.
Concrete, in the present embodiment, electromagnetic generator 2 is arranged at the opposite sides in Copper Foil region 11.
Four limit high-frequency electromagnetic Heat sealing machines of printed circuit board also include:
That be connected with governor circuit, for being controlled to drive electromagnetic generator by governor circuit in electromagnetism hot melt processing procedure
The hold-down mechanism that soft/hard multilayer printed circuit board 1 is compressed.
The frequency range value of high-frequency resonant electric current: 15000-40000Hz, can value 15000,20000,25000,
The numerical value such as 30000 or 40000Hz.
Accordingly, the application provides the printed circuit of a kind of four limit high-frequency electromagnetic Heat sealing machines based on above-mentioned printed circuit board
The 9 Cr 2 steel using electromagnetic heating melting method of plate, including:
Governor circuit controls drive circuit and drives high-frequency power supply circuit work；
High-frequency power supply circuit produces current vortex to electromagnetic generator output high-frequency resonant electric current to trigger Copper Foil region 11, makes
Obtain the Copper Foil region 11 on soft/hard multilayer printed circuit board 1 by insulating barrier 12 that is that contact and that heated by electromagnetism hot melt
It is fused.
The 9 Cr 2 steel using electromagnetic heating melting method of printed circuit board also includes:
Governor circuit controls hold-down mechanism and drives electromagnetic generator 2 to soft/hard multilayer print in electromagnetism hot melt processing procedure
Circuit board 1 processed compresses.Hold-down mechanism can be cylinder or servomotor etc..
Embodiment two:
The present embodiment essentially consists in the difference of other embodiments:
In the present embodiment, four limit high-frequency electromagnetic Heat sealing machines of printed circuit board also include:
The temperature conditioning unit being connected with governor circuit；And,
Temperature sensor that nearly Copper Foil region 11 is arranged, that be connected with temperature conditioning unit.
So, the 9 Cr 2 steel using electromagnetic heating melting method of printed circuit board also includes:
Temperature sensor senses obtains the induced signal of the real time temperature for reflecting Copper Foil region 11；
Temperature conditioning unit is converted into the discernible temperature information of governor circuit to induced signal；
Governor circuit controls drive circuit works according to temperature information.
Embodiment three:
The present embodiment essentially consists in the difference of other embodiments:
In the present embodiment, four limit high-frequency electromagnetic Heat sealing machines of printed circuit board also include: with the output of high-frequency power supply circuit
The mutual inductance circuit of the corresponding setting in loop, governor circuit includes:
Single-chip microcomputer；And,
It is arranged at the peripheral circuit outside single-chip microcomputer,
Single-chip microcomputer has: the driving interface being connected with drive circuit；The triggering interface being connected with temperature conditioning unit；And, with
The transducer signal input interface that mutual inductance circuit is connected.
So, the 9 Cr 2 steel using electromagnetic heating melting method of printed circuit board also includes:
Governor circuit obtains the real-time frequency of high-frequency resonant electric current on the output loop of high-frequency power supply circuit by mutual inductance circuit
Rate；
Governor circuit controls drive circuit works according to high-frequency resonant electric current real-time frequency.
Implement this high-frequency electromagnetic fusion technique, high-speed microprocessor and high-frequency power supply circuit perfect adaptation, height can be produced
Frequency electromagnetic waves, acts on the some position that multilayer circuit board need to fuse, and produces current vortex in every layer circuit board regulation cupric region uniform
Heat the insulating barrier between each layer, be allowed to fuse.Each layer the most uniformly fast heating, breaks through the number of plies and limits, improve adhesion, protect
Card quality, shortens Production Time, improves efficiency.Temperature conditioning unit triggers governor circuit, master control electricity according to the Temperature Feedback of wiring board
Drive circuit is triggered on road, and drive circuit drives high-frequency power supply circuit, produces high frequency electric (this application general about 25KHz frequency
Electric current), such electromagnetic generator just produces high frequency magnetic flux, high frequency magnetic flux generation whirlpool, multilayer circuit board copper district electricity between bar magnet
Stream heating.During up and down bar magnet by compression multilayer circuit boards such as hold-down mechanism such as cylinders, be finally allowed to mutual with insulating barrier
Fusion.After temperature reaches design temperature, temperature conditioning unit stops output, and governor circuit stops triggering, and mechanism stops heating.
Further, breaking through at one stroke tradition bottleneck, the four direction at printed circuit board fuses simultaneously, and each direction is molten
Syncephalon can adjust distance, and each fusion head can individually control switch, independent temperature control.This mechanism efficiency is high, compatible
Property is strong
In the description of this specification, reference term " embodiment ", " some embodiments ", " an enforcement
Example ", " some embodiments ", " example ", the description of " concrete example " or " some examples " etc. mean to combine this embodiment or example
The specific features, structure, material or the feature that describe are contained at least one embodiment or the example of the application.In this explanation
In book, the schematic representation of above-mentioned term is not necessarily referring to identical embodiment or example.And, the concrete spy of description
Levy, structure, material or feature can combine in any one or more embodiments or example in an appropriate manner.
Above content is to combine the further description that the application is made by specific embodiment, it is impossible to assert this Shen
Being embodied as please is confined to these explanations.For the application person of an ordinary skill in the technical field, do not taking off
On the premise of the application conceives, it is also possible to make some simple deduction or replace.
Claims (6)
1. four limit high-frequency electromagnetic Heat sealing machines of a printed circuit board, it is characterised in that four limit high frequencies of described printed circuit board
Electromagnetism Heat sealing machine is for carrying out electromagnetism hot melt process to soft/hard multilayer printed circuit board so that described soft/hard multilayer printed circuit
The Copper Foil region that plate is positioned on four limits is fused by insulating barrier that is that contact and that heated by electromagnetism hot melt, and its feature exists
In, including:
The electromagnetic generator of the corresponding setting in described Copper Foil region that/hard multilayer printed circuit board soft with described is positioned on four limits；
And,
It is that be connected with described electromagnetic generator, for described electromagnetic generator is exported high-frequency resonant electric current to trigger described Copper Foil
Region produces the high-frequency power supply circuit of current vortex；
The drive circuit being connected with described high-frequency power supply circuit；And,
That be connected with described drive circuit, for controlling the master control electricity that described drive circuit drives described high-frequency power supply circuit to work
Road.
2. four limit high-frequency electromagnetic Heat sealing machines of printed circuit board as claimed in claim 1, it is characterised in that described electromagnetism occurs
Device is arranged at the opposite sides in described Copper Foil region.
3. four limit high-frequency electromagnetic Heat sealing machines of printed circuit board as claimed in claim 1, it is characterised in that described printed circuit
Four limit high-frequency electromagnetic Heat sealing machines of plate also include:
The temperature conditioning unit being connected with described governor circuit；And,
Temperature sensor that nearly described Copper Foil region is arranged, that be connected with described temperature conditioning unit.
4. four limit high-frequency electromagnetic Heat sealing machines of printed circuit board as claimed in claim 3, it is characterised in that described printed circuit
Four limit high-frequency electromagnetic Heat sealing machines of plate also include: the mutual electrification of setting corresponding with the output loop of described high-frequency power supply circuit
Road, described governor circuit includes:
Single-chip microcomputer；And,
It is arranged at the peripheral circuit outside described single-chip microcomputer,
Described single-chip microcomputer has: the driving interface being connected with described drive circuit；The triggering interface being connected with described temperature conditioning unit；
And, the transducer signal input interface being connected with described mutual inductance circuit.
5. four limit high-frequency electromagnetic Heat sealing machines of printed circuit board as claimed in claim 1, it is characterised in that described printed circuit
Four limit high-frequency electromagnetic Heat sealing machines of plate also include:
That be connected with described governor circuit, for being controlled to drive institute by described governor circuit in described electromagnetism hot melt processing procedure
State the hold-down mechanism that described soft/hard multilayer printed circuit board is compressed by electromagnetic generator.
6. four limit high-frequency electromagnetic Heat sealing machines of the printed circuit board as according to any one of claim 1-5, it is characterised in that institute
State the frequency range value of high-frequency resonant electric current: 15000-40000Hz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620675184.6U CN205847749U (en) | 2016-06-30 | 2016-06-30 | Four limit high-frequency electromagnetic Heat sealing machines of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620675184.6U CN205847749U (en) | 2016-06-30 | 2016-06-30 | Four limit high-frequency electromagnetic Heat sealing machines of printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN205847749U true CN205847749U (en) | 2016-12-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201620675184.6U Active CN205847749U (en) | 2016-06-30 | 2016-06-30 | Four limit high-frequency electromagnetic Heat sealing machines of printed circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113473751A (en) * | 2021-07-05 | 2021-10-01 | 深圳市美瑞安科技有限公司 | High-frequency electromagnetic fusion machine for multilayer circuit board |
-
2016
- 2016-06-30 CN CN201620675184.6U patent/CN205847749U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113473751A (en) * | 2021-07-05 | 2021-10-01 | 深圳市美瑞安科技有限公司 | High-frequency electromagnetic fusion machine for multilayer circuit board |
| CN113473751B (en) * | 2021-07-05 | 2022-05-24 | 深圳市美瑞安科技有限公司 | High-frequency electromagnetic fusion machine for multilayer circuit board |
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